CN212970600U

CN212970600U - Modularized direct-current power supply heat dissipation device

Info

Publication number: CN212970600U
Application number: CN202022169112.3U
Authority: CN
Inventors: 陈亚东; 赵前虎; 钟钢炜; 唐德平
Original assignee: Hefei Kewei Power System Co ltd
Current assignee: Cowell Technology Co.,Ltd.
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2021-04-13
Anticipated expiration: 2030-09-28

Abstract

The utility model discloses a modularized direct current power supply heat dissipation device, including a shell and a multilayer heat dissipation module arranged in the shell, the shell is a cuboid structure with six end faces, wherein two opposite end faces are a front panel provided with a plurality of first heat dissipation holes and a rear panel provided with a plurality of second heat dissipation holes, the multilayer heat dissipation module comprises a bottommost heat dissipation module, a middle layer heat dissipation module and an uppermost layer heat dissipation module, the bottommost heat dissipation module, the middle layer heat dissipation module and the uppermost layer heat dissipation module are sequentially superposed inside the shell from bottom to top and are integrally arranged between the front panel and the rear panel, and each device of the direct current power supply is respectively arranged on the bottommost heat dissipation module, the middle layer heat dissipation module and the uppermost layer heat dissipation module; the utility model has the advantages that: the heat dissipation device is designed aiming at the full-bridge conversion topology of the direct-current power supply, so that the heat dissipation requirement is met, and the heat dissipation is uniform.

Description

Modularized direct-current power supply heat dissipation device

Technical Field

The utility model relates to a measurement test is with electronic equipment field, more specifically relates to a modularization DC power supply heat abstractor.

Background

In the field of electronic technology, a dc test power supply is one of indispensable test instruments for power electronics enterprises, and since many tested devices need high-power or high-voltage tests, the dc test power supply is required to be capable of providing high-power or high-voltage output to meet various test environments. The full-bridge conversion is a topology commonly used by the high-frequency direct-current test power supply at present, and the full-bridge conversion topology is limited by the development level of the existing semiconductor device, so that high-power or high-voltage output is difficult to realize by a single circuit, and high-voltage output can be realized by a mode of connecting a plurality of modules in parallel or in series. For the heating device, on the premise of the same power loss, that is, under the condition of the same heating amount in unit time, the heat dissipation area is small, the higher the heat flow density is, the smaller the device volume is, the smaller the heat radiation range is, and the lower the heat conduction efficiency is, and if the heating device is not effectively limited, the situations of component failure, explosion, combustion and the like can occur. The prior art does not have a heat dissipation device aiming at the full-bridge conversion topology of the direct-current power supply, heat dissipation is only carried out through a heat dissipation fan or a heat dissipation hole, a high-power device with heat productivity and a control panel with small heat productivity are not subjected to targeted heat dissipation, the heat dissipation requirement cannot be met, heat dissipation is not uniform, on one hand, a machine cannot work safely, stably and reliably, on the other hand, the size and the cost of the power supply can be increased to some extent, and performance parameters can be restricted.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that prior art does not have the heat abstractor to DC power supply full-bridge transform topology, can't reach the heat dissipation demand, and the heat dissipation is inhomogeneous.

The utility model discloses a following technical means realizes solving above-mentioned technical problem: the utility model provides a modularization DC power supply heat abstractor, include the shell and arrange the multilayer heat dissipation module in the shell in, the cuboid structure of shell for having six terminal surfaces, wherein two relative terminal surfaces are for being equipped with the front panel of a plurality of first louvres and being equipped with the rear panel of a plurality of second louvres, multilayer heat dissipation module includes bottom heat dissipation module, intermediate level heat dissipation module and superiors heat dissipation module, bottom heat dissipation module, intermediate level heat dissipation module and superiors heat dissipation module superpose in proper order and wholly arrange in between front panel and the rear panel inside the shell from the bottom up, each device of DC power supply arranges respectively at bottom heat dissipation module, on intermediate level heat dissipation module and the superiors heat dissipation module.

