CN211467025U - Cutting device for semiconductor processing with high cutting efficiency - Google Patents
Cutting device for semiconductor processing with high cutting efficiency Download PDFInfo
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- CN211467025U CN211467025U CN201922444112.7U CN201922444112U CN211467025U CN 211467025 U CN211467025 U CN 211467025U CN 201922444112 U CN201922444112 U CN 201922444112U CN 211467025 U CN211467025 U CN 211467025U
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Abstract
The utility model belongs to the field of semiconductor processing, and particularly discloses a cutting device for semiconductor processing with high cutting efficiency, which comprises a base, a cutting platform, a support frame and a cutting mechanism, wherein the base is provided with a cavity, a conveying motor is arranged in the cavity, and the cutting platform is arranged at the top of the base; the cutting platform is provided with a conveying assembly, the end part of the cutting platform is fixedly provided with a support frame, the conveying assembly is arranged on the inner side of the support frame and is driven by a conveying motor through a transmission belt, and the conveying assembly comprises a first belt pulley and a second belt pulley which are linked through a belt; the cutting mechanism is arranged at the bottom end part of the support frame and comprises a support plate, a fixed plate, a driving assembly, a cutting assembly and a cam, the support plate and the fixed plate are fixedly arranged on two sides of the support frame respectively, and a sliding groove is formed in the top end part of the support plate. The utility model provides a prior art's semiconductor cutting device adopt manual operation business turn over material, not only can consume a large amount of labours, leads to the slow problem of cutting progress moreover, has good production efficiency.
Description
Technical Field
The utility model relates to a semiconductor processing field specifically is an efficient cutting device for semiconductor processing of cutting.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like. Such as diodes, are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view.
The semiconductor is processed and need be cut into equal size according to required size, but current semiconductor cutting device still has some weak points when using, for example need the staff to move the semiconductor material to the cutting knife under and cut, has not only reduced the cutting progress, has also increased staff's work load, and then causes the availability factor to cutting device and reduces.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an efficient cutting device for semiconductor processing cuts to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a cutting device with high cutting efficiency for semiconductor processing comprises a base, a cutting platform, a support frame and a cutting mechanism, wherein the base is provided with a cavity, a conveying motor is arranged in the cavity, and the cutting platform is arranged at the top of the base; the cutting platform is provided with a conveying assembly, a support frame is fixedly arranged at the end part of the cutting platform, the conveying assembly is arranged on the inner side of the support frame and is driven by a conveying motor through a transmission belt, and the conveying assembly comprises a first belt pulley and a second belt pulley which are linked through a belt; the cutting mechanism is arranged at the bottom end part of the support frame and comprises a support plate, a fixed plate, a driving assembly, a cutting assembly and a cam, the support plate and the fixed plate are fixedly arranged at two sides of the support frame respectively, and a sliding groove is formed in the top end part of the support plate; the sliding groove is connected with a push plate in a sliding mode, the top of the push plate is provided with a rack, and the end portion, close to the fixed plate, of one side of the push plate is connected with the cam through a connecting plate.
Preferably, the cutting assembly comprises a first guide rail frame, a second guide rail frame, a blade seat and a cutter, the first guide rail frame is fixedly arranged on the fixed plate, and the second guide rail frame is arranged on the left side of the first guide rail frame and is connected with the support plate through a connecting block.
Preferably, the blade seat is connected in the groove channel at the end parts of the first guide rail frame and the second guide rail frame in a sliding manner, the bottom end part of the blade seat close to the groove channel is connected with an elastic piece, and the bottom end of the blade seat is provided with a cutter.
Preferably, the end part of the support frame close to the cam is provided with a cam mounting seat, the cam mounting seat is movably connected with the cam through a connecting shaft, and the lower part of the cam is in contact with the blade seat.
Preferably, the driving assembly comprises a motor and a gear, the motor is connected with the supporting frame through a supporting rod, and the output end of the motor is connected with the gear and drives the gear to be meshed with and transmitted to the rack.
