CN213276564U

CN213276564U - Heat dissipation type ceramic mainboard for notebook computer

Info

Publication number: CN213276564U
Application number: CN202022682559.0U
Authority: CN
Inventors: 金杨敏
Original assignee: Shenzhen Daixun Communication Equipment Co ltd
Current assignee: Shenzhen Daixun Communication Equipment Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-05-25
Anticipated expiration: 2030-11-18

Abstract

The utility model relates to a heat dissipation type ceramic mainboard for notebook computer relates to the technical field of computer mainboard, including the computer casing, seted up the cavity in the computer casing, be provided with the mainboard body in the computer casing, be provided with the heat-conducting piece on the mainboard body, set up the holding tank with the cavity intercommunication on the computer casing, the heat-conducting piece sets up in the holding tank, can dismantle on the computer casing and be connected with coupling mechanism, and coupling mechanism is used for inserting in the holding tank and is connected with the heat-conducting piece, is provided with the water-cooling circulation mechanism that is used for carrying out the heat exchange to the heat-conducting piece on the coupling mechanism. The notebook computer has the effect of enabling the notebook computer to have good heat dissipation performance.

Description

Heat dissipation type ceramic mainboard for notebook computer

Technical Field

The application relates to the technical field of computer motherboards, in particular to a heat dissipation type ceramic mainboard for a notebook computer.

Background

A computer motherboard is one of the most basic and important components of a microcomputer, and the motherboard is generally a rectangular circuit board on which main circuit systems and elements constituting the computer are mounted. Because various chips and electronic elements are arranged on the main board, the temperature of the main board is higher when the microcomputer works, and the working performance and the stability of the electronic elements are influenced.

The related heat dissipation type main board uses ceramic as a main board substrate, the ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an aluminum oxide or aluminum nitride ceramic substrate at high temperature, and the manufactured composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft weldability and adhesion strength, so that the heat dissipation capacity of the main board is enhanced, and the working temperature is reduced.

The above prior art solutions have the following drawbacks: in the notebook computer, because the notebook computer has a compact structure and a small fan size, the heat dissipation of the main board is poor and the notebook computer is inconvenient to use.

SUMMERY OF THE UTILITY MODEL

In order to enable the notebook computer to have good heat dissipation performance, the application provides a heat dissipation type ceramic mainboard for the notebook computer.

The application provides a heat dissipation type ceramic mainboard for notebook computer adopts following technical scheme:

the utility model provides a heat dissipation type ceramic mainboard for notebook computer, includes the computer housing, has seted up the cavity in the computer housing, is provided with the mainboard body in the computer housing, be provided with heat-conducting piece on the mainboard body, set up the holding tank with the cavity intercommunication on the computer housing, heat-conducting piece sets up in the holding tank, can dismantle on the computer housing and be connected with coupling mechanism, coupling mechanism is used for inserting in the holding tank and is connected with heat-conducting piece, is provided with the water-cooling circulation mechanism that is used for carrying out the heat exchange to heat-conducting piece on the coupling mechanism.

By adopting the technical scheme, the containing groove is formed in the computer shell, the heat conducting piece is arranged on the main board body, the connecting mechanism can be inserted into the computer shell through the containing groove, so that the connecting mechanism can exchange heat with the main board body through the heat conducting piece, and the water cooling circulating mechanism can dissipate heat of the connecting mechanism by arranging the water cooling circulating mechanism on the connecting mechanism, so that the water cooling circulating mechanism can cool the main board body, and the notebook computer can have a good heat dissipation effect.

Optionally, the main board body comprises a ceramic substrate and an element mounting plate, a mounting groove is formed in the ceramic substrate, the element mounting plate is embedded into the mounting groove, and a plurality of fixing mechanisms used for clamping the element mounting plate are arranged on the ceramic substrate.

