CN111785662B - Wafer detection system and method applied to groove type cleaning machine - Google Patents
Wafer detection system and method applied to groove type cleaning machine Download PDFInfo
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- CN111785662B CN111785662B CN202010650698.7A CN202010650698A CN111785662B CN 111785662 B CN111785662 B CN 111785662B CN 202010650698 A CN202010650698 A CN 202010650698A CN 111785662 B CN111785662 B CN 111785662B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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Abstract
The application discloses a wafer detection system and method applied to a groove type cleaning machine, and relates to the field of semiconductor manufacturing. The wafer detection system applied to the groove type cleaning machine comprises an optical fiber sensor, a sliding module and a processing host; the optical fiber sensor and the sliding module are respectively connected with the processing host; the sliding module is arranged on the mechanical arm, and the mechanical arm is used for driving the wafer frame to move; the optical fiber sensor is arranged on the sliding module, and the sliding module is used for driving the optical fiber sensor to move; the processing host is used for detecting whether the wafer on the wafer rack is abnormal after being cleaned according to the signal sent by the optical fiber sensor; the problem that abnormal conditions of the conventional wafer after being cleaned by a cleaning tank cannot be detected in time is solved; the effect of effectively detecting the position and the fragment condition of the cleaned wafer is achieved.
Description
Technical Field
The application relates to the field of semiconductor manufacturing, in particular to a wafer detection system and method applied to a groove type cleaning machine.
Background
In an integrated circuit manufacturing process, a wafer is processed by oxidation, deposition, photolithography, etching, ion implantation, and the like, and after the related processes are completed, the wafer needs to be cleaned to remove residues on the surface of the wafer.
The wet cleaning of the wafer comprises groove type cleaning and single wafer cleaning, wherein the groove type cleaning can clean a plurality of wafers at the same time. When the wafers are subjected to groove type cleaning, a plurality of wafers are placed on the wafer frame, and the wafer frame is moved by the mechanical arm. When the wafer is transferred between the cleaning tanks, the wafer on the wafer rack is detected by the correlation sensor.
The present correlation sensor is generally mounted on a robot arm or above a cleaning tank. When the wafer frame is lifted to the upper part of the cleaning groove from the cleaning groove by the mechanical arm, the detection light emitted by the correlation sensor is blocked by the wafer on the wafer frame, and the detection of the position of the wafer is realized. However, if some of the wafers are broken and fall into the cleaning tank, the correlation sensor cannot detect them.
Disclosure of Invention
In order to solve the problems in the related art, the present application provides a wafer inspection system and method for a tank cleaning machine. The technical scheme is as follows:
in a first aspect, an embodiment of the present application provides a wafer detection system applied to a tank cleaning machine, where the system includes an optical fiber sensor, a sliding module, and a processing host;
the optical fiber sensor and the sliding module are respectively connected with the processing host;
the sliding module is arranged on the mechanical arm, and the mechanical arm is used for driving the wafer frame to move;
the optical fiber sensor is arranged on the sliding module, and the sliding module is used for driving the optical fiber sensor to move;
the processing host is used for detecting whether the wafer on the wafer rack is abnormal after being cleaned according to the signal sent by the optical fiber sensor.
Optionally, the sliding module includes a sliding rail and a sliding block;
the slide rail is arranged between the two arms of the mechanical arm and is positioned above the wafer rack;
the sliding block is movably fixed on the sliding rail and is connected with the processing host;
the optical fiber sensor is arranged on the sliding block.
In a second aspect, an embodiment of the present application provides a wafer inspection method applied to a tank cleaning machine, where the method includes:
fixing the wafer rack with the wafer on a mechanical arm;
before the wafer is cleaned, the sliding module is controlled by the processing host to drive the optical fiber sensor to move above the wafer frame, and the optical fiber sensor transmits a detection signal and generates a first feedback signal;
sending the first feedback signal to a processing host through an optical fiber sensor;
after the wafer is cleaned, when the wafer frame reaches a preset position above the cleaning groove, the sliding module is controlled by the processing host to drive the optical fiber sensor to move above the wafer frame, and the optical fiber sensor transmits a detection signal and generates a second feedback signal;
sending the second feedback signal to a processing host through an optical fiber sensor;
and detecting whether the wafer on the wafer rack is abnormal after being cleaned by the processing host according to the first feedback signal and the second feedback signal.
