CN114613909A - High-precision preparation and laminating device for organic semiconductor assembly - Google Patents
High-precision preparation and laminating device for organic semiconductor assembly Download PDFInfo
- Publication number
- CN114613909A CN114613909A CN202210303370.7A CN202210303370A CN114613909A CN 114613909 A CN114613909 A CN 114613909A CN 202210303370 A CN202210303370 A CN 202210303370A CN 114613909 A CN114613909 A CN 114613909A
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- block
- mounting
- guide rail
- organic semiconductor
- roller
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
Abstract
The invention provides a high-precision laminating device for preparing an organic semiconductor assembly, and relates to the technical field of laminating devices. According to the invention, the two ends of the guide rail are arranged in a triangular manner, the roller is preset to be not contacted with the concave table, and along with the rotation of the second electric conveying belt, the roller passes over the triangular end of the guide rail, then is in rolling contact with the middle position of the concave table, and then is separated from the guide rail again, so that the fixing and separating process of the attaching plate is completed, the effects of automatically abutting, fixing, separating and blanking the attaching plate are realized, the production efficiency is further improved, and convenience is provided for use.
Description
Technical Field
The invention relates to the technical field of laminating devices, in particular to a high-precision laminating device for preparing an organic semiconductor assembly.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential one of the applications of various semiconductor materials in various forms, solid, liquid, gas, plasma, etc. Materials with poor electrical conductivity, such as coal, intraocular lenses, amber, ceramics, etc., are commonly referred to as insulators.
And metals with relatively good conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are referred to as conductors. The material between the conductor and the insulator may simply be referred to as a semiconductor. The discovery of semiconductor materials is the latest when compared to conductors and insulators, and the presence of semiconductors is really recognized by academia when the purification technology of the materials is improved; at present, various types of semiconductors are prepared, and a bonding device is required to bond some thin film type semiconductor assemblies in the preparation process to meet the production requirement. However, in the use process of most of the existing laminating devices, the fixing and blanking of the laminating plate are not easy to be automatically completed, so that the overall production efficiency is low, and inconvenience is brought to use.
Disclosure of Invention
The invention provides a high-precision preparation and lamination device for an organic semiconductor component, aiming at the problem that the conventional most lamination devices are not easy to automatically finish the fixed blanking of a lamination plate in the using process, so that the integral production efficiency is low and the use is inconvenient.
In order to achieve the purpose, the invention adopts the technical scheme that:
a high-precision preparation and laminating device for an organic semiconductor component comprises a base, wherein a second mounting seat is fixedly mounted on the upper surface of the base, a second electric conveying belt is fixedly mounted between the two second mounting seats, a connecting block is fixedly mounted on the front side of the second electric conveying belt, a stop block is fixedly mounted on the surface of one side of the connecting block, one side of the stop block abuts against a laminating plate, a mounting groove is formed in the upper surface of the base, a guide rail mounting frame is mounted inside the mounting groove, a guide rail is fixedly mounted on the upper surface of the guide rail mounting frame, a concave table is arranged on one side of the guide rail, a pushing component is arranged on the upper surface of the base and comprises a roller and a pushing block, one side of the pushing block is fixedly mounted on the surface of one end of a moving rod, the other side of the pushing block abuts against the laminating plate, and one end of the laminating plate abuts against a blocking rod, the roller is rotatably arranged at one end of the roller mounting rod through a roller mounting pin, and the periphery of the roller is in rolling connection with the inner wall of the concave table.
Preferably, a first mounting seat is fixedly mounted on the upper surface of the base, and a first electric conveying belt is fixedly mounted between the two first mounting seats.
Preferably, the upper surface of the base is also fixedly provided with a manipulator mounting table, the upper surface of the manipulator mounting table is fixedly provided with a manipulator, the output end of the manipulator is fixedly connected with a pneumatic suction nozzle, and the pneumatic suction nozzle is positioned above the first electric conveying belt.
