CN212970525U - Radiator mounting structure and radiator assembly - Google Patents
Radiator mounting structure and radiator assembly Download PDFInfo
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- CN212970525U CN212970525U CN202021419552.3U CN202021419552U CN212970525U CN 212970525 U CN212970525 U CN 212970525U CN 202021419552 U CN202021419552 U CN 202021419552U CN 212970525 U CN212970525 U CN 212970525U
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Abstract
The utility model discloses a radiator mounting structure and a radiator assembly, wherein the radiator mounting structure is used for mounting and fixing a radiator on a printed board and comprises a welding stud, a combined screw and a spring; one end of the welding stud is used for welding on the printed board, and a threaded hole matched with the surface thread of the combined screw is formed in the other end of the welding stud; the spring is sleeved on the welding stud, and the combined screw penetrates through the spring and then is matched with a threaded hole in the welding stud; when the radiator is installed on the printed board, the installation hole of the radiator is aligned with the welding stud to be installed in a matched mode, the spring is sleeved on the protruding portion of the welding stud, and then the combined screw penetrates through the spring and then is screwed into the threaded hole. The structure can realize visual alignment operation when being installed, and avoids the problems that blind installation is aligned to holes, double-sided operation and the alignment is inaccurate, so that a heat conducting medium between a radiator and a chip is damaged.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation, more specifically relates to a radiator mounting structure and radiator unit.
Background
With the increasing power consumption of electronic equipment, the layout of devices becomes more and more compact, and the use of heat sinks becomes more and more common. For a chip with high power consumption, in order to ensure good heat dissipation efficiency and enable the chip to work in a reliable temperature range, a profile or a fin radiator is often adopted to realize heat dissipation. Particularly, devices on a chassis of the communication equipment are dense, the radiator is widely adopted, and how to realize efficient and reliable installation of the radiator becomes a problem worthy of attention.
At present, a heat sink is generally installed and fixed by using spring screws, as shown in fig. 1, a special-shaped stud 61, a C-shaped elastic snap spring 62 and a spring 33 are installed on an installation hole of the heat sink 1, wherein the special-shaped stud 61 is an internal threaded stud. The C-shaped elastic clamp spring 62 is clamped at the lower end of the special-shaped stud 61 to prevent the special-shaped stud 61 from being separated from the radiator 1; the spring 33 is arranged between the special-shaped stud 61 and two end faces of the heat sink 1. The assembly steps of the heat sink 1 and the printed board 2 are as follows:
step one, aligning the radiator 1 to the mounting surface of the printed board 2, and aligning the lower end of the special-shaped stud 61 to the mounting hole on the printed board 2.
And step two, turning the radiator 1 and the printed board 2, and driving a special-shaped screw 63 into the other surface (namely the bottom surface in the figure) of the printed board 2 to enable the external thread of the special-shaped screw 63 to be matched with the internal thread of the special-shaped stud 61.
In the first step, the heat conducting medium between the heat sink and the printed board is already in contact during the alignment operation, and the mounting holes between the heat sink and the printed board are often not aligned due to difficulty in achieving visualization operation. In the second step, the relative position of the radiator and the printed board may move during the turn-over operation, so that the position is often required to be adjusted, and therefore, not only is the assembly efficiency affected, but also more importantly, the heat-conducting medium between the radiator and the printed board may be damaged, and whether the heat-conducting medium is intact cannot be detected visually, so that hidden troubles are left for the normal work of the radiator.
In summary, in the conventional spring screw fixing mode, a special-shaped screw rod, a C-shaped elastic clamp spring and a spring are required to be matched on a radiator, and a special-shaped screw is required; when the radiator is installed, the front side and the back side are required to be operated, and the heat conducting medium is easy to damage due to blind assembly and hole alignment. Meanwhile, the front side and the back side need to be provided with tools, and each machine disc needs to be provided with one tool, so that the cost is high.
SUMMERY OF THE UTILITY MODEL
To the above defect or the improvement demand of prior art, the utility model provides a radiator mounting structure and radiator subassembly realizes visual operation during its aim at installation radiator, from this solves the technical problem that needs positive and negative turn-over operation and damage heat-conducting medium easily among the traditional fixed mode.
