CN212989967U

CN212989967U - Heating device

Info

Publication number: CN212989967U
Application number: CN202021550824.3U
Authority: CN
Inventors: 谢佳松
Original assignee: Xingluo Intelligent Technology Co Ltd
Current assignee: Xingluo Home Yunwulian Technology Co ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-04-16
Anticipated expiration: 2030-07-31

Abstract

The utility model provides a heating device, which comprises a temperature detection circuit, a power supply circuit and a power supply circuit, wherein the temperature detection circuit is coupled with the heating circuit and the power supply circuit and is used for detecting the ambient temperature, and when the ambient temperature is equal to or lower than a first threshold value, a first trigger signal is sent to the heating circuit; and the system power supply circuit is used for receiving the first trigger signal and stopping supplying power to the main chip power supply system. The device provided by the utility model can ensure that under low temperature environment, the system can normally work.

Description

Heating device

Technical Field

The utility model relates to an intelligent equipment field particularly, mainly relates to a heating device.

Background

At present, intelligent equipment is continuously increased, certain intelligent equipment needs to work in a low-temperature environment, but a plurality of chips are difficult to start in the low-temperature environment, such as-20 degrees, and the intelligent equipment cannot work normally.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of heating device can provide a whole set of temperature-detecting mechanism and heating mechanism, has solved the chip and has hardly started in low temperature environment, has caused the unable problem of normal work of smart machine.

In order to achieve the above object, a first aspect of the present invention provides a heating apparatus comprising: the temperature detection circuit is coupled with the heating circuit and the system power supply circuit and used for detecting the ambient temperature and sending a first trigger signal to the heating circuit when the ambient temperature is equal to or lower than a first threshold value; and the system power supply circuit is used for receiving the first trigger signal and stopping supplying power to the main chip power supply system.

The utility model has the advantages that:

the utility model provides a pair of heating device can be higher than certain value with smart machine's ambient temperature through a whole set of temperature-detecting mechanism and heating mechanism, can ensure under low temperature environment that the system can normally work.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention.

Fig. 1 is a schematic structural diagram of a heating device according to an embodiment of the present invention;

fig. 2 is a circuit diagram of a temperature detection circuit according to a first embodiment of the present invention;

fig. 3 is a heating circuit diagram according to a first embodiment of the present invention;

fig. 4 is a circuit diagram of a system power supply according to a first embodiment of the present invention.

Detailed Description

Hereinafter, various embodiments of the present invention will be described more fully. The present invention is capable of various embodiments and of being modified and varied therein. However, it should be understood that: there is no intention to limit the various embodiments of the invention to the specific embodiments disclosed herein, but on the contrary, the intention is to cover all modifications, equivalents, and/or alternatives falling within the spirit and scope of the various embodiments of the invention.

Hereinafter, the terms "includes" or "may include" used in various embodiments of the present invention indicate the presence of the disclosed functions, operations, or elements, and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in various embodiments of the present invention, the terms "comprises," "comprising," "includes," "including," "has," "having" and their derivatives are intended to refer only to the particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combination of the foregoing.

In various embodiments of the present invention, the expression "a or/and B" includes any or all combinations of the words listed simultaneously, e.g. may include a, may include B or may include both a and B.

Expressions (such as "first", "second", and the like) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the respective constituent elements. For example, the above description does not limit the order and/or importance of the elements described. The foregoing description is for the purpose of distinguishing one element from another. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present invention.

It should be noted that: in the present invention, unless otherwise explicitly specified or defined, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; there may be communication between the interiors of the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present invention, it should be understood by those skilled in the art that the terms indicating orientation or positional relationship herein are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the invention. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.

Referring to fig. 1, fig. 1 shows a heating device 100 according to an embodiment of the present invention, where the heating device 100 includes:

the temperature detection circuit 110 is coupled to the heating circuit and the system power supply circuit, and is used for detecting the ambient temperature and sending a first trigger signal to the heating circuit when the ambient temperature is equal to or lower than a first threshold value;

the heating circuit 120 is configured to receive the first trigger signal and heat a system operating environment, and the system power supply circuit 130 is configured to receive the first trigger signal and stop supplying power to the main chip power supply system.

The temperature detection circuit is also used for setting a starting temperature, and sending a second trigger signal to the heating circuit when the ambient temperature is higher than the first threshold value; the heating circuit is further configured to receive the second trigger signal and stop heating a system working environment, and the system power supply circuit is further configured to receive the second trigger signal and supply power to a main chip power supply system.

The heating device is described in detail below with reference to a specific electrical circuit.