Preferably, a servo motor is fixedly mounted on the upper surface of the base, a screw rod is fixedly mounted at the output end of the servo motor, one end, far away from the servo motor, of the screw rod is rotatably mounted inside the screw rod mounting block, and the lower surface of the screw rod mounting block is fixedly connected with the base.
Preferably, a screw rod sleeve is installed on the screw rod, a movable plate is fixedly installed on the upper surface of the screw rod sleeve, a guide rail is fixedly installed on the upper surface of the movable plate, fixing rods are fixedly installed on two sides of the movable plate, one end of each fixing rod is fixedly connected with the lower surface of the guide rail, and the fixing rods are obliquely arranged.
Preferably, the guide rail mounting frames are symmetrically arranged and are provided with two sliding rods and two sliding rods which are respectively and fixedly mounted at the lower ends of the guide rails, the two ends of each sliding rod are respectively and slidably mounted in the sliding grooves, and the sliding grooves are respectively arranged in the mounting grooves.
Preferably, one end of the roller mounting rod, which is far away from the roller, is fixedly connected with the fixing sheet, and two ends of the fixing sheet are arranged in an arc surface.
Preferably, the front side of the fixed plate is fixedly provided with moving rods, the two moving rods are symmetrically arranged, one ends of the two moving rods, which are far away from the fixed plate, penetrate through the moving rod mounting block, the two moving rods are sleeved with springs, one ends of the springs are fixedly connected with the moving rod mounting block, and the other ends of the springs are fixedly connected with the abutting block.
Preferably, the plurality of moving rod mounting blocks are arranged in a vertically symmetrical mode through a second electric conveying belt, and the inner ends of the plurality of moving rod mounting blocks are fixedly connected with the surface of the second electric conveying belt.
Preferably, a square groove is formed in the moving rod mounting blocks, a screw mounting block is fixedly mounted at the bottom of the square groove, a screw is mounted in the screw mounting block, a round block is fixedly mounted at one end of the screw, and one side of the round block is tightly abutted to the abutting block.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the attachment plate is placed above the second electric conveying belt, so that the attachment plate is positioned between the pushing block and the stop block, the two ends of the guide rail are arranged in a triangular mode, the roller is preset to be not in contact with the concave table, the pushing assembly can be driven to move along with the rotation of the second electric conveying belt, the roller passes over the triangular end of the guide rail and then is in rolling contact with the middle position of the concave table, the roller can passively form a moving process after rolling with the concave table, then the two moving rods are pushed to move through the fixing pieces, and the pushing block can move towards the stop block due to the movement of the moving rods, so that the attachment plate is tightly abutted and fixed; can make its reaction force to spring compression when the carriage release lever removes, after the gyro wheel removed the triangle position of the other end from the centre of guide rail, the gyro wheel no longer contacts with the concave station, spring bounce-back makes the carriage release lever drive ejector pad playback this moment, then the laminating board is no longer supported tightly fixedly, second electric conveyor rotates and makes laminating board and its separation, the completion is to the automatic effect of supporting tightly fixedly and separation unloading of laminating board, further promotion production efficiency, for providing convenience in the use.
Drawings
FIG. 1 is a schematic view of the overall structure of a high-precision organic semiconductor device fabrication bonding apparatus according to the present invention;
FIG. 2 is a schematic diagram of a front view of a high precision organic semiconductor device fabrication bonding apparatus according to the present invention;
FIG. 3 is a schematic top view of a high precision organic semiconductor device fabrication and attachment apparatus according to the present invention;
FIG. 4 is a schematic view of a connection structure between a guide rail mounting rack and a guide rail of the high-precision organic semiconductor component preparation and bonding apparatus according to the present invention;
FIG. 5 is a schematic diagram of a pushing assembly of the high precision organic semiconductor device fabrication and attachment apparatus of the present invention;
FIG. 6 is an enlarged schematic view of a portion a of a high precision organic semiconductor device fabrication and bonding apparatus according to the present invention;
FIG. 7 is an enlarged schematic view of the bonding apparatus for preparing high-precision organic semiconductor devices at the position b according to the present invention;
fig. 8 is an enlarged schematic structural view of the bonding apparatus for preparing a high precision organic semiconductor device at the position c according to the present invention.
