CN213223013U - Multi-station dispenser with wafer scanning and aligning device - Google Patents
Multi-station dispenser with wafer scanning and aligning device Download PDFInfo
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- CN213223013U CN213223013U CN202021419030.3U CN202021419030U CN213223013U CN 213223013 U CN213223013 U CN 213223013U CN 202021419030 U CN202021419030 U CN 202021419030U CN 213223013 U CN213223013 U CN 213223013U
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Abstract
The utility model discloses a multistation point gum machine with sign indicating number aligning device is swept to wafer, include: the feeding and discharging mechanism, at least four glue dispensers and the wafer scanning and aligning device. The long unloading mechanism forms into rectangular shape in order to be used for going up unloading, at least four the point gum machine is relative respectively establishes the both sides of going up unloading mechanism, every the point gum machine is right respectively the wafer that goes up unloading mechanism and carry is processed, the wafer is swept a yard aligning device and is located one side of going up unloading mechanism, the wafer is swept a yard aligning device and is right go up unloading mechanism and carry and counterpoint the back by last unloading mechanism is carried extremely the point gum machine. The multi-station glue dispenser with the wafer code scanning and aligning device has the advantages of compact structure, high accuracy, saving of a large amount of manpower and material resources and the like.
Description
Technical Field
The utility model belongs to the technical field of the point is glued, more specifically relates to a multistation point gum machine with sign indicating number aligning device is swept to wafer.
Background
With the rapid development of economic technology, the demand of the market for semiconductors is increasing, wafers are the basic material for manufacturing semiconductor chips, the dispensing technology of wafers is the most important key technology in the advanced electronic manufacturing industry, and the dispensing technology is widely applied to chip packaging and integrated circuit equipment, and aims to reduce the failure probability of elements caused by cold and heat changes, dropping, vibration and other factors in the use process of products, so as to prolong the service life of the products. Therefore, the dispensing technology is used as the key and core of the electronic packaging technology, and the improvement of the technical level is directly related to the quality of the packaging technology. The glue dispenser is used as a novel automatic device and mainly has the function of dripping glue to a corresponding position through a preset path in a specific mode.
However, the dispenser needs to align the wafer to determine the position where dispensing is needed. Before dispensing begins, the wafer needs to be judged to determine whether the product is processed. The accuracy of the existing wafer positioning technology is still to be improved, and the occupied space of the existing product judging device and the existing positioning device is large, so that the overall structure is not compact enough, and the integrity of the dispenser is greatly influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least.
Therefore, the utility model provides a multistation point gum machine with sign indicating number aligning device is swept to wafer, this multistation point gum machine with sign indicating number aligning device is swept to wafer has compact structure, the degree of accuracy is high, use manpower sparingly advantages such as material resources.
According to the utility model discloses multistation point gum machine with sign indicating number aligning device is swept to wafer, include: the feeding and discharging mechanism, at least four glue dispensers and the wafer scanning and aligning device. The long unloading mechanism forms into rectangular shape in order to be used for going up unloading, at least four the point gum machine is relative respectively establishes the both sides of going up unloading mechanism, every the point gum machine is right respectively the wafer that goes up unloading mechanism and carry is processed, the wafer is swept a yard aligning device and is located one side of going up unloading mechanism, the wafer is swept a yard aligning device and is right go up unloading mechanism and carry and counterpoint the back by last unloading mechanism is carried extremely the point gum machine.
According to the utility model discloses multistation point gum machine with sign indicating number aligning device is swept to wafer, through will go up unloading mechanism, four at least point gum machines and wafer sweep a sign indicating number aligning device and combine together, not only can judge the processing state of wafer, can also adjust the position of wafer, be convenient for carry out the point gum machine with the wafer that finishes already processed through last unloading mechanism, carry to idle point gum machine through last unloading mechanism behind the wafer adjustment processing position that will treat processing, make point glue process efficiency higher, the degree of accuracy of whole processing has been improved, a large amount of manpower and materials have been saved.