Optionally, the sliding module includes a sliding rail and a sliding block, the sliding rail is disposed between the two arms of the robot arm, the sliding rail is located above the wafer rack, the sliding block is movably fixed on the sliding rail, and the sliding block is connected with the processing host;
through the top removal of handling host computer control slip module drive optical fiber sensor at the wafer frame, include:
the first sliding instruction is sent to the sliding block through the processing host, and the sliding block drives the optical fiber sensor to move from the first end of the sliding rail to the second end of the sliding rail according to the first sliding instruction.
Optionally, the optical fiber sensor emits a detection signal, including:
in the process that the optical fiber sensor moves from the first end of the sliding rail to the second end of the sliding rail, the optical fiber sensor emits a detection signal.
Optionally, the method further includes:
and sending a second sliding instruction to the sliding block through the processing host, and driving the optical fiber sensor to move from the second end of the sliding rail to the first end of the sliding rail by the sliding block according to the sliding instruction.
Optionally, the method further includes:
when the wafer is cleaned, the wafer rack is lowered into the cleaning tank through the mechanical arm.
Optionally, after cleaning the wafer, the method further includes:
the wafer rack is moved to a predetermined position above the cleaning tank by a robot arm.
Optionally, the detecting whether the wafer on the wafer rack is abnormal after being cleaned by the processing host according to the first feedback signal and the second feedback signal includes:
detecting whether the first feedback signal is consistent with the second feedback signal through the processing host;
if the first feedback signal is consistent with the second feedback signal, determining that the wafer on the wafer frame is not abnormal;
and if the first feedback signal is detected to be inconsistent with the second feedback signal, determining that the wafer on the wafer rack is abnormal.
Optionally, the first feedback signal and the second feedback signal are level signals.
The technical scheme at least comprises the following advantages:
the wafer rack with the wafer is fixed on a mechanical arm, before the wafer is cleaned, the sliding module is controlled by the processing host to drive the optical fiber sensor to move above the wafer rack, the optical fiber sensor transmits a detection signal and generates a first feedback signal, the first feedback signal is sent to the processing host, after the wafer is cleaned, when the wafer rack reaches a preset position above the cleaning tank, the slider module is controlled by the processing host to drive the optical fiber sensor to move above the wafer rack, the optical fiber sensor transmits the detection signal and generates a second feedback signal, the second feedback signal is sent to the processing host, and the processing host detects whether the wafer on the wafer rack is abnormal after being cleaned according to the first feedback signal and the second feedback signal, so that the problem that the abnormal condition of the wafer cannot be detected in time after being cleaned by the cleaning tank at present is solved; the effect of effectively detecting the position and the fragment condition of the cleaned wafer is achieved.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer inspection system for a tank cleaning machine according to an embodiment of the present disclosure;
FIG. 2 is a flowchart of a wafer inspection method applied to a tank cleaning machine according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a corresponding relationship between a first feedback signal and a placement position of a wafer according to an embodiment of the disclosure;
fig. 4 is a schematic diagram illustrating a corresponding relationship between a second feedback signal and a placement position of a wafer according to an embodiment of the disclosure.
Detailed Description
The technical solutions in the present application will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and operate, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection can be mechanical connection or electrical connection; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, the technical features mentioned in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.
The embodiment of the application provides a wafer detection system applied to a groove type cleaning machine.
The optical fiber sensor and the sliding module are respectively connected with the processing host.
A mechanical arm is arranged above a cleaning tank of the tank type cleaning machine, a sliding module is arranged on the mechanical arm, and the mechanical arm is used for driving the wafer frame to move.
The optical fiber sensor is used for emitting detection signals to detect the optical fiber sensor on the wafer frame and sending feedback signals to the processing host.
The processing host is used for detecting whether the wafer on the wafer rack is abnormal after being cleaned according to the signal sent by the optical fiber sensor.
As shown in fig. 1, a support bar 11 is provided above the cleaning tank, a pulling device 12 is provided on the support bar 11, and both arms 13 of the robot arm are fixed to both sides of the pulling device 12.
The wafer rack 14 is used to place the wafer 15 to be cleaned, and several wafers 15 can be placed on one wafer rack 14.