The utility model discloses a heat abstractor carries out the layering setting, and each device of DC power supply arranges respectively on bottommost heat dissipation module, intermediate level heat dissipation module and the superiors heat dissipation module, avoids needing radiating device to concentrate and distributes, carries out corresponding layering subregion heat dissipation to calorific power device and the little control panel of calorific capacity, avoids the heat dissipation inhomogeneous, reaches the heat dissipation demand.

Furthermore, the bottommost heat dissipation module comprises a plurality of first fans which are arranged in a linear array, are close to the front panel and are parallel to the front panel, a plurality of first radiators and a plurality of first main power devices, the plurality of first radiators are close to the first fans and are arranged in the shell in a matrix mode, and the plurality of first main power devices are arranged in a gap between the first radiators and the rear panel.

Still further, the first main power device includes a filter inductance and a power resistance.

Furthermore, the intermediate layer heat dissipation module comprises a plurality of second fans which are arranged in a linear array and are close to the front panel and parallel to the front panel, a plurality of second radiators and a plurality of second main power devices, the second fans are all located right above the first fans, the plurality of second radiators are close to the second fans and are linearly arranged above the first radiators at equal intervals, a first partition plate is arranged above the first main power devices, and the second main power devices are fixed on the side faces of the second radiators, the gaps above the first radiators and the upper portion of the first partition plate.

Still further, the number of the second fans is less than that of the first fans.

Still further, the second main power device comprises a capacitor and an MOS tube.

Still further, the uppermost heat dissipation module comprises a second partition plate, a control plate and an ARM plate, the second partition plate is arranged above the second fan and the second radiator, and the control plate and the ARM plate are arranged on the second partition plate.

The utility model has the advantages that: the utility model discloses a heat abstractor carries out the layering setting, and each device of DC power supply arranges respectively on bottommost heat dissipation module, intermediate level heat dissipation module and the superiors heat dissipation module, avoids needing radiating device to concentrate and distributes, carries out corresponding layering subregion heat dissipation to calorific power device and the little control panel of calorific capacity, avoids the heat dissipation inhomogeneous, reaches the heat dissipation demand.

Drawings

Fig. 1 is a schematic structural view of a modular dc power heat sink according to an embodiment of the present invention, with an upper cover and a front panel removed;

fig. 2 is a schematic diagram of a front panel of a modular dc power heat sink according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a rear panel of a modular dc power heat sink according to an embodiment of the present invention;

fig. 4 is a schematic view of a bottommost heat dissipation module of a modular dc power heat dissipation device according to an embodiment of the present invention;

fig. 5 is a schematic view of a middle-layer heat dissipation module of a modular dc power supply heat dissipation device according to an embodiment of the present invention.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 3, a modularized dc power heat dissipation device, including a housing 1 and a plurality of heat dissipation modules disposed in the housing 1, the housing 1 is a cuboid structure with six end faces, wherein two opposite end faces are a front panel 2 provided with a plurality of first heat dissipation holes 201 and a rear panel 3 provided with a plurality of second heat dissipation holes 301, the plurality of heat dissipation modules include a bottom heat dissipation module 4, a middle heat dissipation module 5 and a top heat dissipation module 6, the bottom heat dissipation module 4, the middle heat dissipation module 5 and the top heat dissipation module 6 are sequentially stacked inside the housing 1 from bottom to top and are integrally disposed between the front panel 2 and the rear panel 3. The utility model discloses a three-layer wind channel design, the bottom is the main power part that calorific capacity is the biggest, and the intermediate level is the main power part of calorific capacity time, and the top layer is control communication part, and every layer has independent straight ventiduct, introduces the structure of each layer in following detail.

As shown in fig. 4, the bottommost heat dissipation module 4 includes a plurality of first fans 401 arranged in a linear array, which are close to and parallel to the front panel 2, a plurality of first heat sinks 402, and a plurality of first main power devices 403, the plurality of first heat sinks 402 are close to the first fans 401 and arranged in the housing 1 in a matrix, and the plurality of first main power devices 403 are arranged in a gap between the first heat sinks 402 and the rear panel 3. The first main power device 403 includes a filter inductor and a power resistor.

