CN112013655A

CN112013655A - Semiconductor chip baking device

Info

Publication number: CN112013655A
Application number: CN202010833358.8A
Authority: CN
Inventors: 李双玉
Original assignee: Yongming Technology Shanghai Co ltd
Current assignee: Yongming Technology Shanghai Co ltd
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2020-12-01

Abstract

The invention relates to the technical field of semiconductor chip production, and discloses a semiconductor chip baking device which comprises an oven and a semiconductor chip, wherein the front end of the left side of the oven is rotatably connected with a box door through a hinge, the middle part of the inner wall of the top end of the oven is communicated with a fan bin in a penetrating manner, and a blower and an electric heating wire are fixedly arranged in the fan bin. According to the invention, the bottom end of the pressing block can be pushed to move out of the accommodating groove to be attached to the upper surface of the rear end of the semiconductor chip through the elastic force of the spring, the semiconductor chip is further fixed, the PLC controls the electric heating wire to work and heat to a specified temperature, the hot air blown out from the fan bin is used for baking the semiconductor chip in the through groove, the driving motor is controlled to work, the semiconductor chip can be driven to rotate through the first rotating rod, so that the baking operation is automatically performed on the upper surface and the lower surface of the semiconductor chip, the pressing block is pulled to move upwards by the handle to be accommodated in the accommodating groove, the baked semiconductor chip is conveniently taken down, and the operation is convenient and rapid.

Description

Semiconductor chip baking device

Technical Field

The invention relates to the technical field of semiconductor chip production, in particular to a semiconductor chip baking device.

Background

The semiconductor chip is a semiconductor device which is made by etching and wiring on a semiconductor wafer and can realize a certain function, not only is a silicon chip, but also commonly comprises semiconductor materials such as gallium arsenide, germanium and the like, in order to meet the requirement of mass production, the electrical property of the semiconductor must be predictable and stable, and therefore, the purity of dopants and the quality of a semiconductor lattice structure must be strictly required;

through the retrieval of the public number, i CN105977189A, the diode chip baking device comprises a box body, heating pipes are uniformly distributed in the box body, a baking rack is arranged in the box body, the baking rack comprises a support and a plurality of layers of trays, a support frame for supporting the trays is arranged in the support, a base movably connected with the box body is arranged at the bottom of the support, a support corresponding to the base is arranged at the bottom of the box body, pulleys are arranged between the base and the support, filter paper is arranged in the trays, handles are symmetrically arranged on two sides of the support, and a heat dissipation area is arranged at the top of the;

in the process of implementing the invention, the inventor finds that at least the following problems in the prior art are not solved, wherein 1, only one side of the chip can be baked, when the other side of the chip needs to be baked, a worker needs to manually turn over the chip, the labor intensity of the worker is increased, and 2, due to the fact that the temperature is high in the chip baking process, the turning operation needs to be carried out after the chip is cooled, and the working efficiency is reduced.

Disclosure of Invention

The invention aims to provide a semiconductor chip baking device, which solves the problems in the prior art.

In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor chip baking device comprises an oven and a semiconductor chip, wherein the left front end of the oven is rotatably connected with a box door through a hinge, the middle part of the inner wall at the top end of the oven is communicated with a fan bin in a penetrating manner, a fan and a heating wire are fixedly arranged in the fan bin, the fan is arranged right above the heating wire, a mounting groove is formed in the middle part of the inner wall at the left side of the oven, a bearing is fixedly arranged in the inner part of the mounting groove, a driving motor is fixedly arranged in the middle part of the right side of the oven, a motor shaft of the driving motor penetrates through the inner wall at the right side of the oven and is fixedly connected with a first rotating rod, the left end of the first rotating rod is fixedly connected with the middle part at the right side of a fixed plate, a second rotating rod is horizontally and fixedly arranged in the middle part at, lead to groove left side inner wall, right side inner wall and rear side inner wall and all seted up the fixed slot, semiconductor chip's left end, right-hand member and rear end run through the fixed slot and the swing joint that lead to groove left side, right side and rear side respectively, the top inner wall middle part of leading to groove rear side fixed slot has been seted up and has been accomodate the groove, the vertical run-through in top inner wall middle part of accomodating the groove has been seted up the guide slot, the inside swing joint of guide slot has the guide arm, the top fixed mounting of guide arm has the handle, the inside swing joint who accomodates the groove has the briquetting, the bottom of guide arm and the upper surface middle part fixed connection of briquetting, the outside cover of guide arm lower extreme is equipped with the spring, the inslot is accomodate in to the spring is arranged in.