Through adopting above-mentioned technical scheme, through seting up the mounting groove on ceramic substrate, imbed the component mounting panel in the mounting groove to make electronic component fix on the component mounting panel, thereby fix on ceramic substrate, the user facilitates user of service's processing and installation through seting up the mounting hole that is used for fixed electronic component on the component mounting panel.

Optionally, the fixing mechanism comprises a rotating rod and a clamping block used for limiting the rotating rod, one end of the rotating rod is hinged to the ceramic substrate, and the clamping block is arranged on the ceramic substrate.

Through adopting above-mentioned technical scheme, through rotating the connection dwang on ceramic substrate to make the dwang rotate and the butt on the component mounting panel, through set up the fixture block on ceramic substrate, make the fixture block play limiting displacement to the dwang, thereby reduce the probability of dwang free rotation on ceramic substrate.

Optionally, the fixing mechanism further comprises a projection for abutting against the component mounting plate, the projection being provided on an end of the rotating lever remote from the hinge point.

By adopting the technical scheme, the lug is arranged on the rotating rod, so that the lug can move along with the rotating rod and is abutted against the element mounting plate, and the probability of rubbing the rotating rod and the element mounting plate is reduced.

Optionally, the connecting mechanism includes a box body, an insertion hole for inserting the heat conducting member is formed in the box body, the box body is used for being inserted into the accommodating groove, and the box body is connected with the water-cooling circulation mechanism.

Through adopting above-mentioned technical scheme, through making box body and water-cooling circulation mechanism be connected to make water-cooling circulation mechanism can pour into the box body with the cooling water, the user of service can make during the heat-conducting piece inserts the box body through inserting the box body into the holding tank, thereby make water-cooling circulation mechanism mesocycle's cooling water can be to the heat-conducting piece cooling, reach the effect that makes water-cooling circulation mechanism cool down the mainboard body.

Optionally, the heat conducting piece is sleeved with a reinforcing cylinder.

Through adopting above-mentioned technical scheme, through set up a reinforcement section of thick bamboo on the heat-conducting piece, make a reinforcement section of thick bamboo play the effect of protection heat-conducting piece to reduce the probability that the box body bumps heat-conducting piece when inserting the holding tank.

Optionally, coupling mechanism still includes the bolt and is used for with the sliding plate of heat-conducting piece sealing connection, sliding plate sealing and sliding connection in the box body, and the bolt runs through keep away from heat-conducting piece one side lateral wall on the box body, and bolt and box body threaded connection, the one end that lies in the box body on the bolt rotates to be connected on the sliding plate, has seted up a plurality of mating holes that are used for making heat-conducting piece male on the sliding plate.

Through adopting above-mentioned technical scheme, through sliding connection sliding plate in the box body, make the sliding plate can remove through the bolt, the user can make the sliding plate remove through revolving the wrong bolt of twisting, reaches the effect that makes in the heat-conducting piece inserts the mating holes, further promotes the leakproofness that box body and heat-conducting piece are connected.

Optionally, a rubber sealing member for sealing the sliding plate and the heat conducting member is disposed on the fitting hole.

Through adopting above-mentioned technical scheme, through set up rubber seal on the mating holes, make rubber seal can promote the leakproofness that sliding plate and heat-conducting member are connected.

Optionally, the water-cooling circulation mechanism comprises a plurality of hoses, a water storage tank and a water pump, the water storage tank is communicated with the water pump through the hoses, and the water storage tank and the water pump are communicated with the box body through the hoses.

Through adopting above-mentioned technical scheme, pass through the hose intercommunication through making water storage box and water pump to make the water pump can pour into the cooling water in the water storage box into the box body, play the effect that makes the cooling water circulation flow, optimize the cooling effect of cooling water to the mainboard body.

