CN212010961U

CN212010961U - High-density patch type six-color integrated LED light source structure

Info

Publication number: CN212010961U
Application number: CN202020818048.4U
Authority: CN
Inventors: 肖亮; 张伟
Original assignee: Guagnzhou Tianxin Photoelectric Co ltd
Current assignee: Guagnzhou Tianxin Photoelectric Co ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2020-11-24
Anticipated expiration: 2030-05-15

Abstract

The utility model discloses a six integrative LED light source structures of SMD six colours of high density, LED light source technique. The scheme is provided aiming at the problems of low luminous power, large product size and the like in the prior art. The LED packaging structure comprises an insulating substrate, wherein a surface circuit layer and six LED chips are arranged on the upper surface of the insulating substrate, and the six LED chips are respectively and electrically connected with the surface circuit layer; a packaging lens is arranged above the insulating substrate and covers all the LED chips in a sealing manner; the surface circuit layer penetrates through and extends to the lower surface of the insulating substrate through a wire and is electrically connected with six positive plates and six negative plates which are arranged on the lower surface of the insulating substrate respectively. The LED lamp has the advantages that the luminous power is greatly improved, the size of a product is reduced, and the competitiveness of a downstream light source product is favorably improved.

Description

High-density patch type six-color integrated LED light source structure

Technical Field

The utility model relates to a LED light source technique especially relates to a six integrative LED light source structures of SMD six colours of high density.

Background

The six-color integrated LED light source is one of common light sources of wall washing lamps and stage lamps at present. In practical application, the LED lamp is required to emit various bright colors, and the light source is required to achieve application effects at different angles of 15-60 ° under the action of the lens. As shown in fig. 1, a batwing-type structural support composed of three parts, i.e., a pin 13, a copper column 14 and an insulating plastic sheet 12, is used for packaging a chip 10 in a conventional six-color integrated light source, and because the batwing-type structure is made of a material and meets the requirements of a manufacturing process, a circuit design cannot be performed on the copper column, a metal part needs to be positioned during injection molding, and the copper column needs to be higher than the pin by a certain fall, so that the position of a chip drop point and the connection position of an external pin cannot be in the same plane. Due to the combination of the reasons, the chips can only be used after being arranged, and the six-color integrated chip can be realized by mixing and matching the bottom-insulated horizontal chip and the vertical chip. The horizontal chip is a five-side light-emitting chip, and the vertical chip is a single-side light-emitting chip. The electrical connection can only adopt gold wire cross spanning connection, the length of the gold wire reaches the length of three chips, and the height of the wire arc reaches the thickness of more than four chips. Due to the above structure material selection, the current used by a single color in the light source is about 400 milliamperes, and the total power of all six colors of the light source is less than 10 watts. The light source structure has larger volume, and the size of a single light source reaches 15 mm. However, the light source has relatively poor heat and weather resistance due to the fact that the plastic is mainly PPA (poly-p-phenylene terephthalamide), and the materials used in the severe environment are not matched in thermal expansion, so that the phenomena of weakening air tightness, breaking of gold wires and the like are easy to occur.

SUMMERY OF THE UTILITY MODEL

The utility model aims to reduce the light source size, improve light source power, provide a six integrative LED light source structures of SMD six colours of high density.

The utility model discloses a six integrative LED light source structures of high density SMD, including insulating substrate, insulating substrate upper surface is equipped with surface circuit layer and six LED chips, six LED chips respectively with surface circuit layer electric connection; a packaging lens is arranged above the insulating substrate and covers all the LED chips in a sealing manner; the surface circuit layer penetrates through and extends to the lower surface of the insulating substrate through a wire and is electrically connected with six positive plates and six negative plates which are arranged on the lower surface of the insulating substrate respectively.

The six positive plates are arranged on one side of the insulating substrate, and the six negative plates are arranged on the other side of the insulating substrate; and the middle part of the lower surface of the insulating substrate is also provided with a heat sink layer.

The upper surface of the packaging lens is a spherical surface or a plane.

The insulating substrate is provided with a support at each corner, the support is embedded into the edge of the packaging lens, and a cavity is arranged between the packaging lens and the LED chip.

Five of the six LED chips respectively correspond to wavelengths of 365-415nm, 450-500nm, 520-570nm, 575-610nm and 615-665nm, and the sixth LED chip corresponds to a color temperature of 2500K-9500K.