The wafer to be cleaned is fixed below the robot arm by a wafer rack 15.
The puller 12 is driven by the support rod 11 to move left and right, the mechanical arm is lifted or lowered or translated by the puller 12, and the wafer frame 15 is driven by the mechanical arm to move.
The puller 12 is connected with a processing host machine, and a lifting or lowering instruction is sent to the puller through the processing host machine.
When cleaning the wafer, moving the wafer rack into the cleaning tank; and after the wafer is cleaned, the wafer frame is moved out of the cleaning tank.
As shown in fig. 1, the slide module includes a slide rail 17 and a slider 16, the slide rail 17 is disposed between the two arms 13 of the robot arm, and the slide rail 17 is located above the wafer rack 14.
The slide block 16 is movably fixed on the slide rail 17, and the slide block 16 is connected with the processing host.
Optionally, the slider is connected with the processing host through a signal line, and the optical fiber module is connected with the processing host through a signal line.
The optical fiber sensor is arranged on the sliding block 16, and the sliding block 16 drives the optical fiber sensor to move on the sliding rail 17.
When the wafer rack is placed in the cleaning tank, the slide rail is positioned above the cleaning tank.
Fig. 2 is a flowchart illustrating a wafer inspection method applied to a tank cleaning machine according to an embodiment of the present disclosure, where the method is applied to a wafer inspection system applied to a tank cleaning machine as illustrated in fig. 1, and the method at least includes the following steps:
in step 201, a wafer rack with wafers placed thereon is mounted on a robot.
Before the wafer is cleaned, the wafer to be cleaned is placed on a wafer rack, and then the wafer rack is fixed at the bottom of the mechanical arm.
Optionally, the spacing between wafers placed on the wafer shelves is predetermined.
In step 202, before the wafer is cleaned, the processing host controls the sliding module to drive the optical fiber sensor to move above the wafer rack, and the optical fiber sensor transmits a detection signal and generates a first feedback signal.
During the movement of the optical fiber sensor, the optical fiber sensor continuously emits a detection signal to scan the wafer on the wafer rack.
Before the wafers are cleaned, the positions of the wafers on the cleaning frame are fixed, the distance between the wafers is also fixed, the optical fiber sensor transmits detection signals to the wafers, the signals are changed in high and low levels under the shielding of the wafers, and the optical fiber sensor generates first feedback signals for indicating the changes in the high and low levels.
As shown in fig. 3, the first feedback signal 31 corresponds to the wafer placement position 32, where no wafer is placed corresponds to a high level, and where a wafer is placed corresponds to a low level.
In step 203, a first feedback signal is sent to the processing host through the fiber sensor.
In step 204, after the wafer is cleaned, when the wafer frame reaches a predetermined position above the cleaning tank, the processing host controls the sliding module to drive the optical fiber sensor to move above the wafer frame, and the optical fiber sensor transmits the detection signal and generates a second feedback signal.
After the wafer is cleaned in the cleaning tank, the wafer frame is moved out of the cleaning tank and moved to a preset position, the optical fiber sensor emits a detection signal, and the signal can have high and low level changes according to the placement position of the wafer.
After the wafer is cleaned in the cleaning tank, fragments may be dropped into the cleaning tank, or the wafer may be tilted, and the like, so that the second feedback signal detected and generated by the optical fiber sensor may not be consistent with the first feedback signal after the wafer is cleaned.
The second feedback signal is used to indicate a high-low level change.
In one example, after the wafer is cleaned, there are wafer fragments falling into the cleaning tank, and the corresponding relationship between the second feedback signal 33 generated by the optical fiber sensor and the placing position 34 of the wafer is shown in fig. 4.
In step 205, the second feedback signal is sent to the processing host through the fiber sensor.
The processing host receives a first feedback signal and a second feedback signal respectively.
In step 206, the processing host detects whether the wafer on the wafer rack is abnormal after being cleaned according to the first feedback signal and the second feedback signal.
The processing host detects whether the first feedback signal is consistent with the second feedback signal.
If the first feedback signal is consistent with the second feedback signal, determining that the wafer on the wafer frame is not abnormal;
and if the first feedback signal is detected to be inconsistent with the second feedback signal, determining that the wafer on the wafer rack is abnormal.
