CN110035647B - Chip mounter and chip mounting method thereof - Google Patents
Chip mounter and chip mounting method thereof Download PDFInfo
- Publication number
- CN110035647B CN110035647B CN201910389011.6A CN201910389011A CN110035647B CN 110035647 B CN110035647 B CN 110035647B CN 201910389011 A CN201910389011 A CN 201910389011A CN 110035647 B CN110035647 B CN 110035647B
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- China
- Prior art keywords
- conveying
- clamping
- top plate
- blanking
- groove
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
Abstract
The invention relates to a chip mounter which comprises a conveying mechanism, and a tin brushing mechanism, a chip mounting mechanism, a reflow soldering mechanism and a blanking mechanism which are sequentially arranged along the conveying direction of the conveying mechanism, wherein the chip mounting mechanism comprises a clamping device for clamping an electronic element, a feeding device for transporting the electronic element and a conveying device for driving the clamping device to move.
Description
Technical Field
The invention relates to the technical field of electronic mounting, in particular to a chip mounter and a chip mounting method thereof.
Background
In the production process of the circuit board, a large number of electronic elements need to be fixed on a composite material substrate, the production and assembly of the existing circuit board are mainly carried out manually, various electronic elements are inserted into the substrate manually, and each electronic element is welded manually one by one, so that the working efficiency is extremely low, and mistakes are easy to make.
Disclosure of Invention
In view of the current situation of the prior art, the technical problem to be solved by the present invention is to provide a chip mounter and a chip mounting method thereof, so as to solve the problems of low production efficiency and high error rate of a circuit board.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a chip mounter comprises a conveying mechanism, and a tin brushing mechanism, a chip mounting mechanism, a reflow soldering mechanism and a blanking mechanism which are sequentially arranged along the conveying direction of the conveying mechanism, wherein the conveying mechanism comprises at least one mounting seat for fixing a circuit board and a conveying belt device for conveying the mounting seat, the mounting seat is arranged on the conveying belt device, the tin brushing mechanism comprises a top plate mechanism for brushing tin and a lifting mechanism for lifting the top plate mechanism, the top plate mechanism is arranged on the lifting mechanism, the chip mounting mechanism comprises a clamping device for clamping an electronic element, a feeding device for conveying the electronic element and a conveying device for driving the clamping device to move, the clamping device is arranged on the conveying device, the clamping device comprises a clamping platform, an air pump is fixed on the upper end face of the clamping platform, and at least one groove is formed in the lower end face of the clamping platform, the center of the groove is provided with a first through hole, at least one finger cylinder is fixed in the groove at equal intervals, the at least one finger cylinder is connected with an air pipe, the air pipe is connected with the air pump through a first through hole, the air pipe is also provided with an electromagnetic valve, the electromagnetic valve is connected with the singlechip, the reflow soldering mechanism comprises a soldering chamber, a heating assembly and a cooling assembly which are arranged in the soldering chamber, the blanking mechanism comprises a blanking top plate and a blanking conveyor belt, by arranging at least one finger cylinder, the clamping device can clamp at least one electronic element at one time and can stick the electronic element on the circuit board at one time, thereby improved production efficiency, and through the accurate control of singlechip to the solenoid valve, opening of solenoid valve can make finger cylinder and air pump be linked together, and corresponding electronic component can be got to the finger cylinder clamp to the accuracy of snatching has been guaranteed.
Preferably, the mounting seat comprises a clamping cylinder, a fixing plate and a rotating motor, the output ends of the clamping cylinder and the rotating motor are respectively connected with the rear end face of the fixing plate, the upper end face of the fixing plate is recessed inwards to form a placing groove, the bottom of the placing groove is provided with at least one tin brushing hole, the tin brushing hole penetrates from the upper end face to the lower end face of the fixing plate, a clamping plate is slidably arranged on a side plate of the placing groove, the rear end face of the clamping plate is connected with the output end of the clamping cylinder, four corners of the fixing plate are provided with at least one second through hole, four corners of the bottom of the placing groove are provided with at least one square through hole, the clamping cylinder is arranged to fix the circuit board, so that the processing accuracy is ensured, the reverse side of the circuit board is prevented from falling off, the mounting seat can be rotated by arranging the rotating motor, and the circuit board has a, need insert electronic component openly at the circuit board during the installation, and need brush tin on the circuit board reverse side during the brush tin, just need the rotating electrical machines to rotate the mount pad this moment, can carry out accurate brush tin to the circuit board through setting up the brush tin hole, and the position that needs brush tin on the circuit board can be hugged closely to the brush tin hole, and soldering tin accessible brush tin hole is brushed on the circuit board.
