CN114323869A - Scribing device for semiconductor substrate sample wafer - Google Patents
Scribing device for semiconductor substrate sample wafer Download PDFInfo
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- CN114323869A CN114323869A CN202210002723.XA CN202210002723A CN114323869A CN 114323869 A CN114323869 A CN 114323869A CN 202210002723 A CN202210002723 A CN 202210002723A CN 114323869 A CN114323869 A CN 114323869A
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- wafer
- guide rail
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- pair
- semiconductor substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 57
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present disclosure provides a scribing apparatus for a semiconductor substrate sample wafer, the apparatus comprising: a wafer stage configured to place a semiconductor substrate sample wafer; the sheet bearing table is arranged on the guide rail frame; and the tool rest can be slidably arranged on the guide rail frame, so that the tool rest can move above the wafer bearing table; the tool holder is configured to make the cutter parallel contact with the tool holder all the time during the movement of the cutter along the longitudinal cutting direction.
Description
Technical Field
The disclosure relates to the technical field of micro-nano technology, in particular to a scribing device for a semiconductor substrate sample wafer.
Background
In the field of micro-nano technology, especially scientific research of semiconductor technology, a substrate sample wafer is often required to be cut. Common substrate sample wafers include silicon wafers, glass wafers, sapphire wafers and the like. In the cutting process of the substrates, a common cutting method is completed by using a cutter or a straight ruler, and the sizes of the samples cut by the method are different, so that the surfaces of the substrates are easily damaged, and potential safety hazards exist.
Therefore, a dicing apparatus for semiconductor substrate sample wafer is needed to solve the above problems.
Disclosure of Invention
Technical problem to be solved
In view of the above, a main object of the present disclosure is to provide a dicing apparatus for a semiconductor substrate sample wafer, so as to at least partially solve at least one of the above-mentioned technical problems.
(II) technical scheme
To achieve the above object, the present disclosure provides a dicing apparatus for a semiconductor substrate sample wafer, comprising: a wafer stage configured to place a semiconductor substrate sample wafer; the sheet bearing table is arranged on the guide rail frame; and the tool rest can be slidably arranged on the guide rail frame, so that the tool rest can move above the wafer bearing table; the tool holder is configured to make the cutter parallel contact with the tool holder all the time during the movement of the cutter along the longitudinal cutting direction.
In some embodiments of the present disclosure, the rail bracket comprises: the wafer bearing platform base is connected with the wafer bearing platform; and the two guide rails are arranged on the wafer bearing platform base in parallel.
In some embodiments of the present disclosure, the stage mount comprises: the two guide rail frames are arranged on two sides of the sheet bearing platform in parallel, and the sheet bearing platform is connected with the bottom of each guide rail frame; the guide rail is connected with the upper part of the guide rail frame.
In some embodiments of the present disclosure, the tool holder comprises: a first pair of tool faces; the second pair of tool faces are arranged in parallel with the first pair of tool faces; the cutter is in parallel contact with the first pair of cutter faces and/or the second pair of cutter faces in the process of moving along the longitudinal cutting direction; and
the connecting surface is perpendicularly connected with the first pair of tool surfaces and the second pair of tool surfaces, and the connecting surface can be slidably connected with the guide rail frame.
In some embodiments of the present disclosure, further comprising: and the bulge extends from the connecting surface to the guide rail frame outside the tool holder.
In some embodiments of the present disclosure, further comprising: and the sliding sleeve is sleeved outside the guide rail and is connected with the protruding part.
In some embodiments of the present disclosure, after the slab table and the slab table base are installed, the slab table base further has a space greater than a distance between the first pair of tool surfaces and the second pair of tool surfaces.
In some embodiments of the present disclosure, the stage and the rail bracket are threadedly connected; the guide rail is in threaded connection with the tool setting frame.
In some embodiments of the present disclosure, a wafer groove is formed on the wafer stage, and the depth of the wafer groove is smaller than the thickness of the semiconductor substrate sample wafer.
In some embodiments of the present disclosure, the rail mount and the counter-knife mount are of stainless steel material; the wafer bearing platform is made of polytetrafluoroethylene materials; the semiconductor substrate sample wafer is connected with the wafer bearing table through the bonding part.
