CN212967665U - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- CN212967665U CN212967665U CN202022058133.8U CN202022058133U CN212967665U CN 212967665 U CN212967665 U CN 212967665U CN 202022058133 U CN202022058133 U CN 202022058133U CN 212967665 U CN212967665 U CN 212967665U
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Abstract
The present application provides a substrate processing apparatus comprising: the cavity is formed by enclosing a shell and a cover; the bracket is positioned in the cavity and used for supporting the substrate; the lifting mechanism carries out lifting motion so as to drive the support to lift in the cavity; a control signal generator for generating a control signal for controlling the lifting mechanism to perform lifting movement; and a substrate detector which detects whether the substrate is in a horizontal state on the support, and when the substrate detector detects that the substrate is in a state of being inclined with respect to the horizontal direction on the support, the lifting mechanism stops the lifting movement.
Description
Technical Field
The present application relates to the field of semiconductor devices, and more particularly, to a substrate processing apparatus.
Background
In the semiconductor manufacturing process, various abnormal alarms can occur in the thin film equipment along with the loss of the machine and the specificity of the wafer. Such as: the machine wafer fails diagonally; wafer sticking occurs in the sputtering process of the aluminum cavity; the transmission process of the mechanical arm is shaken; the wafer position deviation can be caused by the abnormal conditions that the wafer is in the vacuum cavity after the wafer is in the problem and the machine station gives an alarm, and the wafer is stopped in the vacuum cavity for a long time, and the wafer is subjected to fragment risk in the subsequent transmission process.
Once a wafer is broken, it will not only lose the current wafer, but also affect the quality of other wafers in the tool, and the downtime will affect the use of equipment and the replacement consumption of some contaminated parts, increasing expenses and reducing the uptime of the tool.
In the semiconductor manufacturing process, a wafer enters a machine table and then enters a plurality of cavities, and corresponding processing is performed in each cavity. FIG. 1 is a schematic view of a wafer transfer sequence between vacuum chambers. In the multiple chambers shown in fig. 1, some chambers have a lifting mechanism therein, and the wafer is driven by the lifting mechanism to perform lifting movement. The chamber with the lifting mechanism is for example: connecting the transfer chamber and the cooling chamber, etc.
It should be noted that the above background description is only for the convenience of clear and complete description of the technical solutions of the present application and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present application.
Disclosure of Invention
The inventors of the present application have found that the transfer sequence of the wafers shown in fig. 1 has some drawbacks: for example, each cavity can only detect that the wafer reaches the position in the cavity, but cannot detect whether the wafer is in a horizontal state at present, if the wafer deviates on the transfer arm due to an abnormal reason and is transferred into the connecting transfer cavity and the cooling cavity, the device cannot automatically stop the current action, and the cavity continues to perform lifting movement according to a program, so that the deviated wafer is damaged.
Fig. 2 is a schematic view of a wafer in a tilted state in a chamber. As shown in fig. 2, the end of the wafer 201 is not supported on the support point 202 within the chamber, and therefore, the wafer 201 is in a tilted state, i.e., not in a horizontal state. When the support 203 performs the lifting movement, the wafer 201 and the support 203 perform the lifting movement together, which easily causes the wafer 201 to collide with other components in the chamber, so that the wafer is damaged.
The embodiment of the application provides a substrate processing device, whether the substrate is in a horizontal state in a cavity is detected through a substrate detector, and control is performed according to a detection result so as to stop or allow lifting drive of the substrate, therefore, the substrate is prevented from being broken due to the fact that the lifting drive is performed in the inclined state of the substrate, and the safety of the substrate can be guaranteed.
According to an aspect of an embodiment of the present application, there is provided a substrate processing apparatus including:
the cavity is formed by enclosing a shell and a cover;
the bracket is positioned in the cavity and used for supporting the substrate;
the lifting mechanism carries out lifting motion so as to drive the support to lift in the cavity;
a control signal generator for generating a control signal for controlling the lifting mechanism to perform lifting movement; and
a substrate detector that detects whether the substrate is in a horizontal state on the support,
and when the substrate detector detects that the substrate is in a state of inclining relative to the horizontal direction on the support, the lifting mechanism stops performing the lifting movement.
According to another aspect of an embodiment of the present application, wherein,
the substrate detector further detects whether the substrate is located at a predetermined position in the lifting direction,
and when the substrate detector detects that the position of the substrate in the lifting direction is not a preset position, the lifting mechanism stops performing the lifting movement.
