CN109168294B

CN109168294B - Electronic device and control method thereof

Info

Publication number: CN109168294B
Application number: CN201811184978.2A
Authority: CN
Inventors: 范艳辉
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-10-11
Filing date: 2018-10-11
Publication date: 2020-03-10
Anticipated expiration: 2038-10-11
Also published as: CN109168294A

Abstract

The application provides an electronic device and a control method thereof. The electronic device comprises a shell component, a heating piece, a radiator and a power mechanism, wherein the shell component is provided with an opening, the heating piece is connected with the radiator, and the power mechanism is connected with the radiator; the power mechanism is used for driving the radiator to slide out of the opening or driving the radiator to retract from the opening. This scheme can improve the radiating efficiency who generates heat.

Description

Electronic device and control method thereof

Technical Field

The present disclosure relates to heat dissipation, and particularly to an electronic device and a control method thereof.

Background

At present, the integration level of electronic devices is higher and higher, which causes the installation space of electronic components inside the electronic devices to be greatly compressed, and the heat generated by the electronic components in the operation process cannot be timely and effectively diffused, so that the temperature of the electronic components is increased, and even the temperature of adjacent electronic components is increased possibly because of the temperature increase of the electronic components. Therefore, it is desirable to design an electronic device to improve the heat dissipation efficiency of electronic components.

Disclosure of Invention

The application provides an electronic device which comprises a shell assembly, a heating piece, a radiator and a power mechanism, wherein the shell assembly is provided with an opening, the heating piece is connected with the radiator, and the power mechanism is connected with the radiator; the power mechanism is used for driving the radiator to slide out of the opening or driving the radiator to retract from the opening.

The application provides a control method of an electronic device, the electronic device comprises a shell component, a heating piece, a radiator and a power mechanism, wherein the shell component is provided with an opening, the heating piece is connected with the radiator, and the power mechanism is connected with the radiator; the control method comprises the following steps: the electronic device receives a control instruction; the electronic device sends an execution instruction to the power mechanism; the power mechanism is used for driving the radiator to slide out of the opening or driving the radiator to retract from the opening after receiving the execution instruction.

In this application, generate heat a and be connected with the radiator, generate heat on the heat of a can conduct to the radiator, the radiator is connected with power unit, and power unit can promote the radiator and slide to make the radiator can follow shell assembly's trompil department roll-off or retract from the trompil. When the radiator slides out of the opening hole, the radiator is fully contacted with the external environment of the electronic device, heat on the radiating assembly is quickly diffused out, and therefore the heating element can always work at normal temperature.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of an embodiment of an electronic device provided herein;

FIG. 2 is a schematic view of an assembly structure of an embodiment of a heat sink assembly region of an electronic device provided herein;

FIG. 3 is an exploded view of an embodiment of a heat sink assembly region of an electronic device according to the present disclosure;

FIG. 4 is a schematic structural view of an embodiment of a first fastening frame provided herein;

FIG. 5 is a schematic view of an embodiment of a heat sink provided herein at an angle;

FIG. 6 is a schematic view of an embodiment of a heat sink provided herein at another angle;

FIG. 7 is a schematic view of a cross-section taken in the direction VII-VII of FIG. 2 of the present application;

FIG. 8 is a schematic view of an assembly structure of another embodiment of a heat sink assembly region of an electronic device provided herein;

FIG. 9 is a schematic structural view of an embodiment of a connecting rod provided herein;

FIG. 10 is a schematic structural view of an embodiment of a buffer provided herein;

FIG. 11 is a cross-sectional view of one embodiment of a heat sink block region of an electronic device provided herein;

fig. 12 is a flowchart illustrating a control method of an electronic device according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 and 2, the electronic device includes a heat generating component 10, a housing component 20, a display screen component 30, and a heat dissipating component 40. The heating element 10 is a part with large heat generation amount in the electronic device, the heating element 10 is accommodated in the shell assembly 20, the display screen assembly 30 is fixed on the outer side of the shell assembly 20 so as to display information such as characters and images for a user, the heat dissipation assembly 40 is arranged in the shell assembly 20 and connected with the heating element 10, the heat of the heating element 10 can be conducted to the heat dissipation assembly 40, part of the structure of the heat dissipation assembly 40 can extend out of the opening 201 at the end part of the shell assembly 20, thereby being fully contacted with the external environment of the electronic device, diffusing the heat on the heat dissipation assembly 40, and further ensuring that the heating element 10 can always work at normal temperature. Fig. 1 a1 shows the radiator module 40 in a state of not protruding from the housing module 20, and fig. 1 a2 shows the radiator module 40 in a state of partly protruding from the housing module 20. The electronic device includes a smart phone, a tablet, a notebook, a smart watch, a PDA, and the like, which is not limited herein.