To sum up, the beneficial technical effect of this application does:

1. the heat conducting piece is arranged on the main board body by arranging the accommodating groove on the computer shell, so that the connecting mechanism can be inserted into the computer shell through the accommodating groove, the connecting mechanism can exchange heat with the main board body through the heat conducting piece, and the water-cooling circulating mechanism is arranged on the connecting mechanism and can dissipate heat of the connecting mechanism, so that the water-cooling circulating mechanism can cool the main board body, and the notebook computer can have good heat dissipation performance;

2. the box body is connected with the water-cooling circulation mechanism, so that the water-cooling circulation mechanism can inject cooling water into the box body, and a user can insert the heat-conducting piece into the box body by inserting the box body into the accommodating groove, so that the cooling water circulating in the water-cooling circulation mechanism can cool the heat-conducting piece, and the effect of cooling the mainboard body by the water-cooling circulation mechanism is achieved;

3. through sliding connection sliding plate in the box body, make the sliding plate can pass through the bolt removal, the user can make the sliding plate remove through revolving wrong bolt, reaches the effect that makes in the heat-conducting piece inserts the mating holes, further promotes the leakproofness that box body and heat-conducting piece are connected.

Drawings

Fig. 1 is a partial structural schematic diagram of the present application.

Fig. 2 is a schematic view of the connection relationship between the main board body and the connection mechanism.

Fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Fig. 4 is a first schematic sectional view of the connection mechanism.

Fig. 5 is a schematic sectional structure diagram of the connection mechanism.

Reference numerals: 1. a computer housing; 11. accommodating grooves; 2. a main board body; 21. a ceramic substrate; 211. mounting grooves; 212. a heat conductive member; 213. a reinforcement cylinder; 22. an element mounting plate; 221. mounting holes; 23. a fixing mechanism; 231. rotating the rod; 232. a bump; 233. a clamping block; 3. a connecting mechanism; 31. a box body; 311. an insertion hole; 312. a circulation hole; 32. a bolt; 33. a sliding plate; 331. a mating hole; 332. a rubber seal; 4. a water-cooling circulation mechanism; 41. a hose; 42. a water storage tank; 43. and (4) a water pump.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings.

Referring to fig. 1, for the heat dissipation type ceramic motherboard for notebook computer that this application discloses, including computer housing 1, be provided with the cavity in the computer housing 1, be provided with mainboard body 2 in the computer housing 1, mainboard body 2 is fixed in the cavity in the computer housing 1, has seted up holding tank 11 on the computer housing 1, and holding tank 11 communicates with the cavity of computer housing 1. Can dismantle on the mainboard body 2 and be connected with coupling mechanism 3, coupling mechanism 3 is through inserting in holding tank 11 to with mainboard body 2 contact, thereby make mainboard body 2 can carry out the heat exchange with coupling mechanism 3. Be connected with water-cooling circulation mechanism 4 on coupling mechanism 3, water-cooling circulation mechanism 4 can cool down mainboard body 2 and coupling mechanism 3 to reach the effect that promotes mainboard body 2 radiating efficiency.

Referring to fig. 1, the main board body 2 includes a ceramic substrate 21 and a component mounting board 22, and the ceramic substrate 21 is connected to the connection mechanism 3. The ceramic substrate 21 is provided with a mounting groove 211, the mounting groove 211 is a through groove, and the component mounting plate 22 is embedded in the mounting groove 211. The component mounting board 22 is made of a metal or resin material. The component mounting plate 22 is provided with a plurality of mounting holes 221 for mounting components, so that a user can fix the components to the component mounting plate 22, and the ceramic substrate 21 has good thermal conductivity and can efficiently conduct heat generated by the components to the connection mechanism 3.

