CN213044013U

CN213044013U - Air-cooled heat dissipation device and electronic product with same

Info

Publication number: CN213044013U
Application number: CN202021538246.1U
Authority: CN
Inventors: 邹昊雄
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-04-23
Anticipated expiration: 2030-07-28

Abstract

The utility model relates to an air-cooled heat dissipation device and an electronic product with the heat dissipation device, wherein the air-cooled heat dissipation device comprises a volume-variable unit, a driving unit and a heat dissipation module; the heat dissipation module is provided with a heat absorption plate and a heat exchange cavity, the heat exchange cavity is communicated with the volume variable unit, and foam metal or a plurality of heat dissipation fins formed by extending the heat absorption plate into the heat exchange cavity are arranged in the heat exchange cavity; when the volume of the volume-variable unit is changed from large to small, the air in the volume-variable unit is discharged from the opening through the heat exchange cavity, and when the volume of the volume-variable unit is changed from small to large, the external air enters the volume-variable unit through the heat exchange cavity. The utility model discloses a fluid pump among the air-cooled heat abstractor among the current liquid cooling heat abstractor does not need the coolant liquid yet, can make heat abstractor's structure more compact, also more safe for this heat abstractor can be used in consumer electronics products such as cell-phone, panel computer and notebook computer.

Description

Air-cooled heat dissipation device and electronic product with same

Technical Field

The utility model relates to a heat abstractor, more specifically say, relate to an air-cooled heat abstractor and have this heat abstractor's electronic product.

Background

The thinning and thinning are an important trend of consumer electronic products such as mobile phones, tablet computers, notebook computers and the like. On one hand, electronic products are increasingly light, thin and portable; on the other hand, the performance of electronic products is continuously improved, and the heat productivity of core components is increased, which may bring great challenges to the heat dissipation of electronic products. Although some electronic products attempt to dissipate heat by using active liquid-cooling heat dissipation, it is difficult to achieve a heat dissipation device that is thin and light due to the size and volume of components such as a fluid pump, and thus it is difficult to achieve commercialization. But also for electronic products, there is a great risk of leakage of the cooling liquid inside the heat sink.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide an air-cooled heat dissipation device, which is more compact than the conventional heat dissipation device, and can be used in consumer electronics products such as mobile phones, tablet computers, and notebook computers.

According to an embodiment of the air-cooled heat dissipating device of the present invention, the air-cooled heat dissipating device includes a volume variable unit, a driving unit, and a heat dissipating module; the heat dissipation module is provided with a heat absorption plate and a heat exchange cavity, the heat absorption plate is a side wall of the heat exchange cavity, the heat exchange cavity is communicated with the volume variable unit, the heat dissipation module is also provided with an opening for air to enter and exit the heat exchange cavity, and foam metal or a plurality of heat dissipation fins formed by extending the heat absorption plate into the heat exchange cavity are arranged in the heat exchange cavity; the volume of the volume-variable unit is driven by the driving unit to change in a reciprocating manner, when the volume of the volume-variable unit is reduced from large to small, air in the volume-variable unit is discharged from the opening through the heat exchange cavity by the volume-variable unit, and when the volume of the volume-variable unit is reduced from small to large, outside air enters the volume-variable unit through the heat exchange cavity.

According to the utility model discloses an embodiment of air-cooled heat abstractor, the open-ended position is provided with dustproof apron, air-cooled heat abstractor is still including being used for the drive the dustproof apron actuating mechanism of dustproof apron switch.

According to the utility model discloses an embodiment of air-cooled heat abstractor, dustproof apron actuating mechanism include with the reset spring of dustproof apron connection, and with the memory alloy body that can warp during the circular telegram of dustproof apron connection.

According to the utility model discloses an embodiment of air-cooled heat abstractor, dustproof apron actuating mechanism include with the reset spring that dustproof apron is connected, and with the electromagnetic actuator that dustproof apron is connected.

According to an embodiment of the air-cooled heat dissipating device of the present invention, the heat absorbing plate is provided with a vacuum chamber soaking plate.

According to an embodiment of the air-cooled heat dissipating device of the present invention, the heat absorbing plate is a vacuum chamber soaking plate.

According to the utility model discloses an embodiment of forced air cooling heat abstractor, the variable unit of volume is organ case structure, the variable unit of volume has the lateral wall of constituteing by a plurality of collapsible portions.

According to the utility model discloses an embodiment of air-cooled heat abstractor, drive unit include step motor and by step motor driven lead screw mechanism.

Another object of the present invention is to provide an electronic product, which has the above air-cooled heat dissipating device, wherein the heat absorbing plate of the air-cooled heat dissipating device is pressed close to the heat generating component of the electronic product.

According to an embodiment of the utility model discloses an electronic product, electronic product is cell-phone, panel computer or notebook computer, the part that generates heat does electronic product's microprocessor, power, wireless charging part or memory.

Implement the utility model discloses an air-cooled heat abstractor and electronic product has following beneficial effect: the utility model discloses a fluid pump among the air-cooled heat abstractor among the current liquid cooling heat abstractor does not need the coolant liquid yet, can make heat abstractor's structure more compact, also more safe for this heat abstractor can be used in consumer electronics products such as cell-phone, panel computer and notebook computer.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic structural view of an embodiment of an air-cooled heat dissipation device according to the present invention;

fig. 2 is a schematic view of an internal structure of an embodiment of the air-cooling heat dissipation device of the present invention;

fig. 3 is a schematic view of the direction of air flow when the volume of the volume-variable unit is changed from large to small in an embodiment of the air-cooled heat dissipation device of the present invention;

fig. 4 is a schematic view illustrating the flow direction of air when the volume of the volume variable unit is changed from small to large in an embodiment of the air-cooled heat dissipation apparatus of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a heat sink, and more particularly to a heat sink for cooling an electronic device, and a method for manufacturing the same.

In the description of the air-cooled heat dissipating device and the electronic product having the same of the present invention, it is to be understood that the terms "front", "back", "up", "down", "upper", "lower", etc. indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for convenience of description, but not for the purpose of indicating or implying that the device or element to be referred must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Fig. 1 to 4 are schematic views of an air-cooling heat dissipation device according to an embodiment of the present invention. In this embodiment, the air-cooled heat dissipating apparatus includes a volume varying unit 10, a driving unit 20, and a heat dissipating module 30. Wherein, the volume-variable unit 10 is in an organ box structure, the volume-variable unit 10 has a side wall 11 composed of a plurality of foldable parts 101, and the foldable parts 101 can be stretched or folded under the driving of the driving unit 20, so that the volume of the volume-variable unit 10 can be changed back and forth under the driving of the driving unit 20. The driving unit 20 may include a stepping motor 21 and a lead screw mechanism 22 connected to the stepping motor 21, wherein the stepping motor 21 drives the lead screw mechanism 22 to move so as to drive the volume of the variable volume unit 10 to change.

Referring to fig. 1 to 4, the heat dissipation module 30 has an absorber plate 31 and a heat exchange cavity 32, wherein the absorber plate 31 is a side wall of the heat exchange cavity 32, the heat exchange cavity 32 is communicated with the variable volume unit 10, the heat dissipation module 30 further has an opening 33 for air to enter and exit the heat exchange cavity 32, and a foam metal 34 is disposed in the heat exchange cavity 32, it should be understood that a plurality of heat dissipation fins formed by extending the absorber plate 31 into the heat exchange cavity 32 may also be disposed in the heat exchange cavity 32. The foam metal 34 or the heat dissipation fins in the heat exchange cavity 32 are used for exchanging heat with air when the air flows through the heat exchange cavity 32, so that the heat of the foam metal 34 or the heat dissipation fins is taken away by the air, and the purpose of heat dissipation is achieved.

Referring to fig. 2 to 4, the volume of the variable volume unit 10 may be reciprocally changed by the driving unit 20. Referring to fig. 3, the volume of the variable volume unit 10 is variable, when the volume of the variable volume unit 10 is decreased from large to small, the air in the variable volume unit 10 is discharged from the opening 33 through the heat exchange cavity 32 from the variable volume unit 10, when the volume of the variable volume unit 10 is increased from small to large, the external air enters the variable volume unit 10 through the heat exchange cavity 32, and as the air enters and exits the heat exchange cavity 32, the heat of the foam metal 34 or the heat dissipation fins in the heat exchange cavity 32 is taken away by the air, thereby achieving the purpose of heat dissipation.

In the air-cooled heat dissipating device of the present invention, a vacuum Chamber Vapor Chamber (Vapor Chamber) Vapor Chamber may be provided on the heat absorbing plate 31 of the heat dissipating module 30, or the Vapor Chamber may be directly used as the heat absorbing plate 31. The heat absorbing plate 31 serves to absorb heat from the heat generating component and then conduct it to the metal foam 34 or the heat dissipating fins in the heat exchange chamber 32.

Referring to fig. 1, in order to prevent dust and the like from entering the heat exchange cavity 32, the opening 33 may be closed when the air-cooled heat sink does not operate, specifically, a dust-proof cover plate 40 may be disposed at the position of the opening 33, and the air-cooled heat sink further includes a dust-proof cover plate driving mechanism for driving the dust-proof cover plate 40 to open and close. In this embodiment, the dust-proof cover driving mechanism includes a return spring 41 connected to the dust-proof cover 40, and a memory alloy body 42 connected to the dust-proof cover 40 and deformed when energized, wherein the memory alloy body 42 is contracted when energized and heated to pull the dust-proof cover 40 apart and open the opening 33, and when the energization is stopped, the memory alloy body 42 returns to a normal temperature state, and the dust-proof cover 40 closes the opening 33 with the aid of the return spring 41. It should be understood that the memory alloy body 42 may be replaced by an electromagnetic actuator connected to the dust cover 40, and the dust cover 40 is closed or opened by the electromagnetic actuator.

The utility model also provides an electronic product, this electronic product have above air-cooled heat abstractor, the part setting that generates heat of electronic product is pressed close to air-cooled heat abstractor's absorber plate, and electronic product is cell-phone, panel computer or notebook computer, and the part that generates heat is microprocessor, power, wireless charging part or the memory of electronic product.

The embodiments of the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, which are only illustrative and not restrictive, and those skilled in the art can make many forms without departing from the spirit and scope of the present invention, and these forms are all within the protection scope of the present invention.

Claims

1. An air-cooled heat dissipation device is characterized by comprising a volume variable unit, a driving unit and a heat dissipation module; the heat dissipation module is provided with a heat absorption plate and a heat exchange cavity, the heat absorption plate is a side wall of the heat exchange cavity, the heat exchange cavity is communicated with the volume variable unit, the heat dissipation module is also provided with an opening for air to enter and exit the heat exchange cavity, and foam metal or a plurality of heat dissipation fins formed by extending the heat absorption plate into the heat exchange cavity are arranged in the heat exchange cavity; the volume of the volume-variable unit is driven by the driving unit to change in a reciprocating manner, when the volume of the volume-variable unit is reduced from large to small, air in the volume-variable unit is discharged from the opening through the heat exchange cavity by the volume-variable unit, and when the volume of the volume-variable unit is reduced from small to large, outside air enters the volume-variable unit through the heat exchange cavity.

2. The air-cooled heat sink according to claim 1, wherein a dust-proof cover is disposed at the position of the opening, and the air-cooled heat sink further comprises a dust-proof cover driving mechanism for driving the dust-proof cover to open and close.

3. The air-cooled heat sink according to claim 2, wherein the dust cover driving mechanism includes a return spring connected to the dust cover, and a memory alloy body connected to the dust cover and deformable when energized.

4. The air-cooled heat sink of claim 2, wherein the dust cover drive mechanism comprises a return spring coupled to the dust cover and an electromagnetic actuator coupled to the dust cover.

5. The air-cooled heat sink of claim 1, wherein the absorber plate is provided with a vacuum chamber vapor chamber.

6. The air-cooled heat sink of claim 1, wherein the absorber plate is a vacuum chamber vapor chamber.

7. The air-cooled heat dissipating device according to claim 1, wherein the variable volume unit has an accordion-box structure having a side wall composed of a plurality of foldable portions.

8. The air-cooled heat sink of claim 7, wherein the drive unit comprises a stepper motor and a lead screw mechanism driven by the stepper motor.

9. An electronic product, characterized in that the electronic product has the air-cooled heat sink according to any one of claims 1 to 8, and a heat absorbing plate of the air-cooled heat sink is disposed proximate to a heat generating component of the electronic product.

10. The electronic product of claim 9, wherein the electronic product is a mobile phone, a tablet computer or a notebook computer, and the heat generating component is a microprocessor, a power supply, a wireless charging component or a memory of the electronic product.