Referring to fig. 1 to 3, the heat dissipation assembly 40 includes a first fixing frame 41, a second fixing frame 42, a heat sink 43, a power mechanism 44 and a connecting rod 45, the first fixing frame 41 and the second fixing frame 42 are both fixed on the housing assembly 20, the heat sink 43 is slidably connected to the first fixing frame 41, the heating element 10 is connected to the heat sink 43, heat of the heating element 10 can be conducted to the heat sink 43, the power mechanism 44 is connected to the second fixing frame 42, the connecting rod 45 is respectively connected to the power mechanism 44 and the heat sink 43, the connecting rod 45 is provided with a first rotating column 451, the second fixing frame 42 is provided with a first waist-shaped hole 421, and the first rotating column 451 is assembled in the first waist-shaped hole 421. The power mechanism 44 is used for driving the connecting rod 45 to rotate around the first rotating column 451 as a base point, so that the connecting rod 45 pushes the heat sink 43 to slide, and the heat sink 43 can slide out of the opening 201 or can retract from the opening 201.

The heat sink assembly 40 is fixed in the case assembly 20 by the first fixing frame 41 and the second fixing frame 42, thereby facilitating the modular design of the electronic device, and furthermore, when assembling or repairing the heat sink assembly 40, the heat sink assembly 40 can be taken out as a whole to improve the working efficiency.

The first holder 41 and the second holder 42 may be two different parts of one piece, or the first holder 41 and the second holder 42 may be two separate pieces. The first fixing frame 41 and the second fixing frame 42 shown in fig. 2 and 3 are two separate parts, the heat sink 43 is connected with the first fixing frame 41 in a sliding manner, and the heating element 10 is connected with the heat sink 43; the power mechanism 44 is disposed on the second fixing frame 42, so as to further refine the module design of the heat dissipation assembly 40. When the heat dissipation assembly 40 is maintained, the module of the first fixing frame 41 or the module of the second fixing frame 42 may be replaced and maintained, so that the maintenance cost of the heat dissipation assembly 40 is reduced on the premise of improving the maintenance efficiency of the heat dissipation assembly 40.

The first rotating cylinder 451 is fitted in the first kidney-shaped hole 421, and the first rotating cylinder 451 can slide in the first kidney-shaped hole 421. When the heat sink 43 extends out of the housing assembly 20 and the heat sink 43 is accidentally bumped, the first rotating column 451 can slide in the first waist-shaped hole 421, the connecting rod 45 rotates with the joint of the connecting rod 45 and the power mechanism 44 as a base point, and the connecting rod 45 drives the heat sink 43 to retract into the housing assembly 20, so that damage caused by strong impact of external force on the heat sink 43 is eliminated, and the connecting rod 45 and the power mechanism 44 are indirectly protected.

The heat generating member 10 may be a component having a large heat generation amount, such as a battery, a speaker, a microphone, or a camera, and the heat generating member 10 directly contacts the heat sink 43 and transfers its heat to the heat sink 43.

The heat generating element 10 may also be a processor (CPU), which is an ultra-large scale integrated circuit and is an operation core and a control core of an electronic device. The processor functions to interpret the electronic device instructions and process data in the electronic device software, which generates a large amount of heat. The electronic device further comprises a circuit board 11 and a shielding cover 12, the circuit board 11 is connected with the shell assembly 20, the heating element 10 is electrically connected with the circuit board 11, the shielding cover 12 is connected with the circuit board 11 and covers the heating element 10, the shielding cover 12 is abutted to the radiator 43, and heat is conducted in sequence through the heating element 10, the shielding cover 12 and the radiator 43. Optionally, a silicone rubber is disposed between the heat generating member 10 and the shield 12 to increase the heat transfer efficiency.

Referring to fig. 3 and 4, the first fixing frame 41 includes a baffle 411 and side plates 412, the side plates 412 are disposed at opposite ends of the baffle 411, a sliding groove 413 is disposed at a side of the side plates 412 facing the baffle 411, and the heat sink 43 is slidably engaged with the sliding groove 413 to be assembled between the two side plates 412. The shape of the sliding groove 413 may be a U shape, the shape of the sliding groove 413 may also be a V shape, and the sliding groove 413 may also be other irregular shapes. The baffle 411 divides the first fixing frame 41 into a first receiving space 414 and a second receiving space 415, and the first receiving space 414 faces the opening 201 of the housing assembly 20 (see fig. 1).

Referring to fig. 3 to 6, the heat sink 43 includes a heat dissipating portion 431 and a sliding portion 432. The heat dissipating part 431 is convexly disposed on one side of the sliding part 432, the heat dissipating part 431 can be accommodated in the first accommodating space 414, the heat generating member 10 can be connected with the sliding part 432, the heat generating member 10 can be accommodated in the second accommodating space 415, the heat generating member 10 conducts heat to the sliding part 432, and the sliding part 432 conducts heat to the heat dissipating part 431. The sliding portion 432 is slidably engaged with the sliding slot 413, and the sliding portion 432 is provided with a second rotating column 433 to be connected with the connecting rod 45.

Alternatively, the heat dissipating part 431 includes at least two heat dissipating fins protrudingly disposed on one side of the sliding part 432 to increase a contact area of the heat sink 43 with air, thereby improving heat dissipating efficiency of the heat sink 43.

Referring to fig. 7, the heat dissipating assembly 40 further includes a guiding element 46, the guiding element 46 is embedded in the sliding groove 413, the sliding portion 432 is in sliding fit with the guiding element 46, and the guiding element 46 is made of a material with self-lubricating properties, such as Polyoxymethylene (POM). The cross-sectional shape of the guide 46 may be U-shaped, the cross-sectional shape of the guide 46 may be V-shaped, and the cross-sectional shape of the guide 46 may be other shapes, which are not limited herein.

Referring to fig. 8, the power mechanism 44 includes a motor 441, a screw rod 442 and a power block 443, an output end of the motor 441 is connected to the screw rod 442, the screw rod 442 passes through the power block 443 to be connected to the second fixing frame 42, the power block 443 is in threaded connection with the screw rod 442, the power block 443 is provided with a third rotating column 4431, and the connecting rod 45 is connected to the third rotating column 4431. The motor 441 is used to rotate the screw rod 442 to push the power block 443 to slide, so that the power block 443 drives the connecting rod 45 to rotate around the first rotating column 451 (see fig. 3), and the connecting rod 45 pushes the heat sink 43 to extend out of the opening 201 or retract from the opening 201.

Wherein the motor 441 can rotate in an energized state, and the direction of rotation can be changed according to the direction of current, so that the lead screw 442 can rotate in a forward direction or a reverse direction, and the sliding direction of the power block 443 can be changed, and finally the heat sink 43 can extend from the opening 201 or can retract from the opening 201. In addition, the motor 441 can rotate at a speed determined according to the magnitude of the current, so that the heat sink 43 can slide at different speeds relative to the housing assembly 20.

The power mechanism 44 further includes a gear box 444, and the gear box 444 is respectively connected to the output end of the motor 441 and the lead screw 442 to perform a speed reduction process on the speed of the motor 441, so that the lead screw 442 obtains a large torque.

Referring to fig. 7 and 8, the power mechanism 44 further includes a first transmission wheel 445 and a second transmission wheel 446, and the output end of the motor 441, the first transmission wheel 445, the second transmission wheel 446 and the screw rod 442 are sequentially connected in a transmission manner. The first transmission wheel 445 and the second transmission wheel 446 are introduced into the power mechanism 44 to ensure that the axis of the motor 441 is parallel to the screw rod 442, so as to avoid the situation that the axis of the motor 441 and the screw rod 442 are on the same axis to cause the structure of the heat dissipation assembly 40 to be too loose and not compact, thereby affecting the installation and fixation of other parts in the electronic device.

The power mechanism 44 further includes a third driving wheel 447, the third driving wheel 447 is connected to the second fixing frame 42 and is respectively connected to the first driving wheel 445 and the second driving wheel 446 in a driving manner, the first driving wheel 445 drives the third driving wheel 447 to rotate, and the third driving wheel 447 drives the second driving wheel 446 to rotate. On the premise that the distance between the output end of the motor 441 and the screw rod 442 is fixed, the introduction of the third transmission wheel 447 can reduce the diameters of the first transmission wheel 445 and the second transmission wheel 446, so as to prevent the power mechanism 44 from affecting the overall thickness of the electronic device.

Referring to fig. 8 and 9, the opposite ends of the connecting rod 45 are respectively provided with a second waist-shaped hole 452 and a third waist-shaped hole 453, and the connecting rod 45 is provided with a first rotating column 451.

The second rotating post 433 is fitted in the second kidney hole 452, and the third rotating post 4431 is fitted in the third kidney hole 453. The second rotating column 433 can slide in the second waist-shaped hole 452, the third rotating column 4431 can slide in the third waist-shaped hole 453, and the second waist-shaped hole 452 and the third waist-shaped hole 453 provide a buffer distance for the link 45 during the rotation process, so that the normal operation of the link 45 is ensured.

Referring to fig. 1, 2 and 10, the heat dissipating assembly 40 further includes a buffer member 47, the buffer member 47 is connected to the second fixing frame 42 and elastically abuts against the first rotating column 451, so that the first rotating column 451 is fixed relative to the first waist-shaped hole 421, thereby ensuring that the connecting rod 45 stably rotates with the first rotating column 451 as a base point. When the heat sink 43 protrudes out of the opening 201 of the housing assembly 20 and when the heat sink 43 is accidentally bumped, the first rotating column 451 can compress the buffer member 47 to slide in the first kidney-shaped hole 421; when the strong impact disappears, the buffer member 47 recovers to deform to push the first rotating column 451 to restore to the original position, thereby ensuring that the heat dissipation assembly 40 can still work normally when the strong impact disappears.

The buffer member 47 may be a wire spring, the buffer member 47 may also be an elastic foam, and the buffer member 47 may also be a silicone rubber. Fig. 10 shows a case that the buffer member 47 is a wire spring, two opposite ends of the wire spring are respectively folded back to form a first hook-shaped portion 471 and a second hook-shaped portion 472, the second fixing frame 42 is provided with a position-limiting post 422, the first hook-shaped portion 471 is sleeved on the position-limiting post 422, the second hook-shaped portion 472 is sleeved on the first rotating post 451, wherein the wire spring is in a compressed state, so that the second hook-shaped portion 472 is elastically abutted against the first rotating post 451.

The second fixing frame 42 is provided with an accommodating groove 423, the first waist-shaped hole 421 penetrates through the bottom of the accommodating groove 423, the buffer 47 is accommodated in the accommodating groove 423, and the limiting column 422 is convexly disposed at the bottom of the accommodating groove 423.

Referring to fig. 11, the housing assembly 20 may include a housing 21 and a dust-proof plate 22, the display screen assembly 30 (see fig. 1) is disposed on the housing 21, the heat dissipation assembly 40 and the heat generating element 10 are accommodated in the housing 21, an opening 201 is disposed at an end of the housing 21, the dust-proof plate 22 is accommodated in the opening 201 to close the opening 201, the dust-proof plate 22 is elastically hinged to the housing 21, the dust-proof plate 22 is used to prevent external dust from entering the inside of the electronic device, and the heat sink 43 can slide out of the opening 201 of the housing 21 and push the dust-proof plate 22 out of the opening 201.

It should be noted that the housing 21 is a combination of a front housing and a rear housing in the electronic device, the front housing is fixed on the rear housing to form a receiving space for receiving the heat dissipation assembly 40 and the heat generating element 10, and the opening 201 may be opened on an end of the front housing or the rear housing, which is not limited herein.

Specifically, the dust-proof plate 22 is hinged to the housing 21 so that the dust-proof plate 22 can rotate around the housing 21, the dust-proof plate 22 is connected to the housing 21 through the elastic member 23, and when the dust-proof plate 22 is rotated out of the opening 201, the elastic member 23 is in a stretching state to provide a force for rotating the dust-proof plate 22 into the opening 201.