As a preferred embodiment of the invention, the middle parts of the left and right inner walls of the accommodating groove are vertically and symmetrically provided with limiting grooves, the left and right sides of the top end of the pressing block are symmetrically provided with limiting blocks, and the limiting grooves are in sliding connection with the limiting blocks.

In a preferred embodiment of the present invention, the bottom side of the pressing block is bonded with a rubber pad by strong glue.

In a preferred embodiment of the present invention, four corners of the bottom side of the oven are vertically provided with connecting grooves, and the connecting grooves are internally and threadedly connected with support legs.

As a preferred embodiment of the present invention, the top end of the fan housing is horizontally and fixedly installed with a filter screen plate by a bolt.

As a preferred embodiment of the present invention, the bottom end of the fan chamber is communicated with an air guiding groove, and the air guiding groove is funnel-shaped.

In a preferred embodiment of the present invention, the input terminal of the PLC controller is electrically connected to an external power source through a wire, and the output terminal of the PLC controller is electrically connected to the input terminals of the blower and the heating wire through a wire.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention respectively penetrates the left end, the right end and the rear end of a semiconductor chip through fixing grooves at the left side, the right side and the rear side of a through groove, a spring is sleeved outside the lower end of a guide rod, a pressing block is connected inside the containing groove in a sliding manner, the bottom end of the pressing block can be pushed to move out of the containing groove to be attached to the upper surface of the rear end of the semiconductor chip through the elastic force of the spring, the semiconductor chip is further fixed, a PLC controller controls an electric heating wire to work and heat to a specified temperature, a blower to work is controlled, hot air blown out of a fan bin carries out baking operation on the semiconductor chip inside the through groove, a driving motor is controlled to work, the semiconductor chip inside a fixing plate can be driven to rotate through a first rotating rod, so that the upper surface and the lower surface of the semiconductor chip are automatically baked, the working efficiency is high, when the baked semiconductor chip needs to be taken, the baked semiconductor chip is convenient to take down, and the operation is convenient and fast.

2. According to the semiconductor chip fixing device, the limiting groove is connected with the limiting block in a sliding mode, so that the pressing block can be limited, the pressing block is prevented from moving out of the accommodating groove, the moving stability of the pressing block can be improved, and the pressing block is prevented from inclining in the moving process and affecting the fixing effect of the pressing block on the semiconductor chip.

3. According to the invention, the filter screen plate is horizontally and fixedly arranged at the top end of the fan bin through the bolt, and the filter screen plate can filter dust in the outside air, so that the dust in the air is prevented from entering the oven and being adhered to the surface of the semiconductor chip to influence the use effect.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic diagram of an overall structure of a semiconductor chip baking apparatus according to the present invention;

FIG. 2 is a top view of a fixing plate of the baking apparatus for semiconductor chips according to the present invention;

FIG. 3 is a front view of a fixing plate of the baking apparatus for semiconductor chips in accordance with the present invention;

FIG. 4 is a schematic view of a portion A of a semiconductor chip baking apparatus according to the present invention.

