CN212967749U

CN212967749U - High-density patch type 3535 four-color integrated LED light source

Info

Publication number: CN212967749U
Application number: CN202021650699.3U
Authority: CN
Inventors: 肖亮; 张伟
Original assignee: Guagnzhou Tianxin Photoelectric Co ltd
Current assignee: Guagnzhou Tianxin Photoelectric Co ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-04-13
Anticipated expiration: 2030-08-10

Abstract

The utility model discloses a SMD 3535 four-color integrative LED light source of high density relates to the LED light source. The scheme is provided aiming at the problem of insufficient luminous power in the prior art and is realized by utilizing a specially-made mold top lens. The die top lens is a hemispherical lens with four sides respectively provided with a side plane, and the diameter of the hemispherical lens is larger than the side length of the insulating substrate; each side plane is located within the range of the insulating substrate and close to the corresponding edge of the insulating substrate. Its advantage lies in, has set up the side plane of four sides after, can greatly increased the diameter scope of die-top lens, no longer receive the size restriction of insulating substrate for the size of luminous chip can choose for use wider scope. The power is twice of the maximum value of the original 3535 four-in-one light source, the power output level of the common 3535 monochromatic light source is achieved, and larger brightness output can be achieved on the premise of the same area in the optical design.

Description

High-density patch type 3535 four-color integrated LED light source

Technical Field

The utility model relates to a LED light source especially relates to a SMD 3535 four-color integrative LED light source of high density.

Background

The 3535 size LED light source is one of light sources used for wall washing lamps and stage lamps at present, wherein 3535 means that the length of an insulating substrate is 3.5 +/-0.1 mm, the width of the insulating substrate is 3.5 +/-0.1 mm, and the insulating substrate is one of substrate sizes commonly used in the industry. In practical application, the LED lamp is required to emit various bright colors, and the light source is required to realize application effects at different angles of 5-60 degrees under the action of the hemispherical lens. The conventional 3535 light source has two forms, one is a single-chip light source with a single color, the use power is 700-1000 milliamperes, and the other is a four-color integrated LED light source.

The specific structure of the four-color integrated LED light source is shown in FIGS. 1 and 2, and four light emitting chips 11 are arranged in the middle of the upper side surface of an insulating substrate 10 and correspond to different color temperatures. And a hemispherical lens 12 is also arranged to completely cover the four light-emitting chips in a sealing manner. The diameter of the hemispherical lens is limited by the insulating substrate, and the value range is not more than 3.4 mm. Due to the size of the hemispherical lens, the single size of the light-emitting chips of four colors can be controlled within 30mil at most. Resulting in a maximum of about 500 milliamps of current being used for a single color within the light source and less than 6 watts of total power for all four colors of the light source. The power of the light source is limited, and the function of the prior four single chip light sources cannot be replaced by a single four-in-one light source. Wherein the size of the light emitting chip is 30mil and particularly refers to the side length.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrative LED light source of SMD 3535 four-color of high density solves the not enough problem of light source power on the basis that does not change the insulating substrate size.

The utility model discloses a high-density SMD 3535 four-color integrated LED light source, which comprises an insulating substrate, wherein four light-emitting chips which are distributed in a rectangular shape are arranged in the middle of the upper side surface of the insulating substrate, and a die top lens is further arranged to completely seal the four light-emitting chips; the die top lens is a hemispherical lens with four sides respectively provided with a side plane, and the diameter of the hemispherical lens is larger than the side length of the insulating substrate; each side plane is located within the range of the insulating substrate and close to the corresponding edge of the insulating substrate.

A SMD 3535 integrative LED light source of four-color of high density, its advantage lies in, has set up the side plane of four sides after, can greatly increased the diameter scope of mould top lens, no longer by the size restriction of insulating substrate for the size of luminous chip can choose for use wider range. The power is twice of the maximum value of the original 3535 four-in-one light source, the power output level of the common 3535 monochromatic light source is achieved, and larger brightness output can be achieved on the premise of the same area in the optical design.

The diameter of the hemispherical lens is 3.0 mm-4.3 mm, and the preferred diameter is 3.8 +/-0.2 mm.

The side plane inclines towards the middle of the insulating substrate and forms a demolding included angle with the normal of the insulating substrate. The demolding included angle is 1-5 degrees, and preferably 3 degrees.

The size of the light-emitting chip is 35-40 mil, and preferably 38 mil.

Drawings

FIG. 1 is a schematic structural diagram of a conventional 3535 four-color integrated LED light source;

fig. 2 is a top view of fig. 1.

Fig. 3 is a schematic structural diagram of a high-density patch-type 3535 four-color integrated LED light source of the present invention;

FIG. 4 is a top view of FIG. 3;

fig. 5 is a schematic diagram of a partially enlarged structure of an edge portion of a high-density patch-type 3535 four-color integrated LED light source.

