CN111030638A

CN111030638A - Surface acoustic wave module one-step molding packaging structure and packaging process thereof

Info

Publication number: CN111030638A
Application number: CN201911345219.4A
Authority: CN
Inventors: 王婕; 朱德进; 綦超; 张伟; 刘石桂
Original assignee: Tiantong Kaimei Microelectronics Co ltd
Current assignee: TIANTONG RUIHONG TECHNOLOGY Co.,Ltd.
Priority date: 2019-12-24
Filing date: 2019-12-24
Publication date: 2020-04-17

Abstract

The invention discloses a packaging structure for one-step molding of an acoustic surface wave module and a packaging process thereof. The packaging process comprises the following steps: mounting each device on the laminate; covering a film on the mounting surface of each device for curing; then removing the film on the surface of the grounding PAD through laser equipment, and arranging a metal coating to conduct the metal coating and the grounding PAD; and finally filling the EMC layer. The invention can flexibly create a shielding area, reduce the packaging size, and have better heat dissipation through the shielding layer; compared with the traditional process, the process is simplified, the metal shielding layer is protected, the reliability is better, the shielding effect is good, and the overall performance is better.

Description

Surface acoustic wave module one-step molding packaging structure and packaging process thereof

Technical Field

The invention relates to a packaging structure of a filter and a packaging process thereof, in particular to a packaging structure formed in one step by a surface acoustic wave module and a packaging process thereof.

Background

At present, the surface acoustic wave filter has high requirement on the cleanliness of a working surface, a bare chip is usually packaged independently, but the function of the independent chip is single, the requirement on the high integration level of modern electronic products cannot be met, devices with other functions are often required to be combined for secondary packaging, the size of an integrated module is increased, and the concept of miniaturization is violated. Meanwhile, the shielding performance of the surface acoustic wave filter is important for the performance of the surface acoustic wave filter, if signal interference exists, the filtering effect is greatly influenced, the current packaging is injection molding packaging, then nickel plating is carried out to realize shielding, the metal shielding layer is located on the outermost layer of the device, and the metal layer can be damaged in the subsequent assembling process, so that the shielding effect is influenced. And can only satisfy the inside and outside isolation of module, in fact because the high integration of module, the device quantity and the function in the module are all increasing, also can produce the interference each other, influence the performance.

Disclosure of Invention

The technical problem to be solved by the invention is to provide a packaging structure for one-step molding of an acoustic surface wave module and a packaging process thereof, which can flexibly create a shielding region, reduce the packaging size, and have better heat dissipation through a shielding layer; compared with the traditional process, the process is simplified, the metal shielding layer is protected, the reliability is better, the shielding effect is good, and the overall performance is better.

The technical scheme adopted by the invention for solving the technical problem is as follows: the utility model provides a surface acoustic wave module one shot forming's packaging structure, includes the lamination board, be equipped with naked chip of sound table and active device on the lamination board, be equipped with via hole PAD in the lamination board be equipped with the film on the surface mounting of naked chip of sound table and active device be equipped with metallic coating on the film, metallic coating passes through the positive ground PAD of through-hole connection and the ground PAD at the back the peripheral encapsulation EMC layer of metallic coating.

As a further improvement, a passive device is further arranged on the laminated board, the passive device is a resistor, a capacitor and/or an inductor, and a thin film is arranged on the mounting surface of the passive device.

Preferably, the active device is a switch, PA or LNA.

Preferably, the film is an epoxy film.

Preferably, the EMC layer is an epoxy molding compound.

Preferably, the metal coating is a nickel layer, a copper layer, a titanium layer or a silver layer.

The packaging process of the surface acoustic wave module one-step molding packaging structure comprises the following steps,

firstly, mounting a sound surface bare chip, an active device and a passive device on a laminated board through SMT (surface mount technology), gold ball flip-chip technology or tin ball flip-chip technology;

secondly, covering films of thermosetting resin on the attaching surfaces of the acoustic surface bare chip, the active device and the passive device, laminating the films by vacuum laminating equipment, and curing the films in an oven;

thirdly, removing the thin film on the surface of the grounding PAD from the laminated board with the cured thin film through laser equipment, and exposing the metal surface of the grounding PAD;

fourthly, a metal coating is arranged on the film, so that the metal coating is conducted with the grounding PAD to realize a shielding function;

and fifthly, filling the EMC layer through film pressing forming equipment, curing, cutting and separating into single modules.

The invention can decide whether to shield the device independently or shield several devices together according to the characteristics of the device, and the grounding Pad is designed at the position on the laminated board to be grounded.

The invention has the advantages that the shielding area can be flexibly established, the packaging size is reduced, and the heat dissipation is better through the shielding layer; compared with the traditional process, the process is simplified, the metal shielding layer is protected, the reliability is better, the shielding effect is good, and the overall performance is better.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.

FIG. 2 is a schematic structural diagram of the second step of the process of example 2 of the present invention.

FIG. 3 is a schematic structural diagram of the third step of the process of example 2 of the present invention.

FIG. 4 is a schematic structural diagram of the fourth step of the process of example 2 of the present invention.

The invention is further described below with reference to the accompanying drawings.

Detailed Description

Example 1: as shown in fig. 1, a surface acoustic wave module one shot forming's packaging structure, including the lamination board 6, be equipped with five sound table bare chip 1, active device 2 and passive device 3 on the lamination board 6, active device 2 includes a switch and an LNA, passive device 3 includes three electric capacity and four inductance, be equipped with via connection ground PAD5 in the lamination board 6 be equipped with epoxy film 4 on the surface of pasting of sound table bare chip 1, active device 2 and passive device 3 be equipped with nickel layer 7 on epoxy film 4, nickel layer 7 passes through via connection positive ground PAD and the ground PAD5 of back 7 peripheral encapsulation EMC layer 8 of nickel layer 7, EMC layer 8 is epoxy molding compound.

Example 2: a packaging process of a surface acoustic wave module one-step formed packaging structure comprises the following steps,

firstly, a sound surface bare chip 1, an active device 2 and a passive device 3 are attached to a laminated board 6 through SMT (surface mount technology) chip mounting, gold ball flip-chip or tin ball flip-chip technology; the active device 2 comprises a switch and an LNA, and the passive device 3 comprises three capacitors and four inductors;

secondly, covering epoxy resin films 4 on the attaching surfaces of the acoustic surface bare chip 1, the active device 2 and the passive device 3, laminating the films by vacuum laminating equipment, and curing the films in an oven (as shown in figure 2); the film has good associativity with the laminated board and the device, and the bottom of the device is not filled with resin, so that the normal function of the surface acoustic wave device can be ensured;

thirdly, the epoxy resin film 4 on the surface of the PAD5 on the front surface of the substrate is removed by passing the laminated board with the cured epoxy resin film 4 through a laser device, and the metal surface of the ground PAD5 on the front surface is exposed (as shown in FIG. 3);

fourthly, a nickel layer 7 is arranged on the epoxy resin film 4, so that the nickel layer 7 is conducted with a ground PAD5 to realize a shielding function (as shown in FIG. 4);

fifthly, through press mold molding equipment at last, fill EMC layer 8 (as shown in figure 1), cut after the solidification, separate into single module, the shielding layer is protected in resin materials, can not influence the shielding function because of actions such as the equipment in later stage, and the reliability can be better.

Example 3: the second one-step molding packaging structure of the surface acoustic wave module comprises a laminated board 6, wherein four surface acoustic wave bare chips 1 and an active device 2 are arranged on the laminated board 6, and the active device 2 comprises a switch. The metal plating layer 7 is a copper layer. The rest is the same as in example 1.

Example 4: a third kind of surface acoustic wave module one shot forming's packaging structure, including the lamination board 6, be equipped with four naked chips of surface acoustic wave 1, active device 2 and passive device 3 on the lamination board 6, active device 2 includes a switch and an LNA, passive device 3 includes three electric capacity and five inductance. The metal coating 7 is a silver layer. The rest is the same as in example 1.

Claims

1. The utility model provides a surface acoustic wave module integrated into one piece's packaging structure, includes laminated board (6), its characterized in that: be equipped with sound surface bare chip (1) and active device (2) on laminated board (6), be equipped with via hole connected ground PAD (5) in laminated board (6) be equipped with film (4) on the surface mounting of sound surface bare chip (1) and active device (2) be equipped with metallic coating (7) on film (4), metallic coating (7) are through the positive ground PAD of via hole connection and the ground PAD (5) at the back metallic coating (7) peripheral encapsulated layer EMC (8).

2. The one-shot molding package structure of surface acoustic wave module set as claimed in claim 1, wherein: the laminated board (6) is also provided with a passive device (3), and the passive device (3) is a resistor, a capacitor and/or an inductor.

3. A surface acoustic wave module one shot forming package structure as claimed in claim 1, wherein: the active device (2) is a switch, PA or LNA.

4. The one-shot molding package structure of surface acoustic wave module set as claimed in claim 1, wherein:

the film (4) is an epoxy resin film.

5. The one-shot molding package structure of surface acoustic wave module set as claimed in claim 1, wherein:

the EMC layer (8) is made of epoxy resin molding compound.

6. The one-shot molding package structure of surface acoustic wave module set as claimed in claim 1, wherein:

the metal coating (7) is a nickel layer, a copper layer, a titanium layer or a silver layer.

7. The process for encapsulating a surface acoustic wave module one-shot molded package structure as claimed in claim 1, wherein: comprises the following steps of (a) carrying out,

firstly, a sound surface bare chip (1), an active device (2) and a passive device (3) are mounted on a laminated board (6) through SMT (surface mount technology) chip mounting, gold ball flip-chip or tin ball flip-chip technology;

secondly, covering an epoxy resin film (4) on the attaching surfaces of the acoustic surface bare chip (1), the active device (2) and the passive device (3), laminating through vacuum laminating equipment, and curing in an oven;

thirdly, removing the epoxy resin film (4) on the surface of the PAD (5) on the front surface of the substrate by the laminated board with the cured epoxy resin film (4) through laser equipment, and exposing the metal surface of the PAD (5) on the front surface;

fourthly, a metal coating (7) is arranged on the film (4), so that the metal coating (7) is conducted with the ground PAD (5) to realize a shielding function;

and fifthly, filling the EMC layer (8) through film pressing forming equipment, curing, cutting and separating into single modules.