CN213244459U - Anti-falling multilayer printed circuit board - Google Patents
Anti-falling multilayer printed circuit board Download PDFInfo
- Publication number
- CN213244459U CN213244459U CN202022103868.8U CN202022103868U CN213244459U CN 213244459 U CN213244459 U CN 213244459U CN 202022103868 U CN202022103868 U CN 202022103868U CN 213244459 U CN213244459 U CN 213244459U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- groove
- heat
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a drop-proof multilayer printed circuit board, which comprises a ground layer, a first inner layer, a second inner layer, an element layer and a power layer, wherein a heat-conducting plate is arranged at the bottom end of the ground layer, a longitudinal radiating groove is uniformly arranged in the heat-conducting plate, a transverse radiating groove is uniformly arranged at the bottom end of the longitudinal radiating groove, an insulating ink layer is arranged at the bottom end of the heat-conducting plate, the first inner layer is arranged at the top end of the ground layer, the second inner layer is arranged at the top end of the first inner layer, the power layer is arranged at the top end of the second inner layer, the element layer is uniformly arranged at the top end of the power layer, the utility model has a certain dustproof effect on the circuit board through a dustproof plate arranged at the top end of the element layer, when the dustproof plate needs to be replaced, a fastening nut is rotated, a telescopic rod and a telescopic spring are recovered, the dustproof plate can be taken, the operation is simple, and the disassembly is convenient.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a prevent falling type multilayer printed circuit board.
Background
Along with the development of the electronic industry, the electronic technology is applied to various fields, the requirements on the electronic technology are higher and higher, the circuit board is used as the most important component of the electronic technology, the requirements on the performance and the safety of the circuit board are higher and higher, the circuit board can be divided into a single-panel type, a double-panel type, a multilayer circuit board type and the like, and the multilayer circuit board has the advantages of high speed, multiple functions, high capacity and the like:
traditional multilayer printed circuit board prevents during the use that the ability is relatively poor, and the electronic component of the inside of fragile circuit board to a certain extent influences the result of use of circuit board, has reduced the life of circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an prevent falling type multilayer printed circuit board to the multilayer printed circuit board who provides in solving above-mentioned background art prevents falling the relatively poor problem of ability.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an prevent falling type multilayer printed circuit board, includes ground plane, first inlayer, second inlayer, component layer and power layer, the heat-conducting plate is installed to the bottom of ground plane, vertical radiating groove is evenly installed to the inside of heat-conducting plate, and the bottom of vertical radiating groove evenly installs horizontal radiating groove, insulating printing ink layer is installed to the bottom of heat-conducting plate, first inlayer is installed on the top of ground plane, the second inlayer is installed on the top of first inlayer, and the power layer is installed on the top of second inlayer, the component layer is evenly installed on the top of power layer, the dust guard is installed on the top of component layer, the connecting rod is all installed to the both sides of dust guard bottom, the heating panel is all installed to the both sides on heat-conducting plate top, one side of heating panel all is provided with buffer structure, buffer structure includes spacing groove, buffer spring, The limiting groove comprises a limiting rod, limiting blocks, a rubber pad and a clamping groove, wherein the limiting groove is arranged at the top end and the bottom end of one side of the heating panel, a buffer spring is arranged in the limiting groove, the limiting rod is arranged on one side of the limiting groove, the rubber pad is arranged on one side of the limiting rod, the limiting blocks are arranged on one side of the rubber pad, the clamping groove is arranged on one side of the limiting block, and a fixing structure is arranged at the top end of the heating panel.
Preferably, the fixed knot constructs including fastening nut, resettlement groove, telescopic link and expanding spring, the top at the heating panel is all installed in the resettlement groove, the telescopic link is all installed to the top and the bottom of resettlement groove one side, expanding spring is all installed in the outside of telescopic link, fastening nut is all installed to the opposite side of resettlement groove.
Preferably, the limiting groove is arranged in a C shape, and the limiting groove and the limiting rod form a sliding structure.
Preferably, one side of the buffer spring is connected with one side of the limiting rod, and the buffer spring and the limiting rod form a telescopic structure.
Preferably, the limiting rod and the rubber pad are designed vertically, and the limiting rod is symmetrically distributed about the vertical center of the rubber pad.