Reference numerals: 10-insulating substrate, 11-light emitting chip, 12-hemispherical lens, 20-mode top lens, 21-side plane, and K-normal of insulating substrate.

Detailed Description

As shown in fig. 3-5, a SMD 3535 integrative LED light source of high density all-in-one of four colors adopts ceramic material's insulating substrate as encapsulation LED's design basis, rectangular distribution sets up four luminescence chips on the insulating substrate, and the special mould top lens of rethread shape covers four luminescence chips comprehensively. The specific structure of the die top lens is a hemispherical lens with side planes on four sides, and the diameter of the hemispherical lens is larger than the side length of the insulating substrate. Each side plane is located within the range of the insulating substrate and close to the corresponding edge of the insulating substrate. The diameter of the hemispherical lens is 3.0 mm-4.3 mm, and the preferred diameter is 3.8 +/-0.2 mm.

The thickness of the insulating substrate is 0.25-0.6 mm, the length of the appearance of the single four-color integrated LED light source is 3.5 +/-0.1 mm, and the width of the single four-color integrated LED light source is 3.5 +/-0.1 mm. The connecting circuits which are in one-to-one correspondence and are independently controlled by four colors are arranged on two surfaces of the insulating substrate, so that the arrangement of the light-emitting chips and the connection of the light source and the outside are realized. The front surface is provided with a circuit and the connection position of the light-emitting chips, and the minimum distance between the light-emitting chips is controlled to be 0.1 +/-0.05 mm. The bottom of the chip and the connection position of the circuit are the same plane, and the light-emitting chip and the circuit are welded by gold wires to be in circuit connection.

The four light emitting chips may correspond to four colors. The wavelength and color temperature can be respectively selected as: the visible monochromatic chip is 380-780 nm or the color temperature is 1700K-15000K. The light-emitting chips can be packaged by adopting vertical or horizontal structure chips, uniform single-side surface light emission can be realized in a light-emitting mode, and the light-emitting chips are symmetrically distributed relative to an optical center. The size of the light-emitting chip can be increased from the original maximum of less than 30mil to 40mil, the area is close to 1.8 times of the original area, and the current used by a single color can reach 1000 milliamperes. The luminous power is twice of the maximum value of the original 3535 four-in-one light source, the power output level of a common 3535 monochromatic light source is achieved, and larger brightness output can be achieved on the premise of the same area in the optical design. Under the concept of the invention, the size of the light-emitting chip can adopt a value range of 35-40 mil, and the current and the power of the light-emitting chip in the size range are basically close to each other. But 38 mils are the most cost effective from the standpoint of production cost and difficulty.

Further, in order to facilitate the demolding treatment of the mold-top lens, the side plane is inclined towards the middle of the insulating substrate and forms a demolding included angle with the normal of the insulating substrate. The demolding included angle is 1-5 degrees, and preferably 3 degrees.

Furthermore, the LED light source with the design can realize one to four color combination packaging by adjusting the color combination of the light-emitting chips, and 1 to 4 chips can be made in a single color. The power and the brightness of a single color are greatly improved to adapt to various occasions with different requirements on color and brightness, and the light source can be suitable for more creative designs of the light source. The light source structure is compact and compact, and the light source competitiveness of downstream enterprises is effectively improved.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.

Claims

1. A high-density patch-type 3535 four-color integrated LED light source comprises an insulating substrate, wherein four light-emitting chips are arranged in the middle of the upper side face of the insulating substrate in a rectangular distribution mode, and a mold top lens is arranged to completely seal the four light-emitting chips; the mold top lens is a hemispherical lens with side planes on four sides, and the diameter of the hemispherical lens is larger than the side length of the insulating substrate; each side plane is located within the range of the insulating substrate and close to the corresponding edge of the insulating substrate.

2. The high-density patch-type 3535 four-color integrated LED light source of claim 1, wherein the hemispherical lens has a diameter of 3.0mm to 4.3 mm.

3. The high-density patch-type 3535 four-color integrated LED light source of claim 2, wherein the hemispherical lens diameter is 3.8 ± 0.2 mm.

4. The high-density patch-type 3535 four-color integrated LED light source of claim 1, wherein the side planes are inclined toward the middle of the insulating substrate and form an included angle with the normal of the insulating substrate.

5. The high-density patch-type 3535 four-color integrated LED light source of claim 4, wherein the included angle of the mold release is 1-5 °.

6. The high-density patch-type 3535 four-color integrated LED light source of claim 5, wherein the included demolding angle is 3 °.

7. The high-density patch-type 3535 four-color integrated LED light source as claimed in any one of claims 1 to 6, wherein the size of the light emitting chip is 35-40 mil.

8. The high-density patch-style 3535 four-color integrated LED light source of claim 7, wherein the light emitting chip size is 38 mils.