To achieve the above object, according to one aspect of the present invention, there is provided a heat sink mounting structure for mounting and fixing a heat sink 1 on a printed board 2, including a welding stud 31, a combination screw 32, and a spring 33;
one end of the welding stud 31 is used for welding on the printed board 2, and a threaded hole 311 matched with the surface thread of the combined screw 32 is formed in the other end of the welding stud;
the spring 33 is sleeved on the welding stud 31, and the combined screw 32 passes through the spring 33 and then is matched with a threaded hole 311 arranged in the welding stud 31;
when the heat sink 1 is mounted on the printed board 2, after the mounting hole of the heat sink 1 is aligned with the welding stud 31 and is mounted in a matching manner, the spring 33 is sleeved on the protruding portion of the welding stud 31, and then the combination screw 32 penetrates through the spring 33 and is screwed into the threaded hole 311.
Preferably, the welding stud 31 comprises a threaded column 312, a limiting column 313 and a pin 314 which are connected in sequence, and the outer diameter of the limiting column 313 is larger than that of the threaded column 312 and the pin 314; wherein the threaded hole 311 is opened in the threaded column 312.
Preferably, the pins 314 extend into soldering holes on the printed board 2 and are soldered and fixed with the soldering holes.
Preferably, the pins 314 and the welding holes are fixed by wave soldering.
Preferably, the threaded column 312 and the limiting column 313 protrude out of the mounting surface of the printed board 2, and the end surface of the limiting column 313 is welded and fixed with the mounting surface of the printed board 2.
Preferably, the end surface of the limiting column 313 and the mounting surface of the printed board 2 are fixed by reflow soldering.
Preferably, the top end of the welding stud 31 is provided with a mylar sheet so as to realize feeding welding.
According to another aspect of the present invention, there is provided a heat sink assembly, comprising a heat sink 1, a printed board 2, and at least two heat sink mounting structures 3 for mounting the heat sink 1 on a mounting surface of the printed board 2;
the radiator 1 is provided with mounting holes 11 corresponding to each radiator mounting structure 3;
welding holes are respectively formed in the printed board 2 corresponding to each radiator mounting structure 3;
the heat sink mounting structure 3 includes a weld stud 31, a combination screw 32, and a spring 33; one end of the welding stud 31 is welded on the printed board 2 through the welding hole, and the other end protrudes out of the mounting surface of the printed board 2 and is coupled with the mounting hole 11 on the heat sink 1; the spring 33 is sleeved on the protruding part of the welding stud 31, and the combined screw 32 passes through the spring 33 and then is matched with a threaded hole 311 arranged in the welding stud 31.
Preferably, a chip 4 is arranged on the mounting surface of the printed board 2, and a heat conduction gasket 5 is arranged on the chip 4; wherein, the chip 4 and the heat conduction gasket 5 are both located between the heat sink 1 and the printed board 2.
Preferably, the welding stud 31 comprises a threaded column 312, a limiting column 313 and a pin 314 which are connected in sequence;
the threaded column 312 and the limiting column 313 protrude out of the mounting surface of the printed board 2, and the end surface of the limiting column 313 is welded and fixed with the mounting surface of the printed board 2; the pins 314 extend into the welding holes on the printed board 2 and are welded and fixed with the welding holes.
Generally, through the utility model discloses above technical scheme who conceives compares with prior art, has following beneficial effect: the utility model provides a radiator mounting structure sets up a welding double-screw bolt on the printing board, and the outstanding printing board surface of welding double-screw bolt can regard as the guide of radiator installation to realize visual counterpoint operation when the installation, avoided blind dress to the hole, two-sided operation and to the inaccurate problem that leads to heat-conducting medium between radiator and the chip to the hole, adopt ordinary combination screw and spring to realize that chip and radiator need compress tightly.
