CN220074166U - Deckle edge grinding device is used in production of semiconductor connection piece - Google Patents
Deckle edge grinding device is used in production of semiconductor connection piece Download PDFInfo
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- CN220074166U CN220074166U CN202321502987.8U CN202321502987U CN220074166U CN 220074166 U CN220074166 U CN 220074166U CN 202321502987 U CN202321502987 U CN 202321502987U CN 220074166 U CN220074166 U CN 220074166U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005498 polishing Methods 0.000 claims abstract description 39
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 239000002699 waste material Substances 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a burr polishing device for semiconductor connecting sheet production, which comprises a base, wherein two sides above the base are respectively fixed with a support frame, a fixed rod is fixed above the support frame, two sides below the fixed rod are respectively provided with an electric push rod, a movable frame is fixed below the electric push rod, a first electric sliding rail is arranged in front of the movable frame, one side of the first electric sliding rail is provided with a sliding block, one side of the sliding block is fixed with a connecting block, and a driving motor is fixed above the connecting block; this deckle edge grinding device is used in production of semiconductor connection piece uses through the cooperation of fixed block, servo motor, transmission shaft and spring clamping piece, and the both sides centre gripping of semiconductor connection piece is passed through the spring clamping piece when the device uses to the in-process has improved the stability of polishing, opens servo motor's switch, drives the transmission shaft and rotates to the staff of being convenient for overturns the semiconductor connection piece, polishes more comprehensively.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a burr polishing device for producing semiconductor connecting sheets.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, the importance of the semiconductor is very huge from the aspects of technology or economic development, most of electronic products such as computers, mobile phones or digital recorders and the semiconductor are provided with very closely related semiconductor connecting sheets which are devices made of the semiconductor, and polishing devices are needed to remove burrs in the processing process of the semiconductor connecting sheets.
In current chinese patent publication No. CN218658156U, burr removing device is used in circuit board production, including the middle part joint of base both sides has mobilizable adapting mechanism and the movable plate that upper surface mounting had small-size motor, the accessible fixture realizes the centre gripping to the circuit board both sides, when polishing the edge of circuit board, mobilizable catch bar drives the circuit board and removes, conveniently polish the different positions of coplanar, but this burr removing device is used in circuit board production can not overturn the circuit board when polishing, be inconvenient for polishing to circuit board both sides, consequently, need propose a burr grinding device is used in semiconductor connection piece production.
Disclosure of Invention
The utility model aims to provide a burr polishing device for semiconductor connecting sheet production, which solves the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a burr grinding device is used in production of semiconductor connection piece, includes the base, the top both sides of base all are fixed with the support frame, the top of support frame is fixed with the dead lever, electric putter is all installed to the below both sides of dead lever, electric putter's below is fixed with the fly frame, first electronic slide rail is installed in the place ahead of fly frame, the slider is installed to one side of first electronic slide rail, one side of slider is fixed with the connecting block, the top of connecting block is fixed with driving motor, the mounting disc is installed to driving motor's below output, the polishing head is installed to the below of mounting disc, both sides all are fixed with the fixed block around the base, top one side of fixed block is fixed with servo motor, the transmission shaft is installed to one side output of servo motor, spring clamping piece is installed to one side of transmission shaft, the waste bin has been seted up on the top surface of base.
Preferably, the movable frame forms a lifting structure with the support frame through an electric push rod, and the electric push rod is symmetrically arranged by the central axis of the movable frame.
Preferably, the polishing head forms a sliding structure with the movable frame through a first electric sliding rail, and the first electric sliding rail is matched with the sliding block for use.
Preferably, the spring clamping piece and the fixed block form a rotary structure through the transmission shaft, and the fixed block is symmetrically arranged by the central axis of the base.
Preferably, the second electric slide rail is all installed to the bottom both sides of chute, movable block is installed to one side of second electric slide rail, one side of movable block is fixed with the mounting bracket, the cleaning brush is installed to the below of mounting bracket.
Preferably, the cleaning brush and the waste tank form a sliding structure through the second electric sliding rail, and the length of the cleaning brush is smaller than that of the waste tank.
