CN210840209U - Light-transmitting circuit board - Google Patents
Light-transmitting circuit board Download PDFInfo
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- CN210840209U CN210840209U CN201921137837.5U CN201921137837U CN210840209U CN 210840209 U CN210840209 U CN 210840209U CN 201921137837 U CN201921137837 U CN 201921137837U CN 210840209 U CN210840209 U CN 210840209U
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- transparent adhesive
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- adhesive layer
- light
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Abstract
The utility model discloses a light-transmitting circuit board, including substrate layer, first transparent adhesive layer, circuit layer, second transparent adhesive layer and protective layer, the substrate layer is equipped with the one deck, and the substrate layer adopts transparent PET material, and the two sides of substrate layer are equipped with respectively first transparent adhesive layer, first transparent adhesive layer adopt polyurethane resin to glue, are equipped with on the two-layer first transparent adhesive layer respectively the circuit layer is equipped with on the two-layer circuit layer respectively second transparent adhesive layer, second transparent adhesive layer adopt polyurethane resin to glue, are equipped with on the two-layer second transparent adhesive layer the protective layer, protective layer adopt transparent PET material, and the position that the protective layer is used for being connected with external device on the circuit layer is equipped with fretwork portion in order to expose the local on circuit layer. The utility model discloses a scheme makes whole circuit board only by the unable printing opacity of the part that the circuit layer covered, and all the other parts are transparent, and the both sides that can realize the circuit board after the LED chip is connected to the pad department electricity that corresponds on the circuit layer can all let light pierce through.
Description
Technical Field
The utility model relates to an electronic equipment field especially relates to light transmission circuit board.
Background
The circuit board is generally used for carrying circuits and circuit components so as to realize certain functions, and is a core component of electronic equipment. At present under some special operating modes, for example in the LED illumination field, need the practicality to bear the weight of the LED chip by non-light tight circuit board to ensure that the light-emitting of LED chip is at utmost not receive the hindrance of circuit board and reduced the light-emitting light efficiency. The scheme is generated.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the light-transmitting circuit board can meet the light-emitting requirement of the LED chip.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a light-transmitting circuit board, includes substrate layer, first transparent adhesive layer, circuit layer, second transparent adhesive layer and protective layer, the substrate layer is equipped with the one deck, and the substrate layer adopts transparent PET material, and the both sides of substrate layer are equipped with respectively first transparent adhesive layer, first transparent adhesive layer adopt polyurethane resin to glue, are equipped with on the two-layer first transparent adhesive layer respectively the circuit layer is equipped with on the two-layer circuit layer respectively second transparent adhesive layer, second transparent adhesive layer adopt polyurethane resin to glue, are equipped with on the two-layer second transparent adhesive layer the protective layer, protective layer adopt transparent PET material, and the position that the protective layer is used for being connected with external device on the circuit layer is equipped with fretwork portion in order to expose the part on circuit layer.
Further, the first transparent adhesive layer and the second transparent adhesive layer are made of polyurethane resin adhesive with the transmittance of more than 80.
Further, the coating thickness of the first transparent adhesive layer and the second transparent adhesive layer is 5-50 micrometers.
Further, the thickness of the base material layer is 25-300 microns.
Furthermore, the circuit layer is a copper foil circuit.
Further, the circuit layer is an aluminum foil circuit.
The beneficial effects of the utility model reside in that: the transparent PET is used as a base material, the circuit layers are bonded on two sides of the base material through transparent adhesive layers, so that only the part of the whole circuit board covered by the circuit layers cannot transmit light, and the rest parts are transparent; meanwhile, in order to protect the circuit layer, a protective layer is covered outside the circuit layer, and a hollow part is arranged on the protective layer only at a position on the circuit layer, which is required to be connected with an external device, to connect the external device.
Drawings
Fig. 1 is a cross-sectional view of a light-transmitting circuit board according to an embodiment of the present invention.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made in conjunction with the embodiments and the accompanying drawings.
The utility model discloses the most crucial design lies in: the base material, the glue and the protective layer are made of transparent materials, so that the circuit board is light-permeable.
The utility model provides a light-transmitting circuit board, includes substrate layer, first transparent adhesive layer, circuit layer, second transparent adhesive layer and protective layer, the substrate layer is equipped with the one deck, and the substrate layer adopts transparent PET material, and the both sides of substrate layer are equipped with respectively first transparent adhesive layer, first transparent adhesive layer adopt polyurethane resin to glue, are equipped with on the two-layer first transparent adhesive layer respectively the circuit layer is equipped with on the two-layer circuit layer respectively second transparent adhesive layer, second transparent adhesive layer adopt polyurethane resin to glue, are equipped with on the two-layer second transparent adhesive layer the protective layer, protective layer adopt transparent PET material, and the position that the protective layer is used for being connected with external device on the circuit layer is equipped with fretwork portion in order to expose the part on circuit layer.
From the above description, the beneficial effects of the present invention are: the transparent PET is used as a base material, the circuit layers are bonded on two sides of the base material through transparent adhesive layers, so that only the part of the whole circuit board covered by the circuit layers cannot transmit light, and the rest parts are transparent; meanwhile, in order to protect the circuit layer, a protective layer is covered outside the circuit layer, and a hollow part is arranged on the protective layer only at a position on the circuit layer, which is required to be connected with an external device, to connect the external device.
Further, the first transparent adhesive layer and the second transparent adhesive layer are made of polyurethane resin adhesive with the transmittance of more than 80.
From the above description, it can be known that the light extraction efficiency in practical use can be ensured by selecting a material with better transmittance as the adhesive layer.
Further, the coating thickness of the first transparent adhesive layer and the second transparent adhesive layer is 5-50 micrometers.