Drawings
Fig. 1 is a partial schematic view of a conventional heat sink mounting structure;
fig. 2 is a partial exploded view of a heat sink mounting structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a welding stud according to an embodiment of the present invention;
fig. 4 is an exploded view of a heat sink assembly according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;
the same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
1-radiator, 11-mounting hole; 2-a printed board; 3-radiator mounting structure, 31-welding stud, 32-combination screw, 33-spring, 311-threaded hole, 312-threaded column, 313-limiting column and 314-pin; 4-chip; 5-heat conducting gasket; 61-special-shaped stud, 62-C-shaped elastic clamp spring and 63-special-shaped screw.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
In the description of the present invention, the terms "inside", "outside", "longitudinal", "lateral", "up", "down", "top", "bottom", "left", "right", "front", "back", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention and do not require that the present invention must be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Example 1
For the technical problem who needs the positive and negative operation and damage heat-conducting medium easily among the solution traditional radiator fixed mode, the embodiment of the utility model provides a radiator mounting structure, as shown in fig. 2, including welding stud 31, combination screw 32 and spring 33 for fix the installation of radiator 1 on printing board 2.
Referring to fig. 2 and 3, one end (i.e., the bottom end in the drawing) of the welding stud 31 is used for welding on the printed board 2, the other end (i.e., the top end in the drawing) protrudes from the mounting surface (i.e., the upper surface in the drawing) of the printed board 2, and a threaded hole 311 matched with the surface thread of the combination screw 32 is formed in the other end.
Referring to fig. 2, the spring 33 is sleeved on the top end of the welding stud 31, and the combination screw 32 passes through the spring 33 and then is matched with a threaded hole 311 formed in the welding stud 31. To meet the requirement of fitting, the inner diameter of the spring 33 should be larger than the outer diameter of the welding stud 31 and the outer diameter of the stud part of the combination screw 32.
With reference to fig. 2 and 4, when the heat sink 1 needs to be mounted on the printed board 2, after the mounting hole of the heat sink 1 is aligned with the welding stud 31 and is mounted in a matching manner, the top end of the welding stud 31 protrudes out of the surface of the mounting hole of the heat sink 1, at this time, only the spring 33 needs to be sleeved on the protruding portion of the top end of the welding stud 31, and then the combination screw 32 penetrates through the spring 33 and then is screwed into the threaded hole 311 to be screwed.
Wherein, the combination screw 32 is usually selected from a common combination screw with a flat pad, and a flat head screw is not required to be customized; therefore, during installation, the flat pad is firstly placed at the top end of the spring 33, and then a corresponding screw is screwed into the threaded hole 311 through the flat pad and the spring 33.
In the radiator mounting structure, the welding stud protrudes out of the surface of the printed board and can be used as a guide piece for mounting the radiator, so that visual alignment operation is realized during mounting, the problem that the heat-conducting medium between the radiator and the chip is damaged due to blind assembly, hole aligning operation and inaccurate hole aligning is avoided, and the compression required by the chip and the radiator can be realized by adopting a common combined screw and a spring.
The following describes the heat sink mounting structure with reference to the accompanying drawings:
as shown in fig. 3, the welding stud 31 includes a threaded post 312, a limiting post 313 and a pin 314 connected in sequence, which may be formed independently or integrally, and is not limited herein; the outer diameter of the limiting column 313 is larger than the outer diameter of the threaded column 312 and the outer diameter of the plug 314; wherein the threaded hole 311 is opened in the threaded column 312.
Furthermore, the pins 314 extend into the welding holes on the printed board 2 and are welded and fixed with the welding holes; the threaded column 312 and the limiting column 313 protrude out of the mounting surface of the printed board 2, and the end surface of the limiting column 313 is welded and fixed with the mounting surface of the printed board 2.
The height of the welding stud 31 protruding out of the mounting surface of the printed board 2 (namely the total height of the threaded column 312 and the limiting column 313) meets the welding requirement of a plug-in device, and the pin 314 and the welding hole can be fixed by wave soldering, so that the welding strength meets the mounting requirement of the radiator 1. The wave soldering is a soft soldering, and specifically, molten soft soldering flux is jetted into a solder wave required by design through an electric pump or an electromagnetic pump, or the solder wave is formed by injecting nitrogen into a solder pool, and the mechanical and electrical connection between the pin 314 and the printed board 2 is realized through the solder wave; here, the wave soldering process is performed on the perforated element to ensure that the pins 314 are firmly connected to the printed board 2, so that the soldering strength can meet the mounting requirements of the heat sink 1.