Preferably, a discharge hole is formed in the front surface of the base, and the discharge hole is arranged corresponding to the waste tank.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the burr polishing device for the production of the semiconductor connecting piece, through the cooperation of the fixed block, the servo motor, the transmission shaft and the spring clamping pieces, the two sides of the semiconductor connecting piece are clamped through the spring clamping pieces in the using process of the device, the polishing stability is improved, the switch of the servo motor is turned on, the transmission shaft is driven to rotate, so that a worker can conveniently turn over the semiconductor connecting piece, and polishing is more comprehensive;
2. according to the burr polishing device for the production of the semiconductor connecting piece, through the arrangement of the electric push rod, the movable frame, the first electric sliding rail, the sliding block and the connecting block, the height of the movable frame can be adjusted by opening the switch of the electric push rod, and meanwhile, the switch of the first electric sliding rail is opened to drive the connecting block to slide and drive the polishing head to move, so that different positions of the semiconductor connecting piece can be polished;
3. this deckle edge grinding device is used in production of semiconductor connection piece, through the setting of waste bin, second electronic slide rail, movable block, mounting bracket, cleaning brush and bin outlet, the sweeps that produce in polishing fall into the waste bin in, open the switch of second electronic slide rail, drive cleaning brush back-and-forth slip, can collect the sweeps from the bin outlet, avoided the sweeps to pile up a large amount and influence operational environment.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic structural view of a support frame according to the present utility model;
FIG. 3 is a schematic view of the structure of the polishing head of the present utility model;
FIG. 4 is a schematic view of the spring clip of the present utility model;
fig. 5 is a schematic view of the structure of the cleaning brush of the present utility model.
In the figure: 1. a base; 2. a support frame; 3. a fixed rod; 4. an electric push rod; 5. a movable frame; 6. a first electric slide rail; 7. a slide block; 8. a connecting block; 9. a driving motor; 10. a mounting plate; 11. polishing head; 12. a fixed block; 13. a servo motor; 14. a transmission shaft; 15. a spring clip; 16. a waste tank; 17. the second electric sliding rail; 18. a movable block; 19. a mounting frame; 20. a cleaning brush; 21. and a discharge port.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides the following technical solutions: the utility model provides a burr grinding device is used in production of semiconductor connection piece, the on-line screen storage device comprises a base 1, the top both sides of base 1 all are fixed with support frame 2, the top of support frame 2 is fixed with dead lever 3, electric putter 4 is all installed to the below both sides of dead lever 3, electric putter 4's below is fixed with movable frame 5, first electronic slide rail 6 is installed in the place ahead of movable frame 5, slider 7 is installed to one side of first electronic slide rail 6, one side of slider 7 is fixed with connecting block 8, the top of connecting block 8 is fixed with driving motor 9, mounting plate 10 is installed to driving motor 9's below output, polishing head 11 is installed to mounting plate 10's below, the front and back both sides of base 1 all are fixed with fixed block 12, top one side of fixed block 12 is fixed with servo motor 13, transmission shaft 14 is installed to one side output of servo motor 13, spring clamping piece 15 is installed to one side of transmission shaft 14, waste bin 16 has been seted up on the top surface of base 1.
In this embodiment, the movable frame 5 forms a lifting structure with the support frame 2 through the electric push rod 4, the electric push rod 4 is symmetrically arranged with the central axis of the movable frame 5, and the height of the movable frame 5 can be adjusted by opening the switch of the electric push rod 4, so as to adjust the height of the polishing head 11.
In this embodiment, the polishing head 11 forms a sliding structure with the movable frame 5 through the first electric sliding rail 6, the first electric sliding rail 6 is matched with the sliding block 7 for use, the switch of the first electric sliding rail 6 is opened, the connecting block 8 is driven to slide, the polishing head 11 is driven to move, and different positions of the semiconductor connecting sheet can be polished.
In this embodiment, the spring clamping piece 15 forms a rotating structure with the fixed block 12 through the transmission shaft 14, the fixed block 12 is symmetrically arranged with the central axis of the base 1, the switch of the servo motor 13 is opened, the transmission shaft 14 is driven to rotate, so that the semiconductor connecting piece is turned over by a worker conveniently, and the polishing is more comprehensive.
In this embodiment, the second electric slide rail 17 is all installed to the bottom both sides of the waste bin 16, and movable block 18 is installed to one side of second electric slide rail 17, and one side of movable block 18 is fixed with mounting bracket 19, and cleaning brush 20 is installed to the below of mounting bracket 19, can collect the sweeps that produce of polishing through waste bin 16, has improved the practicality of the device.
In this embodiment, the cleaning brush 20 forms a sliding structure with the waste tank 16 through the second electric sliding rail 17, the length of the cleaning brush 20 is smaller than that of the waste tank 16, the switch of the second electric sliding rail 17 is turned on, the cleaning brush 20 is driven to slide back and forth, and the waste scraps can be swept out from the discharge hole 21 for collection.
In this embodiment, the front surface of the base 1 is provided with the discharge opening 21, the discharge opening 21 is correspondingly arranged with the waste tank 16, and the arrangement of the discharge opening 21 and the waste tank 16 can uniformly treat the waste scraps, so that the influence of a large amount of accumulation of the waste scraps on the working environment is avoided.