In the figure: 1. an oven; 2. a hinge; 3. a box door; 4. a fan bin; 5. a blower; 6. an electric heating wire; 7. a bolt; 8. a filter screen plate; 9. a wind guide groove; 10. mounting grooves; 11. a bearing; 12. a drive motor; 13. a first rotating lever; 14. a fixing plate; 15. a second rotating lever; 16. a through groove; 17. fixing grooves; 18. a semiconductor chip; 19. a receiving groove; 20. a guide groove; 21. a guide bar; 22. a handle; 23. briquetting; 24. a spring; 25. a limiting groove; 26. a limiting block; 27. a rubber pad; 28. connecting grooves; 29. supporting legs; 30. an air outlet; 31. a PLC controller.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention; in the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor chip baking device comprises an oven 1 and a semiconductor chip 18, wherein the left front end of the oven 1 is rotatably connected with a box door 3 through a hinge 2, the middle part of the inner wall at the top end of the oven 1 is communicated with a fan bin 4 in a penetrating way, the inside fixed mounting of the fan bin 4 is provided with a blower 5 and a heating wire 6, the blower 5 is arranged right above the heating wire 6, the middle part of the inner wall at the left side of the oven 1 is provided with a mounting groove 10, the inside fixed mounting of the mounting groove 10 is provided with a bearing 11, the middle part of the right side of the oven 1 is fixedly provided with a driving motor 12, the motor shaft of the driving motor 12 penetrates through the inner wall at the right side of the oven 1 and is fixedly connected with a first rotating rod 13, the left end of the first rotating rod 13 is fixedly connected with the middle part of the right side of a fixing plate 14, the horizontal middle part of, a through groove 16 is formed in the middle of the front side of the fixing plate 14, fixing grooves 17 are formed in the left inner wall, the right inner wall and the rear inner wall of the through groove 16, the left end, the right end and the rear end of the semiconductor chip 18 respectively penetrate through the fixing grooves 17 in the left side, the right side and the rear side of the through groove 16 and are movably connected, an accommodating groove 19 is formed in the middle of the inner wall of the top end of the rear fixing groove 17 of the through groove 16, a guide groove 20 is vertically formed in the middle of the inner wall of the top end of the accommodating groove 19 in a penetrating manner, a guide rod 21 is movably connected inside the guide groove 20, a handle 22 is fixedly mounted at the top end of the guide rod 21, a pressing block 23 is movably connected inside the accommodating groove 19, the bottom end of the guide rod 21 is fixedly connected with the middle of the upper surface of the pressing block 23, a spring 24 is sleeved outside, the upper end of the right side of the oven 1 is provided with a PLC (programmable logic controller) 31, a spring 24 is sleeved outside the lower end of a guide rod 21, a pressing block 23 is connected inside the accommodating groove 19 in a sliding manner, the bottom end of the pressing block 23 can be pushed to move out of the accommodating groove 19 to be attached to the upper surface of the rear end of the semiconductor chip 18 through the elastic force of the spring 24, the semiconductor chip 18 is further fixed, the PLC 31 controls the electric heating wire 6 to work and heat to a specified temperature, the blower 5 to work, the hot air blown out from the fan bin 4 is used for baking the semiconductor chip 18 inside the through groove 16, the driving motor 12 is controlled to work, the first rotating rod 13 can drive the semiconductor chip 18 inside the fixing plate 14 to rotate, so that the upper surface and the lower surface of the semiconductor chip 18 are automatically baked, the working efficiency is high, when the baked semiconductor chip 18 needs to be taken down, the pressing block 23 is pulled by the, the baked semiconductor chip 18 is convenient and quick to take down.

In this embodiment (please refer to fig. 4), the middle portions of the left and right inner walls of the accommodating groove 19 are vertically and symmetrically provided with limiting grooves 25, the left and right sides of the top end of the pressing block 23 are symmetrically provided with limiting blocks 26, the limiting grooves 25 are slidably connected with the limiting blocks 26, on one hand, the pressing block 23 can be limited, the pressing block 23 is prevented from moving out of the accommodating groove 19, on the other hand, the moving stability of the pressing block 23 can be improved, and the pressing block 23 is prevented from being inclined in the moving process to influence the fixing effect of the pressing block 23 on the semiconductor chip 18.

In this embodiment (see fig. 4), the rubber pad 27 is adhered to the bottom side of the pressing block 23 by strong glue, so as to prevent the pressing block 23 from wearing the outer side of the semiconductor chip 18 when pressing and fixing the semiconductor chip 18.

In this embodiment (see fig. 1), the four corners of the bottom side of the oven 1 are vertically provided with connecting slots 28, the internal threads of the connecting slots 28 are connected with supporting legs 29, and the supporting legs 29 are rotated, so that the stability of the oven 1 is conveniently adjusted.

In this embodiment (see fig. 1), a filter screen plate 8 is horizontally and fixedly installed at the top end of the fan chamber 4 through a bolt 7, and the filter screen plate 8 can filter dust in the outside air, so as to prevent the dust in the air from entering the oven 1 and adhering to the surface of the semiconductor chip 18 to affect the use effect.

In this embodiment (see fig. 1), the bottom end of the fan chamber 4 is communicated with the air guiding groove 9, and the air guiding groove 9 is funnel-shaped, so as to improve the baking efficiency of the semiconductor chip 18.

In this embodiment (see fig. 1), the input end of the PLC controller 31 is electrically connected to an external power source through a wire, and the output end of the PLC controller 31 is electrically connected to the input ends of the blower 5 and the heating wire 6 through a wire.

When a semiconductor chip baking device is used, it should be noted that the present invention is a semiconductor chip baking device, including an oven 1, a hinge 2, a box door 3, a blower cabin 4, a blower 5, an electric heating wire 6, a bolt 7, a filter screen 8, an air guide groove 9, a mounting groove 10, a bearing 11, a driving motor 12, a first rotating rod 13, a fixing plate 14, a second rotating rod 15, a through groove 16, a fixing groove 17, a semiconductor chip 18, a storage groove 19, a guide groove 20, a guide rod 21, a handle 22, a pressing block 23, a spring 24, a limiting groove 25, a limiting block 26, a rubber pad 27, a connecting groove 28, a supporting leg 29, an air outlet 30, a PLC controller 31, and components that are all common standard components or components known by those skilled in the art, and the structure and principle thereof can be known by the technical manual or by a conventional experimental method.