According to the utility model discloses an embodiment, go up unloading mechanism includes: the feeding and discharging machine comprises a feeding and discharging machine body, a moving part and a material taking part. It has the activity space to inject in the last unloading organism, the both ends of going up the unloading organism be equipped with respectively with the material mouth of activity space intercommunication, the moving part is two movably between the material mouth is established in the activity space, it movably establishes to get material spare on the moving part in order to follow go up unloading on material mouth or the processing station.
According to an embodiment of the utility model, go up the unloading organism and form into opening decurrent \ 21274;, be equipped with respectively on every stabilizer blade of unloading organism the material mouth.
According to the utility model discloses an embodiment, go up unloading mechanism still includes: two magazines. The two material boxes are respectively arranged at the positions, corresponding to the material openings, of the two support legs, and at least one part of the material taking part extends out of the material openings to enter the material boxes for loading and unloading.
According to the utility model discloses an embodiment, the wafer is swept a yard aligning device and is located two between the point gum machine.
According to the utility model discloses an embodiment, the sign indicating number aligning device is swept to wafer includes: code scanning device and aligning device. The code scanning device scans and identifies the wafers, and the alignment device aligns the wafers conveyed by the feeding and discharging mechanism to adjust the positions of the wafers.
According to the utility model discloses an embodiment, the multistation point gum machine that sign indicating number aligning device was swept to wafer has still includes: the wafer preheating mechanism is arranged on the other side of the feeding and discharging mechanism and is used for preheating wafers conveyed by the feeding and discharging mechanism.
According to the utility model discloses an embodiment, the wafer preheats the mechanism and establishes two between the point gum machine and with the wafer is swept a yard aligning device and is set up relatively.
According to the utility model discloses an embodiment, four the point gum machine symmetry is established go up the both sides of unloading mechanism.
According to the utility model discloses an embodiment, go up unloading mechanism with the top of point gum machine is equipped with cooling fan respectively.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a wafer code scanning alignment device of a multi-station dispenser with a wafer code scanning alignment device according to an embodiment of the present invention;
fig. 2 is a schematic partial structural view of a wafer code scanning alignment device of a multi-station dispenser with a wafer code scanning alignment device according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a multi-station dispenser with a wafer code scanning alignment device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a feeding and discharging mechanism of a multi-station dispenser with a wafer code scanning and aligning device according to an embodiment of the present invention.
Reference numerals:
a multi-station dispenser 1000 with a wafer code scanning alignment device;
a loading and unloading mechanism 100;
a loading and unloading machine body 110; a material port 112; a leg 114;
a moveable member 120; a material taking part 130; a magazine 140;
a dispenser 400;
a wafer scanning alignment device 300; a code scanning device 310; a positioning device 320;
a wafer preheating mechanism 200;
the heat dissipation fan 500.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The multi-station dispenser 1000 having the wafer code scanning alignment apparatus 300 according to the embodiment of the present invention is described in detail below with reference to the drawings.
As shown in fig. 1 to 4, a multi-station dispenser 1000 with a wafer scanning alignment apparatus 300 according to an embodiment of the present invention includes: the loading and unloading mechanism 100, at least four glue dispensers 400 and the wafer scanning and aligning device 300.
Specifically, the long feeding mechanism is formed into a long strip shape for feeding and discharging, at least four dispensing machines 400 are respectively and oppositely arranged on two sides of the feeding and discharging mechanism 100, each dispensing machine 400 respectively processes the wafer conveyed by the feeding and discharging mechanism 100, the wafer code scanning and aligning device 300 is arranged on one side of the feeding and discharging mechanism 100, and the wafer code scanning and aligning device 300 scans and aligns the wafer conveyed by the feeding and discharging mechanism 100 and then conveys the wafer to the dispensing machines 400 through the feeding and discharging mechanism 100.
