CN213242494U - Wet oxidation device for semiconductor manufacturing - Google Patents

Wet oxidation device for semiconductor manufacturing Download PDF

Info

Publication number
CN213242494U
CN213242494U CN202022725732.0U CN202022725732U CN213242494U CN 213242494 U CN213242494 U CN 213242494U CN 202022725732 U CN202022725732 U CN 202022725732U CN 213242494 U CN213242494 U CN 213242494U
Authority
CN
China
Prior art keywords
motor
surface wall
wet oxidation
manufacturing
threaded rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022725732.0U
Other languages
Chinese (zh)
Inventor
张子运
王浩源
汪文坚
端雪峰
谢曙阳
黄笑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Nepes Semiconductor Co ltd
Original Assignee
Jiangsu Nepes Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Nepes Semiconductor Co ltd filed Critical Jiangsu Nepes Semiconductor Co ltd
Priority to CN202022725732.0U priority Critical patent/CN213242494U/en
Application granted granted Critical
Publication of CN213242494U publication Critical patent/CN213242494U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a wet oxidation device for manufacturing semiconductors, which comprises an installation platform, a switch is arranged on the surface wall of one side of the mounting table, a fixed seat is arranged at the bottom of the mounting table, a first motor is arranged on one side surface wall of the fixed seat through a motor frame, an output shaft of the first motor penetrates through one side surface wall of the fixed seat and is connected with a threaded rod in a rotating way, the top plate is arranged on the surface wall of one side of the fixed seat, one end of the threaded rod, which is far away from the first motor, is rotationally connected with the top plate through the moving shaft, the utility model is provided with the first motor, the rise and fall of the height of the CCD imaging device can be realized by the driving of the first motor, the imaging range is enlarged, when imaging observation is carried out, more accurate images and data information can be provided, and data support can be provided for the operation of an operator.