Preferably, the longitudinal radiating grooves are all located in the same horizontal plane, and are arranged in the heat conducting plate at equal intervals.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the rubber pad is arranged on one side of the heat dissipation plate, the rubber pad can play a certain buffering effect, when the circuit board falls carelessly, the heat dissipation plate enables the buffer spring to compress, the limiting groove moves towards the limiting rod, the circuit board plays a certain buffering effect, meanwhile, the rubber pad can enhance the buffering effect on the circuit board to a certain extent, electronic elements in the circuit board are prevented from being damaged, and the service life of the circuit board is prolonged;
2. the dustproof plate can play a certain dustproof effect on the circuit board through the dustproof plate arranged at the top end of the element layer, when the dustproof plate needs to be replaced, the fastening nut is rotated, the telescopic rod and the telescopic spring recover, the dustproof plate can be taken down and replaced, the operation is simple, and the disassembly is convenient;
3. through the heat-conducting plate of installation in ground plane bottom, the heat-conducting plate can play certain radiating effect, avoids the circuit board to be damaged because of inside temperature is too high at the during operation, and the inside vertical radiating groove and the horizontal radiating groove that evenly set up of heat-conducting plate can strengthen the heat-sinking capability of circuit board simultaneously, and insulating printing ink layer can play certain wearability to the circuit board.
Drawings
Fig. 1 is a schematic front view of the present invention;
fig. 2 is a schematic view of a partial top-view cross-sectional structure of the heat-conducting plate of the present invention;
fig. 3 is a schematic view of the front cross-sectional structure of the fixing structure of the present invention;
fig. 4 is an enlarged schematic structural diagram of a in fig. 1 according to the present invention.
In the figure: 1. a fixed structure; 101. fastening a nut; 102. a placing groove; 103. a telescopic rod; 104. a tension spring; 2. a buffer structure; 201. a limiting groove; 202. a buffer spring; 203. a limiting rod; 204. a limiting block; 205. a rubber pad; 206. a card slot; 3. a heat dissipation plate; 4. an insulating ink layer; 5. a heat conducting plate; 6. a longitudinal heat dissipation groove; 7. a ground plane; 8. a connecting rod; 9. a first inner layer; 10. a second inner layer; 11. an element layer; 12. a power layer; 13. a dust-proof plate; 14. and a transverse heat dissipation groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: a drop-resistant multi-layer printed circuit board comprises a ground layer 7, a first inner layer 9, a second inner layer 10, an element layer 11 and a power layer 12, wherein a heat-conducting plate 5 is installed at the bottom end of the ground layer 7, longitudinal heat-radiating grooves 6 are uniformly installed in the heat-conducting plate 5, transverse heat-radiating grooves 14 are uniformly installed at the bottom end of the longitudinal heat-radiating grooves 6, the longitudinal heat-radiating grooves 6 are all positioned in the same horizontal plane, and the longitudinal heat-radiating grooves 6 are arranged in the heat-conducting plate 5 at equal intervals to enhance the heat-conducting capacity;
the bottom end of the heat conducting plate 5 is provided with the insulating ink layer 4, the heat conducting plate 5 arranged at the bottom end of the grounding layer 7 can play a certain role in heat dissipation, the circuit board is prevented from being damaged due to too high internal temperature during working, meanwhile, the longitudinal heat dissipation grooves 6 and the transverse heat dissipation grooves 14 uniformly arranged in the heat conducting plate 5 can enhance the heat dissipation capacity of the circuit board, and the insulating ink layer 4 can play a certain role in wear resistance on the circuit board;
a first inner layer 9 is installed at the top end of the grounding layer 7, a second inner layer 10 is installed at the top end of the first inner layer 9, a power supply layer 12 is installed at the top end of the second inner layer 10, element layers 11 are evenly installed at the top end of the power supply layer 12, a dust guard 13 is installed at the top end of the element layers 11, connecting rods 8 are installed at two sides of the bottom end of the dust guard 13, heat dissipation plates 3 are installed at two sides of the top end of a heat conduction plate 5, a buffer structure 2 is arranged at one side of each heat dissipation plate 3, each buffer structure 2 comprises a limiting groove 201, a buffer spring 202, a limiting rod 203, a limiting block 204, a rubber pad 205 and a clamping groove 206, the limiting grooves 201 are installed at the top end and the bottom end of one side of each heat dissipation plate 3, the buffer springs 202 are installed inside the limiting grooves 201, the limiting rods 203 are installed at one side of the, a clamping groove 206 is arranged on one side of each limiting block 204, the limiting grooves 201 are arranged in a C shape, and the limiting grooves 201 and the limiting rods 203 form a sliding structure so as to be convenient to move;