In other words, the multi-station dispenser 1000 with the wafer scanning alignment device 300 mainly comprises the loading/unloading mechanism 100, at least four dispenser 400 and the wafer scanning alignment device 300. As shown in fig. 1, the feeding and discharging mechanism 100 is elongated and can be located in the middle of the whole multi-station dispenser 1000, at least four dispensers 400 are symmetrically distributed on two sides of the feeding and discharging mechanism 100, that is, two dispensers 400 are respectively arranged on two sides of the feeding and discharging mechanism 100, a wafer scanning and aligning device 300 can be arranged on one side of the feeding and discharging mechanism 100, and the wafer scanning and aligning device 300 can scan not only the wafer to determine whether the wafer is a wafer to be processed or a processed wafer, but also can align the wafer and adjust the processing position of the wafer.
The specific working process is as follows: firstly, a wafer is conveyed to a wafer code scanning and aligning device 300 by adopting a feeding and discharging mechanism 100, and whether the wafer is a processed material part or not is identified by scanning a code on the wafer; secondly, the wafer is aligned, so that the position of the wafer can be accurately adjusted to a specific position needing dispensing; finally, the processed wafer is conveyed to the dispenser 400 by the loading and unloading mechanism 100, and dispensing is performed on the wafer by the dispenser 400.
From this, according to the utility model discloses a multistation point gum machine 1000 with sign indicating number aligning device 300 is swept to wafer, through will go up unloading mechanism 100, four at least point gum machines 400 and wafer sweep sign indicating number aligning device 300 and combine, not only can judge the processing state of wafer, can also adjust the position of wafer, be convenient for carry out point gum machine 400 with the wafer that finishes already processed through last unloading mechanism 100, carry to idle point gum machine 400 through last unloading mechanism 100 behind the wafer adjustment processing position that will treat processing, make some glue process efficiency higher, the degree of accuracy of whole processing has been improved, a large amount of manpower and materials have been saved.
According to the utility model discloses an embodiment, go up unloading mechanism 100 includes: go up unloading organism 110, moving part 120 and get material piece 130, it has the activity space to inject in the unloading organism 110 to go up, and the both ends of unloading organism 110 are equipped with the material mouth 112 with the activity space intercommunication respectively, and moving part 120 movably establishes in the activity space between two material mouths 112, gets material piece 130 movably establishes on moving part 120 in order to go up unloading from material mouth 112 or processing station. Through set up moving part 120 and material piece 130 in last unloading organism 110, moving part 120 is reciprocating motion in last unloading organism 110, can drive material piece 130 and move about in last unloading organism 110 to can realize waiting to process the wafer and carry to appointed station, and after the processing is accomplished, can take out the wafer that has processed, continue to carry out next step's process.
In some embodiments of the present invention, the loading and unloading machine body 110 is formed in a shape of a v-21274with a downward opening, and each support leg 114 of the loading and unloading machine body 110 is provided with a material opening 112. That is, the feeding and discharging machine body 110 is designed to be of a v-21274shape with a downward opening, so that the whole structure of the multi-station dispenser 1000 is more compact, and the space is more fully utilized. In addition, each support leg 114 of the feeding and discharging machine body 110 is provided with a material port 112, which is more convenient for feeding and discharging materials of the feeding and discharging mechanism 100, not only saves the whole space, but also saves the time for conveying the materials, and improves the whole processing efficiency.
According to the utility model discloses an embodiment, go up unloading mechanism 100 and still include two magazines 140, and two magazines 140 are established respectively on two stabilizer blades 114 with the corresponding position of material mouth 112, get at least some of material part 130 and stretch out material mouth 112 and get into and go up unloading in magazine 140. By arranging the two material boxes 140 on the two support legs 114 of the feeding and discharging machine body 110, the storage of materials to be processed and processed materials is facilitated, and a large amount of manpower and material resources are saved. In addition, the material box 140 is arranged at a position corresponding to the material port 112, so that the material taking part 130 can perform loading and unloading operations, and unnecessary strokes are avoided.