Referring to fig. 2 and 3, a plurality of fixing mechanisms 23 for fixing the component mounting board 22 are provided on the ceramic substrate 21, and the fixing mechanisms 23 are provided on both surfaces of the ceramic substrate 21 so that the fixing mechanisms 23 can abut on the opposite surfaces of the component mounting board 22, thereby fixing the component mounting board 22 on the ceramic substrate 21. The fixing mechanism 23 includes a rotating lever 231, a projection 232, and a latch 233, and the rotating lever 231 has one end hinged to the ceramic substrate 21 and the other end capable of abutting on the surface of the element mounting plate 22 by rotation. The protrusion 232 may be made of an elastic material, the protrusion 232 is disposed at an end of the rotating rod 231 away from the hinge point, and the protrusion 232 can move along with the rotating rod 231 and abut against the element mounting plate 22, so that the scraping between the rotating rod 231 and the element mounting plate 22 is reduced. The latch 233 is fixed on the ceramic substrate 21, and the latch 233 is disposed on one side of the rotating rod 231, so that the latch 233 acts as a limit for the rotating rod 231, and the probability of the rotating rod 231 freely rotating on the ceramic substrate 21 is reduced.

Referring to fig. 4 and 5, a plurality of heat-conducting members 212 for connecting with the connecting mechanism 3 are disposed on one side of the ceramic substrate 21, the heat-conducting members 212 are disposed in a cylindrical structure, and the heat-conducting members 212 are disposed in the accommodating groove 11. The length direction of the heat-conducting member 212 is parallel to the opening direction of the accommodating groove 11. The connecting mechanism 3 includes a box body 31, a bolt 32, and a slide plate 33. The box 31 can be inserted into the computer case 1 through the receiving groove 11. The case 31 is provided with a plurality of insertion holes 311 for inserting the heat conducting members 212, and when the case 31 is inserted into the computer case 1, the heat conducting members 212 can be inserted into the case 31. Each of the heat-conducting members 212 is sleeved with a reinforcing cylinder 213, and the reinforcing cylinder 213 may be made of a hard metal material. By providing the reinforcing cylinder 213 on the heat conducting member 212, the probability of the heat conducting member 212 being bent or broken due to the impact of the case 31 can be reduced when the case 31 is inserted into the computer case 1. The sliding plate 33 is hermetically and slidably coupled in the case body 31, the sliding direction of the sliding plate 33 is parallel to the longitudinal direction of the heat conductive member 212, and the sliding plate 33 can slide in a direction approaching and separating from the heat conductive member 212. The bolt 32 penetrates through the side wall of the box body 31 far away from the heat conducting piece 212, and the bolt 32 is in threaded connection with the box body 31. One end of the bolt 32 is located in the box 31 and is rotatably connected to the sliding plate 33, and a user can rotate the bolt 32 to push the sliding plate 33 against the bolt 32, so that the sliding plate 33 slides in the box 31. The sliding plate 33 is provided with a plurality of fitting holes 331, and when the heat conductive member 212 is inserted into the insertion hole 311, a user can insert the heat conductive member 212 into the fitting holes 331 by controlling the sliding plate 33 to slide. A rubber seal 332 is provided in each fitting hole 331, and when the heat-conducting member 212 is inserted into the fitting hole 331, the heat-conducting member 212 pushes the rubber seal 332 open, thereby hermetically connecting the heat-conducting member 212 to the slide plate 33.

Referring to fig. 4 and 5, two circulation holes 312 are formed in the side surface of box 31 away from insertion hole 311, and box 31 is connected to water-cooling circulation mechanism 4 through two circulation holes 312. The water-cooling circulation mechanism 4 includes a plurality of hoses 41, a water storage tank 42, and a water pump 43. The water storage tank 42 is communicated with the water pump 43 through the hose 41, and both the water storage tank 42 and the water pump 43 are communicated with the box body 31 through the hose 41. The water pump 43 can inject the cooling water in the water tank 42 into the box body 31 and make the cooling water in the box body 31 flow back to the water tank 42, so that the cooling water contacts with the heat-conducting member 212 inserted into the box body 31, thereby achieving the effect of cooling the main board body 2.