(III) advantageous effects
Based on the technical scheme, compared with the prior art, the method has at least one or one part of the following beneficial effects:
(1) according to the linear cutting device, the substrate can be linearly cut by only placing the substrate on the wafer bearing table, adjusting the distance to the knife rest and cutting the substrate by using the cutter according to the knife rest.
(2) The cutting method disclosed by the invention is convenient and quick to cut, uniform and accurate in slicing, and the slicing efficiency is improved.
(3) The method and the device reduce the labor intensity of operators and improve the safety of experiments.
Drawings
Fig. 1 is an overall design diagram of a dicing apparatus for a semiconductor substrate sample wafer in an embodiment of the present disclosure;
FIG. 2 is a block diagram of a stage in accordance with an embodiment of the present disclosure;
fig. 3 is a cross-sectional view taken along the plane a-a in fig. 2.
[ description of reference ]
1: tool setting rack
2: guide rail
3: wafer bearing platform
4: wafer bearing table base
5: slice groove
Detailed Description
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
Certain embodiments of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the disclosure are shown. Indeed, various embodiments of the disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.
The present disclosure provides a dicing apparatus for a semiconductor substrate sample wafer, and fig. 1 schematically shows an overall design diagram of the dicing apparatus for a semiconductor substrate sample wafer according to an embodiment of the present disclosure.
As shown in fig. 1, the dicing apparatus for a semiconductor substrate sample wafer includes: a sheet bearing table 3, a guide rail frame and a tool setting frame 1.
The structure of the rail holder will be described in detail below. The guide rail frame includes: a wafer-bearing table base 4 and two guide rails 2. The slide holder base 4 comprises two guide rail frames which are respectively arranged on two sides of the slide holder 3 in parallel; the bottoms of the two guide rail frames are respectively connected with the two sides of the sheet bearing platform 3 through threads; the upper parts of the two guide rail frames are respectively connected with the two guide rails 2, and the two guide rails 2 are parallel to each other.
According to the embodiment of the disclosure, the wafer slot 5 is formed in the wafer bearing table 3 and used for placing the semiconductor substrate sample wafer to be cut, when the semiconductor substrate sample wafer to be cut is placed in the wafer slot 5, the substrate can be positioned, and meanwhile, the substrate is prevented from sliding out of the wafer bearing table 3.
According to the embodiment of the disclosure, the depth of the wafer groove 5 is set to be 200 μm, and the depth of the wafer groove 5 is smaller than the thickness of the semiconductor substrate sample wafer, so that when the semiconductor substrate sample wafer to be cut is placed in the wafer groove 5, part of the semiconductor substrate sample wafer to be cut protrudes out of the wafer groove 5, which is beneficial to the complete cutting of the semiconductor substrate sample wafer.
According to the embodiment of the present disclosure, the tool post 1 is slidably mounted on the rail frame, the position of the semiconductor substrate sample wafer to be cut on the wafer support table 3 is set according to the cutting requirement of the semiconductor substrate sample wafer to be cut, and the position of the tool post 1 relative to the wafer support table 3 is set by sliding the tool post 1 on the rail.
According to the embodiment of the disclosure, when the cutter cuts the semiconductor substrate sample wafer along the longitudinal cutting direction, the cutter abuts against the opposite tool face of the opposite tool rest 1, so that the cutter is always in parallel contact with the opposite tool rest 1.
The structure of the tool holder 1 will be described in detail below. The tool holder 1 comprises a first pair of tool faces, a second pair of tool faces and a connecting face. Two tool setting faces are arranged in parallel, double-sided tool setting cutting can be achieved, the two tool setting faces are arranged in parallel, in the process of sliding the tool rest 1, the tool rest 1 is kept not to deviate, and machining is easy. The connecting surface is respectively and vertically connected with the first pair of tool surfaces and the second pair of tool surfaces, and the connecting surface can be connected with the guide rail frame in a sliding manner.
According to the embodiment of the disclosure, the connecting surface is connected with the bulge, the bulge extends from the connecting surface to the guide rail frame outside the tool holder 1, the tool holder 1 is connected with the guide rail frame in a sliding manner through the bulge, and the bulge is fixed with the guide rail 2 on the guide rail frame through threads; or a sliding sleeve can be arranged on the convex part and then connected with the guide rail frame, and the sliding sleeve and the guide rail 2 on the guide rail frame are fixed through threads.
