CN213244457U

CN213244457U - Partial pressure unit PCB board

Info

Publication number: CN213244457U
Application number: CN202022057403.3U
Authority: CN
Inventors: 蒋伟; 吕月平; 许俊; 李传连
Original assignee: Hipo Electrix Science & Technology Co ltd
Current assignee: Hipo Electrix Science & Technology Co ltd
Priority date: 2020-09-18
Filing date: 2020-09-18
Publication date: 2021-05-18
Anticipated expiration: 2030-09-18

Abstract

The utility model relates to a PCB board technical field, specific partial pressure unit PCB board that says so, which comprises a substrate, the base plate upper end is provided with and covers the copper layer, it is three to cover the copper layer and is cut apart into three unit, it is three the unit is high-pressure unit, ARC signal unit and partial discharge signal unit, every group respectively the unit all includes a plurality of encapsulation pads, a plurality of lead wire and a plurality of connection pad, through lead wire electric connection between encapsulation pad and the connection pad, it is provided with the synthetic resin fiber layer to cover copper layer up end, synthetic resin fiber layer up end is provided with the inoxidizing coating, evenly distributed has the louvre on the base plate. The utility model discloses cover the copper layer and cut apart into three unit, three unit is high-pressure unit, ARC signal unit and partial discharge signal unit respectively to concentrate on same PCB board with high pressure, ARC signal and partial discharge signal, make the PCB board functional stronger, shared area is littleer.

Description

Partial pressure unit PCB board

Technical Field

The utility model relates to a PCB board technical field specifically is a partial pressure unit PCB board.

Background

The PCB is a printed circuit board, also called printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. Sampling data in the existing PCB are independent sampling modules, and high voltage, ARC signals and local discharge signals are all independently arranged. For this reason, we propose a voltage division unit PCB board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a partial pressure unit PCB board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a partial pressure unit PCB board, includes the base plate, the base plate upper end is provided with covers the copper layer, it is cut apart into three unit to cover the copper layer, and is three the unit is high-voltage unit, ARC signal unit and partial discharge signal unit respectively, every group the unit all includes a plurality of encapsulation pads, a plurality of lead wire and a plurality of connection pad, through lead wire electric connection between encapsulation pad and the connection pad, it is provided with synthetic resin fiber layer to cover copper layer up end, synthetic resin fiber layer up end is provided with the inoxidizing coating, evenly distributed has the louvre on the base plate.

As a further optimization of the technical scheme, the substrate is an epoxy glass fiber fabric substrate.

As a further optimization of the technical scheme, the thickness of the substrate is 0.1mm-0.2 mm.

As a further optimization of the technical scheme, the substrate, the copper-clad layer, the synthetic resin fiber layer and the protective layer are all connected through adhesive layers, and the adhesive layers are epoxy resin adhesive layers.

Compared with the prior art, the beneficial effects of the utility model are that: the copper-clad layer of the utility model is divided into three units, the three units are respectively a high-voltage unit, an ARC signal unit and a local discharge signal unit, so that the high-voltage, the ARC signal and the local discharge signal are concentrated on the same PCB, the PCB has stronger functionality and smaller occupied area; through the setting of synthetic resin fibrous layer, when strengthening the structural strength of PCB board, improve the flexibility of PCB board, synthetic resin fibrous layer up end is provided with the inoxidizing coating, through the setting of inoxidizing coating, protects the PCB board, avoids external environment to cause the damage to the PCB board.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the copper-clad layer structure of the present invention.

In the figure: 1. a substrate; 2. coating a copper layer; 3. a high voltage unit; 4. an ARC signal unit; 5. a partial discharge signal unit; 6. packaging the bonding pad; 7. a lead wire; 8. a connection pad; 9. a synthetic resin fiber layer; 10. a protective layer; 11. and (4) heat dissipation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a partial pressure unit PCB board, includes base plate 1, it is specific, the thickness of base plate 1 is 0.1mm-0.2 mm, base plate 1 is the fine cloth base plate of epoxy glass for base plate 1's shock resistance type and stability are higher. The utility model discloses a packaging structure, including base plate 1, it includes base plate 6, ARC signal unit 4, partial discharge signal unit 5, every group to cover copper layer 2, it is three to cover copper layer 2 and be cut apart into three unit, three the unit is high-voltage unit 3, ARC signal unit 4 and partial discharge signal unit 5 respectively the unit all includes a plurality of encapsulation pads 6, a plurality of lead wire 7 and a plurality of connection pad 8, through lead wire 7 electric connection between encapsulation pad 6 and the connection pad 8.

Cover 2 up end in copper layer and be provided with synthetic resin fiber layer 9, through the setting of synthetic resin fiber layer 9, when strengthening the structural strength of PCB board, improve the flexibility of PCB board, 9 up end in synthetic resin fiber layer is provided with inoxidizing coating 10, through the setting of inoxidizing coating 10, protects the PCB board, avoids external environment to cause the damage to the PCB board.

The radiating holes 11 are uniformly distributed on the base plate 1, so that the radiating effect is achieved, and the service life of the PCB is prolonged.

Specifically, base plate 1, cover copper layer 2, synthetic resin fibrous layer 9 and inoxidizing coating 10 between all connect through the adhesive layer, the adhesive layer is the epoxy glue film, and the adhesion on epoxy glue film is strong for the PCB plate structure is more firm.

Specifically, when the copper-clad laminate is used, the copper-clad laminate 2 is divided into three units, namely a high-voltage unit 3, an ARC signal unit 4 and a local discharge signal unit 5, so that the high-voltage, ARC signals and local discharge signals are concentrated on the same PCB, the PCB is higher in functionality, and the occupied area is smaller; through the setting of synthetic resin fibrous layer 9, when strengthening the structural strength of PCB board, improve the flexibility of PCB board, synthetic resin fibrous layer 9 up end is provided with inoxidizing coating 10, through the setting of inoxidizing coating 10, protects the PCB board, avoids external environment to cause the damage to the PCB board.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A partial pressure unit PCB board, includes base plate (1), its characterized in that: the utility model discloses a packaging structure, including base plate (1), copper layer (2) is covered to the base plate upper end, it is three to cover copper layer (2) and is cut apart into three unit, three the unit is high-voltage unit (3), ARC signal unit (4) and partial discharge signal unit (5), every group respectively the unit all includes a plurality of encapsulation pads (6), a plurality of lead wire (7) and a plurality of connection pad (8), through lead wire (7) electric connection between encapsulation pad (6) and connection pad (8), it is provided with synthetic resin fibre layer (9) to cover copper layer (2) up end, synthetic resin fibre layer (9) up end is provided with inoxidizing coating (10), evenly distributed has louvre (11) on base plate (1).

2. The PCB board of claim 1, wherein: the substrate (1) is an epoxy glass fiber cloth substrate.

3. The PCB board of claim 1, wherein: the thickness of the substrate (1) is 0.1mm-0.2 mm.

4. The PCB board of claim 1, wherein: the base plate (1), the copper-clad layer (2), the synthetic resin fiber layer (9) and the protective layer (10) are connected through adhesive layers, and the adhesive layers are epoxy resin adhesive layers.