Working principle: when the burr polishing device for semiconductor connecting piece production is used, an external power supply is firstly connected, then two sides of the semiconductor connecting piece are clamped through the spring clamping piece 15, polishing stability is improved, then a switch of the electric push rod 4 is opened, the polishing head 11 is driven to a proper height, the switch of the driving motor 9 is opened to drive the polishing head 11 to rotate so as to polish burrs of the connecting piece, then the switch of the first electric slide rail 6 is opened, the connecting block 8 is driven to slide, the polishing head 11 is driven to move, the semiconductor connecting piece can be polished at different positions, the switch of the servo motor 13 is opened, the transmission shaft 14 is driven to rotate, the semiconductor connecting piece can be overturned, finally scraps produced in polishing fall into the scrap groove 16, the switch of the second electric slide rail 17 is opened, the cleaning brush 20 is driven to slide back and forth, the scraps can be swept out from the discharge port 21 to be collected, the external power supply of the device is cut off when the device is not used, the model numbers TJC-C1-T3-P of the device, the model numbers of the first electric slide rail 6 and the second electric slide rail 17 are P45, the model numbers of the motor 9 and the model numbers of the motor 9-D2-T3-P-P are respectively, and the model numbers of the semiconductor connecting piece can be produced by using the servo motor 2S and the polishing device, and the model numbers of ZD 2-S-132 are respectively, and the model numbers of the manufacturing processes are used.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a semiconductor connection piece production is with deckle edge grinding device, includes base (1), its characterized in that: the utility model discloses a waste bin, including base (1), base, driving motor (9), fixed lever (3), electric putter (4) are all installed to the top both sides of base (1), electric putter (4) are all installed in the below both sides, electric putter (4) are fixed with adjustable shelf (5), first electronic slide rail (6) are installed in the place ahead of adjustable shelf (5), slider (7) are installed to one side of first electronic slide rail (6), one side of slider (7) is fixed with connecting block (8), the top of connecting block (8) is fixed with driving motor (9), mounting disc (10) are installed to driving motor's (9) below output, polishing head (11) are installed to the below of mounting disc (10), both sides all are fixed with fixed block (12) around base (1), one side output of servo motor (13) installs transmission shaft (14), one side of transmission shaft (14) is fixed with servo motor (13), waste bin (16) are seted up on one side of clamping piece (16) of spring (1).
2. The burr polishing device for semiconductor connecting sheet production according to claim 1, wherein the movable frame (5) and the supporting frame (2) form a lifting structure through an electric push rod (4), and the electric push rod (4) is symmetrically arranged by a central axis of the movable frame (5).
3. The burr polishing device for semiconductor connecting sheet production according to claim 1, wherein the polishing head (11) forms a sliding structure with the movable frame (5) through a first electric sliding rail (6), and the first electric sliding rail (6) is matched with the sliding block (7).
4. The burr polishing device for semiconductor connecting sheet production according to claim 1, wherein the spring clamping piece (15) and the fixed block (12) form a rotary structure through the transmission shaft (14), and the fixed block (12) is symmetrically arranged with the central axis of the base (1).
5. The burr polishing device for semiconductor connecting sheet production according to claim 1, wherein the second electric slide rail (17) is installed on two sides of the bottom of the waste tank (16), a movable block (18) is installed on one side of the second electric slide rail (17), a mounting frame (19) is fixed on one side of the movable block (18), and a cleaning brush (20) is installed below the mounting frame (19).
6. The burr polishing device for semiconductor connecting sheet production according to claim 5, wherein the cleaning brush (20) and the waste tank (16) form a sliding structure through the second electric sliding rail (17), and the length of the cleaning brush (20) is smaller than that of the waste tank (16).
7. The burr polishing device for semiconductor connecting sheet production according to claim 1, wherein a discharge opening (21) is formed in the front surface of the base (1), and the discharge opening (21) is arranged corresponding to the waste tank (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321502987.8U CN220074166U (en) | 2023-06-13 | 2023-06-13 | Deckle edge grinding device is used in production of semiconductor connection piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321502987.8U CN220074166U (en) | 2023-06-13 | 2023-06-13 | Deckle edge grinding device is used in production of semiconductor connection piece |
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| CN220074166U true CN220074166U (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202321502987.8U Active CN220074166U (en) | 2023-06-13 | 2023-06-13 | Deckle edge grinding device is used in production of semiconductor connection piece |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117600951A (en) * | 2024-01-04 | 2024-02-27 | 山西恒强电力科技有限公司 | Aluminum alloy forging deburring device and application method thereof |
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2023
- 2023-06-13 CN CN202321502987.8U patent/CN220074166U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117600951A (en) * | 2024-01-04 | 2024-02-27 | 山西恒强电力科技有限公司 | Aluminum alloy forging deburring device and application method thereof |
| CN117600951B (en) * | 2024-01-04 | 2024-03-29 | 山西恒强电力科技有限公司 | Aluminum alloy forging deburring device and application method thereof |
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