The elastic member 23 may be a spring, the elastic member 23 may also be an iron elastic sheet, and the elastic member 23 may also be other parts with a telescopic property. When the heat dissipating assembly 40 is in the extended state, the dust-proof plate 22 is pushed out of the opening 201 by the heat sink 43, and when the heat dissipating assembly 40 is in the non-extended state, the dust-proof plate 22 is automatically rebounded and accommodated in the opening 201. The dust-proof plate 22 may also be directly hinged to the housing 21, and when the heat dissipation assembly 40 retracts into the housing 21, the dust-proof plate 22 may fall back to the opening 201 by an external force, such as an artificial force or a self-gravity of the dust-proof plate 22, which is not limited herein.

As shown in fig. 8, in another implementation, the housing assembly 20 may not include a dust-proof plate, and when the heat dissipation assembly 40 is in the non-extended state, the heat sink 43 is fitted into the opening 201, and the outer circumferential surface of the heat sink 43 is flush with the outer circumferential surface of the housing assembly 20.

In the above embodiment, the heat generating member 10 is connected to the heat sink 43, the heat of the heat generating member 10 can be conducted to the heat sink 43, the heat sink 43 is connected to the power mechanism 44 through the connecting rod 45, and the power mechanism 44 can drive the connecting rod 45 to rotate around the first rotating column 451, so that the connecting rod 45 pushes the heat sink 43 to slide, and the heat sink 43 can slide out of the opening 201 or retract from the opening 201. When the heat sink 43 slides out of the opening 201, the heat sink 43 is in full contact with the external environment of the electronic device, and the heat on the heat dissipation assembly 40 is rapidly dissipated, thereby ensuring that the heat generating component 10 can always work at a normal temperature.

Further, the first rotating cylinder 451 is fitted in the first kidney hole 421, and the first rotating cylinder 451 can slide in the first kidney hole 421. When the heat sink 43 extends out of the housing assembly 20 and when the heat sink 43 is accidentally bumped, the first rotating column 451 can slide in the first kidney-shaped hole 421, the connecting rod 45 rotates with the third rotating column 4431 as a base point, and the connecting rod 45 drives the heat sink 43 to retract into the housing 21, so that damage caused by strong impact of external force on the heat sink 43 is eliminated, and the connecting rod 45 and the power mechanism 44 are indirectly protected.

Referring to fig. 1, fig. 3 and fig. 12, the electronic device includes a display screen assembly 30, a housing assembly 20, a heat generating element 10, a heat sink 43 and a power mechanism 44, wherein the display screen assembly 30 is fixed on an outer side of the housing assembly 20, the housing assembly 20 is provided with an opening 201, the heat generating element 10, the heat sink 43 and the power mechanism 44 are disposed in the housing assembly 20, the heat generating element 10 is connected to the heat sink 43, and the power mechanism 44 is connected to the heat sink 43.

M101: the electronic device receives a control instruction.

In one embodiment, when the user senses that the temperature of the electronic device is too high, the function switch of the electronic device is triggered to input the control command to the electronic device, and when the user senses that the temperature of the electronic device has been reduced to be within the proper range, the function switch of the electronic device is triggered to input the control command to the electronic device.

In another embodiment, the electronic device may include a temperature controller for detecting the temperature of the heat generating member 10. When the temperature is greater than or equal to the threshold value, a control command is input into the electronic device, and when the temperature is less than the threshold value, the control command is input into the electronic device.

M102: the electronics send execution instructions to the power mechanism 44.

After receiving the control command, the electronic device sends an execution command to the power mechanism 44 to electrically connect the power mechanism 44. At this time, the power mechanism 44 drives the heat sink 43 to slide out of the opening 201 of the housing assembly 20 or retract from the opening 201 of the housing assembly 20, when the temperature is greater than or equal to the threshold value, the heat sink 43 slides out of the opening 201 of the housing assembly 20 to rapidly dissipate heat of the heat generating component 10, and when the temperature is less than the threshold value, the heat sink 43 retracts from the opening 201 of the housing assembly 20.

The above description is only for the purpose of illustrating embodiments of the present invention and is not intended to limit the scope of the present invention, and all modifications, equivalents, and equivalent structures or equivalent processes that can be used directly or indirectly in other related fields of technology shall be encompassed by the present invention.

Claims

1. An electronic device, comprising:

the heating device comprises a shell assembly, a heating part, a radiator, a connecting rod, a second fixing frame and a power mechanism, wherein the shell assembly is provided with an opening, the heating part is connected with the radiator, the connecting rod is respectively connected with the power mechanism and the radiator, the second fixing frame is fixed on the shell assembly, and the power mechanism is connected with the second fixing frame;

wherein, the connecting rod is provided with first rotation post, the second mount is provided with first waist shape hole, first rotation post assemble in first waist shape hole, power unit is used for driving the connecting rod with first rotation post rotates as the basic point, so that the connecting rod promotes the radiator is followed trompil department roll-off or drive the radiator is followed trompil department withdrawal.

2. The electronic device of claim 1,

the electronic device further comprises a first fixing frame, the first fixing frame is connected with the shell assembly, a sliding groove is formed in the first fixing frame, and the radiator is in sliding fit with the sliding groove.

3. The electronic device of claim 2,

the first support comprises a baffle plate and side plates, the side plates are arranged at two opposite ends of the baffle plate, and the side plates are provided with the sliding grooves;

the radiator includes radiating part and sliding part, the radiating part set up in on one side of sliding part, the sliding part with spout sliding fit, generate heat the piece with the sliding part is connected, power unit with the sliding part is connected, in order to drive the sliding part with the radiating part is followed the trompil department roll-off.

4. The electronic device of claim 2,

the electronic device further comprises a guide piece, the guide piece is embedded in the sliding groove and is in sliding fit with the radiator, and the guide piece is made of polyformaldehyde.

5. The electronic device of claim 1,

the electronic device further comprises a buffer piece, wherein the buffer piece is connected with the second fixing frame and elastically abuts against the first rotating column, so that the first rotating column is fixed relative to the first waist-shaped hole.

6. The electronic device of claim 5,

the second fixing frame is provided with a containing groove, the first waist-shaped hole penetrates through the bottom of the containing groove, and the buffer piece is contained in the containing groove.

7. The electronic device of claim 6,

the buffer piece is a linear spring, and two opposite ends of the linear spring are respectively folded back to form a first hook-shaped part and a second hook-shaped part;

the second fixing frame is provided with a limiting column in a protruding mode at the bottom of the accommodating groove, the first hook-shaped portion is sleeved on the limiting column, the second hook-shaped portion is sleeved on the first rotating column, and the wire spring is in a compressed state so that the second hook-shaped portion can be elastically abutted against the first rotating column.

8. The electronic device of claim 1,

the power mechanism comprises a motor, a screw rod and a power block, the output end of the motor is connected with the screw rod, the screw rod penetrates through the power block to be connected with the second fixing frame, the power block is in threaded connection with the screw rod, the connecting rod is connected with the power block, and the motor is used for driving the screw rod to rotate so as to push the power block to slide.

9. The electronic device of claim 8,

the power mechanism further comprises a first driving wheel and a second driving wheel, the axis of the motor is parallel to the screw rod, and the output end of the motor, the first driving wheel, the second driving wheel and the screw rod are sequentially in transmission connection.

10. The electronic device of claim 9,

the power mechanism further comprises a third driving wheel, and the third driving wheel is connected with the second fixing frame and is in transmission connection with the first driving wheel and the second driving wheel respectively.

11. The electronic device according to any one of claims 1-10,

the relative both ends of connecting rod are provided with second waist shape hole and third waist shape hole respectively, the radiator is provided with the second and rotates the post, power unit is provided with the third and rotates the post, the second rotate the post assemble in the second waist shape hole, the third rotate the post assemble in the third waist shape hole.

12. The electronic device of claim 1,

the electronic device further comprises a circuit board and a shielding cover, the heating part is a processor, the heating part is electrically connected with the circuit board, the shielding cover is connected with the circuit board and covers the heating part, and the heating part passes through the shielding cover and is connected with the radiator.

13. A method of controlling an electronic device, comprising:

the electronic device comprises a shell assembly, a heating part, a radiator, a connecting rod, a second fixing frame and a power mechanism, wherein the shell assembly is provided with an opening, the heating part is connected with the radiator, the connecting rod is respectively connected with the power mechanism and the radiator, the second fixing frame is fixed on the shell assembly, and the power mechanism is connected with the second fixing frame;

the control method comprises the following steps: the electronic device receives a control instruction;

the electronic device sends an execution instruction to the power mechanism;

the power mechanism is used for driving the connecting rod to rotate by taking the first rotating column as a base point after receiving the execution instruction, so that the connecting rod pushes the radiator to slide out of the opening or drives the radiator to retract from the opening.