Fig. 2 shows a specific circuit implementation of the temperature detection circuit, fig. 3 shows a specific circuit implementation of the heating circuit, and fig. 4 shows a system power supply circuit implementation. The out signal lines of the three circuits are connected together. The VCC power supply is common.

As shown in fig. 2, the temperature detecting circuit includes a temperature detecting chip U2401, and the U2401 may be TMP300 bideck of TI corporation. A resistor R2408 is connected between the Tset and the GND pins, and the resistance value of the resistor is used for setting the first threshold. Pin V + is connected with the power supply VCC, and

pins

4 and 5 are suspended. Pin 3 may output a high level when the temperature is above the first threshold and a low level when the temperature is below or equal to the first threshold.

As shown in fig. 3, the heating circuit includes a PNP transistor Q2404, an NPN transistor Q2403, and a pmos mosfet Q2402, wherein a base of the Q2404 is connected to an OUT pin of the TMP300 bideck kr, an emitter of the Q2404 is connected to a base of the Q2403 through a resistor R2400, a collector of the Q2403 is connected to a gate of the Q2402 through a resistor R2417, a source of the Q2402 is connected to a power source VCC, and a drain of the Q2402 is connected to a heating coil. The collector of the Q2404 is grounded, and the emitter of the Q2404 is connected to a power supply VCC through R2402. The base of 2403 is grounded through R2401, and the emitter of 2403 is grounded. The gate of Q2402 is connected to a power supply VCC through R2418.

As shown in fig. 4, the system power supply circuit includes a pmos mosfet Q2401, the gate of the Q2401 may be connected to the OUT pin of the TMP300 bideck through R2409, the source of the Q2401 is connected to a power source VCC, and the drain of the Q2401 is connected to a main chip power supply system. The gate of Q2401 is connected to a power supply VCC through R2411.

Specifically, for example, by setting 0 ° to be the first threshold value in R2408, when the ambient temperature is higher than 0 °, the OUT pin of U2401 outputs a high level, and then Q2402 of the heating circuit is not turned on and does not heat, and Q2401 of the system power supply circuit is turned on, and VCC will supply power to the main chip power supply system. When the ambient temperature is lower than 0 degree, the OUT pin of the U2401 outputs low level, at this time, the Q2402 of the heating circuit is conducted, the heating coil heats the system working environment to improve the temperature of the working environment, meanwhile, the Q2401 of the system power supply circuit is not conducted, and the VCC stops supplying power to the main chip power supply system.

In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and bus dynamic RAM (RDRAM).

The above-described embodiments are merely illustrative of several embodiments of the present invention, which are described in detail and specific, but not intended to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, other various changes and modifications can be made according to the above-described technical solutions and concepts, and all such changes and modifications should fall within the protection scope of the present invention.

Claims

1. A heating device, comprising:

the temperature detection circuit is coupled with the heating circuit and the system power supply circuit and used for detecting the ambient temperature and sending a first trigger signal to the heating circuit when the ambient temperature is equal to or lower than a first threshold value;

and the system power supply circuit is used for receiving the first trigger signal and stopping supplying power to the main chip power supply system.

2. The apparatus of claim 1,

the temperature detection circuit is also used for setting a starting temperature, and sending a second trigger signal to the heating circuit when the ambient temperature is higher than the first threshold value;

the heating circuit is further configured to receive the second trigger signal and stop heating a system working environment, and the system power supply circuit is further configured to receive the second trigger signal and supply power to a main chip power supply system.

3. The apparatus of claim 2,

the temperature detection circuit comprises a temperature detection chip TMP300BIDCKR, a resistor R2408 is connected between a Tset pin and a GND pin, and the resistance value of the resistor is used for setting the first threshold value.

4. The apparatus of claim 3,

the heating circuit comprises a PNP type triode Q2404, an NPN type triode Q2403 and a P channel metal-oxide-semiconductor field effect transistor Q2402, wherein the base electrode of the Q2404 is connected with the OUT pin of the TMP300BIDCKR, the emitter electrode of the Q2404 is connected with the base electrode of the Q2403 through a resistor R2400, the collector electrode of the Q2403 is connected with the grid electrode of the Q2402 through a resistor R2417, the source electrode of the Q2402 is connected with a power supply VCC, and the drain electrode of the Q2402 is connected with a heating coil.

5. The apparatus of claim 3,

the system power supply circuit comprises a P-channel metal-oxide-semiconductor field effect transistor Q2401, the grid electrode of the Q2401 is connected with the OUT pin of the TMP300BIDCKR, the source electrode of the Q2401 is connected with a power supply VCC, and the drain electrode of the Q2401 is connected with a main chip power supply system.