The LED chips are distributed symmetrically relative to the center of the insulating substrate.

The insulating substrate is made of ceramic.

A six integrative LED light source structures of SMD of high density, its advantage is in, the chip bottom is same plane with the hookup location on surperficial circuit layer, therefore the gold thread welding exaggerates the degree longest and only about a chip length, the wire arc height is no longer than two chip thickness. The six chips with different colors can be packaged by adopting the chips with the vertical structures, and the uniform single-side surface light emission can be realized in a light emitting mode. The light-emitting chips are distributed in a central symmetry mode relative to the ceramic substrate, the connection mode of each chip and the surface circuit layer is simplified, the processing difficulty is greatly reduced, and the gap between the chips can be further reduced. The distribution positions of the six chips are reduced to be within 4mm from the diameter of 5mm of the previous batwing type, the light emitting diameter is reduced by 20%, the light emitting area is about 70% of the original light source, and a smaller light emitting angle can be realized on the premise of a lens with the same volume in the optical design. And the utility model discloses conventional copper post design has been saved completely.

Meanwhile, the ceramic material is used as a surface circuit layer, and the ceramic substrate has excellent insulating and heat dissipation performance, small thermal expansion coefficient and better matching with a chip. The current used by a single color chip can be increased to 700 milliamperes, and the brightness of a single light source can be increased by more than 50% compared with the brightness of a previous batwing-type light source. The light source of the design can be used for manufacturing any combination package of two to six colors by adjusting the chip package, or a single color can be used for manufacturing two to four chips. The power and brightness of a single color can be greatly improved, so that the LED lamp is suitable for various occasions requiring different color and brightness requirements, and the full utilization of a light source is achieved.

The design of the light source provides two forms of hemispherical silica gel lens airtight protection packaging and plane lens packaging, the whole light source monomer is only 5mm in length and width, and the volume of the light source is less than 30% of that of the original batwing-type six-in-one light source. More design spaces are provided for light source creative designers at the later stage, so that the six-color integrated light source can be suitable for more light source creative designs. The light source has compact and compact structure, can be manufactured by using the conventional DPC process, has stable ceramic circuit performance and accurate size of a ceramic single-particle cutting light source. The full-automatic equipment can be adopted for sorting and packaging, the finished product manufacturing process is simplified, the reject ratio is reduced, the consistency of large-batch light sources is good, and the light source competitiveness of downstream enterprises is improved.

Drawings

Fig. 1 is a schematic structural diagram of a patch type six-color integrated LED light source structure in the prior art.

Fig. 2 is a schematic structural diagram of a first embodiment of a high-density patch-type six-color integrated LED light source structure of the present invention;

FIG. 3 is a top view of FIG. 2;

fig. 4 is a bottom view of fig. 2.

Fig. 5 is a schematic structural view of a second embodiment of the high-density patch-type six-color integrated LED light source structure of the present invention;

fig. 6 is a top view of fig. 5.

Fig. 7 is a schematic structural view of a third embodiment of the high-density patch-type six-color integrated LED light source structure of the present invention;

fig. 8 is a top view of fig. 7.

Description of the drawings: 10-LED chip, 11-packaging lens, 12-insulating plastic sheet, 13-pin and 14-copper column; 20-insulating substrate, 21-surface circuit layer, 22-positive plate, 23-heat sink layer, 24-negative plate, 25-bracket and 26-cavity.

Detailed Description

As shown in fig. 2-8, a six integrative LED light source structures of SMD of high density, including ceramic material's insulating substrate 20 surface circuit layer 21 and six LED chips 10 are laid to insulating substrate 20 top. The LED chips 10 are electrically connected to the surface circuit layer 21. The surface circuit layer 21 is formed by laying a plurality of wires according to the wiring requirement, and the specific wiring mode is a conventional technical means of a person skilled in the art. The wire is preferably gold wire. The insulating substrate 20 preferably has a thickness of 0.25-0.6mm, the LED chips 10 are symmetrically distributed around the center of the insulating substrate 20, and the minimum distance between the LED chips 10 can be in the range of 0.1 ± 0.05 mm. The connecting position of the bottom of each LED chip 10 and the surface circuit layer 21 is the same plane, the longest gold wire welding quartic degree is only about one chip length, and the wire arc height can be realized to be not more than two chip thicknesses. On the basis of the light source structure, the six LED chips 10 can be packaged by vertical structure chips. Of course, the use of six vertically configured chips is the best solution, and does not preclude the use of horizontally patterned chips.