The end face of the limiting column 313 and the mounting face of the printed board 2 are fixed by reflow soldering, namely the contact ring face of the limiting column 313 and the printed board 2 is subjected to reflow soldering, so that the soldering strength meets the mounting requirement of the radiator 1. The reflow soldering is also soft soldering, and particularly realizes mechanical and electrical connection between the end surface of the limiting column 313 and the mounting surface of the printed board 2 by remelting paste soft solder pre-distributed on the printed board; here, the reflow soldering process is adopted at the end face connection position, so that the connection and fixation between the limiting column 313 and the printed board 2 are more reliable, and the soldering strength meets the installation requirement of the radiator 1. Meanwhile, the temperature is easier to control when reflow soldering is adopted, oxidation can be avoided in the soldering process, and the manufacturing cost is lower. In addition, in a preferred embodiment, the top end of the welding stud 31 is provided with a mylar sheet, so that automatic feeding welding can be realized.
To sum up, the embodiment of the utility model provides a radiator mounting structure has following advantage:
a welding stud is welded on the printed board, protrudes out of the surface of the printed board and can be used as a guide piece for installing the radiator, so that visual alignment operation is realized during installation, blind assembly hole aligning and double-sided operation are avoided, and the installation efficiency is improved;
after the mounting hole of the radiator is aligned to the welding stud, the chip on the printed board can be tightly pressed with the radiator by adopting a common combined screw and a spring, so that the contact pressure between the radiator and the chip can meet the radiating requirement and cannot exceed the pressure resistance of the chip;
before the radiator is correctly positioned, the radiator is not contacted with the heat-conducting medium arranged on the chip, and only after the radiator is accurately positioned, the radiator is contacted with the heat-conducting medium on the chip, so that the heat-conducting medium is ensured not to be damaged in the installation process, and the reliability is improved;
the contact pressure of the radiator and the chip depends on the rigidity and the compression amount of the spring and is irrelevant to the screwing degree of the combined screw, so that the accurate control of the contact pressure between the radiator and the chip is realized;
the top end of the welding stud is provided with the Mylar film, and the welding stud can be automatically welded in wave soldering and reflow soldering processes, so that the welding strength meets the installation requirement of the radiator.
Example 2
On the basis of the heat sink mounting structure provided by the above embodiment 1, the embodiment of the present invention further provides a heat sink assembly, as shown in fig. 4, including a heat sink 1, a printed board 2 and at least two heat sink mounting structures 3 for mounting the heat sink 1 on the mounting surface of the printed board 2.
The heat sink 1 is provided with four mounting holes 11 corresponding to each heat sink mounting structure 3, and the number of the heat sink mounting structures 3 is usually four, so that the number of the mounting holes 11 is also four, as shown in fig. 5, but not limited to.
The printed board 2 is provided with a soldering hole corresponding to each heat sink mounting structure 3, as shown in fig. 2-4, the number of the heat sink mounting structures 3 is usually four, and therefore the number of the soldering holes is also four, but not limited to. In addition, a chip 4 is disposed on the mounting surface of the printed board 2, a heat conducting pad 5 (i.e., the heat conducting medium mentioned in embodiment 1) is disposed on the chip 4, and the chip 4 and the heat conducting pad 5 are both located between the heat sink 1 and the printed board 2, as shown in fig. 4.
The heat sink mounting structure 3 is the heat sink mounting structure in embodiment 1, and includes a weld stud 31, a combination screw 32, and a spring 33, as shown in fig. 2. One end (bottom end in the figure) of the welding stud 31 is welded on the printed board 2 through the welding hole, the other end (top end in the figure) protrudes out of the mounting surface of the printed board 2 and is coupled with the mounting hole 11 on the heat sink 1, and a threaded hole 311 matched with the surface thread of the combined screw 32 is formed in the other end. The spring 33 is sleeved on the protruding part of the welding stud 31, and the combined screw 32 passes through the spring 33 and then is matched with a threaded hole 311 arranged in the welding stud 31. To meet the requirement of fitting, the inner diameter of the spring 33 should be larger than the outer diameter of the welding stud 31 and the outer diameter of the stud part of the combination screw 32.