Preferably, a control box connected with the conveying motor and the motor is installed on one side of the supporting frame.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a motor drives gear operation and meshes the transmission in the rack, make the push pedal remove along the spout on the extension board, and the push pedal tip is through connecting plate connection cam, the cam can be relative cam mount pad motion under the drive of push pedal, the conflict blade holder of cam bottom, the blade holder can last and effectually carry out the semiconductor cutting under the effect of cam, and adopt the conveyer belt pay-off, the semiconductor cutting device who has solved prior art adopts manual operation business turn over material, not only can consume a large amount of labours, and lead to the slow problem of cutting progress, and has good productivity ratio.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1. a base; 2. cutting the platform; 3. a support frame; 4. a conveying motor; 5. a delivery assembly; 6. a support plate; 7. a fixing plate; 8. a drive assembly; 81. a motor; 82. a gear; 9. a cutting assembly; 91. a first guide rail bracket; 92. a second guide rail bracket; 93. a blade seat; 94. a cutter; 10. a cam; 11. a cam mount; 12. pushing the plate; 121. a rack; 122. a connecting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1, the present invention provides a technical solution: a cutting device with high cutting efficiency for semiconductor processing comprises a base 1, a cutting platform 2, a support frame 3 and a cutting mechanism, wherein the base 1 is provided with a cavity, a conveying motor 4 is arranged in the cavity, and the cutting platform 2 is arranged at the top of the base 1; the cutting platform 2 is provided with a conveying assembly 5, the end part of the cutting platform 2 is fixedly provided with a support frame 3, the conveying assembly 5 is arranged on the inner side of the support frame 3 and is driven by a conveying motor 4 through a transmission belt, the conveying assembly 5 comprises a first belt pulley and a second belt pulley which are linked through a belt, and the belt is provided with a bearing part for fixing a semiconductor material; the cutting mechanism is arranged at the bottom end part of the support frame 3 and comprises a support plate 6, a fixed plate 7, a driving assembly 8, a cutting assembly 9 and a cam 10, the support plate 6 and the fixed plate 7 are fixedly arranged at two sides of the support frame 3 respectively, and the top end part of the support plate 6 is provided with a sliding chute; the sliding chute is connected with a push plate 12 in a sliding mode, the top of the push plate 12 is provided with a rack 121, and the end part, close to the fixed plate 7, of one side of the push plate 12 is connected with the cam 10 through a connecting plate 122.
Further, the cutting assembly 9 comprises a first guide rail frame 91, a second guide rail frame 92, a blade seat 93 and a cutter 94, wherein the first guide rail frame 91 is fixedly arranged on the fixing plate 7, and the second guide rail frame 92 is arranged on the left side of the first guide rail frame 91 and is connected with the support plate 6 through a connecting block.
Further, a blade seat 93 is slidably connected in the groove channel at the end parts of the first guide rail frame 91 and the second guide rail frame 92, and a cutter 94 is installed at the bottom end of the blade seat 93.
Further, a cam mounting seat 11 is mounted at the end of the supporting frame 3 close to the cam 10, the cam mounting seat 11 is movably connected with the cam 10 through a connecting shaft, and the lower side of the cam 10 contacts the blade seat 93.
Further, the driving assembly 8 comprises a motor 81 and a gear 82, the motor 81 is connected with the support frame 3 through a support rod, the output end of the motor 81 is connected with the gear 82, and the gear 82 is driven to be meshed with the rack 121.
Furthermore, a control box connected with the conveying motor 4 and the motor 81 is installed on one side of the support frame 3.
The working principle is as follows:
the conveying component 5 of the utility model comprises a first belt pulley and a second belt pulley which are linked through a belt, wherein a bearing part for fixing semiconductor materials is arranged on the belt, and the conveying component 5 is driven by a conveying motor 4 through a transmission belt; the cutting mechanism comprises a support plate 6, a fixing plate 7, a driving assembly 8, a cutting assembly 9 and a cam 10, the support plate 6 and the fixing plate 7 are fixedly arranged on two sides of the support frame 3 respectively, the cutting mechanism works specifically by driving a gear 82 to run through a motor 81 and meshing and transmitting the gear to a rack 121, so that a push plate 12 moves along a chute on the support plate 6, the end part of the push plate 12 is connected with the cam 10 through a connecting plate 122, the cam 10 can move relative to a cam mounting seat 11 under the driving of the push plate 12, the bottom of the cam 10 abuts against a blade seat 93, the blade seat 93 can continuously and effectively cut a semiconductor under the action of the cam 10, and the semiconductor cutting mechanism adopts conveyor belt for feeding and discharging, thereby solving the problems that the semiconductor cutting device in the prior art adopts manual operation for feeding and discharging, not only a large.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The cutting device for semiconductor processing is high in cutting efficiency and is characterized by comprising a base (1), a cutting platform (2), a support frame (3) and a cutting mechanism, wherein the base (1) is provided with a cavity, a conveying motor (4) is arranged in the cavity, and the cutting platform (2) is arranged at the top of the base (1); the cutting platform (2) is provided with a conveying assembly (5), the end part of the cutting platform (2) is fixedly provided with a support frame (3), the conveying assembly (5) is arranged on the inner side of the support frame (3) and is driven by a conveying motor (4) through a transmission belt, and the conveying assembly (5) comprises a first belt pulley and a second belt pulley which are linked through a belt; the cutting mechanism is arranged at the bottom end part of the support frame (3) and comprises a support plate (6), a fixed plate (7), a driving assembly (8), a cutting assembly (9) and a cam (10), the support plate (6) and the fixed plate (7) are fixedly arranged at two sides of the support frame (3) respectively, and a sliding groove is formed in the top end part of the support plate (6); the sliding groove is connected with a push plate (12) in a sliding mode, a rack (121) is arranged at the top of the push plate (12), and the end portion, close to the fixing plate (7), of one side of the push plate (12) is connected with the cam (10) through a connecting plate (122).