One end of the gold wire of the surface circuit layer 21 is connected to the LED chip 10, and the other end thereof extends downward through the insulating substrate 20. Six positive electrode plates 22 are provided on one side of the lower surface of the insulating substrate 20, and six negative electrode plates 24 are provided on the other side. The gold wires extending downwards are respectively and electrically connected with the corresponding positive plate 22 or negative plate 24. It should be understood by those skilled in the art that the positive and negative electrodes of each LED chip 10 are LED out to a corresponding positive electrode tab 22 and a corresponding negative electrode tab 24 by a gold wire. A heat sink layer 23 is provided in the middle of the insulating substrate 20 at a position between the positive electrode tab 22 and the negative electrode tab 24. The heat sink layer 23 can be formed by a copper metal heat sink, and is used for conveniently welding the light source structure to each lamp.

The selection of the six LED chips 10 can be varied according to the application. For example, the wavelength of the five LED chips 10 is selected to be any one or any combination of 365-415nm, 450-500nm, 520-570nm, 575-610nm and 615-665 nm; and the color temperature of the sixth LED chip 10 can be selected from 2500K-9500K.

Be equipped with encapsulation lens 11 on insulating substrate 20 and be used for sealed isolated LED chip 10 and outside atmosphere, the utility model provides a following three kinds of encapsulation lens 11's implementation:

example one

As shown in fig. 2 and 3, the package lens 11 is a hemispherical shape protruding upward, and the package lens 11 fills and covers all surfaces of the LED chip 10. The edge of the package lens 11 extends to the edge position of the upper surface of the insulating substrate 20.

Example two

As shown in fig. 5 and 6, the present embodiment is different from the first embodiment mainly in that the package lens 11 has a planar structure, and the package lens 11 fills and covers the surfaces of all the LED chips 10.

EXAMPLE III

As shown in fig. 7 and 8, the present embodiment is different from the second embodiment mainly in that the insulating substrate 20 is provided with a bracket 25 at each corner. The support 25 is embedded in the edge of the package lens 11, so that the package lens 11 can form a cavity 26 with the LED chip 10 by using the prior art. The cavity 26 has a certain degree of vacuum or is filled with an inert gas.

The insulating substrate 20 of the above three embodiments can be applied to the bottom structure shown in fig. 4.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.

Claims

1. A high-density patch type six-color integrated LED light source structure is characterized by comprising an insulating substrate (20), wherein the upper surface of the insulating substrate (20) is provided with a surface circuit layer (21) and six LED chips (10), and the six LED chips (10) are respectively and electrically connected with the surface circuit layer (21); a packaging lens (11) is arranged above the insulating substrate (20) and hermetically covers all the LED chips (10); the surface circuit layer (21) penetrates through the lower surface of the insulating substrate (20) through a conducting wire and extends to the lower surface of the insulating substrate (20), and is respectively and electrically connected with six positive plates (22) and six negative plates (24) arranged on the lower surface of the insulating substrate (20).

2. The high-density patch type six-color integrated LED light source structure according to claim 1, wherein the six positive plates (22) are arranged on one side of the insulating substrate (20), and the six negative plates (24) are arranged on the other side of the insulating substrate (20); a heat sink layer (23) is arranged in the middle of the lower surface of the insulating substrate (20).

3. The high-density patch-type six-color integrated LED light source structure according to claim 1, wherein the upper surface of the package lens (11) is spherical or planar.

4. The high-density patch-type six-color integrated LED light source structure as claimed in claim 3, wherein the insulating substrate (20) is provided with a bracket (25) at each corner, the bracket (25) is embedded into the edge of the package lens (11), and a cavity (26) is provided between the package lens (11) and the LED chip (10).

5. The high-density patch type six-color integrated LED light source structure according to claim 1, wherein five of the six LED chips (10) respectively correspond to wavelengths of 365-415nm, 450-500nm, 520-570nm, 575-610nm and 615-665nm, and the sixth corresponds to a color temperature of 2500K-9500K.

6. The high-density patch type six-color integrated LED light source structure according to claim 1, wherein the LED chips (10) are distributed symmetrically with respect to the center of the insulating substrate (20).

7. The high-density patch-type six-color integrated LED light source structure according to any one of claims 1 to 6, wherein the insulating substrate (20) is made of ceramic.