Optionally, the wafer scanning alignment device 300 is located between two dispenser 400. By arranging the wafer scanning and aligning device 300 between the two dispensing machines 400, after the wafer is scanned and/or positioned, the wafer is conveniently conveyed to any one of the two dispensing machines 400, the conveying stroke can be effectively shortened, the feeding and discharging mechanism 100 is convenient for conveying the wafer, and the multi-station dispensing machine 1000 with the wafer scanning and aligning device 300 is integrally compact and attractive in appearance.
According to the utility model discloses an embodiment, the sign indicating number aligning device 300 is swept to the wafer includes sweeps sign indicating number device 310 and aligning device 320, sweeps a sign indicating number discernment to the wafer by sign indicating number device 310, and aligning device 320 counterpoints the position in order to adjust the wafer to the wafer that last unloading mechanism 100 carried. That is to say, sweep yard device 310 through setting up and can sweep yard processing to the wafer, judge whether the wafer has carried out some glue operations, can reduce the error rate, prevent to the repeated operation of the wafer that has already processed, to the missed operation of unprocessed wafer, can effectively guarantee the precision and the efficiency of processing. Through carrying out the counterpoint to the wafer, can carry out accurate counterpoint to the wafer according to the position that specifically needs the point to glue on the wafer, adjust the position of wafer, reduce subsequent work load, improve machining efficiency.
Optionally, the multi-station dispenser 1000 with the wafer scanning and aligning device 300 further includes a wafer preheating mechanism 200, the wafer preheating mechanism 200 is disposed on the other side of the loading and unloading mechanism 100, and the wafer preheating mechanism 200 is used for preheating the wafer conveyed by the loading and unloading mechanism 100. Through the arrangement of the wafer preheating mechanism 200, the wafer can be preheated before dispensing, the temperature of the wafer can be controlled and improved through preheating, the subsequent dispensing treatment effect is better, and the defects that the wafer is directly heated and dispensed to cause damage to the wafer and the dispensing effect is influenced are avoided.
Preferably, the wafer preheating mechanism 200 is disposed between the two dispensing machines 400 and is disposed opposite to the wafer scanning and aligning device 300, that is, the wafer preheating mechanism 200 is disposed at a position opposite to the wafer scanning and aligning device 300, which not only enables the overall structure to be symmetrical and beautiful, but also facilitates the wafer after being preheated to be conveyed to the corresponding dispensing machine 400 through the loading and unloading mechanism 100 or the wafer after being subjected to scanning and aligning to the wafer preheating mechanism 200 by disposing the wafer preheating mechanism 200 between the two dispensing machines 400, thereby improving the overall processing efficiency.
Further, the four dispensing machines 400 are symmetrically arranged on two sides of the loading and unloading mechanism 100. The glue dispensing machines 400 are symmetrically distributed on the two sides of the feeding and discharging mechanism 100, so that the feeding and discharging mechanism 100 is beneficial to conveying materials to the glue dispensing machines 400 and conveying the materials subjected to glue dispensing out of the multi-station glue dispensing machine 1000, and the multi-station glue dispensing machine has the advantages of saving time and space, being more compact in overall structure and the like.
According to the utility model discloses an embodiment, the top of going up unloading mechanism 100 and point gum machine 400 is equipped with cooling fan 500 respectively. Set up cooling fan 500 through the top at last unloading mechanism 100 and point gum machine 400, be favorable to going up the heat dissipation of unloading mechanism 100 and point gum machine 400, prevent to lead to the damage of machine and wafer material because of inside high temperature.