Description

Wet oxidation device for semiconductor manufacturing
Technical Field
The utility model belongs to the technical field of the semiconductor, concretely relates to wet process oxidation unit is used in semiconductor manufacturing.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, and the importance of the semiconductor is very great from the viewpoint of science and technology or economic development. Most of electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors, and common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one of various semiconductor material applications.
However, the existing wet oxidation device for manufacturing semiconductors in the market at present has some defects in the use process, for example, most of the devices can only support a small amount of semiconductors to perform independent operation when being used, the scale and the operation efficiency are low, the working time is often delayed in the actual use process, and the improvement of the manufacturing efficiency of enterprises is not facilitated.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wet process oxidation unit for semiconductor manufacturing to solve the convenience problem of current semiconductor manufacturing.
In order to achieve the above object, the utility model provides a following technical scheme: a wet oxidation device for semiconductor manufacturing comprises a mounting table, wherein a switch is mounted on one side surface wall of the mounting table, a fixed seat is mounted at the bottom of the mounting table, a first motor is mounted on one side surface wall of the fixed seat through a motor frame, an output shaft of the first motor penetrates through one side surface wall of the fixed seat to be rotatably connected with a threaded rod, a top plate is mounted on one side surface wall of the fixed seat, one end of the threaded rod, far away from the first motor, is rotatably connected with the top plate through a moving shaft, a moving block is arranged on one side surface of the threaded rod, a threaded hole is formed in one side surface wall of the moving block, the moving block is in threaded connection with the threaded rod through the threaded hole, a sliding rail is mounted on one side surface wall of the fixed seat, a sliding block is arranged on one side, close to the fixed, the first motor is electrically connected with the switch.
Preferably, the connection platform is installed to the bottom of mount table, the second motor is installed at the top of connection platform, the output shaft of second motor rotates and is connected with the drive wheel, the top of connecting the platform rotates through the loose axle and is connected with the intermittent type wheel, a poker rod is installed to a side table wall of drive wheel, the drive groove has been seted up to a side table wall of intermittent type wheel, the poker rod is connected with the drive groove transmission, second motor and switch electric connection.
Preferably, one side of one end of the intermittent wheel, which is far away from the connecting table, is provided with three reaction boxes, and heat sources are arranged in the three reaction boxes.
Preferably, a lifting frame is installed on one side surface wall of the motion block, a CCD imaging device is installed on one side surface wall of the lifting frame, and the CCD imaging device is electrically connected with the switch.
Preferably, the supporter is installed at the top of mount table, the internally mounted of supporter has the baffle.
Preferably, the bottom of the mounting table is provided with a mounting groove, and a base is mounted in the mounting groove.
Compared with the prior art, the utility model, following beneficial effect has:
(1) the utility model discloses set up first motor, can realize the rising and the decline of CCD image device height through the drive of first motor, the imaging range enlarges, can provide more accurate image and data information when imaging the observation, can provide data support for operating personnel's operation.
(2) The utility model discloses set up the second motor, be provided with a plurality of reaction boxes at the top of intermittent type wheel, enlarged the manufacturing scale of semiconductor, the incessant operation of three reaction box can be realized to the drive through the second motor, has improved production efficiency, has saved the manufacturing time.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a side sectional view of the present invention;
fig. 3 is a bottom cross-sectional view of the present invention;
fig. 4 is a top view of the present invention.
In the figure: 1. an installation table; 2. a switch; 3. a fixed seat; 4. a first motor; 5. a threaded rod; 6. a top plate; 7. a motion block; 8. a slide rail; 9. a connecting table; 10. a second motor; 11. a drive wheel; 12. a batch wheel; 13. a poke rod; 14. a reaction box; 15. a lifting frame; 16. a CCD imaging device; 17. a rack; 18. a base.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: a wet oxidation device for semiconductor manufacturing comprises a mounting table 1, a switch 2 is mounted on one side surface wall of the mounting table 1, a fixed seat 3 is mounted at the bottom of the mounting table 1, a first motor 4 is mounted on one side surface wall of the fixed seat 3 through a motor frame, the type of the first motor 4 is YS, an output shaft of the first motor 4 penetrates through one side surface wall of the fixed seat 3 to be rotatably connected with a threaded rod 5, a top plate 6 is mounted on one side surface wall of the fixed seat 3, one side of one end of the threaded rod 5, far away from the first motor 4, is rotatably connected with the top plate 6 through a moving shaft, a moving block 7 is arranged on one side surface of the threaded rod 5, a threaded hole is formed in one side surface wall of the moving block 7, the moving block 7 is in threaded connection with the threaded rod 5 through the threaded hole, a sliding rail 8 is mounted on one side surface wall of the fixed seat 3, a, the first motor 4 is electrically connected with the switch 2, and the rising and falling of the height of the CCD imaging device 16 can be realized by the driving of the first motor 4, so that the imaging range is enlarged.
In this embodiment, preferably, the connecting table 9 is installed at the bottom of the mounting table 1, the second motor 10 is installed at the top of the connecting table 9, the model of the second motor 10 is YS, the output shaft of the second motor 10 is rotatably connected with the driving wheel 11, the top of the connecting table 9 is rotatably connected with the intermittent wheel 12 through the movable shaft, the poking rod 13 is installed on one side surface wall of the driving wheel 11, the driving groove is formed in one side surface wall of the intermittent wheel 12, the poking rod 13 is in transmission connection with the driving groove, the second motor 10 is electrically connected with the switch 2, the uninterrupted operation of the three reaction boxes 14 can be realized, the production efficiency is improved, and the manufacturing time is saved.
In this embodiment, it is preferable that three reaction cassettes 14 are installed at one end of the intermittent wheel 12 away from the connecting table 9, a heat source is installed inside each of the three reaction cassettes 14, and the plurality of reaction cassettes 14 move without interruption, thereby enlarging the manufacturing scale of the semiconductor.
In this embodiment, preferably, a lifting frame 15 is installed on a side surface wall of the moving block 7, a CCD imaging device 16 is installed on a side surface wall of the lifting frame 15, and the CCD imaging device 16 is electrically connected to the switch 2, so that more accurate image and data information can be provided, and data support can be provided for the operation of an operator.
In this embodiment, preferred, supporter 17 is installed at the top of mount table 1, and the internally mounted of supporter 17 has the baffle, and the operating personnel of being convenient for improves the simple operation degree in the use of actual operation in-process.
In this embodiment, preferably, the bottom of the installation table 1 is provided with an installation groove, and a base 18 is installed in the installation groove, so that the vibration frequency of the equipment during operation is reduced, and the vibration range of the process during operation is ensured to meet the process standard.
The utility model discloses a theory of operation and use flow: when the wet oxidation device for semiconductor manufacturing is used, a plurality of semiconductor wafers needing wet oxidation are placed in a reaction box 14, a heat source in the reaction box 14 is started, a first motor 4 is started, the first motor 4 drives a threaded rod 5 to rotate, the threaded rod 5 drives a moving block 7 to move along a sliding rail 8, the moving block 7 drives a lifting frame 15 to move, the lifting frame 15 drives a CCD imaging device 16 to move, accurate images are observed, after the wet oxidation of the first semiconductor wafer is finished, a second motor 10 is started, the second motor 10 drives a driving wheel 11 to rotate, the driving wheel 11 drives a poking rod 13 to move, the poking rod 13 drives an intermittent wheel 12 to rotate, the intermittent wheel 12 drives three reaction boxes 14 to rotate, the semiconductor wafers needing wet oxidation are rotated to a preset position, and then the steps are repeated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A wet oxidation device for semiconductor manufacturing comprises a mounting table (1), wherein a switch (2) is mounted on one side surface wall of the mounting table (1), and the wet oxidation device is characterized in that: the bottom of the mounting table (1) is provided with a fixing seat (3), one side surface wall of the fixing seat (3) is provided with a first motor (4) through a motor frame, an output shaft of the first motor (4) penetrates through one side surface wall of the fixing seat (3) to be rotatably connected with a threaded rod (5), one side surface wall of the fixing seat (3) is provided with a top plate (6), one side of one end of the threaded rod (5), which is far away from the first motor (4), is rotatably connected with the top plate (6) through a movement shaft, one side surface of the threaded rod (5) is provided with a movement block (7), one side surface wall of the movement block (7) is provided with a threaded hole, the movement block (7) is in threaded connection with the threaded rod (5) through the threaded hole, one side surface wall of the fixing seat (3) is provided with a sliding rail (8), one side of the movement block (, the motion block (7) is connected with the sliding rail (8) in a sliding mode through a set sliding block, and the first motor (4) is electrically connected with the switch (2).
2. The wet oxidation apparatus for manufacturing a semiconductor according to claim 1, wherein: the utility model discloses a motor-driven intermittent type wheel, including mount table (1), connection platform (9), second motor (10) are installed at the top of connection platform (9), the output shaft of second motor (10) rotates and is connected with drive wheel (11), the top of connecting platform (9) is rotated through the loose axle and is connected with intermittent type wheel (12), poker rod (13) are installed to a side table wall of drive wheel (11), the drive groove has been seted up to a side table wall of intermittent type wheel (12), poker rod (13) are connected with the drive groove transmission, second motor (10) and switch (2) electric connection.
3. The wet oxidation apparatus for manufacturing a semiconductor according to claim 2, wherein: one end of the intermittent wheel (12) is far away from one side of the connecting table (9) and is provided with three reaction boxes (14), and heat sources are arranged inside the three reaction boxes (14).
4. The wet oxidation apparatus for manufacturing a semiconductor according to claim 1, wherein: lifting frame (15) are installed to one side table wall of motion piece (7), CCD image device (16) are installed to one side table wall of lifting frame (15), CCD image device (16) and switch (2) electric connection.
5. The wet oxidation apparatus for manufacturing a semiconductor according to claim 1, wherein: supporter (17) are installed at the top of mount table (1), the internally mounted of supporter (17) has the baffle.
6. The wet oxidation apparatus for manufacturing a semiconductor according to claim 1, wherein: the bottom of the mounting table (1) is provided with a mounting groove, and a base (18) is mounted in the mounting groove.
CN202022725732.0U 2020-11-23 2020-11-23 Wet oxidation device for semiconductor manufacturing Active CN213242494U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022725732.0U CN213242494U (en) 2020-11-23 2020-11-23 Wet oxidation device for semiconductor manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022725732.0U CN213242494U (en) 2020-11-23 2020-11-23 Wet oxidation device for semiconductor manufacturing