According to the embodiment of the disclosure, the guide rail 2 can be of a tubular structure or a rectangular structure, when the guide rail 2 is of a tubular structure, the tool rest 1 and the guide rail 2 are matched through a hole shaft, the tool rest 1 can not be clamped and inclined in the moving process, and meanwhile, a positioning hole is designed for the tool rest 1 and is used for locking and positioning by using a screw after the tool rest 1 is moved to an expected position.
According to the embodiment of the disclosure, after the wafer bearing table 3 and the wafer bearing table base 4 are installed, the wafer bearing table base 4 is also provided with an empty space which is larger than the distance between the first pair of tool surfaces and the second pair of tool surfaces, when the wafer bearing table 3 is disassembled or installed, the counter tool rest 1 slides to the upper part of the empty space, and collision is avoided when the wafer bearing table is disassembled or installed.
According to the embodiment of the disclosure, the guide rail frame and the tool rest 1 are made of stainless steel materials, have corrosion resistance and are suitable for micro-nano processing laboratory environments.
According to the embodiment of the disclosure, the wafer bearing table 3 is made of polytetrafluoroethylene material, has good corrosion resistance and good toughness, and can adapt to acid-base environments in micro-nano processing laboratories.
According to the embodiment of the present disclosure, the semiconductor substrate sample wafer is connected to the stage 3 through the adhesive portion.
So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It is to be noted that, in the attached drawings or in the description, the implementation modes not shown or described are all the modes known by the ordinary skilled person in the field of technology, and are not described in detail.
It should also be noted that directional terms, such as "upper", "lower", "front", "rear", "left", "right", and the like, used in the embodiments are only directions referring to the drawings, and are not intended to limit the scope of the present disclosure. Throughout the drawings, like elements are represented by like or similar reference numerals. Conventional structures or constructions will be omitted when they may obscure the understanding of the present disclosure.
And the shapes and sizes of the respective components in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of the embodiments of the present disclosure. Furthermore, in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
Unless otherwise indicated, the numerical parameters set forth in the specification and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by the present disclosure. In particular, all numbers expressing quantities of ingredients, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term "about". In general, the expression is meant to encompass variations of 10% in some embodiments, 5% in some embodiments, 1% in some embodiments, 0.5% in some embodiments, by the specified amount.
Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.
The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify a corresponding element does not by itself connote any ordinal number of the element or any ordering of one element from another or the order of manufacture, and the use of the ordinal numbers is only used to distinguish one element having a certain name from another element having a same name.
In addition, unless steps are specifically described or must occur in sequence, the order of the steps is not limited to that listed above and may be changed or rearranged as desired by the desired design. The embodiments described above may be mixed and matched with each other or with other embodiments based on design and reliability considerations, i.e., technical features in different embodiments may be freely combined to form further embodiments.
Those skilled in the art will appreciate that the modules in the device in an embodiment may be adaptively changed and disposed in one or more devices different from the embodiment. The modules or units or components of the embodiments may be combined into one module or unit or component, and furthermore they may be divided into a plurality of sub-modules or sub-units or sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features and/or processes or elements are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Also in the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. However, the disclosed method should not be interpreted as reflecting an intention that: that is, the claimed disclosure requires more features than are expressly recited in each claim. Rather, as the following claims reflect, disclosed aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this disclosure.
The above embodiments are provided to further explain the purpose, technical solutions and advantages of the present disclosure in detail, and it should be understood that the above embodiments are merely exemplary of the present disclosure and are not intended to limit the present disclosure, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.
Claims (10)
1. A scribing apparatus for a semiconductor substrate sample wafer, comprising:
a wafer stage configured to place a semiconductor substrate sample wafer;
the sheet bearing table is arranged on the guide rail frame; and
the tool setting frame is slidably arranged on the guide rail frame, so that the tool setting frame moves above the wafer bearing table; the tool holder is configured to make the cutter parallel contact with the tool holder all the time during the movement of the cutter along the longitudinal cutting direction.
2. The dicing apparatus according to claim 1, wherein the rail holder comprises:
the wafer bearing platform base is connected with the wafer bearing platform; and
and the two guide rails are arranged on the wafer bearing platform base in parallel.
3. The dicing apparatus of claim 2, wherein the stage mount comprises:
the two guide rail frames are arranged on two sides of the sheet bearing platform in parallel, and the sheet bearing platform is connected with the bottom of each guide rail frame; the guide rail is connected with the upper part of the guide rail frame.
