CN216928622U

CN216928622U - Adjustable color light LED lamp pearl of flip-chip that simple structure practicality is high

Info

Publication number: CN216928622U
Application number: CN202122395306.XU
Authority: CN
Inventors: 陈文婧; 周俊
Original assignee: Guangdong Super Smart Semiconductor Co ltd
Current assignee: Guangdong Super Smart Semiconductor Co ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2022-07-08
Anticipated expiration: 2031-09-30

Abstract

The utility model discloses a flip adjustable color LED lamp bead with simple structure and high practicability, which comprises a primary color red light chip, a primary color green light chip, a first primary color blue light chip, a second primary color blue light chip, a ceramic substrate and a conductive through hole. The utility model forms a novel adjustable color light LED packaging structure by changing the structures of the color light primary color chip and the substrate bonding pad, thereby simplifying the design of a ceramic substrate circuit, obviously reducing the processes of color light LED packaging, further improving the packaging yield of the color light LED lamp bead and prolonging the service life of the color light LED lamp bead in the future, and realizing the advantages.

Description

Adjustable color light LED lamp pearl of flip-chip that simple structure practicality is high

Technical Field

The utility model relates to the technical field of LEDs, in particular to an inverted adjustable color light LED lamp bead which is simple in structure and high in practicability.

Background

The existing color light integrated LED packaging structure on the market electrically connects the vertical color light primary color chip and the substrate by a gold wire bonding method, and on the basis, taking the traditional RGBW (Red, Green, blue and white) four-color integrated LED lamp bead as an example, in the packaging process, at least four gold wires are required to be bonded to electrically connect the chip and the substrate, wherein the red chip and the blue chip are a generation of wire chips, namely, the chip with the polarity of the surface of the chip as the negative pole and the back as the positive pole, the green chip matched with the red and blue chips is a second-generation perforated chip with the polarity of the surface of the chip as the positive pole and the back as the negative pole, therefore, in order to package the first generation chip and the second generation chip simultaneously, the ceramic substrate circuit needs to be designed in a complicated way, and if the number of wire bonding required by the chip is increased, the fewer the good products produced, and the risk of lamp death during subsequent use will also increase accordingly.

Therefore, the structure of the color light primary color chip and the substrate bonding pad is necessary to be changed, and a novel inverted adjustable color light LED packaging structure is provided, so that the circuit design and the packaging process of the ceramic substrate are simplified, the packaging yield is improved, and the service life is prolonged.

Disclosure of Invention

In order to achieve the purpose, the utility model adopts the following technical scheme:

an inverted adjustable color LED lamp bead with simple structure and high practicability comprises a primary color red light chip, a primary color green light chip, a first primary color blue light chip, a second primary color blue light chip, a ceramic substrate and conductive through holes, and is characterized in that circuit layers on the ceramic substrate are symmetrically designed and are provided with eight blocks in total, and each circuit layer is provided with a conductive through hole; the conductive through hole is vertically arranged on the ceramic substrate in a penetrating manner; the primary color red light chip, the primary color green light chip, the first primary color blue light chip and the second primary color blue light chip are sequentially arranged in a clockwise direction and are reversely mounted and fixedly arranged on the ceramic substrate; the primary color red light chip, the primary color green light chip, the first primary color blue light chip and the second primary color blue light chip are arranged on the circuit layer in a spanning mode of flip-chip fixation, specifically, each chip is respectively fixed on two positive circuit layers and one negative circuit layer, namely, each chip is provided with two positive circuit layers and two negative circuit layers; wherein the second primary color blue light chip is provided with a fluorescent silica gel soft film; the front surface and the back surface of the ceramic substrate are electrically conducted to realize independent control of the circuit.

Preferably, the fluorescent silica gel soft film can be yellow, or fluorescent silica gel soft films with other colors can be obtained according to the proportion of use requirements.

Preferably, both the left side and the right side of the circuit layer on the ceramic substrate are a negative electrode or a positive electrode.

Preferably, the circuit layers on the ceramic substrate can be increased with the increase of the number of chips according to actual use requirements, rearranged according to the number and the matching of the positive electrode and the negative electrode, and rearranged.

The utility model has the beneficial effects that: because the surface of the first generation chip is linear, the polarity is negative, the surface of the second generation chip is porous, the polarity is positive, and the red light of the current vertical chip is only the first generation chip, while the blue light and the green light are mostly packaged by using the second generation chip, the utility model considers that the light-emitting sequence of the RGBW chip needs to be matched with the electric polarities of the first generation chip and the second generation chip in the packaging process, thereby replacing the installation of the chip on the ceramic substrate with an inverted structure, the design change can lead the electric polarities of RGB three-color chips to be uniform, the problem of electric polarity matching can be omitted on the design of the substrate, thereby simplifying the design of the ceramic substrate circuit, obviously reducing the procedures of color LED packaging, further improving the packaging yield of the color LED lamp beads and prolonging the service life in the future, and realizing the specific characteristics of the advantages that the original color of the color chip is fixedly arranged on the circuit layers of the positive pole and the negative pole by the inverted mode, the utility model can effectively reduce the risk of lamp death by supporting programming to control the primary color chip, thereby meeting the applicability under more scenes and improving the use embodiment and practicability of users.