As shown in fig. 5, the middle-layer heat dissipation module 5 includes a plurality of second fans 501, a plurality of second radiators 502 and a plurality of second main power devices 503, the second fans 501 are arranged in a linear array, are close to the front panel 2, and are parallel to the front panel, the second fans 501 are located right above the first fan 401, the second radiators 502 are close to the second fans 501, and are arranged above the first radiators 402 in a linear array at equal intervals, the first partition board 404 is arranged above the first main power devices 403, and the second main power devices 503 are fixed on the side surfaces of the second radiators 502, the gaps above the first radiators 402, and above the first partition board 404. The number of the second fans 501 is less than that of the first fans 401, because the middle-layer heat dissipation module 5 is provided with the second main power device 503 which generates less heat than the first main power device 403, and the heat dissipation requirement is lower than that of the bottommost heat dissipation module 4. The second main power device 503 includes a capacitor and a MOS transistor.

With reference to fig. 1, the uppermost heat dissipation module 6 includes a second partition 601, a control board 602, and an ARM board 603, the second partition 601 is disposed above the second fan 501 and the second heat sink 502, and the control board 602 and the ARM board 603 are disposed on the second partition 601.

The utility model provides a pair of modularization DC power supply heat abstractor carries out the layering setting, and each device of DC power supply arranges respectively on bottommost layer heat dissipation module 4, intermediate level heat dissipation module 5 and superiors heat dissipation module 6, avoids needing radiating device to concentrate and distributes, carries out corresponding layering subregion to calorific power device and the little control panel 602 of calorific capacity, avoids the heat dissipation inhomogeneous, reaches the heat dissipation demand.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a modularization DC power supply heat abstractor, a serial communication port, include the shell and arrange the multilayer heat dissipation module in the shell in, the shell is the cuboid structure that has six terminal surfaces, wherein two relative terminal surfaces are for the front panel that is equipped with a plurality of first louvres and the rear panel that is equipped with a plurality of second louvres, multilayer heat dissipation module includes bottommost heat dissipation module, intermediate level heat dissipation module and superiors heat dissipation module, bottommost heat dissipation module, intermediate level heat dissipation module and superiors heat dissipation module superpose in proper order and wholly arrange in between front panel and the rear panel inside from the bottom up in the shell, each device of DC power supply arranges respectively at bottommost heat dissipation module, on intermediate level heat dissipation module and the superiors heat dissipation module.

2. The modular dc power supply heat sink of claim 1, wherein the bottom heat sink module comprises a plurality of first fans arranged in a linear array and parallel to the front panel, a plurality of first heat sinks arranged in a matrix in the housing adjacent to the first fans, and a plurality of first main power devices arranged in a gap between the first heat sinks and the rear panel.

3. The modular dc power heat sink of claim 2, wherein said first primary power device comprises a filter inductor and a power resistor.

4. The modular direct-current power supply heat dissipation device as recited in claim 2, wherein the middle heat dissipation module comprises a plurality of second fans arranged in a linear array and parallel to the front panel, a plurality of second heat sinks and a plurality of second main power devices, the second fans are all located right above the first fans, the second heat sinks are close to the second fans and are linearly arranged above a row of the first heat sinks at equal intervals, a first partition board is arranged above the first main power devices, and the second main power devices are fixed on the side surfaces of the second heat sinks, the gaps above the first heat sinks and above the first partition boards.

5. The modular dc power heat sink of claim 4, wherein the number of second fans is less than the number of first fans.

6. The modular dc power heat sink of claim 4, wherein said second primary power device comprises a capacitor and a MOS transistor.

7. The modular dc power supply heat sink of claim 5, wherein the uppermost heat sink module comprises a second partition, a control board and an ARM board, and a second partition is disposed above the second fan and the second heat sink, and the control board and the ARM board are disposed on the second partition.