To sum up, according to the utility model discloses a multistation point gum machine 1000 with sign indicating number aligning device 300 is swept to wafer combines together through sweeping sign indicating number aligning device 300 with last unloading mechanism 100, four at least point gum machines 400 and wafer, utilizes the wafer to sweep sign indicating number aligning device 300 and sweep the sign indicating number, counterpoint processing to the wafer for the multistation point gum machine 1000 that has the wafer and sweep sign indicating number aligning device 300 not only obviously promotes the efficiency of whole point gum, and the accuracy of gluing is showing the improvement moreover.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The utility model provides a multistation point gum machine with sign indicating number aligning device is swept to wafer which characterized in that includes:
the feeding and discharging mechanism is provided with a linear conveying channel for feeding and discharging materials;
the at least four glue dispensers are respectively and oppositely arranged on two sides of the feeding and discharging mechanism, and each glue dispenser can process the wafers conveyed by the feeding and discharging mechanism;
a yard aligning device is swept to wafer, a yard aligning device is swept to wafer is located one side of going up unloading mechanism, it is right that a yard aligning device is swept to wafer go up the unloading mechanism and carry the wafer sweep the sign indicating number and counterpoint the back by go up unloading mechanism carries extremely the point gum machine.
2. The multi-station dispenser with wafer scanning and aligning device according to claim 1, wherein the loading and unloading mechanism comprises:
the feeding and discharging machine comprises a feeding and discharging machine body, wherein a movable space is limited in the feeding and discharging machine body, and two ends of the feeding and discharging machine body are respectively provided with a material port communicated with the movable space;
the movable piece is movably arranged in the movable space between the two material ports;
get the material piece, get material piece movably and establish on the moving part in order to follow go up unloading in material mouth or processing station.
3. The multi-station glue dispenser with the wafer code scanning and aligning device according to claim 2, wherein the feeding and discharging machine body is formed into a v-21274shape with a downward opening, and each support leg of the feeding and discharging machine body is provided with the material port.
4. The multi-station dispenser with wafer scanning and aligning device according to claim 3, wherein said feeding and discharging mechanism further comprises:
the two material boxes are respectively arranged at the positions, corresponding to the material openings, of the two support legs, and at least one part of the material taking part extends out of the material openings to enter the material boxes for loading and unloading.
5. The multi-station dispenser with wafer code scanning and aligning device according to claim 1, wherein the wafer code scanning and aligning device is located between two dispenser.
6. The multi-station dispenser with wafer code scanning and aligning device according to claim 1, wherein the wafer code scanning and aligning device comprises:
the code scanning device is used for scanning and identifying the wafer;
and the alignment device aligns the wafer conveyed by the feeding and discharging mechanism so as to adjust the position of the wafer.
7. The multi-station dispenser with wafer code scanning and alignment device according to claim 1, further comprising:
the wafer preheating mechanism is arranged on the other side of the feeding and discharging mechanism and is used for preheating wafers conveyed by the feeding and discharging mechanism.
8. The multi-station glue dispenser with the wafer code scanning and aligning device according to claim 7, wherein the wafer preheating mechanism is arranged between the two glue dispensers and opposite to the wafer code scanning and aligning device.
9. The multi-station dispenser with the wafer scanning and aligning device according to any one of claims 1 to 8, wherein four dispenser devices are symmetrically arranged on two sides of the loading and unloading mechanism.
10. The multi-station glue dispenser with the wafer code scanning and aligning device according to claim 1, wherein a heat dissipation fan is arranged above the feeding and discharging mechanism and the glue dispenser respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021419030.3U CN213223013U (en) | 2020-07-17 | 2020-07-17 | Multi-station dispenser with wafer scanning and aligning device |
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| CN202021419030.3U CN213223013U (en) | 2020-07-17 | 2020-07-17 | Multi-station dispenser with wafer scanning and aligning device |
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| CN213223013U true CN213223013U (en) | 2021-05-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113484325A (en) * | 2021-07-05 | 2021-10-08 | 广东奥普特科技股份有限公司 | Wafer dispensing defect detection device and wafer dispensing defect detection method |
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2020
- 2020-07-17 CN CN202021419030.3U patent/CN213223013U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113484325A (en) * | 2021-07-05 | 2021-10-08 | 广东奥普特科技股份有限公司 | Wafer dispensing defect detection device and wafer dispensing defect detection method |
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