In the figure: 1. a base; 2. a first mounting seat; 3. a second mounting seat; 4. a first electric conveyor belt; 5. a manipulator mounting table; 6. a manipulator; 7. a rail mount; 8. a guide rail; 9. a pushing assembly; 901. a roller; 902. mounting a pin on the roller; 903. a roller mounting rod; 904. a fixing sheet; 905. a travel bar; 906. a propping block; 907. a spring; 908. a travel bar mounting block; 909. a push block; 910. a square groove; 911. a screw mounting block; 912. a screw; 913. a circular block; 10. a second electric conveyor belt; 11. a servo motor; 12. a screw rod; 13. a screw rod mounting block; 14. a screw rod sleeve; 15. moving the plate; 16. a fixing rod; 17. a slide bar; 18. a chute; 19. mounting grooves; 20. a pneumatic suction nozzle; 21. a concave platform; 22. a gear lever; 23. attaching a plate; 24. connecting blocks; 25. and a stop block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1 to 8, a high precision organic semiconductor device preparation and bonding apparatus includes a base 1, a second mounting seat 3 is fixedly mounted on an upper surface of the base 1, a second electric conveyor belt 10 is fixedly mounted between the two second mounting seats 3, a connecting block 24 is fixedly mounted on a front side of the second electric conveyor belt 10, a stopper 25 is fixedly mounted on a surface of one side of the connecting block 24, one side of the stopper 25 abuts against a bonding plate 23, a mounting groove 19 is formed on an upper surface of the base 1, a guide rail mounting frame 7 is mounted inside the mounting groove 19, a guide rail 8 is fixedly mounted on an upper surface of the guide rail mounting frame 7, a concave table 21 is arranged on one side of the guide rail 8, a pushing assembly 9 is arranged on the upper surface of the base 1, the pushing assembly 9 includes a roller 901 and a pushing block 909, one side of the pushing block 909 is fixedly mounted on a surface of one end of a movable rod 905, and the other side of the pushing block 909 abuts against the bonding plate 23, one end of the attaching plate 23 abuts against the stopper rod 22, the roller 901 is rotatably mounted at one end of the roller mounting rod 903 through a roller mounting pin 902, and the periphery of the roller 901 is in rolling connection with the inner wall of the concave table 21.
In this application, the upper surface fixed mounting of base 1 has first mount pad 2, and fixed mounting has first electronic conveyer belt 4 between two first mount pads 2. The upper surface of the base 1 is also fixedly provided with a manipulator mounting table 5, the upper surface of the manipulator mounting table 5 is fixedly provided with a manipulator 6, the output end of the manipulator 6 is fixedly connected with a pneumatic suction nozzle 20, and the pneumatic suction nozzle 20 is positioned above the first electric conveying belt 4.
It should be noted that the air inlet end of the pneumatic suction nozzle 20 is communicated with the air inlet system through an air inlet pipe, and the manipulator 6 is selected and matched according to the actual environment in the prior art.
In this application, base 1's last fixed surface installs servo motor 11, and servo motor 11's output fixed mounting has lead screw 12, and lead screw 12 keeps away from servo motor 11's one end and rotates the inside of installing in lead screw installation piece 13, and the lower surface and the base 1 fixed connection of lead screw installation piece 13. The screw rod 12 is provided with a screw rod sleeve 14, the upper surface of the screw rod sleeve 14 is fixedly provided with a movable plate 15, the upper surface of the movable plate 15 is fixedly provided with a guide rail 8, two sides of the movable plate 15 are fixedly provided with fixed rods 16, one ends of the two fixed rods 16 are fixedly connected with the lower surface of the guide rail 8, and the two fixed rods 16 are obliquely arranged. Two guide rail mounting brackets 7 are symmetrically arranged, the lower ends of two guide rails 8 are fixedly provided with slide bars 17, the two ends of the two slide bars 17 are slidably mounted in sliding grooves 18, and the two sliding grooves 18 are arranged in mounting grooves 19.