Taking the first feedback signal 31 in fig. 3 and the second feedback signal 33 in fig. 4 as an example, if the processing host detects that the first feedback signal 31 and the second feedback signal 33 are inconsistent, it is determined that the wafer on the wafer rack is abnormal.
Optionally, when the wafer on the wafer rack is detected to be abnormal, the groove type cleaning machine sends an alarm, the wafer rack is moved to the safety groove, and the groove entering process of subsequent products is stopped.
In summary, the wafer inspection method applied to the tank-type cleaning machine provided by the embodiment of the present application fixes the wafer rack on which the wafer is placed on the robot arm, before the wafer is cleaned, the sliding module is controlled by the processing host to drive the optical fiber sensor to move above the wafer frame, the optical fiber sensor emits a detection signal and generates a first feedback signal, the first feedback signal is sent to the processing host, after the wafer is cleaned and the wafer frame reaches a preset position above the cleaning tank, the processing host controls the sliding block module to drive the optical fiber sensor to move above the wafer frame, the optical fiber sensor transmits a detection signal and generates a second feedback signal, the second feedback signal is sent to the processing host, and the processing host detects whether the wafer on the wafer rack is abnormal after being cleaned according to the first feedback signal and the second feedback signal, so that the problem that the abnormal condition of the wafer cannot be detected in time after being cleaned by the cleaning tank at present is solved; the effect of effectively detecting the position and the fragment condition of the cleaned wafer is achieved.
In an alternative embodiment based on the embodiment shown in fig. 2, the sliding module includes a sliding rail and a sliding block, the sliding rail is disposed between two arms of the robot arm, the sliding rail is located above the wafer rack, the sliding block is movably fixed on the sliding rail, and the sliding block is connected with the processing host; the 'controlling the sliding module to drive the optical fiber sensor to move above the wafer rack by the processing host machine' can be realized by the following steps:
and S1, sending a first sliding instruction to the sliding block through the processing host, and driving the optical fiber sensor to move from the first end of the sliding rail to the second end of the sliding rail by the sliding block according to the first sliding instruction.
The sliding block moves from the first end of the sliding rail to the second end of the sliding rail according to the first sliding instruction, and the optical fiber sensor moves along with the movement of the sliding block.
In the process that the optical fiber sensor moves from the first end to the second end of the sliding rail, the optical fiber sensor emits continuous detection signals and generates feedback signals; the feedback signal is used for indicating the change of high and low levels, and the feedback signal is a level signal.
After the sliding block moves from the first end to the second end of the sliding rail, the sliding block can be controlled to move from the second end to the first end of the sliding rail, and the follow-up optical fiber sensor can conveniently scan the wafer on the wafer rack again. I.e. the method may further comprise the steps of:
and S2, sending a second sliding instruction to the sliding block through the processing host, and driving the optical fiber sensor to move from the second end of the sliding rail to the first end of the sliding rail by the sliding block according to the sliding instruction.
In an alternative embodiment based on the embodiment shown in fig. 2, after step 203, wafer cleaning is performed, and the wafer rack is lowered into the cleaning tank by a robot arm while cleaning the wafer.
Optionally, the cleaning solution in the cleaning tank is over the wafer on the wafer rack.
In an alternative embodiment based on the embodiment shown in fig. 2, before step 204, the wafer rack is moved by the robot from the cleaning tank to a predetermined position above the cleaning tank after the wafer cleaning is completed.
When the preset position is reached, the lifting device sends an arrival signal to the processing host, and the processing host sends an instruction to the sliding module according to the arrival signal to control the sliding module to move on the sliding rail.
In an alternative embodiment based on the embodiment shown in fig. 2, the first feedback signal and the second feedback signal are level signals.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of this invention are intended to be covered by the scope of the invention as expressed herein.
Claims (9)
1. A wafer detection system applied to a groove type cleaning machine is characterized by comprising an optical fiber sensor, a sliding module and a processing host;
the optical fiber sensor and the sliding module are respectively connected with the processing host;
the sliding module is arranged on a mechanical arm, and the mechanical arm is used for driving the wafer frame to move;
the optical fiber sensor is arranged on the sliding module, and the sliding module is used for driving the optical fiber sensor to move;
the processing host is used for detecting whether the wafer on the wafer rack is abnormal after being cleaned according to the signal sent by the optical fiber sensor;
the sliding module comprises a sliding rail and a sliding block;
the slide rail is arranged between the two arms of the mechanical arm and is positioned above the wafer rack;
the sliding block is movably fixed on the sliding rail and is connected with the processing host;
the optical fiber sensor is arranged on the sliding block.