4. The dicing apparatus according to claim 1, wherein the counter-blade holder comprises:
a first pair of tool faces;
the second pair of tool faces are arranged in parallel with the first pair of tool faces; the cutter is in parallel contact with the first pair of cutter faces and/or the second pair of cutter faces in the process of moving along the longitudinal cutting direction; and
the connecting surface is perpendicularly connected with the first pair of tool surfaces and the second pair of tool surfaces, and the connecting surface can be slidably connected with the guide rail frame.
5. The dicing apparatus of claim 4, further comprising:
and the bulge extends from the connecting surface to the guide rail frame outside the tool holder.
6. The dicing apparatus of claim 5, further comprising:
and the sliding sleeve is sleeved outside the guide rail and is connected with the protruding part.
7. The dicing apparatus of claim 4, wherein the stage base further has a space that is larger than a distance between the first and second pairs of blade surfaces after the stage is mounted with the stage base.
8. The scribing apparatus as in claim 2, wherein the stage and the rail mount are threadedly connected; the guide rail is in threaded connection with the tool setting frame.
9. The dicing apparatus according to any one of claims 1 to 8, wherein a wafer groove is opened on the wafer stage, and the depth of the wafer groove is smaller than the thickness of the semiconductor substrate sample wafer.
10. The scribing apparatus as in any one of claims 1 to 8, wherein the rail holder and the pair of tool holders are of stainless steel material; the wafer bearing platform is made of polytetrafluoroethylene materials; the semiconductor substrate sample wafer is connected with the wafer bearing table through the bonding part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210002723.XA CN114323869A (en) | 2022-01-04 | 2022-01-04 | Scribing device for semiconductor substrate sample wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210002723.XA CN114323869A (en) | 2022-01-04 | 2022-01-04 | Scribing device for semiconductor substrate sample wafer |
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| Publication Number | Publication Date |
|---|---|
| CN114323869A true CN114323869A (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210002723.XA Pending CN114323869A (en) | 2022-01-04 | 2022-01-04 | Scribing device for semiconductor substrate sample wafer |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05198670A (en) * | 1992-01-20 | 1993-08-06 | Fujitsu Ltd | Cutting method for semiconductor wafer |
| US20020185121A1 (en) * | 2001-06-06 | 2002-12-12 | Farnworth Warren M. | Group encapsulated dicing chuck |
| US20070281444A1 (en) * | 2004-03-15 | 2007-12-06 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method |
| CN209832245U (en) * | 2019-04-19 | 2019-12-24 | 山东晶导微电子股份有限公司 | Diode wafer scribing mechanism |
| CN209912842U (en) * | 2018-06-22 | 2020-01-07 | 领凡新能源科技(北京)有限公司 | Substrate material cutting equipment |
| CN211467025U (en) * | 2019-12-30 | 2020-09-11 | 泰成半导体精密(苏州)有限公司 | Cutting device for semiconductor processing with high cutting efficiency |
| CN214121134U (en) * | 2020-12-28 | 2021-09-03 | 江苏微影智能装备有限公司 | Semiconductor wafer scribing knife flatness detection mechanism |
-
2022
- 2022-01-04 CN CN202210002723.XA patent/CN114323869A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05198670A (en) * | 1992-01-20 | 1993-08-06 | Fujitsu Ltd | Cutting method for semiconductor wafer |
| US20020185121A1 (en) * | 2001-06-06 | 2002-12-12 | Farnworth Warren M. | Group encapsulated dicing chuck |
| US20070281444A1 (en) * | 2004-03-15 | 2007-12-06 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method |
| CN209912842U (en) * | 2018-06-22 | 2020-01-07 | 领凡新能源科技(北京)有限公司 | Substrate material cutting equipment |
| CN209832245U (en) * | 2019-04-19 | 2019-12-24 | 山东晶导微电子股份有限公司 | Diode wafer scribing mechanism |
| CN211467025U (en) * | 2019-12-30 | 2020-09-11 | 泰成半导体精密(苏州)有限公司 | Cutting device for semiconductor processing with high cutting efficiency |
| CN214121134U (en) * | 2020-12-28 | 2021-09-03 | 江苏微影智能装备有限公司 | Semiconductor wafer scribing knife flatness detection mechanism |
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