Before use, the servo motor 11 is started to drive the screw rod 12 to rotate, so that the screw rod sleeve 14 drives the moving plate 15 to move, and further the guide rail 8 moves, and the contact distance between the guide rail 8 and the roller 901 can be controlled.
In this application, the one end and the stationary blade 904 fixed connection of gyro wheel installation pole 903 keeping away from gyro wheel 901, the both ends of stationary blade 904 are the cambered surface setting. The front side of the fixed plate 904 is fixedly provided with moving rods 905, the two moving rods 905 are symmetrically arranged, one ends of the two moving rods 905, far away from the fixed plate 904, penetrate through the moving rod mounting block 908, springs 907 are sleeved on the two moving rods 905, one ends of the springs 907 are fixedly connected with the moving rod mounting block 908, and the other ends of the springs 907 are fixedly connected with the abutting block 906. The plurality of moving rod mounting blocks 908 are symmetrically arranged up and down on the second electric conveyor belt 10, and the inner ends of the plurality of moving rod mounting blocks 908 are fixedly connected with the surface of the second electric conveyor belt 10. A square groove 910 is formed in the plurality of moving rod mounting blocks 908, a screw mounting block 911 is fixedly mounted at the bottom of the square groove 910, a screw 912 is mounted in the screw mounting block 911, a circular block 913 is fixedly mounted at one end of the screw 912, and one side of the circular block 913 abuts against the abutting block 906.
It should be noted that, the worker starts the second electric conveyor belt 10, places the attachment plate 23 above the second electric conveyor belt 10, and makes the attachment plate 23 be located between the push block 909 and the stopper 25, because the two ends of the guide rail 8 are arranged in a triangular manner, the roller 901 is preset to be not in contact with the concave table 21, and along with the rotation of the second electric conveyor belt 10, the pushing assembly 9 is driven to move, so that the roller 901 crosses the triangular end of the guide rail 8 and then is in rolling contact with the middle position of the concave table 21, after the roller 901 rolls with the concave table 21, the roller 901 will passively form a moving process, and then push the two moving rods 905 to move through the fixing piece 904, and the movement of the moving rods 905 can make the push block 909 move towards the stopper 25, so as to tightly abut and fix the attachment plate 23; the moving rod 905 can compress the spring 907 to generate a reaction force when moving, after the roller 901 moves from the middle of the guide rail 8 to the triangular position at the other end, the roller 901 is not in contact with the concave table 21 any more, at the moment, the spring 907 rebounds to enable the moving rod 905 to drive the push block 909 to return to the position, then the attaching plate 23 is not abutted and fixed any more, the second electric conveyor belt 10 rotates to enable the attaching plate 23 to be separated from the attaching plate, and the effects of automatically abutting and fixing the attaching plate 23 and separating and blanking are completed. When the device is used, the screw 912 can be screwed to move the circular block 913, the abutting block 906 is pushed to move, the abutting block 906 drives the two moving rods 905 to move, the roller 901 is finally moved, otherwise, the screw 912 is rotated, the roller 901 reversely moves, so that the initial position of the roller 901 can be better controlled, better installation and adjustment can be performed, if the roller 901 is worn and worn due to long-time use, the distance between the roller 901 and the guide rail 8 slightly changes, the roller 901 can be finely adjusted by the method, the fixing effect of the attaching plate 23 is improved, the roller 901 can be made of rubber, certain rolling noise is reduced, and the first electric conveying belt 4, the second electric conveying belt 10, the servo motor 11 and the manipulator 6 are all connected with a plc control panel through wires in the prior art. The mounting rack of the second electric conveyor belt 10 has a certain distance with the second electric conveyor belt 10, so that the rollers 901 are not blocked when the second electric conveyor belt 10 drives the pushing assembly 9 to rotate.