Further, the thickness of the base material layer is 25-300 microns.
Furthermore, the circuit layer is a copper foil circuit.
Further, the circuit layer is an aluminum foil circuit.
Referring to fig. 1, a first embodiment of the present invention is: a light-transmitting circuit board comprises a substrate layer 10, a first transparent adhesive layer 20, a circuit layer 30, a second transparent adhesive layer 40 and a protective layer 50.
The base material layer 10 is provided with a layer, the base material layer 10 is made of transparent PET materials, and the thickness of the base material layer 10 is 30 micrometers;
the two sides of the substrate layer 10 are respectively provided with the first transparent adhesive layer 20, the first transparent adhesive layer 20 is made of polyurethane resin adhesive with the transmittance of more than 80, and the coating thickness of the first transparent adhesive layer 20 is 10 micrometers;
the circuit layers 30 are respectively arranged on the two first transparent adhesive layers 20, the circuit layers 30 are copper foil circuits, and the circuit layers 30 distributed on the two sides of the base material layer 10 realize circuit connection by punching holes on the base material layer 10 and arranging electroplated layers in the holes;
the second transparent adhesive layers 40 are respectively arranged on the two circuit layers 30, the second transparent adhesive layers 40 are made of polyurethane resin adhesive with the transmittance of more than 80, and the coating thickness of the second transparent adhesive layers 40 is 8 micrometers;
the protective layer 50 is arranged on the two second transparent adhesive layers 40, the protective layer 50 is made of a transparent PET material, and a hollow portion is arranged at a position, which is used for being connected with an external device, of the protective layer 50 on the circuit layer 30 so as to expose a local portion of the circuit layer 30.
In other embodiments, the thickness of the first transparent adhesive layer 20 can also be 5 microns, 10 microns, 20 microns, 30 microns, 40 microns, and the like, and the maximum thickness is not more than 50 microns. The setting of specific thickness needs the external force size that the circuit board bore under the operating mode of circuit board in the in-service use determines, and the light transmissivity is higher the lower the glue film thickness, but the adhesion ratio that corresponds is lower.
In other embodiments, the thickness of the second transparent adhesive layer 40 may be the same as that of the first transparent adhesive layer, and may also be 5 microns, 10 microns, 20 microns, 30 microns, 40 microns, and the like, and the maximum thickness is not more than 50 microns. The second transparent adhesive layer is used for bonding the circuit layer and the protective layer, the protective layer can be used for isolating the circuit layer from being in contact with external air, the influence of the bonding strength between the circuit layer and the protective layer on the overall performance of the circuit board is small, and therefore the smaller the thickness of the second transparent adhesive layer is, the better the light emitting efficiency can be improved.
In other embodiments, the thickness of the substrate layer 10 may be 25 microns at a minimum and not more than 300 microns at a maximum.
In other embodiments, the wiring layer 30 may also use aluminum foil.
The above scheme can be realized according to the following process steps during specific manufacturing:
1. mixing polyurethane resin glue and a curing agent according to a certain proportion and uniformly stirring;
2. coating the material obtained in the step 1 on the surface of a PET substrate layer through a coating machine, and putting the PET substrate layer into an oven to dry at the temperature of 60-150 ℃;
3. bonding the circuit layer on the material obtained in the step (2), and putting the material into an oven to cure the circuit layer at the temperature of 40-80 ℃ for 72 hours;
4. coating a polyurethane resin adhesive on the PET protective layer, and performing roll-to-roll compounding with the material obtained in the step (3);
5. the protective layer is cut away where soldering is required on the wire, thereby exposing the pads.
To sum up, the utility model provides a light transmission circuit board luminousness is high, can guarantee that the LED lamps and lanterns of making with the LED chip of installing on this light transmission circuit board have the light-emitting light efficiency that meets the requirements.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (6)
1. A light-transmitting circuit board is characterized by comprising a substrate layer, a first transparent adhesive layer, a circuit layer, a second transparent adhesive layer and a protective layer,
the base material layer is provided with a layer and is made of transparent PET material,
the two sides of the substrate layer are respectively provided with the first transparent adhesive layer which adopts polyurethane resin adhesive,
the two first transparent adhesive layers are respectively provided with the circuit layer,
the second transparent adhesive layers are respectively arranged on the two circuit layers and adopt polyurethane resin adhesive,
be equipped with on two-layer second transparent adhesive layer the protective layer adopts transparent PET material, and the protective layer is used for being equipped with fretwork portion in order to expose the part on circuit layer with the position that external device is connected on the circuit layer.
2. The light-transmitting circuit board of claim 1, wherein the first transparent adhesive layer and the second transparent adhesive layer are made of polyurethane resin adhesive with a light transmittance of 80 or more.
3. The light-transmitting circuit board of claim 1, wherein the first transparent adhesive layer and the second transparent adhesive layer are coated to a thickness of 5-50 microns.
4. The light-transmitting circuit board of claim 1, wherein the substrate layer has a thickness of 25 to 300 microns.
5. The light-transmitting circuit board of claim 1, wherein the circuit layer is a copper foil circuit.
6. The light-transmitting circuit board of claim 1, wherein the circuit layer is an aluminum foil circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921137837.5U CN210840209U (en) | 2019-07-18 | 2019-07-18 | Light-transmitting circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921137837.5U CN210840209U (en) | 2019-07-18 | 2019-07-18 | Light-transmitting circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210840209U true CN210840209U (en) | 2020-06-23 |
Family
ID=71259276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921137837.5U Active CN210840209U (en) | 2019-07-18 | 2019-07-18 | Light-transmitting circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210840209U (en) |
-
2019
- 2019-07-18 CN CN201921137837.5U patent/CN210840209U/en active Active
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