When in use, the left end, the right end and the rear end of the semiconductor chip 18 respectively penetrate through the fixing grooves 17 at the left side, the right side and the rear side of the through groove 16, the spring 24 is sleeved outside the lower end of the guide rod 21, the pressing block 23 is connected inside the accommodating groove 19 in a sliding manner, the bottom end of the pressing block 23 can be pushed to move out of the accommodating groove 19 to be attached to the upper surface of the rear end of the semiconductor chip 18 through the elastic force of the spring 24, the semiconductor chip 18 is further fixed, the PLC 31 controls the electric heating wire 6 to work and heat to a specified temperature, the blower 5 is controlled to work, the hot air blown out from the fan bin 4 carries out baking operation on the semiconductor chip 18 inside the through groove 16, the driving motor 12 is controlled to work, the semiconductor chip 18 inside the fixing plate 14 can be driven to rotate through the first rotating rod 13, thereby automatically baking operation is carried out, when the semiconductor chip 18 after baking needs to be taken down, the pressing block 23 is pulled by the handle 22 to move upwards to be accommodated in the accommodating groove 19, the semiconductor chip 18 after baking is conveniently taken down, the supporting leg 29 is rotated conveniently and rapidly, the stability of the oven 1 is conveniently adjusted, the bolt 7 is removed, and the filter screen plate 8 is conveniently replaced and cleaned.

While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor chip baking apparatus comprising an oven (1) and a semiconductor chip (18), characterized in that: the oven is characterized in that a box door (3) is rotatably connected to the left front end of the oven (1) through a hinge (2), a fan bin (4) is communicated with the middle of the inner wall of the top end of the oven (1) in a penetrating manner, a blower (5) and a heating wire (6) are fixedly mounted inside the fan bin (4), the blower (5) is arranged right above the heating wire (6), a mounting groove (10) is formed in the middle of the inner wall of the left side of the oven (1), a bearing (11) is fixedly mounted inside the mounting groove (10), a driving motor (12) is fixedly mounted in the middle of the right side of the oven (1), a motor shaft of the driving motor (12) penetrates through the inner wall of the right side of the oven (1) and is fixedly connected with a first rotating rod (13), the left end of the first rotating rod (13) is fixedly connected with the middle of the right side of a fixed plate (14), the left end of the second rotating rod (15) penetrates through a middle shaft of the bearing (11) and is fixedly connected with the middle shaft, a through groove (16) is formed in the middle of the front side of the fixing plate (14), fixing grooves (17) are formed in the left inner wall, the right inner wall and the rear inner wall of the through groove (16), the left end, the right end and the rear end of the semiconductor chip (18) penetrate through the fixing grooves (17) in the left side, the right side and the rear side of the through groove (16) respectively and are movably connected with one another, an accommodating groove (19) is formed in the middle of the inner wall at the top end of the fixing groove (17) at the rear side of the through groove (16), a guide groove (20) is vertically formed in the middle of the inner wall at the top end of the accommodating groove (19) in a penetrating manner, a guide rod (21) is movably connected with the inside of the guide groove (20), a handle (22) is fixedly installed at the top end of the guide rod (21, the outside cover of guide arm (21) lower extreme is equipped with spring (24), in accomodating groove (19) was arranged in spring (24), a plurality of groups exhaust vent (30) have been seted up in the bottom on oven (1) right side run through, oven (1) right side upper end is provided with PLC controller (31).

2. The semiconductor chip baking apparatus according to claim 1, wherein: accomodate groove (19) left side and the vertical symmetry in middle part of right side inner wall and seted up spacing groove (25), stopper (26) are installed to the left side and the right side symmetry on briquetting (23) top, spacing groove (25) and stopper (26) sliding connection.

3. The semiconductor chip baking apparatus according to claim 1, wherein: the bottom side of the pressing block (23) is bonded with a rubber pad (27) through strong glue.

4. The semiconductor chip baking apparatus according to claim 1, wherein: connecting grooves (28) are vertically formed in four corners of the bottom side of the oven (1), and supporting legs (29) are connected to the inner portions of the connecting grooves (28) in a threaded mode.

5. The semiconductor chip baking apparatus according to claim 1, wherein: the top end of the fan bin (4) is horizontally and fixedly provided with a filter screen plate (8) through a bolt (7).

6. The semiconductor chip baking apparatus according to claim 1, wherein: the bottom end of the fan bin (4) is communicated with an air guide groove (9), and the air guide groove (9) is funnel-shaped.

7. The semiconductor chip baking apparatus according to claim 1, wherein: the input end of the PLC (31) is electrically connected with an external power supply through a lead, and the output end of the PLC (31) is electrically connected with the input ends of the blower (5) and the electric heating wire (6) through leads.