Preferably, the top plate mechanism comprises a top plate, a brush and a first linear motor, the top plate is of a hollow structure, positioning columns are fixed at four corners of the bottom of the top plate and can be inserted into the second through hole, the upper end face of the top plate is inwards sunken to form a solder paste groove for placing solder paste, the first linear motor is fixed on the upper portion of the solder paste groove, the output end of the first linear motor is connected with the brush, a limiting block is convexly arranged on the front end face of the top plate, the accuracy of brushing the solder can be guaranteed by arranging the positioning columns, the positioning columns can be inserted into the fixing plate, the top plate and the fixing plate are kept on the same vertical plane, and the influence of vibration of the machine on brushing the solder can be.
Preferably, the rear end face of the lifting mechanism is inwards sunken to form a track, a limiting block is arranged in the track, a first air cylinder is fixed at the top end of the track, the output end of the first air cylinder is connected with the limiting block, and the lifting mechanism is arranged to drive the top plate mechanism to lift and move.
Preferably, loading attachment includes the material loading platform, and this material loading bench up end is sunken to be equipped with at least one and goes up the silo, go up and be fixed with pusher on the silo front end, the other material loading conveyer belt that is equipped with of this pusher through setting up pusher, can push electronic component to go up the silo in, guaranteed the accuracy of transportation, through setting up the silo, guaranteed the accuracy nature when snatching electronic component, go up the silo and can restrict electronic component at the assigned position.
Preferably, the welding cavity top is equipped with the air inlet, is equipped with the intake pipe in this air inlet, and this intake pipe is connected with heating element and cooling module respectively, be equipped with the first part of blowing that is used for blowing out steam on the heating element, the last second part of blowing that is used for blowing out air conditioning that is equipped with of cooling module can carry out reflow soldering to the circuit board through setting up heating element, can cool off fixedly to circuit board welding position through setting up cooling module to welded firmness has been guaranteed, the quality of product has been improved.
Preferably, a support is further arranged on the blanking conveyor belt, a second linear motor is fixed on the support, the output end of the second linear motor is connected with the top of the blanking top plate, at least one ejection column used for ejecting the circuit board is arranged at the bottom of the blanking top plate, the ejection column can be inserted into the square through hole, products can be subjected to centralized blanking through the arrangement of the blanking conveyor belt, and the production efficiency of the products is improved.
Preferably, the conveying device comprises a transverse conveying device used for driving the clamping device to transversely move and a longitudinal conveying device used for driving the clamping device to longitudinally move, and through the arrangement of the transverse conveying device and the longitudinal conveying device, the maneuverability of the clamping device is improved, and the accuracy of the patch is guaranteed.
A chip mounting method of a chip mounter comprises the following steps:
a. placing the circuit board in a placing groove, clamping a cylinder to open and clamp the circuit board, starting a conveyor belt device to operate, starting a rotating motor to drive a fixing plate to rotate 180 degrees and then stop, starting a feeding conveyor belt to operate, conveying the electronic element to the front of a pushing device by the feeding conveyor belt, starting the pushing device, and pushing the electronic element into a feeding groove by the pushing device;
b. the conveyor belt device drives the fixing plate to run right below the tin brushing mechanism and stop running, the first air cylinder drives the top plate to run downwards, the first air cylinder stops running after the top plate is attached to the fixing plate, the first linear motor drives the brush to run leftwards, the brush is dipped with tin paste and then brushes the tin paste on the fixing plate, the tin paste can flow onto a circuit board from a tin brushing hole, the first air cylinder runs upwards after tin brushing is finished, the conveyor belt device is started and drives the fixing plate to run continuously, and the rotary motor is started and drives the fixing plate to rotate 180 degrees so that the fixing plate rotates back to the original position;
c. the conveying device drives the clamping device to move above the fixed plate and inserts at least one electronic element into the circuit board, the conveying device drives the clamping device to return to the original position, and the conveying device drives the fixed plate to continue to operate;
d. the conveying belt device drives the fixed plate to move to the heating assembly to stop running, the heating assembly blows hot air to perform a reflow soldering process on the circuit board, the conveying belt device drives the fixed plate to move to the cooling assembly to stop running after heating is completed, the cooling assembly blows cold air to cool and fix the welded position of the circuit board, the conveying belt device is started after cooling and fixing are completed, the rotating motor is started to drive the fixed plate to rotate 180 degrees, the circuit board is placed downwards at the moment, when the conveying belt device drives the fixed plate to be under the blanking top plate, the tightening cylinder is closed, the second linear motor is started to drive the blanking top plate to move downwards, the top column is inserted into the square through hole and ejects the circuit board out, the circuit board falls onto the blanking conveying belt, and the blanking conveying belt drives.
Compared with the prior art, the invention has the advantages that:
by arranging the conveying mechanism and the tin brushing mechanism, the chip mounting mechanism, the reflow soldering mechanism and the blanking mechanism which are sequentially arranged along the conveying direction of the conveying mechanism, the circuit board can be automatically brushed, mounted and subjected to over-current soldering, the circuit board can be manufactured into a finished product, the production efficiency is improved, the labor cost is reduced, the quality of the circuit board is ensured, and the error rate is reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of a reflow soldering mechanism in accordance with the present invention;
fig. 3 is a schematic structural view of a patch mechanism of the present invention.
Description of reference numerals:
1-a conveyor means; 2-a rotating electrical machine; 3-clamping the cylinder; 4, fixing a plate; 5-placing the groove; 6-brushing tin holes; 7-a square through hole; 8-a second via; 9-a lifting mechanism; 10-a top plate; 11-a brush; 12-a tin paste bath; 13-a gripping platform; 14-a transport device; 15-longitudinal conveying means; 16-a transverse conveyance device; 17-an air pump; 18-a feeding table; 19-a pushing device; 20-feeding trough; 21-a welding chamber; 22-an air inlet; 23-a blanking conveyor belt; 24-a scaffold; 25 blanking a top plate; 26-a heating assembly; 27-a cooling assembly; 28-finger cylinder; 29-feeding conveyor belt.
Detailed Description
As shown in fig. 1-3, the soldering device comprises a conveying mechanism, and a tin brushing mechanism, a chip mounting mechanism, a reflow soldering mechanism and a blanking mechanism which are sequentially arranged along a conveying direction of the conveying mechanism, wherein the conveying mechanism comprises at least one mounting seat for fixing a circuit board and a conveying belt device 1 for conveying the mounting seat, the mounting seat is mounted on the conveying belt device 1, the tin brushing mechanism comprises a top plate mechanism for brushing tin and a lifting mechanism 9 for lifting the top plate mechanism, the top plate mechanism is arranged on the lifting mechanism 9, the chip mounting mechanism comprises a clamping device for clamping an electronic element, a feeding device for conveying the electronic element and a conveying device 14 for driving the clamping device to move, the clamping device is arranged on the conveying device 14, the clamping device comprises a clamping platform 13, an air pump 17 is fixed on the upper end surface of the clamping platform 13, and at least one groove is formed on the lower end surface of the clamping platform 13, this recess center department is equipped with first through-hole, and the equidistance is fixed with at least one and points cylinder 28 in this recess, at least one points cylinder 28 and all is connected with the trachea, and this trachea is connected with air pump 17 through first through-hole, still is equipped with the solenoid valve on this trachea, and this solenoid valve is connected with the singlechip, reflow soldering mechanism includes welding cavity 21 and sets up heating element 26 and the cooling module 27 in welding cavity 21, unloading mechanism includes unloading roof 25 and unloading conveyer belt 23.
The chip mounting method of the chip mounter comprises the following steps:
a. placing the circuit board in a placing groove 5, opening a clamping cylinder 3 and clamping the circuit board, opening a conveyor belt device 1 to enable the conveyor belt device to operate, starting a rotating motor 2 and driving a fixing plate 4 to rotate 180 degrees and then stop, starting a feeding conveyor belt to operate, conveying electronic components to the front of a pushing device 19 by the feeding conveyor belt, opening the pushing device 19, and pushing the electronic components into a feeding groove 20 by the pushing device 19;
b. the operation is stopped when the conveyor belt device 1 drives the fixed plate 4 to move right below the tin brushing mechanism, the first air cylinder drives the top plate 10 to move downwards, the first air cylinder stops moving after the top plate 10 is attached to the fixed plate 4, the first linear motor drives the brush 11 to move leftwards, the brush 11 is dipped with tin paste and then brushes the tin paste on the fixed plate 4, the tin paste can flow onto a circuit board from a tin brushing hole 6, the first air cylinder moves upwards after tin brushing is finished, the conveyor belt device 1 is started and drives the fixed plate 4 to continue to operate, and the rotary motor 2 is started and drives the fixed plate 4 to rotate 180 degrees so that the fixed plate 4 rotates back to the original position;
c. the conveyor belt device 1 drives the fixed plate 4 to run right below the surface mounting mechanism, the conveyor belt device 1 stops running, the conveying device 14 drives the clamping device to run right above the feeding table 18, after the clamping device clamps the electronic components, the conveyor belt device 14 drives the clamping device to run to the position above the fixed plate 4 and inserts at least one electronic component into the circuit board, the conveyor belt device 14 drives the clamping device to return to the original position, and the conveyor belt device 1 drives the fixed plate 4 to continue running;
d. the conveyor belt device 1 drives the fixing plate 4 to move to the heating assembly 26 and stop moving, the heating assembly 26 blows hot air to perform a reflow soldering process on a circuit board, the conveyor belt device 1 drives the fixing plate 4 to move to the cooling assembly 27 and stop moving after heating is completed, the cooling assembly 27 blows cold air to cool and fix the welded part of the circuit board, the conveyor belt device 1 is started after cooling and fixing are completed, the rotating motor 2 is started and drives the fixing plate 4 to rotate 180 degrees, the circuit board is placed downwards at the moment, when the conveyor belt device 1 drives the fixing plate 4 to be under the blanking top plate 25, the tightening cylinder 3 is closed, the second linear motor is started and drives the blanking top plate 25 to move downwards, the top column is inserted into the square through hole 7 and pushes out the circuit board, the circuit board falls onto the blanking conveyor belt 23, and the blanking conveyor belt 23.
Specifically, when the machine runs, the circuit board is placed in a placing groove 5 with the right side facing upwards, a clamping cylinder 3 is opened and clamps the circuit board, a conveyor belt device 1 is opened to run, a rotating motor 2 is started and drives a fixing plate 4 to rotate 180 degrees and then stop, at the moment, the circuit board is placed downwards, a feeding conveyor belt starts to run, the feeding conveyor belt transports electronic elements to the front of a pushing device 19, the pushing device 19 is started, the electronic elements are pushed into a feeding groove 20 by the pushing device 19, a plurality of electronic elements are arranged in the feeding groove 20 in order, the conveyor belt device 1 drives the fixing plate 4 to run right below a tin brushing mechanism and stop running, a first cylinder drives a top plate 10 to run downwards, positioning columns are inserted into a second through hole 8, the first cylinder stops running after the top plate 10 is attached to the fixing plate 4, a first linear motor drives a brush 11 to run leftwards, the brush 11 brushes the tin paste onto the tin brushing holes 6 in a 45-degree mode, solder paste can flow onto a circuit board from a solder brushing hole 6, after the solder brushing is finished, a first air cylinder moves upwards, a conveyor belt device 1 is started and drives a fixed plate 4 to continue to operate, a rotating motor 2 is started and drives the fixed plate 4 to rotate 180 degrees so that the fixed plate 4 rotates to the original position, the circuit board is placed upwards at the moment, the conveyor belt device 1 drives the fixed plate 4 to stop operating when the fixed plate 4 moves to the position under a chip mounting mechanism, a conveying device 14 drives a clamping device to move to the position over a feeding table 18, a single chip microcomputer accurately controls a finger air cylinder 28 to be clamped to be started through an electromagnetic valve, the finger air cylinder 28 clamps corresponding electronic elements, the finger air cylinder 28 which does not need to clamp the electronic elements is closed all the time, so that the clamping accuracy is ensured, after the clamping device clamps the electronic elements, the conveying device 14 drives the clamping device to, the singlechip precisely controls the finger cylinder 28 to loosen through the electromagnetic valve, the conveying device 14 drives the clamping device to return to the original position, the conveying belt device 1 drives the fixing plate 4 to continue to operate, the conveying belt device 1 drives the fixing plate 4 to operate to the heating component 26 to stop operating, the heating component 26 sucks air from the air inlet 22 and heats the air to a certain temperature and then blows hot air, so that a reflow soldering process can be carried out on the circuit board, solder paste is melted and the output end of an electronic element is wrapped, the conveying belt device 1 drives the fixing plate 4 to operate to the cooling component 27 to stop operating after heating is completed, the cooling component 27 blows cold air to cool and fix the welded part of the circuit board, the conveying belt device 1 is started after cooling and fixing is completed, the rotating motor 2 is started to drive the fixing plate 4 to rotate 180 degrees, the circuit board is placed downwards at the moment, and the conveying belt device, the clamping cylinder 3 is closed, the second linear motor is started and drives the blanking top plate 25 to move downwards, the top column is inserted into the square through hole 7 and pushes out the circuit board, the circuit board falls onto the blanking conveyor belt 23, and the circuit board is driven to the blanking area by the blanking conveyor belt 23 to carry out blanking.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in the embodiments and modifications thereof may be made, and equivalents may be substituted for elements thereof; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A chip mounter is characterized by comprising a conveying mechanism, and a tin brushing mechanism, a chip mounting mechanism, a reflow soldering mechanism and a blanking mechanism which are sequentially arranged along the conveying direction of the conveying mechanism, wherein the conveying mechanism comprises at least one mounting seat for fixing a circuit board and a conveying belt device (1) for conveying the mounting seat, the mounting seat is mounted on the conveying belt device (1), the tin brushing mechanism comprises a top plate mechanism for brushing tin and a lifting mechanism (9) for lifting the top plate mechanism, the top plate mechanism is arranged on the lifting mechanism (9), the chip mounting mechanism comprises a clamping device for clamping an electronic element, a feeding device for conveying the electronic element and a conveying device (14) for driving the clamping device to move, the clamping device is arranged on the conveying device (14), and the clamping device comprises a clamping platform (13), an air pump (17) is fixed on the upper end face of the clamping platform (13), at least one groove is formed in the lower end face of the clamping platform (13), a first through hole is formed in the center of the groove, at least one finger cylinder (28) is fixed in the groove at equal intervals, the at least one finger cylinder (28) is connected with an air pipe, the air pipe is connected with the air pump (17) through the first through hole, an electromagnetic valve is further arranged on the air pipe and connected with a single chip microcomputer, the reflow soldering mechanism comprises a welding cavity (21), and a heating assembly (26) and a cooling assembly (27) which are arranged in the welding cavity (21), and the blanking mechanism comprises a blanking top plate (25) and a blanking conveyor belt (23);
the mounting seat comprises a clamping cylinder (3), a fixing plate (4) and a rotating motor (2), wherein the output ends of the clamping cylinder (3) and the rotating motor (2) are respectively connected with the rear end face of the fixing plate (4), the upper end face of the fixing plate (4) is inwards sunken to form a placing groove (5), at least one tin brushing hole (6) is formed in the bottom of the placing groove (5), the tin brushing hole (6) penetrates through the upper end face of the fixing plate (4) to the lower end face, a clamping plate is slidably arranged on a side plate of the placing groove (5), the rear end face of the clamping plate is connected with the output end of the clamping cylinder (3), at least one second through hole (8) is further formed in the four corners of the fixing plate (4), and at least one square through hole (7) is further formed in the four corners of the bottom of the placing groove (5).