2. The cutting apparatus for semiconductor processing with high cutting efficiency according to claim 1, characterized in that: the cutting assembly (9) comprises a first guide rail frame (91), a second guide rail frame (92), a blade seat (93) and a cutter (94), the first guide rail frame (91) is fixedly arranged on the fixing plate (7), and the second guide rail frame (92) is arranged on the left side of the first guide rail frame (91) and is connected with the support plate (6) through a connecting block.
3. The cutting apparatus for semiconductor processing with high cutting efficiency according to claim 2, characterized in that: and a blade seat (93) is connected in the grooves at the end parts of the first guide rail frame (91) and the second guide rail frame (92) in a sliding manner, and a cutter (94) is installed at the bottom end of the blade seat (93).
4. The cutting apparatus for semiconductor processing with high cutting efficiency according to claim 1, characterized in that: the supporting frame (3) is close to the end of the cam (10) and is provided with a cam mounting seat (11), the cam mounting seat (11) is movably connected with the cam (10) through a connecting shaft, and the lower part of the cam (10) is in contact with the blade seat (93).
5. The cutting apparatus for semiconductor processing with high cutting efficiency according to claim 1, characterized in that: drive assembly (8) include motor (81) and gear (82), and motor (81) pass through branch connection support frame (3), and gear (82) and drive gear (82) meshing transmission are in rack (121) are connected to motor (81) output.
6. The cutting apparatus for semiconductor processing with high cutting efficiency according to claim 1, characterized in that: and a control box connected with the conveying motor (4) and the motor (81) is installed on one side of the support frame (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922444112.7U CN211467025U (en) | 2019-12-30 | 2019-12-30 | Cutting device for semiconductor processing with high cutting efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922444112.7U CN211467025U (en) | 2019-12-30 | 2019-12-30 | Cutting device for semiconductor processing with high cutting efficiency |
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| Publication Number | Publication Date |
|---|---|
| CN211467025U true CN211467025U (en) | 2020-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922444112.7U Active CN211467025U (en) | 2019-12-30 | 2019-12-30 | Cutting device for semiconductor processing with high cutting efficiency |
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| CN (1) | CN211467025U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112454631A (en) * | 2020-10-19 | 2021-03-09 | 李传江 | Ceramic tile continuous cutting processing apparatus for producing |
| CN114261029A (en) * | 2021-12-22 | 2022-04-01 | 山东旭扬新能源有限公司 | Manufacturing device based on semiconductor device processing |
| CN114323869A (en) * | 2022-01-04 | 2022-04-12 | 中国科学院半导体研究所 | Scribing device for semiconductor substrate sample wafer |
-
2019
- 2019-12-30 CN CN201922444112.7U patent/CN211467025U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112454631A (en) * | 2020-10-19 | 2021-03-09 | 李传江 | Ceramic tile continuous cutting processing apparatus for producing |
| CN114261029A (en) * | 2021-12-22 | 2022-04-01 | 山东旭扬新能源有限公司 | Manufacturing device based on semiconductor device processing |
| CN114323869A (en) * | 2022-01-04 | 2022-04-12 | 中国科学院半导体研究所 | Scribing device for semiconductor substrate sample wafer |
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