With reference to fig. 2 and 4, the specific assembly process of the heat sink assembly is as follows: firstly, aligning the mounting hole 11 on the radiator 1 to the welding stud 31 for matching installation, wherein the top end of the welding stud 31 protrudes out of the surface of the mounting hole 11 of the radiator 1; then the spring 33 is sleeved on the protruding part at the top end of the welding stud 31, and finally the combined screw 32 is screwed into the threaded hole 311 after penetrating through the spring 33. It should be noted that, before the heat spreader 1 is correctly positioned, the heat spreader 1 does not contact the thermal pad 5 mounted on the chip 4, and only after the heat spreader 1 is correctly positioned, the heat spreader 1 contacts the thermal pad 5 on the chip 4.
Wherein, the combination screw 32 is usually selected from a common combination screw with a flat pad, and a flat head screw is not required to be customized; therefore, during installation, the flat pad is firstly placed at the top end of the spring 33, and then a corresponding screw is screwed into the threaded hole 311 through the flat pad and the spring 33.
In above-mentioned radiator subassembly, the welding has the welding double-screw bolt on the printing board, and the welding double-screw bolt is outstanding on the printing board surface, can regard as the guide of radiator installation to realize visual counterpoint operation when the installation, avoided blind dress to the hole, two-sided operation and to the inaccurate problem that leads to heat-conducting medium between radiator and the chip to damage of hole, adopt ordinary combination screw and spring can realize that chip and radiator need compress tightly.
The following describes the heat sink mounting structure with reference to the accompanying drawings:
as shown in fig. 3, the welding stud 31 includes a threaded post 312, a limiting post 313 and a pin 314 connected in sequence, which may be formed independently or integrally, and is not limited herein; the outer diameter of the limiting column 313 is larger than the outer diameter of the threaded column 312 and the outer diameter of the plug 314; wherein the threaded hole 311 is opened in the threaded column 312.
Furthermore, the pins 314 extend into the welding holes on the printed board 2 and are welded and fixed with the welding holes; the threaded column 312 and the limiting column 313 protrude out of the mounting surface of the printed board 2, and the end surface of the limiting column 313 is welded and fixed with the mounting surface of the printed board 2.
The height of the welding stud 31 protruding out of the mounting surface of the printed board 2 (namely the total height of the threaded column 312 and the limiting column 313) meets the welding requirement of an insertion device, and the pin 314 and the welding hole can be fixed by wave soldering. The end face of the limiting column 313 and the mounting face of the printed board 2 are fixed by reflow soldering, namely the contact ring face of the limiting column 313 and the printed board 2 is subjected to reflow soldering, so that the soldering strength meets the mounting requirement of the radiator 1. In addition, in a preferred embodiment, the top end of the welding stud 31 is provided with a mylar sheet, so that automatic feeding welding can be realized.
To sum up, the embodiment of the present invention provides a heat sink assembly having the following advantages:
a welding stud is welded on the printed board, protrudes out of the surface of the printed board and can be used as a guide piece for installing the radiator, so that visual alignment operation is realized during installation, blind assembly hole aligning and double-sided operation are avoided, and the installation efficiency is improved;
after the mounting hole of the radiator is aligned to the welding stud, the chip on the printed board can be tightly pressed with the radiator by adopting a common combined screw and a spring, so that the contact pressure between the radiator and the chip can meet the radiating requirement and cannot exceed the pressure resistance of the chip;
before the radiator is correctly positioned, the radiator is not contacted with the heat-conducting medium arranged on the chip, and only after the radiator is accurately positioned, the radiator is contacted with the heat-conducting medium on the chip, so that the heat-conducting medium is ensured not to be damaged in the installation process, and the reliability is improved;
the contact pressure of the radiator and the chip depends on the rigidity and the compression amount of the spring and is irrelevant to the screwing degree of the combined screw, so that the accurate control of the contact pressure between the radiator and the chip is realized;
the top end of the welding stud is provided with the Mylar film, and the welding stud can be automatically welded in wave soldering and reflow soldering processes, so that the welding strength meets the installation requirement of the radiator.
