CN213094732U - Layout structure of power amplifier - Google Patents

Abstract

The utility model discloses a power amplifier's layout structure, include: the heat radiator comprises a shell, wherein a first base plate, a second base plate and a heat radiator are arranged in the shell, a positioning column is arranged on the lower side surface of the shell, the lower side surface of the first base plate is fixedly connected with the positioning column, a first heat-conducting fin is welded on the upper side surface of the first base plate, a second heat-conducting fin is welded on the lower side surface of the second base plate, the upper side surface of the heat radiator is connected with the second heat-conducting fin, the lower side surface of the heat radiator is connected with the first heat-conducting fin, and the upper side surface of the first base plate is; the front side wall of the shell is provided with a front ventilation window, and the rear side wall of the shell is provided with a rear ventilation window; the radiator is installed between the front louver and the rear louver. By the layout structure, the occupied space of the power amplifier is reduced while the efficient heat dissipation of the power amplifier is ensured, and conditions are provided for the miniaturization of the power amplifier. The utility model discloses mainly used power amplifier technical field.

Description

Layout structure of power amplifier

Technical Field

The utility model relates to a power amplifier technical field, in particular to power amplifier's layout structure.

Background

A power amplifier (abbreviated as "power amplifier") is an amplifier that can generate maximum power output to drive a load (e.g., a speaker) under a given distortion ratio. The power amplifier plays a role of 'organization and coordination' in the whole sound system, and governs to some extent whether the whole system can provide good sound quality output.

Heat sinking is a significant concern in the industry for power amplifiers. There is a certain demand for miniaturization of power amplifiers in the industry, but the layout of the existing power amplifiers is often unreasonable in the miniaturization design, so that the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a layout structure of a power amplifier to solve one or more technical problems in the prior art, and at least provide a useful choice or creation condition.

The utility model provides a solution of its technical problem is: a layout structure of a power amplifier, comprising: the heat radiator comprises a shell, wherein a first base plate, a second base plate and a heat radiator are installed inside the shell, a positioning column is arranged on the lower side surface of the shell, the lower side surface of the first base plate is fixedly connected with the positioning column, a first heat-conducting fin is welded on the upper side surface of the first base plate, a second heat-conducting fin is welded on the lower side surface of the second base plate, the upper side surface of the heat radiator is connected with the second heat-conducting fin, the lower side surface of the heat radiator is connected with the first heat-conducting fin, and the upper side surface of the first base plate is connected with the lower side surface of the second base; the front side wall of the shell is provided with a front ventilation window, and the rear side wall of the shell is provided with a rear ventilation window; the radiator is installed between the front louver and the rear louver.

Further, the radiator is equipped with first ventilation groove array, first ventilation groove array comprises a plurality of unit cell body, the one end of unit cell body is close to preceding ventilation window, the other end of unit cell body is close to back ventilation window.

Furthermore, the radiator is also provided with a second vent groove array, and the second vent groove arrays are symmetrical to each other.

Further, the heat sink is an aluminum alloy member.

Furthermore, the connecting column is a copper column.

Further, a handle is arranged on the front side wall of the shell. .

The utility model has the advantages that: a layout structure of a power amplifier, comprising: the heat radiator comprises a shell, wherein a first base plate, a second base plate and a heat radiator are installed inside the shell, a positioning column is arranged on the lower side surface of the shell, the lower side surface of the first base plate is fixedly connected with the positioning column, a first heat-conducting fin is welded on the upper side surface of the first base plate, a second heat-conducting fin is welded on the lower side surface of the second base plate, the upper side surface of the heat radiator is connected with the second heat-conducting fin, the lower side surface of the heat radiator is connected with the first heat-conducting fin, and the upper side surface of the first base plate is connected with the lower side surface of the second base; the front side wall of the shell is provided with a front ventilation window, and the rear side wall of the shell is provided with a rear ventilation window; the radiator is installed between the front louver and the rear louver. By the layout structure, the occupied space of the power amplifier is reduced while the efficient heat dissipation of the power amplifier is ensured, and conditions are provided for the miniaturization of the power amplifier.

Drawings

In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures represent only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from these figures without inventive effort.

Fig. 1 is a schematic diagram of the internal structure of a power amplifier;

fig. 2 is a schematic cross-sectional structure of a power amplifier.

Detailed Description

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the coupling/connection relationships mentioned herein do not mean that the components are directly connected, but mean that a better coupling structure can be formed by adding or reducing coupling accessories according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.

Referring to fig. 1 and 2, a layout structure of a power amplifier includes: the heat dissipation device comprises a shell 100, wherein a first substrate 310, a second substrate 320 and a heat sink 200 are installed inside the shell 100, a positioning column 311 is arranged on the lower side surface of the shell 100, the lower side surface of the first substrate 310 is fixedly connected with the positioning column 311, a first heat-conducting fin (not shown) is welded on the upper side surface of the first substrate 310, a second heat-conducting fin (not shown) is welded on the lower side surface of the second substrate 320, the upper side surface of the heat sink 200 is connected with the second heat-conducting fin, the lower side surface of the heat sink 200 is connected with the first heat-conducting fin, and the upper side surface of the first substrate 310 is connected with the lower side surface of the second substrate 320 through a connecting column 321; a front ventilation window 110 is arranged on the front side wall of the shell 100, and a rear ventilation window 120 is arranged on the rear side wall of the shell 100; the heat sink 200 is installed between the front louver 110 and the rear louver 120. The first heat conducting sheet is a copper-clad structure welded on the first substrate 310, and the second heat conducting sheet is a copper-clad structure welded on the second substrate 320. The first and second heat-conductive sheets function to guide heat generated from the first and second substrates 310 and 320 to the heat sink 200. It should be noted that, when the first substrate 310 and the second substrate 320 are in layout, the heat conducting lines may be disposed on the components with high heat dissipation, and the heat is transferred to the first heat conducting sheet or the second heat conducting sheet through the heat conducting lines. And transfers the heat to the heat sink 200 through the first heat-conductive sheet or the second heat-conductive sheet. The heat sink 200 may be fixed to the first substrate 310 and the second substrate 320 by screws. Fig. 1 is a schematic view reflecting the internal structure of the power amplifier, in which the upper sidewall of the case 100 is removed while the second substrate 320 is separated from the connection post 321.

By providing the first substrate 310 and the second substrate 320, the electronic components of the entire power amplifier can be distributed on two boards, providing conditions for downsizing the entire power amplifier. Meanwhile, since the heat sink 200 is in contact with the first substrate 310 and the second substrate 320, respectively, one heat sink 200 can provide heat dissipation service for the two substrates, thereby improving heat dissipation efficiency of the two substrates. Also, when the power amplifier operates, since the front louver 110 and the rear louver 120 generate air flows, the flowing air acts on the heat sink 200, further improving the heat dissipation efficiency of the heat sink 200.

The power amplifier has the advantages that through the layout structure, the efficient heat dissipation of the power amplifier is guaranteed, meanwhile, the occupied space of the power amplifier is reduced, and conditions are provided for the miniaturization of the power amplifier.

The choice of the heat sink 200 may be varied. In some preferred embodiments, the heat sink 200 is provided with a first vent groove array 210, the first vent groove array 210 is composed of a plurality of unit groove bodies, one end of each unit groove body is close to the front vent window 110, and the other end of each unit groove body is close to the rear vent window 120. Through the first ventilation groove array 210, the area of the heat sink 200 contacting with the flowing air is increased, and the heat dissipation efficiency is improved.

Of course, the greater the number of vent slot arrays, the greater the contact area between the heat sink 200 and the flowing air, and the greater the heat dissipation efficiency of the heat sink 200. In some preferred embodiments, the heat sink 200 is provided with a second vent slot array 220 in addition to the first vent slot array 210, and the second vent slot array 220 is symmetrical to the first vent slot array 210.

The first substrate 310 and the second substrate 320 are connected by the connection post 321, and the connection post 321 mainly functions to support and connect the second substrate 320. It is in principle better for the material choice of the connecting column 321 to be harder. In some preferred embodiments, the connecting posts 321 are copper posts. The material of the connecting column 321 is selected to be copper, which mainly considers corrosion resistance and heat dissipation, and the connecting column 321 is in contact with the first substrate 310 and the second substrate 320, so that the connecting column 321 selected to be copper can dissipate heat for the first substrate 310 and the second substrate 320 to a certain extent. Meanwhile, since the connection is directly made with the first and second substrates 310 and 320, if the connection post 321 has weak corrosion resistance, rust may be easily generated at the connection position, which may affect the first and second substrates 310 and 320. For this reason, the connecting post 321 is preferably a copper post.

In some preferred embodiments, the heat sink 200 is an aluminum alloy member.

To facilitate movement, in some preferred embodiments, the front side wall of the housing 100 is provided with a handle 230. The entire power amplifier can be lifted up by the handle 230 to facilitate transportation.

While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the invention is not limited to the details of the embodiments shown, but is capable of various modifications and changes without departing from the spirit of the invention.

Claims (6)

1. A layout structure of a power amplifier, comprising: the heat radiator comprises a shell, wherein a first base plate, a second base plate and a heat radiator are installed inside the shell, a positioning column is arranged on the lower side surface of the shell, the lower side surface of the first base plate is fixedly connected with the positioning column, a first heat-conducting fin is welded on the upper side surface of the first base plate, a second heat-conducting fin is welded on the lower side surface of the second base plate, the upper side surface of the heat radiator is connected with the second heat-conducting fin, the lower side surface of the heat radiator is connected with the first heat-conducting fin, and the upper side surface of the first base plate is connected with the lower side surface of the second base; the front side wall of the shell is provided with a front ventilation window, and the rear side wall of the shell is provided with a rear ventilation window; the radiator is installed between the front louver and the rear louver.

2. The layout structure of a power amplifier according to claim 1, wherein: the radiator is equipped with first ventilation groove array, first ventilation groove array comprises a plurality of unit cell body, the one end of unit cell body is close to preceding ventilation window, the other end of unit cell body is close to back ventilation window.

3. The layout structure of a power amplifier according to claim 2, wherein: the radiator is also provided with a second vent groove array, and the second vent groove arrays are mutually symmetrical.

4. The layout structure of a power amplifier according to claim 1, wherein: the heat sink is an aluminum alloy member.

5. The layout structure of a power amplifier according to claim 1, wherein: the connecting column is a copper column.

6. The layout structure of a power amplifier according to claim 1, wherein: the front side wall of the shell is provided with a handle.

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