one side of the buffer spring 202 is connected with one side of the limiting rod 203, and the buffer spring 202 and the limiting rod 203 form a telescopic structure so as to be convenient to stretch;
the limiting rod 203 and the rubber pad 205 are designed vertically, the limiting rod 203 is symmetrically distributed about the vertical center of the rubber pad 205, when the circuit board accidentally drops, the heat dissipation plate 3 compresses the buffer spring 202, the limiting groove 201 moves towards the limiting rod 203, the circuit board has a certain buffering effect, and meanwhile, the rubber pad 205 can enhance the buffering effect on the circuit board to a certain extent, prevent electronic elements in the circuit board from being damaged, and prolong the service life of the circuit board;
fixed knot constructs 1 all is provided with on the top of heating panel 3, fixed knot constructs 1 including fastening nut 101, settling tank 102, telescopic link 103 and expanding spring 104, settling tank 102 all installs the top at heating panel 3, telescopic link 103 is all installed to the top and the bottom of settling tank 102 one side, expanding spring 104 is all installed in the outside of telescopic link 103, fastening nut 101 is all installed to the opposite side of settling tank 102, through the dust guard 13 of installing on 11 tops of component layer, dust guard 13 can play certain dustproof effect to the circuit board, when dust guard 13 needs to be changed, rotatory fastening nut 101, telescopic link 103 and expanding spring 104 resume, alright take off dust guard 13, change dust guard 13, and the operation is simple, and convenient for disassembly, finally, the work of falling type multilayer printed circuit board is prevented in the completion.
The working principle is as follows: when the circuit board is used, firstly, when the circuit board falls carelessly, the heat dissipation plate 3 compresses the buffer spring 202, the limiting groove 201 moves towards the limiting rod 203, the circuit board has a certain buffering effect, and meanwhile, the rubber pad 205 can enhance the buffering effect on the circuit board to a certain extent, prevent the electronic elements in the circuit board from being damaged, and prolong the service life of the circuit board;
then, the heat conducting plate 5 is arranged at the bottom end of the grounding layer 7, the heat conducting plate 5 can play a certain role in heat dissipation, the circuit board is prevented from being damaged due to too high internal temperature during working, meanwhile, the longitudinal heat dissipation grooves 6 and the transverse heat dissipation grooves 14 which are uniformly arranged in the heat conducting plate 5 can enhance the heat dissipation capacity of the circuit board, and the insulating ink layer 4 can play a certain role in wear resistance on the circuit board;
finally, through the dust guard 13 of installation on component layer 11 top, dust guard 13 can play certain dustproof effect to the circuit board, and when dust guard 13 needed to be changed, rotatory fastening nut 101, telescopic link 103 and expanding spring 104 resume, alright take off dust guard 13, change dust guard 13, easy operation, convenient to detach, the final work of accomplishing and preventing falling type multilayer printed circuit board.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. A prevent falling type multilayer printed circuit board, includes ground plane (7), first inlayer (9), second inlayer (10), component layer (11) and power layer (12), its characterized in that: the heat-conducting plate is characterized in that the heat-conducting plate (5) is installed at the bottom end of the grounding layer (7), longitudinal radiating grooves (6) are evenly installed inside the heat-conducting plate (5), transverse radiating grooves (14) are evenly installed at the bottom end of the longitudinal radiating grooves (6), the insulating ink layer (4) is installed at the bottom end of the heat-conducting plate (5), the first inner layer (9) is installed at the top end of the grounding layer (7), the second inner layer (10) is installed at the top end of the first inner layer (9), the power supply layer (12) is installed at the top end of the second inner layer (10), the element layer (11) is evenly installed at the top end of the power supply layer (12), the dustproof plate (13) is installed at the top end of the element layer (11), the connecting rods (8) are installed at two sides of the bottom end of the dustproof plate (13), the radiating plates (3) are installed at two sides of the top, buffer structure (2) are including spacing groove (201), buffer spring (202), gag lever post (203), stopper (204), rubber pad (205) and draw-in groove (206), top and bottom in heating panel (3) one side are all installed to spacing groove (201), buffer spring (202) are all installed to the inside of spacing groove (201), gag lever post (203) are all installed to one side of spacing groove (201), rubber pad (205) are all installed to one side of gag lever post (203), and stopper (204) are all installed to one side of rubber pad (205), draw-in groove (206) are all installed to one side of stopper (204), the top of heating panel (3) all is provided with fixed knot constructs (1).