It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A radiator mounting structure is used for mounting and fixing a radiator (1) on a printed board (2), and is characterized by comprising a welding stud (31), a combined screw (32) and a spring (33);
one end of the welding stud (31) is used for being welded on the printed board (2), and a threaded hole (311) matched with the surface thread of the combined screw (32) is formed in the other end of the welding stud;
the spring (33) is sleeved on the welding stud (31), and the combined screw (32) penetrates through the spring (33) and then is matched with a threaded hole (311) formed in the welding stud (31);
when the radiator (1) is installed on the printed board (2), the installation hole of the radiator (1) is aligned to the welding stud (31) to be installed in a matched mode, the spring (33) is sleeved on the protruding portion of the welding stud (31), and then the combined screw (32) penetrates through the spring (33) and then is screwed into the threaded hole (311).
2. The heat sink mounting structure according to claim 1, wherein the weld stud (31) comprises a threaded column (312), a retaining column (313) and a pin (314) connected in sequence, and an outer diameter of the retaining column (313) is larger than outer diameters of the threaded column (312) and the pin (314); wherein the threaded hole (311) is opened in the threaded post (312).
3. The heat sink mounting structure according to claim 2, wherein the pins (314) are inserted into soldering holes in the printed board (2) and soldered to the soldering holes.
4. The heat sink mounting structure according to claim 3, wherein the pins (314) are fixed to the soldering holes by wave soldering.
5. The heat sink mounting structure according to claim 2, wherein the screw post (312) and the stopper post (313) protrude from the mounting surface of the printed board (2), and an end surface of the stopper post (313) is fixed by welding to the mounting surface of the printed board (2).
6. The heat sink mounting structure according to claim 5, wherein the end face of the stopper post (313) is fixed to the mounting surface of the printed board (2) by reflow soldering.
7. Heat sink mounting arrangement according to any one of claims 1-6, characterised in that the welding studs (31) are provided with mylar tabs at their top ends for facilitating the feed welding.
8. A heat sink assembly, comprising a heat sink (1), a printed board (2) and at least two heat sink mounting structures (3) for mounting the heat sink (1) on a mounting surface of the printed board (2);
mounting holes (11) are respectively formed in the radiator (1) corresponding to each radiator mounting structure (3);
welding holes are respectively formed in the printed board (2) corresponding to each radiator mounting structure (3);
the radiator mounting structure (3) comprises a welding stud (31), a combined screw (32) and a spring (33); one end of the welding stud (31) is welded on the printed board (2) through the welding hole, and the other end of the welding stud protrudes out of the mounting surface of the printed board (2) and is coupled with the mounting hole (11) in the radiator (1); the spring (33) is sleeved on a protruding portion of the welding stud (31), and the combined screw (32) penetrates through the spring (33) and then is matched with a threaded hole (311) formed in the welding stud (31).
9. A heat sink assembly according to claim 8, wherein a chip (4) is arranged on the mounting surface of the printed board (2), and a heat conducting pad (5) is arranged on the chip (4); wherein the chip (4) and the heat conduction gasket (5) are both positioned between the heat radiator (1) and the printed board (2).
10. The heat sink assembly according to claim 8, wherein the weld stud (31) comprises a threaded post (312), a retaining post (313) and a pin (314) connected in series;
the threaded column (312) and the limiting column (313) protrude out of the mounting surface of the printed board (2), and the end surface of the limiting column (313) is welded and fixed with the mounting surface of the printed board (2); the pins (314) extend into the welding holes in the printed board (2) and are welded and fixed with the welding holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021419552.3U CN212970525U (en) | 2020-07-19 | 2020-07-19 | Radiator mounting structure and radiator assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021419552.3U CN212970525U (en) | 2020-07-19 | 2020-07-19 | Radiator mounting structure and radiator assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212970525U true CN212970525U (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021419552.3U Active CN212970525U (en) | 2020-07-19 | 2020-07-19 | Radiator mounting structure and radiator assembly |
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| CN (1) | CN212970525U (en) |
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