The implementation principle of the embodiment is as follows: the user makes mainboard body 2 be connected with coupling mechanism 3 through heat-conducting piece 212 through setting up mainboard body 2 in computer housing 1, and the user injects the cooling water into box body 31 through water-cooling circulation mechanism 4, makes the cooling water can carry out the heat exchange with heat-conducting piece 212 to make water-cooling circulation mechanism 4 cool down mainboard body 2, reach radiating effect.

The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a heat dissipation type ceramic mainboard for notebook computer, includes computer housing (1), has seted up the cavity in computer housing (1), is provided with mainboard body (2), its characterized in that in computer housing (1): be provided with on mainboard body (2) heat-conducting piece (212), set up holding tank (11) with the cavity intercommunication on computer housing (1), heat-conducting piece (212) set up in holding tank (11), and computer housing (1) is gone up to dismantle and is connected with coupling mechanism (3), and coupling mechanism (3) are used for inserting in holding tank (11) and are connected with heat-conducting piece (212), are provided with on coupling mechanism (3) and are used for carrying out water-cooling circulation mechanism (4) of heat exchange to heat-conducting piece (212).

2. The heat dissipation type ceramic motherboard for notebook computer according to claim 1, wherein: mainboard body (2) have seted up mounting groove (211) including ceramic substrate (21) and component mounting panel (22) on ceramic substrate (21), and in component mounting panel (22) embedding mounting groove (211), be provided with a plurality of fixed establishment (23) that are used for joint component mounting panel (22) on ceramic substrate (21).

3. The heat dissipation type ceramic motherboard for notebook computer according to claim 2, wherein: the fixing mechanism (23) comprises a rotating rod (231) and a clamping block (233) used for limiting the rotating rod (231), one end of the rotating rod (231) is hinged to the ceramic substrate (21), and the clamping block (233) is arranged on the ceramic substrate (21).

4. The heat dissipation type ceramic motherboard for notebook computer according to claim 3, wherein: the fixing mechanism (23) further comprises a protruding block (232) used for abutting against the element mounting plate (22), and the protruding block (232) is arranged on one end, far away from the hinge point, of the rotating rod (231).

5. The heat dissipation type ceramic motherboard for notebook computer according to claim 1, wherein: the connecting mechanism (3) comprises a box body (31), an insertion hole (311) for inserting the heat conducting piece (212) is formed in the box body (31), the box body (31) is used for being inserted into the accommodating groove (11), and the box body (31) is connected with the water cooling circulating mechanism (4).

6. The heat dissipation type ceramic motherboard for notebook computer according to claim 5, wherein: the heat conducting piece (212) is sleeved with a reinforcing cylinder (213).

7. The heat dissipation type ceramic motherboard for notebook computer according to claim 5, wherein: the connecting mechanism (3) further comprises a bolt (32) and a sliding plate (33) which is used for being connected with the heat conducting piece (212) in a sealing mode, the sliding plate (33) is connected in the box body (31) in a sealing mode and in a sliding mode, the bolt (32) penetrates through the side wall, far away from one side of the heat conducting piece (212), of the box body (31), the bolt (32) is in threaded connection with the box body (31), one end, located in the box body (31), of the bolt (32) is rotatably connected to the sliding plate (33), and the sliding plate (33) is provided with a plurality of matching holes (331) used for enabling the heat conducting piece (212.

8. The heat dissipation type ceramic motherboard for notebook computer according to claim 7, wherein: the matching hole (331) is provided with a rubber sealing piece (332) for hermetically connecting the sliding plate (33) and the heat conducting piece (212).

9. The heat dissipation type ceramic motherboard for notebook computer according to claim 8, wherein: the water-cooling circulation mechanism (4) comprises a plurality of hoses (41), water storage tanks (42) and water pumps (43), wherein the water storage tanks (42) are communicated with the water pumps (43) through the hoses (41), and the water storage tanks (42) and the water pumps (43) are communicated with the box body (31) through the hoses (41).