CN213227055U - 一种硅片切割用硅片收集装置 - Google Patents
一种硅片切割用硅片收集装置 Download PDFInfo
- Publication number
- CN213227055U CN213227055U CN202021354997.8U CN202021354997U CN213227055U CN 213227055 U CN213227055 U CN 213227055U CN 202021354997 U CN202021354997 U CN 202021354997U CN 213227055 U CN213227055 U CN 213227055U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- silicon chip
- inserted sheet
- collection device
- fixed block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 238000005520 cutting process Methods 0.000 title claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 33
- 239000007921 spray Substances 0.000 description 11
- 239000000110 cooling liquid Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021354997.8U CN213227055U (zh) | 2020-07-11 | 2020-07-11 | 一种硅片切割用硅片收集装置 |
Applications Claiming Priority (1)
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CN202021354997.8U CN213227055U (zh) | 2020-07-11 | 2020-07-11 | 一种硅片切割用硅片收集装置 |
Publications (1)
Publication Number | Publication Date |
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CN213227055U true CN213227055U (zh) | 2021-05-18 |
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CN202021354997.8U Expired - Fee Related CN213227055U (zh) | 2020-07-11 | 2020-07-11 | 一种硅片切割用硅片收集装置 |
Country Status (1)
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CN (1) | CN213227055U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113793824A (zh) * | 2021-09-18 | 2021-12-14 | 扬州欧拉工业设计有限公司 | 一种全自动高速硅片插片机 |
-
2020
- 2020-07-11 CN CN202021354997.8U patent/CN213227055U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113793824A (zh) * | 2021-09-18 | 2021-12-14 | 扬州欧拉工业设计有限公司 | 一种全自动高速硅片插片机 |
CN113793824B (zh) * | 2021-09-18 | 2022-04-19 | 扬州欧拉工业设计有限公司 | 一种全自动高速硅片插片机 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A silicon wafer collecting device for silicon wafer cutting Effective date of registration: 20220105 Granted publication date: 20210518 Pledgee: Agricultural Bank of China Limited by Share Ltd. Shanghai Minhang branch Pledgor: SHANGHAI PANMENG ELECTRONIC MATERIALS CO.,LTD. Registration number: Y2022310000003 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231212 Granted publication date: 20210518 Pledgee: Agricultural Bank of China Limited by Share Ltd. Shanghai Minhang branch Pledgor: SHANGHAI PANMENG ELECTRONIC MATERIALS CO.,LTD. Registration number: Y2022310000003 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210518 |