Drawings

FIGS. 1 and 2 are schematic top views of the present invention;

FIG. 3 is a bottom view of the present invention;

fig. 4 is a perspective structural view of the present invention.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments.

Referring to fig. 1 to 4, the flip-chip adjustable color light LED lamp bead with a simple structure and high practicability in the present embodiment adopts the following technical scheme, and includes a primary color red light chip (1), a primary color green light chip (2), a first primary color blue light chip (3), a second primary color blue light chip (4), a ceramic substrate (5) and conductive through holes (6), and is characterized in that circuit layers (7) on the ceramic substrate (5) are symmetrically designed, eight circuit layers are provided, and each circuit layer (7) is provided with a conductive through hole (6); the conductive through hole (6) is vertically arranged on the ceramic substrate (5) in a penetrating manner; the primary color red light chip (1), the primary color green light chip (2), the first primary color blue light chip (3) and the second primary color blue light chip (4) are sequentially arranged in a clockwise direction, inversely arranged and fixedly arranged on the ceramic substrate (5); the primary color red light chip (1), the primary color green light chip (2), the first primary color blue light chip (3) and the second primary color blue light chip (4) are arranged on the circuit layer (7) in a spanning and fixed mode in an inverted mode, specifically, each chip is respectively fixed on two positive and negative circuit layers (7), namely, each chip is provided with two positive and negative circuit layers (7); wherein the second primary color blue light chip (4) is provided with a fluorescent silica gel soft film; wherein the front surface and the back surface of the ceramic substrate (5) are electrically conducted to realize the independent control of the circuit.

The fluorescent silica gel soft film can be yellow, or fluorescent silica gel soft films with other colors can be obtained according to the use requirement.

Wherein, the left side or the right side of the circuit layer (7) on the ceramic substrate (5) is a cathode or an anode.

The circuit layer (7) on the ceramic substrate (5) can increase with the increase of the number of chips according to actual use requirements, and can be rearranged according to the number and the matching of the anode and the cathode.

The present embodiment takes the above scheme as an example.

Because the surface of the first generation chip is linear, the polarity is negative, the surface of the second generation chip is porous, the polarity is positive, and the red light of the current vertical chip is only the first generation chip, while the blue light and the green light are mostly packaged by using the second generation chip, the utility model considers that the light-emitting sequence of the RGBW chip needs to be matched with the electric polarities of the first generation chip and the second generation chip in the packaging process, thereby replacing the installation of the chip on the ceramic substrate with an inverted structure, the design change can lead the electric polarities of RGB three-color chips to be uniform, the problem of electric polarity matching can be omitted on the design of the substrate, thereby simplifying the design of the ceramic substrate circuit, obviously reducing the procedures of color LED packaging, further improving the packaging yield of the color LED lamp beads and prolonging the service life in the future, and realizing the specific characteristics of the advantages that the original color of the color chip is fixedly arranged on the circuit layers of the positive pole and the negative pole by the inverted mode, the utility model can effectively reduce the risk of lamp death by supporting programming to control the primary color chip, thereby meeting the applicability under more scenes and improving the use embodiment and practicability of users.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A flip-chip adjustable color LED lamp bead with simple structure and high practicability comprises a primary color red light chip (1), a primary color green light chip (2), a first primary color blue light chip (3), a second primary color blue light chip (4), a ceramic substrate (5) and conductive through holes (6), and is characterized in that circuit layers (7) on the ceramic substrate (5) are symmetrically designed, eight circuit layers are arranged, and each circuit layer (7) is provided with a conductive through hole (6); the conductive through hole (6) is vertically arranged on the ceramic substrate (5) in a penetrating manner; the primary color red light chip (1), the primary color green light chip (2), the first primary color blue light chip (3) and the second primary color blue light chip (4) are sequentially arranged in a clockwise direction, inversely arranged and fixedly arranged on the ceramic substrate (5); the primary color red light chip (1), the primary color green light chip (2), the first primary color blue light chip (3) and the second primary color blue light chip (4) are arranged on the circuit layer (7) in a spanning and fixed mode in an inverted mode, specifically, each chip is respectively fixed on two positive and negative circuit layers (7), namely, each chip is provided with two positive and negative circuit layers (7); wherein the second primary color blue light chip (4) is provided with a fluorescent silica gel soft film; wherein the front surface and the back surface of the ceramic substrate (5) are electrically conducted to realize the independent control of the circuit.

2. The flip-chip adjustable color light LED lamp bead with simple structure and high practicability as claimed in claim 1, wherein the fluorescent silica gel soft film can be yellow or can be made into other colors according to the proportion of use requirements.

3. The flip-chip adjustable color light LED lamp bead with simple structure and high practicability as claimed in claim 1, wherein the left side or the right side of the circuit layer (7) on the ceramic substrate (5) is uniformly a negative electrode or a positive electrode.

4. The flip-chip adjustable color light LED lamp bead with simple structure and high practicability as claimed in claim 1, wherein the circuit layer (7) on the ceramic substrate (5) can be increased with the increase of the number of chips according to actual use requirements, and can be rearranged according to the number and the matching of the positive electrode and the negative electrode.