According to another aspect of the embodiments of the present application, wherein the predetermined position corresponds to a position where the lifting mechanism is bottomed out.
According to another aspect of the embodiment of the present application, the substrate detector receives the light reflected by the substrate, and determines whether the substrate is in a horizontal state and/or whether the substrate is located at a predetermined position in a lifting direction according to the intensity of the received light.
According to another aspect of an embodiment of the present application, wherein the cover is at least partially of a transparent material,
the substrate detector is positioned outside the cavity and above the area where the substrate is positioned, receives light through the transparent material,
the substrate detector is arranged along the vertical direction.
According to another aspect of the embodiments of the present application, in the case where the intensity of the light received by the substrate detector is not equal to the standard intensity,
the substrate detector stops the elevating mechanism from performing the elevating movement.
According to another aspect of the embodiments of the present application, wherein, in the case where the intensity of the light received by the substrate detector is equal to the standard intensity,
the substrate detector allows the elevating mechanism to perform the elevating movement.
According to another aspect of embodiments herein, wherein the standard strength is:
the intensity of the light received by the substrate detector is in a state where the substrate is horizontal on the holder and the substrate is located at the predetermined position.
According to another aspect of the embodiments of the present application, wherein the substrate processing apparatus further comprises:
a switching unit disposed between the elevating mechanism and the substrate detector.
The beneficial effect of this application lies in: whether the substrate is in a horizontal state in the cavity is detected through the substrate detector, and control is performed according to a detection result so as to stop or allow the lifting drive of the substrate, therefore, the substrate is prevented from being broken due to the lifting drive in an inclined state of the substrate, and the safety of the substrate can be ensured.
Specific embodiments of the present application are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the application may be employed. It should be understood that the embodiments of the present application are not so limited in scope. The embodiments of the application include many variations, modifications and equivalents within the spirit and scope of the appended claims.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic view of a wafer transfer sequence between vacuum chambers;
FIG. 2 is a schematic view of a wafer in a tilted state within a chamber;
fig. 3 is a schematic view of a substrate processing apparatus according to embodiment 1 of the present application.
Detailed Description
The foregoing and other features of the present application will become apparent from the following description, taken in conjunction with the accompanying drawings. In the description and drawings, particular embodiments of the application are disclosed in detail as being indicative of some of the embodiments in which the principles of the application may be employed, it being understood that the application is not limited to the described embodiments, but, on the contrary, is intended to cover all modifications, variations, and equivalents falling within the scope of the appended claims.
Example 1
The embodiment 1 of the present application provides a substrate processing apparatus for processing a substrate.
The substrate may be a substrate commonly used in the field of semiconductor manufacturing, such as a Silicon wafer, a Silicon On Insulator (SOI) wafer, a Silicon germanium wafer, a gallium nitride wafer, a SiC wafer, or an insulating wafer such as quartz, sapphire, or glass. In addition, the surface of the substrate may have thereon various thin films and various structures required for a semiconductor device or a MEMS device. The present embodiment is not limited to the above-described examples for the substrate.
Fig. 3 is a schematic view of a substrate processing apparatus according to embodiment 1 of the present application. As shown in fig. 3, the substrate processing apparatus 300 includes: a chamber 30, a support 31, a lifting mechanism 32, a control signal generator 33 and a substrate detector 34.
Wherein, the cavity 30 is enclosed by a housing (not shown in fig. 3) and a cover 301; the support 31 is positioned in the cavity 30 and supports the substrate 3; the lifting mechanism 32 performs a lifting motion to drive the support 31 to lift in the cavity 30, the lifting motion direction may be along a vertical direction, the lifting mechanism 32 may be, for example, a lifting cylinder, and the lifting cylinder may drive the support 31 to lift by compressed air; the control signal generator 33 can generate a control signal for controlling the elevating mechanism 32 to perform the elevating movement. Further, as shown in fig. 3, the control signal generator 33 may be connected to the elevating mechanism 32 through a solenoid valve 35.
In this embodiment, the substrate detector 34 may detect whether the substrate 3 is in a horizontal state on the support 31, and the detection result of the substrate detector 34 may be used to control the elevating mechanism 32. As shown in fig. 3, the output of the substrate detector 34 may be connected to the lift mechanism 32.
For example, when the substrate detector 34 detects that the substrate 3 is tilted with respect to the horizontal direction on the support 31 (that is, the substrate 3 is not in the horizontal state on the support 31), the elevating mechanism 32 is controlled to stop the elevating movement, and at this time, the control signal from the control signal generator 33 does not cause the elevating mechanism 32 to perform the elevating movement, and thus the support on the support 31 does not perform the elevating movement. For another example, when the substrate detector 34 detects that the substrate 3 is in a horizontal state on the support 31, the elevating mechanism 32 is controlled to allow the elevating movement, and at this time, the control signal from the control signal generator 33 enables the elevating mechanism 32 to perform the elevating movement, whereby the support on the support 31 can perform the elevating movement.
According to the embodiment of the application, whether the substrate is in a horizontal state in the cavity is detected through the substrate detector, and control is performed according to the detection result so as to stop or allow the lifting drive of the substrate, therefore, the substrate is prevented from being broken due to the lifting drive in the inclined state of the substrate, and the safety of the substrate can be ensured.
In the present embodiment, the substrate detector 34 may also detect whether the substrate 3 is located at a predetermined position in the lifting direction. When the substrate detector 34 detects that the position of the substrate 3 in the lifting direction is not the predetermined position, the lifting mechanism 32 stops the lifting movement. Further, when the substrate detector 34 detects that the position of the substrate 3 in the lifting direction is a predetermined position, the lifting mechanism 32 is allowed to perform the lifting movement. Wherein the predetermined position corresponds to a position where the lifting mechanism 32 is lowered to the lowest point, i.e., a lower position of the cavity position.
In this embodiment, the substrate detector 34 may receive the light reflected by the substrate 3, and determine whether the substrate is in a horizontal state and/or whether the substrate is located at a predetermined position in the lifting direction according to the intensity of the received light.
For example, in the case where the intensity of the light received by the substrate detector 34 is not equal to the standard intensity, the substrate detector 34 may stop the elevating mechanism 32 from performing the elevating movement; for another example, in the case where the intensity of the light received by the substrate detector 34 is equal to the standard intensity, the substrate detector 34 allows the elevating mechanism 32 to perform the elevating movement.
Wherein, the standard strength refers to: in a case where the substrate 3 is in a horizontal state on the holder 31 and the substrate 3 is located at a predetermined position, the intensity of the light received by the substrate detector 34.
In one embodiment, the substrate detector 34 may be disposed in a vertical direction and emit illumination light in the vertical direction and receive reflected light. If the substrate 3 is inclined with respect to the horizontal direction, the intensity of the reflected light received by the substrate detector 34 is low, and therefore, the intensity of the light received by the substrate detector 34 is not equal to the standard intensity; if the substrate 3 is not located at a predetermined position (for example, the uppermost end in the lifting direction, i.e., the upper position of the chamber position) although it is located in the horizontal state, the intensity of the reflected light received by the substrate detector 34 is high, and therefore, the intensity of the light received by the substrate detector 34 is not equal to the standard intensity; if the substrate 3 is not supported on the support 31, the intensity of the reflected light received by the substrate detector 34 is also low, and therefore, the intensity of the light received by the substrate detector 34 is not equal to the standard intensity; if the substrate 3 is in a horizontal state and is located at a predetermined position (for example, at the lowermost end in the elevating direction, i.e., at a lower position than the chamber position), the intensity of the reflected light received by the substrate probe 34 is the same as the standard intensity.
In this embodiment, the cover 301 is at least partially made of a transparent material, the substrate detector 34 is located outside the chamber 30 and above the region where the substrate 3 is located, and the substrate detector 34 is vertically disposed so as to receive light through the transparent material.
In the above, the case where the substrate detector 34 detects the substrate 3 based on the intensity of the received light reflected by the substrate 3 has been described. The present application is not limited thereto, and the substrate detector 34 may detect whether the substrate 3 is horizontal and in a predetermined position based on other means. For example, the substrate detector 34 may photograph the substrate 3 at a certain fixed angle, compare the photographed image with a standard image, and thereby detect whether the substrate 3 is horizontal and in a predetermined position.
As shown in fig. 3, the substrate processing apparatus 300 may further include: a switching unit 36.
A switching unit 36 may be disposed between the lift mechanism 32 and the substrate detector 34. When the switch unit 36 is turned on, the lifting mechanism 32 can be controlled by the detection result of the substrate detector 34; when the switch unit 36 is turned off, the elevating mechanism 32 cannot be controlled by the detection result of the substrate detector 34, and at this time, the elevating mechanism 32 can be controlled by a signal manually input.
In the present application, under the condition that the switch unit 36 is turned on and the substrate detector 34 works normally, once the substrate is not in a horizontal state in the cavity 30 or is deviated, the substrate detector 34 feeds back a signal that the substrate 3 is not detected to the electromagnetic valve 35, so that the electromagnetic valve 35 does not perform a switching action on the signal, thereby stopping the lifting and lowering movement of the lifting mechanism 32 and ensuring the safety of the substrate, thereby ensuring the safety of the product during the production process of the equipment and improving the production capacity requirement. In addition, the substrate detector 34 may send a signal that the substrate 3 is not detected to a display (not shown) of the substrate processing apparatus 300, and the display may display "unknown position" or the like, thereby prompting the operator to: the attitude or position of the substrate within the chamber is incorrect.
In the present application, the substrate processing apparatus 300 may be: an apparatus for performing thin film deposition (e.g., a physical vapor deposition apparatus), or other semiconductor thin film growth or processing apparatus. For example, vapor deposition equipment; aluminum nitride film growth equipment; vanadium oxide film growth equipment; various thin film etching equipment and other vacuum conveying equipment. In addition, the substrate processing apparatus 300 of the present application may be applied to other chambers having a transparent cover.
According to the embodiment of the application, whether the substrate is in a horizontal state in the cavity is detected through the substrate detector, and control is performed according to the detection result so as to stop or allow the lifting drive of the substrate, therefore, the substrate is prevented from being broken due to the lifting drive in the inclined state of the substrate, and the safety of the substrate can be ensured.
The present application has been described in conjunction with specific embodiments, but it should be understood by those skilled in the art that these descriptions are intended to be illustrative, and not limiting. Various modifications and adaptations of the present application may occur to those skilled in the art based on the spirit and principles of the application and are within the scope of the application.
Claims (9)
1. A substrate processing apparatus, characterized by comprising:
the cavity is formed by enclosing a shell and a cover;
the bracket is positioned in the cavity and used for supporting the substrate;
the lifting mechanism carries out lifting motion so as to drive the support to lift in the cavity;
a control signal generator for generating a control signal for controlling the lifting mechanism to perform lifting movement; and
a substrate detector that detects whether the substrate is in a horizontal state on the support,
and when the substrate detector detects that the substrate is in a state of inclining relative to the horizontal direction on the support, the lifting mechanism stops performing the lifting movement.
2. The substrate processing apparatus according to claim 1,
the substrate detector further detects whether the substrate is located at a predetermined position in the lifting direction,
and when the substrate detector detects that the position of the substrate in the lifting direction is not a preset position, the lifting mechanism stops performing the lifting movement.
3. The substrate processing apparatus according to claim 2,
the preset position corresponds to the position where the lifting mechanism descends to the lowest point.
4. The substrate processing apparatus according to any one of claims 1 to 3,
the substrate detector receives the light reflected by the substrate, and judges whether the substrate is in a horizontal state and/or whether the substrate is positioned at a preset position in the lifting direction according to the intensity of the received light.
5. The substrate processing apparatus according to claim 4,
the cover is at least partially of a transparent material,
the substrate detector is positioned outside the cavity and above the area where the substrate is positioned, receives light through the transparent material,
the substrate detector is arranged along the vertical direction.
6. The substrate processing apparatus according to claim 4,
in case the intensity of the light received by the substrate detector is not equal to the standard intensity,
the substrate detector stops the elevating mechanism from performing the elevating movement.
7. The substrate processing apparatus according to claim 4,
in the case where the intensity of the light received by the substrate detector is equal to the standard intensity,
the substrate detector allows the elevating mechanism to perform the elevating movement.
8. The substrate processing apparatus according to claim 6 or 7,
the standard intensities are:
the intensity of the light received by the substrate detector is in a state where the substrate is horizontal on the holder and the substrate is located at the predetermined position.
9. The substrate processing apparatus according to any one of claims 1 to 3,
the substrate processing apparatus further includes:
a switching unit disposed between the elevating mechanism and the substrate detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022058133.8U CN212967665U (en) | 2020-09-18 | 2020-09-18 | Substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022058133.8U CN212967665U (en) | 2020-09-18 | 2020-09-18 | Substrate processing apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN212967665U true CN212967665U (en) | 2021-04-13 |
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| CN202022058133.8U Active CN212967665U (en) | 2020-09-18 | 2020-09-18 | Substrate processing apparatus |
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| CN (1) | CN212967665U (en) |
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