Publications (1)

Publication Number Publication Date
CN213242494U true CN213242494U (en) 2021-05-18

Family

ID=75883092

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022725732.0U Active CN213242494U (en) 2020-11-23 2020-11-23 Wet oxidation device for semiconductor manufacturing

Country Status (1)

Country Link
CN (1) CN213242494U (en)

Similar Documents

Publication Publication Date Title
CN213242494U (en) Wet oxidation device for semiconductor manufacturing
CN216015299U (en) Semiconductor separation monitoring device
CN212444726U (en) Semiconductor processing grinding device
CN211467025U (en) Cutting device for semiconductor processing with high cutting efficiency
CN113510870A (en) Semiconductor wafer cutting device
CN220074166U (en) Deckle edge grinding device is used in production of semiconductor connection piece
CN112013655A (en) Semiconductor chip baking device
CN218824565U (en) Multi-station test board for chip test
CN216310185U (en) Detection equipment for packaging semiconductor packaging integrated block
CN212991040U (en) Packaging equipment for semiconductor production
CN212257358U (en) Scribing device for semiconductor production and processing
CN213278046U (en) A push away material positioner for semiconductor processing
CN214136789U (en) Crystal bar slicing device for semiconductor processing
CN211938036U (en) Heat dissipation sheet cleaning device for display card
CN110335840B (en) Die bonding structure for semiconductor production
CN210435963U (en) Dustless grinder of semiconductor chip
CN218700291U (en) Chip cutting processing frock
CN212948541U (en) Cutting device for semiconductor production
CN214378347U (en) Automatic die cleaning device
CN216883295U (en) Burnishing device for semiconductor processing
CN117012699B (en) Automatic clamping device for semiconductor parts
CN218926316U (en) Punching mechanism for semiconductor aluminum plate
CN213080566U (en) Combined platform for welding based on radiating fins
CN213970537U (en) Polishing device used in semiconductor production process
CN218827025U (en) Charging tray handling device suitable for wafer

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant