CN213212161U - Bendable and cuttable high-reliability flexible lamp strip - Google Patents
Bendable and cuttable high-reliability flexible lamp strip Download PDFInfo
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- CN213212161U CN213212161U CN201922407034.3U CN201922407034U CN213212161U CN 213212161 U CN213212161 U CN 213212161U CN 201922407034 U CN201922407034 U CN 201922407034U CN 213212161 U CN213212161 U CN 213212161U
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Abstract
The utility model relates to a bendable and cuttable high-reliability flexible lamp belt, which comprises a plurality of flexible circuit board units and a plurality of LED luminous chips, wherein the flexible circuit board units extend along the length direction of the lamp belt, the flexible circuit board units are provided with chip mounting holes, and the LED luminous chips are fixed in the chip mounting holes in a flip chip structure mode; the first packaging adhesive layer covers the LED light-emitting chip and welding points of the LED light-emitting chip and the flexible circuit board unit and is arranged in the dam formed by the chip mounting holes, and the first packaging adhesive layer is tightly combined with the LED light-emitting chip and the side walls of the chip mounting holes, so that the mounting reliability of the LED light-emitting chip is improved; the second packaging adhesive layer is packaged outside the first packaging adhesive layer and the flexible circuit board unit, and the flexibility of the flexible lamp strip is increased by the second packaging adhesive layer. Above-mentioned structure has improved the anti ability of beating of flexible lamp area, prevents that LED luminescent chip from appearing collapsing and take off the bonding pad, has improved the reliability in flexible lamp area.
Description
Technical Field
The utility model relates to a flexible lamp area technical field, concretely relates to high reliability flexible lamp area that can buckle and tailor.
Background
The existing flexible lamp strip generally welds a surface-mounted LED lamp bead on a strip-shaped flexible circuit board, and then is processed in different modes such as casing pipe penetration, glue dripping and the like. The existing flexible lamp strip has the following defects: the LED lamp beads need to be subjected to series of processes such as die bonding, wire welding, glue sealing and the like, and the lamp strip also needs to be subjected to procedures such as surface mounting, sleeve penetrating and the like, so that the production process is complex and the cost is high; the flexible lamp area is in the in-process of production and transport, and difficult the emergence is buckled and is got rid of and beat, excessively buckles or get rid of beat and easily appear the lamp pearl welding department collapse take off the problem of opening circuit, because of LED lamp pearl is the hard body, the circuit board is the flexible body, and the stress point of lamp pearl is great, buckles many times or get rid of and beat the lamp and have the phenomenon that probably leads to the lamp pearl leg to collapse and take off the pad because of the atress is big.
SUMMERY OF THE UTILITY MODEL
In view of the above, there is a need to provide a bendable and cuttable flexible light strip with high reliability, which is resistant to bending and whipping, and has higher connection reliability of LED light emitting chips.
A bendable and cuttable high-reliability flexible lamp strip comprises a plurality of flexible circuit board units and a plurality of LED light-emitting chips, wherein the flexible circuit board units extend along the length direction of the lamp strip; the LED light-emitting chip is covered with a first packaging adhesive layer, the first packaging adhesive layer is filled in the chip mounting hole, the first packaging adhesive layer and the flexible circuit board unit are covered with a second packaging adhesive layer, and the first packaging adhesive layer increases the connection reliability of the LED light-emitting chip.
Furthermore, the flexible circuit board unit further comprises a circuit layer, an intermediate insulating layer and a supporting layer, wherein the circuit layer comprises a plurality of lead structures, each lead structure is provided with a chip bonding pad, and the LED light-emitting chips are welded on the chip bonding pads; the supporting layer is provided with a supporting structure, and the supporting structure is used for increasing the flexibility of the flexible lamp strip during bending; the intermediate insulating layer is arranged between the circuit layer and the supporting layer, so that the circuit layer and the supporting layer are mutually independent.
Further, the surface insulating layer is arranged on the upper surface of the flexible circuit board unit, and the surface insulating layer is used for insulating the circuit layer of the flexible circuit board unit from the outside.
Furthermore, the chip mounting holes are uniformly distributed on the surface insulating layer along the length direction of the flexible circuit board unit, and the chip mounting holes are arranged above the chip bonding pads of the flexible circuit board unit.
Furthermore, the surface insulating layer has a certain thickness, the area of the chip mounting hole is larger than the areas of the LED light-emitting chip and the welding connection point of the LED light-emitting chip and the chip bonding pad, and the chip mounting hole forms a dam around the LED light-emitting chip.
Furthermore, the first packaging adhesive layer covers the LED light-emitting chip and the welding connection point of the LED light-emitting chip and the chip bonding pad, the first packaging adhesive layer is arranged in the dam and tightly combined with the inner side wall of the dam, and the first packaging adhesive layer is used for enhancing the fixed connection strength of the LED light-emitting chip and the chip bonding pad.
Furthermore, the second packaging adhesive layer covers the circuit layer and the first packaging adhesive layer of the flexible circuit board unit along the length direction of the flexible circuit board unit, and the height of the second packaging adhesive layer is larger than that of the first packaging adhesive layer.
Furthermore, the first packaging adhesive layer is made of epoxy resin adhesive with certain hardness, the second packaging adhesive layer is made of thixotropic adhesive, and the second packaging adhesive layer is made of mixed fluorescent adhesive.
Further, the cross section of the second packaging adhesive layer has different heights and shapes, the light emitting angle of the LED light emitting chip is changed by changing the shape of the colloid of the second packaging adhesive layer, and the second packaging adhesive layer is used for increasing the flexibility of the lamp strip and enabling the lamp strip to have different light emitting angles.
Furthermore, positive electrode pads and negative electrode pads are arranged at two ends of the flexible circuit board unit, pad connecting wires are respectively arranged between the two positive electrode pads and the two negative electrode pads which are arranged at two ends of the flexible circuit board unit, the pad connecting wires are arranged along the length of the flexible circuit board unit, and shearing marks are arranged on the positive electrode pads and the negative electrode pads; the positive electrode pad with the negative electrode pad adopts elongated welding pad, makes the positive electrode pad with the negative electrode pad is at the connecting power line or be convenient for weld and heat dissipation when the lamp area extends the concatenation, helps avoiding junction both ends when flexible lamp area splices the phenomenon that LED luminescence chip is not bright.
In the bendable and cuttable high-reliability flexible lamp strip, the LED light-emitting chip adopts a flip chip and is fixed in the chip mounting hole of the flexible circuit board unit by adopting a surface mounting technology, the first packaging adhesive layer covers the LED light-emitting chip and a welding point between the LED light-emitting chip and the chip bonding pad and is arranged in the dam formed by the chip mounting hole, and the first packaging adhesive layer is tightly combined with the LED light-emitting chip and the side wall of the chip mounting hole, so that the mounting reliability of the LED light-emitting chip is improved, and the phenomenon that the LED light-emitting chip is not bright due to the falling of the chip bonding pad is avoided; the second packaging adhesive layer is packaged outside the first packaging adhesive layer and the flexible circuit board unit, and the flexibility of the flexible lamp strip is increased by the second packaging adhesive layer. The structure improves the throwing-resistant capability of the flexible lamp strip, prevents the LED light-emitting chip from breaking off the bonding pad, and improves the reliability of the flexible lamp strip. The utility model discloses a flexible lamp area simple structure, manufacturing method easily realizes, and the facilitate promotion is used.
Drawings
Fig. 1 is the utility model discloses but the positive structure sketch map of the flexible lamp area of high reliability of bending cutting.
Fig. 2 is the utility model discloses the side structure schematic diagram of the flexible lamp area of high reliability that can buckle and tailor.
Fig. 3 is the utility model discloses the packaging structure explosion picture in flexible lamp area of high reliability that can buckle and can tailor.
Fig. 4 is the utility model discloses the packaging structure enlargements in flexible lamp area of high reliability that can buckle and tailor.
Fig. 5 is the utility model discloses the line layer structure sketch map of the flexible line way board unit in high reliability flexible light strip that can buckle and can tailor.
Fig. 6 is the utility model discloses the supporting layer structure sketch map of the flexible line way board unit in high reliability flexible light strip that can buckle and can tailor.
Detailed Description
The present invention will be described in detail with reference to the following embodiments and drawings.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, which illustrate a bendable and cuttable high-reliability flexible light strip 100 and a manufacturing method thereof according to an embodiment of the present invention, where the bendable and cuttable high-reliability flexible light strip 100 includes a plurality of flexible circuit board units 20 extending along a length direction of the light strip and a plurality of LED light emitting chips 10, the flexible circuit board units 20 include surface insulation layers, each surface insulation layer has a chip mounting hole 23, and the LED light emitting chips 10 are fixed in the chip mounting holes 23 of the flexible circuit board units 20 in a flip chip structure; the LED light-emitting chip 10 is covered with a first packaging adhesive layer 30, the first packaging adhesive layer 30 is filled in the chip mounting hole 23, the first packaging adhesive layer 30 and the flexible circuit board unit 20 are covered with a second packaging adhesive layer 40, and the first packaging adhesive layer 30 increases the connection reliability of the LED light-emitting chip 10.
Further, the flexible printed circuit board unit 20 further includes a circuit layer 21, an intermediate insulating layer and a supporting layer 22, the circuit layer 21 includes a plurality of wire structures 211, the wire structures 211 have chip pads 2113, and the LED light emitting chips 10 are soldered on the chip pads 2113; the support layer 22 has a support structure for increasing flexibility of the flexible light strip when bent; the intermediate insulating layer is disposed between the circuit layer 21 and the supporting layer 22, so that the circuit layer 21 and the supporting layer 22 are independent from each other.
Further, the surface insulating layer is disposed on the upper surface of the flexible printed circuit board unit 20, and the surface insulating layer is used for insulating the circuit layer 21 of the flexible printed circuit board unit 20 from the outside. The chip mounting holes 23 are uniformly distributed on the surface insulating layer along the length direction of the flexible circuit board unit 20, and the chip mounting holes 23 are arranged above the chip bonding pads 2113 of the flexible circuit board unit 20. The surface insulating layer has a certain thickness, the area of the chip mounting hole 23 is larger than the area of the LED light emitting chip 10 and the area of the welding connection point between the LED light emitting chip 10 and the chip pad 2113, and the chip mounting hole 23 forms a dam around the LED light emitting chip 10.
Further, the first packaging adhesive layer 30 covers the LED light emitting chip 10 and the welding connection point between the LED light emitting chip 10 and the chip pad 2113, the first packaging adhesive layer 30 is disposed in the dam and tightly combined with the inner side wall of the dam, and the first packaging adhesive layer 30 is used for enhancing the fixed connection strength between the LED light emitting chip 10 and the chip pad 2113. The second packaging adhesive layer 40 covers the flexible circuit board unit 20 above the circuit layer 21 and the first packaging adhesive layer 30 along the length direction of the flexible circuit board unit 20, and the height of the second packaging adhesive layer 40 is larger than that of the first packaging adhesive layer 30.
Further, the first encapsulation glue layer 30 is made of epoxy resin glue with certain hardness, the second encapsulation glue layer 40 is made of thixotropic glue, and the second encapsulation glue layer 40 is made of mixed fluorescent glue. The cross section of the second packaging adhesive layer 40 has different heights and shapes, the light emitting angle of the LED light emitting chip 10 is changed by changing the shape of the colloid of the second packaging adhesive layer 40, and the second packaging adhesive layer 40 is used for increasing the flexibility of the lamp strip and enabling the lamp strip to have different light emitting angles.
Specifically, the LED light emitting chip 10 is welded on the chip pad 2113, the inner side wall of the chip mounting hole 23 is in the LED light emitting chip 10 and the periphery of the welding connection point of the chip pad 2113 form the dam, the first packaging adhesive layer 30 is arranged in the dam, covers the LED light emitting chip 10 and the welding connection point of the chip pad 2113, and the first packaging adhesive layer 30 is tightly combined with the inner side wall of the dam, so that the connection reliability of the LED light emitting chip 10 is provided, and the bending resistance and the swinging resistance of the flexible lamp strip are enhanced.
Specifically, the first encapsulating adhesive layer 30 is preferably an epoxy resin adhesive with a certain height and hardness, and the LED light-emitting chip 10 is welded to the chip pad 2113 and adhered to the chip mounting hole 23 by the first encapsulating adhesive layer 30, so that the anti-whipping capability of the LED light-emitting chip 10 is improved, and the phenomenon that the LED light-emitting chip 10 is not bright due to the falling off of the chip pad 2113 is avoided. The second encapsulation glue layer 40 is preferably silica gel with certain ductility, and fluorescent powder with different color temperatures can be mixed in the silica gel, so that the flexible lamp strip has different color temperatures.
Further, the wire structure 211 includes two main connection lines 2111 arranged in parallel and a plurality of connection branch lines 2112 arranged perpendicularly between the main connection lines 2111, and two ends of each connection branch line 2112 are respectively connected to the two parallel main connection lines 2111; the two lead structures 211 are oppositely arranged to form a pair of lead structures 211, and the plurality of pairs of lead structures 211 are sequentially arranged on the circuit layer 21; the pair of wire structures 211 has an inner side opposite to each other and an outer side opposite to the inner side, and the corresponding two connection branch lines 2112 extend inward to form a pair of opposite chip pads 2113; the pair of conductive line structures 211 comprises a first conductive line structure 211 and a second conductive line structure 211, each pair of conductive line structures 211 has two extension ends, and the two extension ends are respectively arranged on the main connection lines 2111 at two opposite ends of the first conductive line structure 211 and the second conductive line structure 211; the extended end of the first conductive line structure 211 in each pair of conductive line structures 211 is connected to the extended end of the second conductive line structure 211 in an adjacent pair of conductive line structures 211, such that the first conductive line structure 211 in each pair of conductive line structures 211 and the second conductive line structure 211 in an adjacent pair of conductive line structures 211 form a series structure.
Further, the electrodes of the LED light emitting chip 10 are fixed and soldered to a pair of the opposing die pads 2113 by solder paste, so that the LED light emitting chip 10 is bridged over the two opposing wire structures 211. The first packaging adhesive layer 30 covers the LED light-emitting chip 10 and a welding connection point between the LED light-emitting chip 10 and the chip bonding pad 2113, so that the fixed connection between the LED light-emitting chip 10 and the chip bonding pad 2113 is enhanced; the second packaging adhesive layer 40 covers the first packaging adhesive layer 30 and the flexible circuit board unit 20, and the second packaging adhesive layer 40 is used for increasing flexibility of the lamp strip and enabling the lamp strip to have different light-emitting angles.
Specifically, the conductive line structure 211 is shaped like a Chinese character 'mu', and at least two main connection lines 2111 and/or connection branch lines 2112 at each intersection are interconnected with other intersections. The chip pads 2113 are disposed at the intersections, and each electrode of the LED light emitting chip 10 soldered to the chip pads 2113 is connected to at least two main connection lines 2111 and/or the connection branch lines 2112, so that the reliability of circuit connection of the LED light emitting chip 10 is improved.
Specifically, the second adhesive encapsulating layer 40 has an outer surface with different shapes or arcs, so that the flexible light strip has different light emitting angles.
Further, the circuit layer 21 further includes a pad connection line 26 and a current limiting resistor, where the pad connection line 26 is disposed on two sides of the pair of wire structures 211; a plurality of the wire structures 211 form a wire structure 211 group, the wire structures 211 at two ends of each wire structure 211 group are aligned, and the wire structures 211 which are not connected with the adjacent wire structure 211 are connected to the pad connecting wire 26; the current limiting resistor is connected to the pad connecting line 26, and the current limiting resistor is used for limiting the current of the flexible circuit board unit 20 and the LED light emitting chip 10 and performing a voltage division function.
Specifically, in one of the conductive line structures 211, the pair of conductive line structures 211 including a head portion and a tail portion corresponding to the head portion, the pair of conductive line structures 211 including a head portion and a tail portion, the pair of conductive line structures 211 including a head portion, the pair of conductive line structures 211 including a tail portion, and the pair of conductive line structures 211 including a tail portion, the pair of conductive line structures 211 including a head portion, the pair of conductive line structures 211 including a tail portion, and the pair of conductive line.
Specifically, in two adjacent pairs of the conductive line structures 211, the first conductive line structure 211 in one pair of the conductive line structures 211 is connected to the second conductive line structure 211 in the other pair of the conductive line structures 211, so that the two adjacent pairs of the conductive line structures 211 form a series connection structure.
Specifically, a parallel structure is formed between a plurality of LED light emitting chips 10 soldered on one pair of the wire structures 211, a series structure is formed between the LED light emitting chips 10 soldered on two adjacent pairs of the wire structures 211, and a parallel structure is formed between the LED light emitting chips 10 soldered on two adjacent groups of the wire structures 211.
Further, the support structure comprises two support bars 221 and a plurality of support bars 222, which are oppositely arranged, the inner sides of the two support bars 221 are provided with oppositely arranged convex teeth 2211, the teeth 2211 are arranged below the chip bonding pads 2113, and the width of the teeth 2211 is greater than that of the chip bonding pads 2113; the supporting sheet 222 is disposed between the two oppositely disposed teeth 2211, and the supporting sheet 222 is disposed below the LED light emitting chip 10, and the width of the supporting sheet 222 is greater than that of the LED light emitting chip 10; the support piece 222 is connected to the teeth 2211 through a lead, so that the support piece 221 and the support piece 222 realize heat dissipation of the flexible circuit board unit 20.
Specifically, when the flexible light strip is bent, the teeth 2211 and the supporting sheet 222 are not bent, and the widths of the teeth 2211 and the supporting sheet 222 are respectively greater than the widths of the chip bonding pad 2113 and the LED light emitting chip 10, so that the LED light emitting chip 10 is not affected by the bending of the flexible light strip, and the LED light emitting chip 10 is prevented from falling off.
Specifically, the supporting sheet 222 is connected to the supporting strip 221 through a wire, and heat emitted by the LED light emitting chip 10 is conducted to the supporting strip 221 through the supporting sheet 222, so that the heat dissipation capability of the flexible light strip is improved.
Furthermore, positive electrode pads 24 and negative electrode pads 25 are arranged at two ends of the flexible circuit board unit 20, pad connecting wires 26 are respectively arranged between the two positive electrode pads and the two negative electrode pads arranged at the two ends of the flexible circuit board unit 20, the pad connecting wires 26 are arranged along the length of the flexible circuit board unit 20, and the positive electrode pads 24 and the negative electrode pads 25 are provided with cutting marks 27; the positive electrode pad 24 with the negative electrode pad 25 adopts elongated welding pad, makes positive electrode pad 24 with negative electrode pad 25 is at the connecting power line or be convenient for welding and heat dissipation when the lamp area extends the concatenation, helps avoiding junction both ends when the flexible lamp area is spliced the phenomenon that LED luminescence chip 10 is not bright.
The manufacturing method of the bendable and cuttable high-reliability flexible lamp strip is used for manufacturing the bendable and cuttable high-reliability flexible lamp strip and comprises the following steps:
firstly, preparing the flexible circuit board unit 20, the LED light-emitting chip 10 and a current-limiting resistor;
step two, solder paste is printed on the chip bonding pads 2113 of the flexible circuit board unit 20;
step three, the LED light-emitting chip 10 is attached to the chip bonding pad 2113, and the current-limiting resistor is attached to the bonding pad connecting wire 26;
step four, reflow soldering is carried out to weld the LED light-emitting chip 10 on the chip bonding pad 2113, and a current-limiting resistor is welded on the bonding pad connecting wire 26;
fifthly, the first packaging adhesive layer 30 is arranged on the LED light-emitting chip 10 in a dot mode, so that the first packaging adhesive layer 30 covers the LED light-emitting chip 10 and a welding connection point of the LED light-emitting chip 10 and the chip bonding pad 2113;
and sixthly, laying the second packaging adhesive layer 40 on the first packaging adhesive layer 30 and the flexible circuit board unit 20, wherein the cross section of the second packaging adhesive layer 40 is provided with different heights and angles according to requirements.
In the bendable and cuttable high-reliability flexible lamp strip 100, the LED light-emitting chip 10 is a flip chip and is fixed in the chip mounting hole 23 of the flexible circuit board unit 20 by using a surface mount technology, the first encapsulating adhesive layer 30 covers the LED light-emitting chip 10 and the welding point of the LED light-emitting chip 10 and the chip bonding pad 2113 and is arranged in the dam formed by the chip mounting hole 23, and the first encapsulating adhesive layer 30 is tightly combined with the LED light-emitting chip 10 and the side wall of the chip mounting hole 23, so that the mounting reliability of the LED light-emitting chip 10 is improved, and the phenomenon that the LED light-emitting chip 10 is not bright due to the falling off of the chip bonding pad 2113 is avoided; the second packaging adhesive layer 40 is packaged outside the first packaging adhesive layer 30 and the flexible circuit board unit 20, and the flexibility of the flexible light strip is increased by the second packaging adhesive layer 40. The structure improves the throwing-resistant capability of the flexible lamp strip, prevents the LED light-emitting chip 10 from breaking off the bonding pad, and improves the reliability of the flexible lamp strip. The utility model discloses a flexible lamp area simple structure, manufacturing method easily realizes, and the facilitate promotion is used.