2. A wafer detection method applied to a tank type cleaning machine is characterized by comprising the following steps:
fixing the wafer frame with the wafer on a mechanical arm;
before the wafer is cleaned, a sliding module is controlled by a processing host to drive an optical fiber sensor to move above the wafer rack, and the optical fiber sensor transmits a detection signal and generates a first feedback signal;
sending the first feedback signal to the processing host through the optical fiber sensor;
after the wafer is cleaned, when the wafer frame reaches a preset position above the cleaning groove, the sliding module is controlled by the processing host to drive the optical fiber sensor to move above the wafer frame, and the optical fiber sensor transmits a detection signal and generates a second feedback signal;
sending the second feedback signal to the processing host through the optical fiber sensor;
and detecting whether the wafer on the wafer rack is abnormal after being cleaned through the processing host according to the first feedback signal and the second feedback signal.
3. The method of claim 2, wherein the slide module comprises a slide rail and a slide block, the slide rail is disposed between two arms of the robot arm, the slide rail is located above the wafer rack, the slide block is movably fixed on the slide rail, and the slide block is connected to the processing mainframe;
through processing host computer control slip module drive optical fiber sensor and be in the top of wafer frame removes, include:
and sending a first sliding instruction to the sliding block through the processing host, wherein the sliding block drives the optical fiber sensor to move from the first end of the sliding rail to the second end of the sliding rail according to the first sliding instruction.
4. The method of claim 3, wherein the fiber optic sensor emits a detection signal comprising:
and in the process that the optical fiber sensor moves from the first end of the sliding rail to the second end of the sliding rail, the optical fiber sensor emits a detection signal.
5. The method of claim 3, further comprising:
and sending a second sliding instruction to the sliding block through the processing host, wherein the sliding block drives the optical fiber sensor to move from the second end of the sliding rail to the first end of the sliding rail according to the sliding instruction.
6. The method of claim 2, further comprising:
and when the wafer is cleaned, the wafer frame is lowered into the cleaning tank through the mechanical arm.
7. The method of claim 2, wherein after cleaning the wafer, the method further comprises:
and moving the wafer rack to a preset position above the cleaning tank through the mechanical arm.
8. The method of claim 2, wherein the detecting, by the processing mainframe, whether the wafer on the wafer rack is abnormal after being cleaned according to the first feedback signal and the second feedback signal comprises:
detecting, by the processing host, whether the first feedback signal and the second feedback signal are consistent;
if the first feedback signal is detected to be consistent with the second feedback signal, determining that the wafer on the wafer rack is not abnormal;
and if the first feedback signal is detected to be inconsistent with the second feedback signal, determining that the wafer on the wafer rack is abnormal.
9. The method of any of claims 2 to 8, wherein the first feedback signal and the second feedback signal are level signals.
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| CN202010650698.7A CN111785662B (en) | 2020-07-08 | 2020-07-08 | Wafer detection system and method applied to groove type cleaning machine |
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| CN202010650698.7A CN111785662B (en) | 2020-07-08 | 2020-07-08 | Wafer detection system and method applied to groove type cleaning machine |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359578A (en) * | 2007-08-05 | 2009-02-04 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning method and apparatus |
| CN110223944A (en) * | 2019-06-13 | 2019-09-10 | 长江存储科技有限责任公司 | Wafer cleaning bench and its method for cleaning wafer |
| CN110600404A (en) * | 2019-08-28 | 2019-12-20 | 福建省福联集成电路有限公司 | Equipment for detecting wafer placement condition |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359578A (en) * | 2007-08-05 | 2009-02-04 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning method and apparatus |
| CN110223944A (en) * | 2019-06-13 | 2019-09-10 | 长江存储科技有限责任公司 | Wafer cleaning bench and its method for cleaning wafer |
| CN110600404A (en) * | 2019-08-28 | 2019-12-20 | 福建省福联集成电路有限公司 | Equipment for detecting wafer placement condition |
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