2. A drop-resistant multilayer printed circuit board as claimed in claim 1, wherein: fixed knot constructs (1) including fastening nut (101), arrangement groove (102), telescopic link (103) and expanding spring (104), the top at heating panel (3) is all installed in arrangement groove (102), telescopic link (103) are all installed to the top and the bottom of arrangement groove (102) one side, expanding spring (104) are all installed in the outside of telescopic link (103), fastening nut (101) are all installed to the opposite side of arrangement groove (102).
3. A drop-resistant multilayer printed circuit board as claimed in claim 1, wherein: the limiting groove (201) is arranged in a C shape, and the limiting groove (201) and the limiting rod (203) form a sliding structure.
4. A drop-resistant multilayer printed circuit board as claimed in claim 1, wherein: one side of the buffer spring (202) is connected with one side of the limiting rod (203), and the buffer spring (202) and the limiting rod (203) form a telescopic structure.
5. A drop-resistant multilayer printed circuit board as claimed in claim 1, wherein: the limiting rod (203) and the rubber pad (205) are designed vertically, and the limiting rod (203) is symmetrically distributed around the vertical center of the rubber pad (205).
6. A drop-resistant multilayer printed circuit board as claimed in claim 1, wherein: the longitudinal radiating grooves (6) are all located in the same horizontal plane, and the longitudinal radiating grooves (6) are arranged in the heat conducting plate (5) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022103868.8U CN213244459U (en) | 2020-09-23 | 2020-09-23 | Anti-falling multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022103868.8U CN213244459U (en) | 2020-09-23 | 2020-09-23 | Anti-falling multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213244459U true CN213244459U (en) | 2021-05-18 |
Family
ID=75875780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022103868.8U Active CN213244459U (en) | 2020-09-23 | 2020-09-23 | Anti-falling multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213244459U (en) |
-
2020
- 2020-09-23 CN CN202022103868.8U patent/CN213244459U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2727959Y (en) | Radiator | |
| CN207460055U (en) | A kind of small-volume large-power electric machine controller | |
| CN213244459U (en) | Anti-falling multilayer printed circuit board | |
| CN216526998U (en) | Computer motherboard convenient to installation | |
| CN213340677U (en) | Heat dissipation tooth structure of communication filter cavity | |
| CN212727533U (en) | Multilayer PCB board convenient to heat dissipation | |
| CN104752066A (en) | Super-capacitor module | |
| CN204157199U (en) | Adherent radiating type printed circuit board heat-transfer device | |
| CN217742079U (en) | HDI circuit board of difficult rupture of high strength | |
| CN202889772U (en) | Heat radiation structure of circuit component | |
| CN203025635U (en) | Display card radiating device | |
| CN215582438U (en) | Thermoelectric separation copper substrate with excellent heat dissipation performance | |
| CN219919511U (en) | Connection backboard for circuit board | |
| CN211084025U (en) | High-efficient thermal diffusivity flexible circuit board that L ED lamp was used | |
| CN219285673U (en) | Computer motherboard that radiating effect is good | |
| CN217957385U (en) | Assembled circuit board with anticollision structure | |
| CN218336992U (en) | LED driver with built-in overvoltage protection | |
| CN202979545U (en) | Heat sink | |
| CN221103650U (en) | Multilayer PCB circuit board for liquid crystal display | |
| CN210840199U (en) | Heat balance type PCB | |
| CN220087724U (en) | Mainboard structure with TYPEC interface | |
| CN208904007U (en) | A kind of vibrationproof heat radiator aluminium profile | |
| CN206596327U (en) | A kind of graphite heat conducting medium | |
| CN213659326U (en) | Computer motherboard reinforcing apparatus | |
| CN220271853U (en) | External computer host heat abstractor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |