CN213026103U - Heat dissipation shell and MOS pipe subassembly - Google Patents

Abstract

The utility model particularly discloses a heat dissipation shell, include: a heat dissipation case body having an installation cavity; the circulating heat dissipation assembly comprises a heat conduction plate and a heat dissipation ring pipe, the heat dissipation ring pipe is spirally connected in the installation cavity and penetrates through the heat dissipation shell body, and the heat conduction plate is fixed at the side end of the heat dissipation ring pipe on one side of different heat dissipation shell bodies. The utility model discloses a heat dissipation shell's rational in infrastructure, stability is strong, can continuously heat conduction fast and stably, and heat conduction efficiency is better.

Description

Heat dissipation shell and MOS pipe subassembly

Technical Field

The utility model relates to a MOS manages technical field, concretely relates to heat dissipation shell and MOS pipe assembly.

Background

The MOS transistor is a metal-oxide-semiconductor field effect transistor, or so-called metal-insulator-semiconductor. The MOS tube amplifies the small change of the current at the input end and outputs a large current change at the output end. The gain of the bipolar transistor is defined as the ratio of the output to the input current. Another transistor, called a field effect transistor, converts a change in input voltage into a change in output current; it is commonly used in products such as inverter power supply, solar controller, discharge instrument, UPS power supply, etc., especially in high-power supply products requiring MOS tube,

Because the MOS tube is a power device, the structure of the MOS tube can generate larger heat in the using process, the self heat-conducting property and the spontaneous heat-radiating function can not be realized, the elements of the device are easy to be damaged at high temperature, and the MOS tube is not beneficial to long-time use.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that the invention will solve is that the structure of overcoming prior art can produce great heat, self thermal conductivity with can't realize spontaneous heat dissipation function, make the component of device take place the not enough of high temperature damage easily, provide a heat dissipation shell.

The above problems to be solved by the present invention are achieved by the following technical solutions:

a heat dissipation case, comprising: a heat dissipation case body having an installation cavity; the circulating heat dissipation assembly comprises a heat conduction plate and a heat dissipation ring pipe, the heat dissipation ring pipe is spirally connected in the installation cavity and penetrates through the heat dissipation shell body, and the heat conduction plate is fixed at the side end of the heat dissipation ring pipe on one side of different heat dissipation shell bodies.

Preferably, the circulating heat radiation assembly further comprises a sealing plug fixed at the inlet and the outlet of the heat radiation ring pipe, and used for injecting and updating the heat radiation circulating liquid. The sealing plug can effectively fix and seal the heat dissipation ring pipe, and can be quickly and conveniently disassembled so as to be convenient for cleaning and maintenance.

Preferably, the heat dissipation device further comprises a buffer assembly, and the buffer assembly is fixed between the circulating heat dissipation assembly and the heat dissipation shell body. This scheme can improve barrier propterty for the heat dissipation shell effectively through buffering subassembly, improves its life.

Preferably, the buffer assembly comprises a buffer component and a buffer plate, the buffer component is fixed on the inner wall of the heat dissipation shell body, and the other end of the buffer component is connected with the buffer plate; the buffer plate is connected with the heat dissipation ring pipe. The scheme can protect the buffering and shock absorption of the circulating heat dissipation assembly through the mutual matching of the buffering component and the buffering plate, avoids the external overlarge stress from extruding and damaging the ring pipe of the circulating heat dissipation assembly, enables the heat dissipation liquid to flow out to prevent the inner structure of the mos pipe from being damaged, and prolongs the service life of the mos pipe.

Preferably, the buffer plate is further connected with the heat dissipation ring pipe through a locking assembly; the locking assembly comprises a positioning block, a first locking ring and a second locking ring, the positioning block is fixed at the inner side end of the buffer plate, the first locking ring and the second locking ring can be detachably connected below the positioning block, and the first locking ring and the second locking ring can be matched to be sleeved with a heat dissipation ring pipe. This scheme can further better with the fixed connection of heat dissipation ring canal through mutually supporting of each part of locking Assembly, ensures its installation stability, dismantles the convenience promotion of installation simultaneously.

Preferably, the inner wall of the heat conducting plate is fixed with a heat conducting edge. This scheme can be effectively conduct the heat of MOS pipe to circulation radiator unit fast through heat conduction arris mutually supporting, improves heat conductivity and radiating efficiency.

Preferably, the heat dissipation shell body comprises a main shell and two side plates, and the side plates are detachably connected to the side end of the main shell. This scheme can ensure effectively that the inside part of MOS can be installed fast and dismantle through mutually supporting of main casing and two curb plates, improves and uses the convenience.

Preferably, an MOS tube assembly includes the heat dissipation casing described in any of the above, and further includes an MOS tube body, where the MOS tube body passes through the heat dissipation casing body and is fixed inside the installation cavity.

Has the advantages that: adopt the utility model the structure after, because the structure is equipped with heat dissipation shell body and installation cavity and circulation radiator unit's heat-conducting plate and heat dissipation ring canal, heat transmission that produces MOS pipe body leads to the heat dissipation ring canal fast through the heat-conducting plate in the heat dissipation ring canal to the heat of installation cavity, the intraductal mobile radiating liquid of rethread heat dissipation ring can cyclic transmission, further improve heat dissipation water conservancy diversion performance, improve the protective efficiency of heat dissipation shell, and then obtain rational in infrastructure, and strong stability can continuously heat conduction fast and stably, the better heat dissipation shell of heat conduction efficiency.

Drawings

Fig. 1 is a main structure diagram of a heat dissipation case according to the present invention.

Fig. 2 is an AA cross-sectional structure view of a heat dissipation case according to the present invention.

Fig. 3 is a cross-sectional structural view of another embodiment of an AA cross section of a heat dissipation case according to the present invention.

Fig. 4 is a structural diagram of a locking assembly of a heat dissipation case according to the present invention.

Fig. 5 is a structural diagram of a MOS tube assembly according to the present invention.

FIG. 1-5: 1-heat sink housing body; 2-a main shell; 3-side plate; 4-MOS tube body; 5-circulating heat dissipation components; 6-heat conducting plate; 7-a heat dissipation ring pipe; 8-sealing plug; 9-installing a cavity; 10-a cushioning component; 11-a cushioning component; 12-a buffer plate; 13-a locking assembly; 14-heat conducting edges; 15-positioning blocks; 16-a first locking ring; 17-a second locking ring.

Detailed Description

The present invention will be described in further detail with reference to the following drawings and specific examples, which are not intended to limit the invention in any manner.

Example 1:

a heat dissipation case as shown in fig. 1 and 2, comprising: the heat dissipation shell comprises a heat dissipation shell body 1, wherein the heat dissipation shell body 1 is provided with an installation cavity 9; the circulating heat dissipation assembly 5 comprises a heat conduction plate 6 and a heat dissipation ring pipe 7, the heat dissipation ring pipe 7 is fixedly connected to the inner wall of the installation cavity 9 in a spiral mode and penetrates through the heat dissipation shell body 1, and the heat conduction plate 6 is fixed to the side end of the heat dissipation ring pipe 7 on one side of different heat dissipation shell bodies 1.

Example 2:

a heat dissipation casing as shown in fig. 1 and 2, including all the technical features of embodiment 1, the heat dissipation casing body 1 includes a main casing 2 and two side plates 3, and the side plates 3 are detachably connected to the side ends of the main casing 2; the circulating heat radiation assembly 5 further comprises a sealing plug 8, wherein the sealing plug 8 is fixed at the inlet and the outlet of the heat radiation ring pipe 7 and is used for injecting and updating heat radiation circulating liquid.

Example 3:

a heat dissipating case as shown in fig. 1, 3 and 4, including all the technical features of embodiment 1 or 2, further including a buffer member 10, the buffer member 10 being fixed between the circulating heat dissipating member 5 and the heat dissipating case body 1; the buffer assembly 10 comprises a buffer component 11 and a buffer plate 12, wherein the buffer component 11 is fixed on the inner wall of the heat dissipation shell body 1, and the other end of the buffer component 11 is connected with the buffer plate 12; the buffer plate 12 is connected with the heat dissipation ring pipe 7; the buffer component 11 is a spring or an adjustable shock absorber; the buffer plate 12 is also connected with the heat-radiating ring pipe 7 through a locking assembly 13; the locking assembly 13 comprises a positioning block 15, a first locking ring 16 and a second locking ring 17, the positioning block 15 is fixed at the inner side end of the buffer plate 12, the first locking ring 16 and the second locking ring 17 can be detachably connected below the positioning block 15, and the first locking ring 16 and the second locking ring 17 are matched to be sleeved and fixed with the heat dissipation ring pipe 7; the inner wall of the heat conducting plate 6 is fixed with a heat conducting edge 14.

Example 4:

a MOS tube assembly as shown in fig. 5 includes the heat dissipating case of all the technical features of embodiment 1 or 2 or 3, and further includes a MOS tube body 4, wherein the MOS tube body 4 penetrates through the heat dissipating case body 1 and is fixed inside the mounting cavity 9.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in the drawings and the terms "first", "second", only for the convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (8)

1. A heat dissipation case, comprising:

a heat dissipation case body having an installation cavity;

the circulating heat dissipation assembly comprises a heat conduction plate and a heat dissipation ring pipe, the heat dissipation ring pipe is spirally connected in the installation cavity and penetrates through the heat dissipation shell body, and the heat conduction plate is fixed at the side end of the heat dissipation ring pipe on one side of different heat dissipation shell bodies.

2. The heat dissipating housing of claim 1, wherein the circulating heat dissipating assembly further comprises a sealing plug fixed to the inlet and outlet of the heat dissipating collar for injecting and refreshing the heat dissipating circulating fluid.

3. The heat dissipating housing of claim 1, further comprising a buffer member secured between the circulating heat dissipating member and the heat dissipating housing body.

4. The heat dissipation case of claim 3, wherein the buffer assembly comprises a buffer member and a buffer plate, the buffer member is fixed on the inner wall of the heat dissipation case body and the other end of the buffer member is connected with the buffer plate; the buffer plate is connected with the heat dissipation ring pipe.

5. The heat dissipating shell of claim 4, wherein the buffer plate is further connected to the heat dissipating collar by a locking assembly; the locking assembly comprises a positioning block, a first locking ring and a second locking ring, the positioning block is fixed at the inner side end of the buffer plate, the first locking ring and the second locking ring can be detachably connected below the positioning block, and the first locking ring and the second locking ring can be matched to be sleeved with a heat dissipation ring pipe.

6. The heat dissipating shell of claim 1, wherein the heat conducting plate has heat conducting ribs fixed to an inner wall thereof.

7. The heat dissipating housing of claim 1, wherein the heat dissipating housing body comprises a main housing and two side plates, the side plates being detachably connected to side ends of the main housing.

8. A MOS tube assembly comprising the heat dissipating housing of any of claims 1-7, further comprising a MOS tube body passing through the heat dissipating housing body and secured within the mounting cavity.

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