CN213026119U - Flip chip packaging structure with multiple EMI shielding layers - Google Patents
Flip chip packaging structure with multiple EMI shielding layers Download PDFInfo
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- CN213026119U CN213026119U CN202022107079.1U CN202022107079U CN213026119U CN 213026119 U CN213026119 U CN 213026119U CN 202022107079 U CN202022107079 U CN 202022107079U CN 213026119 U CN213026119 U CN 213026119U
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Abstract
The application relates to a flip chip packaging structure of many EMI shielding layer, packaging structure includes: the flip chip is attached to the surface of the substrate, and the bottom of the flip chip is filled with non-conductive adhesive; the surfaces of the flip chip and the non-conductive adhesive are sequentially coated with the EMI shielding layers to realize EMI shielding, and the non-conductive adhesive is filled between the EMI shielding layers. The utility model discloses a multistage EMI shielding layer structure, its interference killing feature is superior to the mode that the tradition increased individual layer shielding metal layer thickness, encapsulates this many EMI shielding layer in the inside reliability that can effectively promote the product of product. In addition, the whole packaging substrate can be operated, and the process efficiency is higher than that of the traditional EMI shielding structure in which a single product needs to be cut and processed.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to a flip chip packaging structure on many EMI shielding layer.
Background
A Flip-chip (Flip-chip) is a leadless chip that generally contains circuit elements. Flip chips are typically designed to be electrically and mechanically connected to circuitry by an appropriate number of solder balls (covered by a conductive adhesive) on their faces. The EMI (Electromagnetic Interference) is a problem often encountered by electronic and electrical products, and the Interference is caused by the operation of the electronic products to other peripheral electronic products, and the specific Interference includes conducted Interference and radiated Interference.
In the conventional technology, the existing EMI shielding structure of the flip chip package structure only has 1 layer of EMI shielding layer, and most of the EMI shielding structure can only achieve an EMI shielding effect of less than 40 db. Since future packaged products are developed in the direction of light, thin, short and small, the functions of the products are more and more, the sizes of the products are smaller and smaller, electromagnetic interference between components is larger and larger during working, and the 40db anti-interference effect cannot meet future requirements, the EMI shielding effect of the packaged products needs to be improved under the condition that the packaging size is not increased. In addition, the metal layer covering of the EMI shielding structure in the conventional technology can only be performed after the product is cut into a single piece, which cannot be performed on the whole board, resulting in low packaging efficiency of the flip chip.
Disclosure of Invention
In view of the above, it is necessary to provide a flip chip package structure with multiple EMI shielding layers.
A multi-EMI shielding layer flip chip package structure, comprising:
the flip chip is attached to the surface of the substrate, and the bottom of the flip chip is filled with non-conductive adhesive;
the surfaces of the flip chip and the non-conductive adhesive are sequentially coated with the EMI shielding layers to realize EMI shielding, and the non-conductive adhesive is filled between the EMI shielding layers.
In one embodiment, the bottom of the flip chip is filled with a first non-conductive adhesive layer formed of a non-conductive adhesive, and the surfaces of the flip chip and the first non-conductive adhesive layer are coated with a first EMI shielding layer.
In one embodiment, a second non-conductive adhesive layer formed of a non-conductive adhesive is filled outside the first EMI shielding layer.
In one embodiment, a second layer of EMI shielding is coated on a surface of the second layer of non-conductive adhesive.
In one embodiment, a third non-conductive glue layer formed of non-conductive glue is filled outside the second EMI shielding layer.
In one embodiment, a third layer of EMI shielding is coated on a surface of the third layer of non-conductive adhesive.
In one embodiment, a plurality of grounding PADs corresponding to the number of the EMI shielding layers are arranged on the substrate.
In one embodiment, the plurality of ground PADs are respectively connected with a corresponding plurality of EMI shielding layers.
In one embodiment, the package structure further comprises an SMD mounted on the substrate and external to the plurality of EMI shielding layers.
In one embodiment, a non-conductive black glue layer formed by non-conductive black glue is filled outside the plurality of shielding layers and the SMD.
The flip chip packaging structure with the multiple EMI shielding layers is easy to realize, the bottom and surface filling of the non-conductive adhesive can be realized by a dispenser, the covering of the metal shielding layer can be realized by electroplating, sputtering or 3D printing methods, and high anti-interference performance can be achieved. For example: use 1 shielding layer to be 30db shielding effect, 3 shielding layers can realize 90db anti-interference effect, and anti-interference performance more than 90db can be used to high-precision products such as military aviation, therefore this packaging structure's application scene is more extensive. In addition, the shielding layer number can be directionally selected according to the anti-interference requirement of the product. Through multistage EMI shielding layer structure, its interference killing feature is superior to the mode that the single-deck shielding metal layer thickness was increased to the tradition, encapsulates this many EMI shielding layer inside the product can effectively promote the reliability of product. In addition, the whole packaging substrate can be operated, and the process efficiency is higher than that of the traditional EMI shielding structure in which a single product needs to be cut and processed.
Drawings
FIG. 1 is a diagram illustrating a flip-chip EMI shielding package in accordance with the prior art;
FIG. 2 is a diagram of a multi-EMI shielding layer flip-chip package in accordance with one embodiment.
Detailed Description
The technical solutions of the present invention will be described clearly and completely through the following embodiments, which are only some, but not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of the embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
At present, a flip chip EMI shielding package structure in the prior art can be referred to as fig. 1. Specifically, the method comprises the following steps: the Surface Mount Device (SMD) (12) and the Flip-chip (13) are firstly mounted on the surface of a substrate (11), then the bottom of the Flip-chip (13) is filled with non-conductive glue (14), the Flip-chip (13) and the SMD (12) are sealed by non-conductive resin black glue (15), finally, the surface of the black glue (15) is covered with metal by using electroplating, sputtering or 3D printing technology to form an EMI shielding layer (16), and the EMI shielding layer (16) is connected with a grounding PAD (17). Since the current EMI shielding structure only has 1 EMI shielding layer, most of the EMI shielding structure can only achieve EMI shielding effect below 40 db. In addition, the metal layer covering of the EMI shielding structure can be performed only after the product is cut into individual pieces, and cannot be performed on the whole board.
Since future packaged products are developed in the direction of light, thin, short and small, the functions of the products are more and more, the sizes of the products are smaller and smaller, electromagnetic interference between components is larger and larger during working, and the 40db anti-interference effect cannot meet future requirements, the EMI shielding effect of the packaged products needs to be improved under the condition that the packaging size is not increased. Based on this, the utility model provides a new solution, through using the ripe technology method of current industry, at the inside multilayer EMI metal shielding layer that forms of encapsulation product, multistage EMI shielding layer successive layer reduces outside electromagnetic interference to reach the anti electromagnetic interference effect of higher level.
In one embodiment, a multi-EMI shielding layer flip chip package structure is provided, wherein the package structure comprises:
the flip chip is attached to the surface of the substrate, and the bottom of the flip chip is filled with non-conductive adhesive;
the surfaces of the flip chip and the non-conductive adhesive are sequentially coated with the EMI shielding layers to realize EMI shielding, and the non-conductive adhesive is filled between the EMI shielding layers.
In the present embodiment, a multi-EMI shielding layer flip chip package structure is provided, and in particular, reference may be made to fig. 2. The packaging structure comprises a substrate (21) and a Flip-chip (23), wherein the Flip-chip (23) is bonded to the substrate (21) through a furnace. The bottom of the flip chip (23) is filled with a non-conductive adhesive (24). A plurality of EMI shielding layers, which may include, for example, EMI shielding layers 25a, 25b, and 25c in the drawings, are sequentially formed by covering the flip chip (23) and the surface of a non-conductive adhesive with metal using a plating, sputtering, or printing process, and a non-conductive adhesive (24) filled between the plurality of EMI shielding layers, which may be used to prevent a short circuit from occurring. Through forming multilayer EMI metal shielding layer inside the encapsulation product, multistage EMI shielding layer reduces outside electromagnetic interference layer by layer to reach higher level anti electromagnetic interference effect.
In this embodiment, the flip chip package structure with multiple EMI shielding layers is easy to implement, the non-conductive adhesive bottom and surface filling can be implemented by a dispenser, the covering metal shielding layer can be implemented by electroplating, sputtering or 3D printing, and high anti-interference performance can be achieved. For example: use 1 shielding layer to be 30db shielding effect, 3 shielding layers can realize 90db anti-interference effect, and anti-interference performance more than 90db can be used to high-precision products such as military aviation, therefore this packaging structure's application scene is more extensive. In addition, the shielding layer number can be directionally selected according to the anti-interference requirement of the product. Through multistage EMI shielding layer structure, its interference killing feature is superior to the mode that the single-deck shielding metal layer thickness was increased to the tradition, encapsulates this many EMI shielding layer inside the product can effectively promote the reliability of product. In addition, the whole packaging substrate can be operated, and the process efficiency is higher than that of the traditional EMI shielding structure in which a single product needs to be cut and processed.
In one embodiment, the bottom of the flip chip is filled with a first non-conductive adhesive layer formed of a non-conductive adhesive, and the surfaces of the flip chip and the first non-conductive adhesive layer are coated with a first EMI shielding layer;
a second non-conductive adhesive layer formed by non-conductive adhesive is filled outside the first EMI shielding layer;
a second EMI shielding layer is coated on the surface of the second non-conductive adhesive layer;
a third non-conductive adhesive layer formed by non-conductive adhesive is filled outside the second EMI shielding layer;
and a third EMI shielding layer is coated on the surface of the third non-conductive adhesive layer.
Specifically, in the present embodiment, a multi-EMI shielding layer flip chip package structure is provided, in which three EMI shielding layers are included, as shown in fig. 2.
The flip chip (23) is underfilled with a non-conductive adhesive (24). And covering the surfaces of the flip chip (23) and the non-conductive adhesive (24) with metal by using an electroplating, sputtering or printing process to form a first non-conductive adhesive layer (25 a). The surface of the first non-conductive adhesive layer (25a) is covered with a non-conductive adhesive (24) to prevent short circuit. And covering the surface of the non-conductive adhesive (24) with metal by using an electroplating, sputtering or printing process to form a second non-conductive adhesive layer (25 b). The surface of the second non-conductive adhesive layer (25b) is covered with a non-conductive adhesive (24) to prevent short circuit. And covering the surface of the non-conductive adhesive (24) with metal by using an electroplating, sputtering or printing process to form a third non-conductive adhesive layer (25 c).
In this embodiment, the multilayer EMI shielding structure can realize higher anti-interference performance, taking 1-layer shielding (30db), 2-layer shielding (60db), 3-layer shielding (90db) as an example, the anti-interference performance of more than 90db can be used for high-precision products such as military aviation. It can be understood that the number of shielding layers can be directionally selected according to the anti-interference requirement of the product, for example, 1 layer or 2 layers for civil use, 3 layers or more than 3 layers for military space, and the like, so that the requirements of different application products can be met.
In one embodiment, a plurality of grounding PADs corresponding to the number of the EMI shielding layers are arranged on the substrate; the plurality of grounded PADs are respectively connected with the corresponding plurality of EMI shielding layers.
In one embodiment, the package structure further comprises an SMD mounted on the substrate and external to the plurality of EMI shielding layers; and a non-conductive black glue layer formed by non-conductive black glue is filled outside the shielding layers and the SMD.
Specifically, a multi-EMI shielding layer flip chip package structure is provided in the present embodiment, and may be specifically combined with fig. 2. Firstly, a package substrate (21) corresponding to a multi-layer EMI shielding structure is designed, and a corresponding grounding PAD (26) is designed according to the number of EMI shielding layers, for example, in FIG. 2, three grounding PADs (26) are arranged on the substrate because three shielding layers are arranged. Then, the SMD (22) and the flip chip (23) are mounted through a furnace and soldered on the substrate (21).
Next, the flip chip (23) is underfilled with a non-conductive adhesive (24). And covering the surfaces of the flip chip (23) and the non-conductive adhesive (24) with metal by using an electroplating, sputtering or printing process to form a first non-conductive adhesive layer (25 a). The surface of the first non-conductive adhesive layer (25a) is covered with a non-conductive adhesive (24) to prevent short circuit. And covering the surface of the non-conductive adhesive (24) with metal by using an electroplating, sputtering or printing process to form a second non-conductive adhesive layer (25 b). The surface of the second non-conductive adhesive layer (25b) is covered with a non-conductive adhesive (24) to prevent short circuit. And covering the surface of the non-conductive adhesive (24) with metal by using an electroplating, sputtering or printing process to form a third non-conductive adhesive layer (25 c).
Finally, the whole packaged product is subjected to plastic package by using non-conductive black glue (27), and the whole board chip subjected to glue package is cut into single products.
The flip chip packaging structure with multiple EMI shielding layers provided in the embodiment is easy to implement, the filling of the bottom and the surface of the non-conductive adhesive can be realized by a dispenser, and the covering metal layer can be realized by electroplating, sputtering or 3D printing. In addition, the product of the multi-EMI shielding layer packaging structure can be produced by using a whole plate, and the production efficiency is higher than that of the traditional EMI shielding structure which needs to be cut into single products.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A multi-EMI shielding layer flip chip package structure, comprising:
the flip chip is attached to the surface of the substrate, and the bottom of the flip chip is filled with non-conductive adhesive;
the surfaces of the flip chip and the non-conductive adhesive are sequentially coated with the EMI shielding layers to realize EMI shielding, and the non-conductive adhesive is filled between the EMI shielding layers.
2. The multi-EMI shielding layer flip-chip package structure of claim 1, wherein the bottom of the flip-chip is filled with a first non-conductive adhesive layer formed of non-conductive adhesive, and the surfaces of the flip-chip and the first non-conductive adhesive layer are coated with the first EMI shielding layer.
3. The multi-EMI shielding layer flip-chip package structure of claim 2, wherein the first EMI shielding layer is externally filled with a second non-conductive glue layer formed of a non-conductive glue.
4. The multi-EMI shielding layer flip-chip package structure of claim 3, wherein a second EMI shielding layer is coated on a surface of the second non-conductive adhesive layer.
5. The multi-EMI shielding layer flip-chip package structure of claim 4, wherein a third non-conductive glue layer formed of non-conductive glue is filled outside the second EMI shielding layer.
6. The multi-EMI shielding layer flip-chip package structure of claim 5, wherein a third EMI shielding layer is coated on a surface of the third non-conductive adhesive layer.
7. The multi-EMI shielding layer flip-chip package structure of claim 1, wherein a plurality of ground PADs corresponding to the number of EMI shielding layers are disposed on the substrate.
8. The multi-EMI shielding layer flip-chip package structure of claim 7, wherein the plurality of ground PADs are connected to a corresponding plurality of EMI shielding layers, respectively.
9. The multi-EMI shielding layer flip-chip package structure of any one of claims 1-8, further comprising an SMD mounted on the substrate and external to the plurality of EMI shielding layers.
10. The multi-EMI shielding layer flip chip package structure of claim 9, wherein a non-conductive black glue layer formed of a non-conductive black glue is further filled outside the plurality of shielding layers and the SMD.
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| CN202022107079.1U CN213026119U (en) | 2020-09-23 | 2020-09-23 | Flip chip packaging structure with multiple EMI shielding layers |
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| CN202022107079.1U CN213026119U (en) | 2020-09-23 | 2020-09-23 | Flip chip packaging structure with multiple EMI shielding layers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117133724A (en) * | 2023-03-20 | 2023-11-28 | 荣耀终端有限公司 | Packaged chip structure, processing method thereof and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117133724A (en) * | 2023-03-20 | 2023-11-28 | 荣耀终端有限公司 | Packaged chip structure, processing method thereof and electronic equipment |
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Effective date of registration: 20221215 Address after: 523000 Building 1, No. 32, East Industrial Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Dongguan Yilian Information System Co.,Ltd. Address before: No.32, Gongye East Road, Songshanhu high tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: DONGGUAN MEMORY STORAGE TECHNOLOGY Co.,Ltd. |
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