It should be noted that the present invention is not limited to the above embodiments, and other changes can be made by those skilled in the art according to the spirit of the present invention, and all the changes made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. A bendable and cuttable high-reliability flexible lamp strip is characterized by comprising a plurality of flexible circuit board units and a plurality of LED light-emitting chips, wherein the flexible circuit board units extend along the length direction of the lamp strip; the LED light-emitting chip is covered with a first packaging adhesive layer, the first packaging adhesive layer is filled in the chip mounting hole, the first packaging adhesive layer and the flexible circuit board unit are covered with a second packaging adhesive layer, and the first packaging adhesive layer increases the connection reliability of the LED light-emitting chip.
2. The bendable, cuttable, high reliability flexible light strip of claim 1, wherein the flexible wiring board unit further comprises a wiring layer, an intermediate insulating layer and a support layer, the wiring layer comprising a plurality of wire structures, the wire structures having chip pads on which the LED light emitting chips are soldered; the supporting layer is provided with a supporting structure, and the supporting structure is used for increasing the flexibility of the flexible lamp strip during bending; the intermediate insulating layer is arranged between the circuit layer and the supporting layer, so that the circuit layer and the supporting layer are mutually independent.
3. The flexible light strip of claim 2, wherein the surface insulating layer is disposed on the upper surface of the flexible circuit board unit, and the surface insulating layer is used for insulating the circuit layer of the flexible circuit board unit from the outside.
4. The flexible light strip of claim 2, wherein the chip mounting holes are uniformly distributed on the surface insulating layer along the length direction of the flexible circuit board unit, and the chip mounting holes are disposed above the chip pads of the flexible circuit board unit.
5. The flexible light strip of claim 2, wherein the surface insulating layer has a thickness, the area of the chip mounting hole is larger than the area of the LED light emitting chip and the solder connection point between the LED light emitting chip and the chip pad, and the chip mounting hole forms a dam around the LED light emitting chip.
6. The bendable and cuttable high-reliability flexible light strip according to claim 5, wherein the first packaging adhesive layer covers the LED light-emitting chip and the welding points between the LED light-emitting chip and the chip bonding pad, the first packaging adhesive layer is disposed in the dam and tightly bonded to the inner side wall of the dam, and the first packaging adhesive layer is used for enhancing the fixed connection strength between the LED light-emitting chip and the chip bonding pad.
7. The flexible light strip of claim 6, wherein the second adhesive layer covers the circuit layer and the first adhesive layer of the flexible circuit board unit along the length direction of the flexible circuit board unit, and the height of the second adhesive layer is greater than the height of the first adhesive layer.
8. The flexible light strip of claim 1, wherein the first adhesive layer is made of epoxy resin adhesive with certain hardness, the second adhesive layer is made of thixotropic adhesive, and the second adhesive layer is made of mixed fluorescent adhesive.
9. The bendable, cuttable, high reliability flexible light strip of claim 8, wherein the cross section of the second layer of adhesive has different heights and shapes, the light emitting angle of the LED light emitting chip is changed by changing the shape of the glue of the second layer of adhesive, and the second layer of adhesive is used to increase the flexibility of the light strip and provide the light strip with different light emitting angles.
10. The flexible light strip of claim 9, wherein the flexible circuit board unit has positive electrode pads and negative electrode pads at two ends thereof, and pad connection lines are respectively disposed between the two positive electrode pads and the two negative electrode pads at two ends thereof, the pad connection lines being disposed along the length of the flexible circuit board unit, and the positive electrode pads and the negative electrode pads having cutting marks thereon; the positive electrode pad with the negative electrode pad adopts elongated welding pad, makes the positive electrode pad with the negative electrode pad is at the connecting power line or be convenient for weld and heat dissipation when the lamp area extends the concatenation, helps avoiding junction both ends when flexible lamp area splices the phenomenon that LED luminescence chip is not bright.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922407034.3U CN213212161U (en) | 2019-12-27 | 2019-12-27 | Bendable and cuttable high-reliability flexible lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922407034.3U CN213212161U (en) | 2019-12-27 | 2019-12-27 | Bendable and cuttable high-reliability flexible lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213212161U true CN213212161U (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922407034.3U Active CN213212161U (en) | 2019-12-27 | 2019-12-27 | Bendable and cuttable high-reliability flexible lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213212161U (en) |
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2019
- 2019-12-27 CN CN201922407034.3U patent/CN213212161U/en active Active
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