The working principle of the high-precision organic semiconductor component preparation laminating device is as follows:
firstly, the operator starts the second electric conveyor belt 10, places the attachment plate 23 above the second electric conveyor belt 10, and makes the attachment plate 23 be located between the push block 909 and the stopper 25, because the two ends of the guide rail 8 are arranged in a triangular manner, the roller 901 is preset to be not in contact with the concave station 21, and along with the rotation of the second electric conveyor belt 10, the push assembly 9 is driven to move, so that the roller 901 crosses the triangular end of the guide rail 8 and then is in rolling contact with the middle position of the concave station 21, after the roller 901 rolls with the concave station 21, the roller 901 will passively form a moving process, and then the two moving rods 905 are pushed to move through the fixing pieces 904, and the moving rods 905 move to make the push block 909 move towards the stopper 25, so as to tightly fix the attachment plate 23;
when the moving rod 905 moves, the spring 907 is compressed to generate a reaction force, after the roller 901 moves to a triangular position at the other end from the middle of the guide rail 8, the roller 901 is not in contact with the concave table 21 any more, at the moment, the spring 907 rebounds to enable the moving rod 905 to drive the push block 909 to return, then the attaching plate 23 is not abutted and fixed any more, the second electric conveying belt 10 rotates to enable the attaching plate 23 to be separated from the attaching plate, the effects of automatically abutting and fixing the attaching plate 23 and separating blanking are achieved, the production efficiency is further improved, and convenience is brought to use. When the first electric conveyer belt 4 is started, some semiconductors are conveyed, and under the action of starting of the manipulator 6, the semiconductor materials are attached to the upper surface of the attaching plate 23 in cooperation with the pneumatic suction nozzle 20, so that the attaching process is completed.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and obvious variations and modifications may be made within the scope of the present invention.
Claims (10)
1. The utility model provides an organic semiconductor subassembly preparation laminating device of high accuracy, includes base (1), its characterized in that: the upper surface of the base (1) is fixedly provided with second installation seats (3), a second electric conveying belt (10) is fixedly arranged between the two second installation seats (3), a connecting block (24) is fixedly arranged at the front side of the second electric conveying belt (10), a stop block (25) is fixedly arranged on one side surface of the connecting block (24), one side of the stop block (25) is tightly abutted to the attaching plate (23), an installation groove (19) is formed in the upper surface of the base (1), a guide rail installation frame (7) is installed inside the installation groove (19), a guide rail (8) is fixedly arranged on the upper surface of the guide rail installation frame (7), a concave table (21) is arranged on one side of the guide rail (8), a pushing assembly (9) is arranged on the upper surface of the base (1), and the pushing assembly (9) comprises a roller (901) and a pushing block (909), one side of the push block (909) is fixedly installed on the surface of one end of the movable rod (905), the other side of the push block (909) is abutted against the attaching plate (23), one end of the attaching plate (23) is abutted against the stopper rod (22), the roller (901) is rotatably installed at one end of the roller installation rod (903) through a roller installation pin (902), and the periphery of the roller (901) is in rolling connection with the inner wall of the concave table (21).
2. The high-precision organic semiconductor component preparation attaching device according to claim 1, wherein: the last fixed surface of base (1) installs first mount pad (2), two fixed mounting has first electronic conveyer belt (4) between first mount pad (2).