2. The chip mounter according to claim 1, wherein the top plate mechanism comprises a top plate (10), a brush (11) and a first linear motor, the top plate (10) is of a hollow structure, positioning columns are fixed at four corners of the bottom of the top plate (10), the positioning columns can be inserted into the second through holes (8), the upper end surface of the top plate (10) is recessed inwards to form a solder paste groove (12) for placing solder paste, the first linear motor is fixed at the upper part of the solder paste groove (12), the output end of the first linear motor is connected with the brush (11), and a limiting block is convexly arranged on the front end surface of the top plate (10).
3. The chip mounter according to claim 2, wherein the rear end surface of the lifting mechanism (9) is recessed inward to form a rail, a limiting block is arranged in the rail, a first cylinder is fixed at the top end of the rail, and the output end of the first cylinder is connected with the limiting block.
4. A chip mounter according to claim 3, wherein said feeding device comprises a feeding table (18), at least one feeding groove (20) is concavely arranged on the upper end surface of the feeding table (18), a pushing device (19) is fixed on the front end of the feeding groove (20), and a feeding conveyor belt (29) is arranged beside the pushing device (19).
5. The chip mounter according to claim 4, wherein the top end of the welding chamber (21) is provided with an air inlet (22), an air inlet pipe is arranged in the air inlet (22), the air inlet pipe is respectively connected with a heating assembly (26) and a cooling assembly (27), the heating assembly (26) is provided with a first air blowing component for blowing hot air, and the cooling assembly (27) is provided with a second air blowing component for blowing cold air.
6. The chip mounter according to claim 5, wherein the blanking conveyor belt (23) is further provided with a bracket (24), the bracket (24) is fixed with a second linear motor, the output end of the second linear motor is connected with the top of a blanking top plate (25), the bottom of the blanking top plate (25) is provided with at least one top column for ejecting the circuit board, and the top column can be inserted into the square through hole (7).
7. The mounter according to claim 6, wherein said carrying means (14) includes a lateral carrying means (16) for carrying said gripping means in a lateral direction and a longitudinal carrying means (15) for carrying said gripping means in a longitudinal direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910389011.6A CN110035647B (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
| CN202011230015.9A CN112165793A (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910389011.6A CN110035647B (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011230015.9A Division CN112165793A (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110035647A CN110035647A (en) | 2019-07-19 |
| CN110035647B true CN110035647B (en) | 2020-12-08 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011230015.9A Withdrawn CN112165793A (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
| CN201910389011.6A Active CN110035647B (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011230015.9A Withdrawn CN112165793A (en) | 2019-05-10 | 2019-05-10 | Chip mounter and chip mounting method thereof |
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| Country | Link |
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| CN (2) | CN112165793A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337196A (en) * | 2019-08-15 | 2019-10-15 | 安捷利（番禺）电子实业有限公司 | A kind of battery adopts crimping beam dieelctric sheet welding procedure and battery adopts crimping beam welding procedure |
| CN112830232B (en) * | 2020-12-30 | 2023-12-05 | 苏州三德精密机械有限公司 | Automatic feeding clamping structure |
| CN113636265A (en) * | 2021-08-14 | 2021-11-12 | 浙江珵美科技有限公司 | Encoder 46TO surface mount packaging device and method |
| CN114258211B (en) * | 2021-12-27 | 2023-07-25 | 佛山市楚利晨电子有限公司 | Tin brushing device for circuit board surface processing |
| CN117293077A (en) * | 2023-11-22 | 2023-12-26 | 北京锐洁机器人科技有限公司 | Graphite disc positioning device for loading wafer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6047875A (en) * | 1995-09-20 | 2000-04-11 | Unitek Miyachi Coporation | Reflow soldering self-aligning fixture |
| CN100489508C (en) * | 2004-07-21 | 2009-05-20 | 欧姆龙株式会社 | Methods of and apparatus for inspecting substrate |
| JP2006269793A (en) * | 2005-03-24 | 2006-10-05 | Yamagata Casio Co Ltd | Clamp head of electronic component and component packaging apparatus |
-
2019
- 2019-05-10 CN CN202011230015.9A patent/CN112165793A/en not_active Withdrawn
- 2019-05-10 CN CN201910389011.6A patent/CN110035647B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110035647A (en) | 2019-07-19 |
| CN112165793A (en) | 2021-01-01 |
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