3. The high-precision organic semiconductor component preparation attaching device according to claim 1, wherein: the upper surface of base (1) is fixed mounting still has manipulator mount table (5), the last fixed surface of manipulator mount table (5) installs manipulator (6), the pneumatic suction nozzle (20) of output fixedly connected with of manipulator (6), pneumatic suction nozzle (20) are located the top of first electric conveyor belt (4).
4. The high-precision organic semiconductor component preparation attaching device according to claim 1, wherein: the upper surface of base (1) fixed surface installs servo motor (11), the output fixed mounting of servo motor (11) has lead screw (12), servo motor (11) is kept away from in lead screw (12) one end is rotated and is installed in the inside of lead screw installation piece (13), the lower surface and base (1) fixed connection of lead screw installation piece (13).
5. The high-precision organic semiconductor component preparation attaching device according to claim 4, wherein: install lead screw cover (14) on lead screw (12), the last fixed surface of lead screw cover (14) installs movable plate (15), the last fixed surface of movable plate (15) installs guide rail (8), the both sides fixed mounting of movable plate (15) has dead lever (16), two the one end of dead lever (16) and the lower fixed surface of guide rail (8) are connected, two dead lever (16) are the slope and set up.
6. The high-precision organic semiconductor component preparation attaching device according to claim 1, wherein: two guide rail mounting bracket (7) symmetry sets up, two the equal fixed mounting of lower extreme of guide rail (8) has slide bar (17), two the equal slidable mounting in the inside of spout (18) in both ends of slide bar (17), two spout (18) are all opened in the inside of mounting groove (19).
7. The high-precision organic semiconductor component preparation attaching device according to claim 1, wherein: one end, far away from the roller (901), of the roller mounting rod (903) is fixedly connected with the fixing plate (904), and two ends of the fixing plate (904) are arranged in an arc surface mode.
8. The high-precision organic semiconductor component preparation attaching device according to claim 7, wherein: the front side of the fixing plate (904) is fixedly provided with moving rods (905), the two moving rods (905) are symmetrically arranged, one ends, far away from the fixing plate (904), of the two moving rods (905) penetrate through a moving rod mounting block (908), springs (907) are sleeved on the two moving rods (905), one ends of the springs (907) are fixedly connected with the moving rod mounting block (908), and the other ends of the springs (907) are fixedly connected with a propping block (906).
9. The high-precision organic semiconductor component preparation attaching device according to claim 8, wherein: the plurality of the moving rod mounting blocks (908) are arranged in an up-and-down symmetrical mode through a second electric conveying belt (10), and the inner ends of the plurality of the moving rod mounting blocks (908) are fixedly connected with the surface of the second electric conveying belt (10).
10. The high-precision organic semiconductor component preparation attaching device according to claim 9, wherein: a square groove (910) is formed in the moving rod mounting block (908), a screw mounting block (911) is fixedly mounted at the bottom of the square groove (910), a screw (912) is mounted in the screw mounting block (911), a round block (913) is fixedly mounted at one end of the screw (912), and the abutting block (906) abuts against one side of the round block (913).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210303370.7A CN114613909A (en) | 2022-03-24 | 2022-03-24 | High-precision preparation and laminating device for organic semiconductor assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210303370.7A CN114613909A (en) | 2022-03-24 | 2022-03-24 | High-precision preparation and laminating device for organic semiconductor assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114613909A true CN114613909A (en) | 2022-06-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210303370.7A Pending CN114613909A (en) | 2022-03-24 | 2022-03-24 | High-precision preparation and laminating device for organic semiconductor assembly |
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| Country | Link |
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| CN (1) | CN114613909A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156780A (en) * | 2022-09-08 | 2022-10-11 | 江苏利润友机械科技有限公司 | Head end integrated electric welding device for screw machining and installation |
-
2022
- 2022-03-24 CN CN202210303370.7A patent/CN114613909A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156780A (en) * | 2022-09-08 | 2022-10-11 | 江苏利润友机械科技有限公司 | Head end integrated electric welding device for screw machining and installation |
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