CN212964736U

CN212964736U - Novel nitrogen oxide sensor chip heating unit is insulating device

Info

Publication number: CN212964736U
Application number: CN202021288153.8U
Authority: CN
Inventors: 谢光远; 尹亮亮; 邱电荣; 张宇明; 王晓宁
Original assignee: Zhenjiang Xinyuan Chengda Sensor Technology Co ltd
Current assignee: Xuzhou Xinyuan Chengda Sensor Technology Co.,Ltd.
Priority date: 2020-07-01
Filing date: 2020-07-01
Publication date: 2021-04-13
Anticipated expiration: 2030-07-01

Abstract

The utility model discloses a novel nitrogen oxide sensor chip heating unit insulating device, which comprises a heating unit and a signal unit, wherein the lower end of the heating unit is provided with the signal unit, the upper end of a casting sheet is provided with a first substrate, the lower end of the casting sheet is provided with a second substrate, the first substrate is connected with the second substrate through the casting sheet, an integral insulating layer of the casting sheet is added between the heating unit and the substrate sheet layer of the signal unit, thus the insulating effect same as the via hole insulation can be achieved, the process operation is simple, the size of the whole chip can be shortened, the chip length does not need to be prolonged, the ion conduction effect electric leakage of zirconium oxide is blocked by reducing the temperature of a pin end below the temperature, the chip structure is shortened, thus the assembly stress is reduced, the assembly rate is improved, radiating fins are filled in a radiating inner cavity, and the radiating fins are members made of silica gel materials, prevent the chip and the material from overheating, and enhance the heat dissipation of the chip.

Description

Novel nitrogen oxide sensor chip heating unit is insulating device

Technical Field

The utility model relates to a sensor chip technical field specifically is a novel nitrogen oxide sensor chip heating unit is insulating device.

Background

The oxynitride sensor is arranged in an exhaust system and mainly used for measuring the concentration of nitrogen and oxygen in an engine control and aftertreatment system, the oxynitride is formed by connecting a sensing unit and an electronic control unit through a cable, wherein the sensing unit is made of multilayer zirconia ceramics, an electrochemical pump of the sensing element adjusts and calibrates the concentration of oxygen in each cavity of the sensing element, signals are decomposed by applying current to the pump, and the signals are transmitted to a document of the electronic control unit of the engine through CANBUS, so that basic communication is established for assisting a customer and the oxynitride sensor is controlled.

The nitrogen oxide sensor chip mainly comprises a heating unit and a signal unit, wherein the heating unit is the basis and the condition for realizing the function of the signal unit, in the chip manufacturing process, the insulation treatment of the heating unit is one of the difficulties, the insulation treatment of the whole chip is realized by adopting a mode of combining upper insulation and lower insulation and via hole insulation, or the length of the chip is prolonged, the pin end realizes the effect equivalent to insulation due to the temperature lower than 300 ℃, but the via hole insulation can influence the flatness between components, the process operation difficulty can be increased by prolonging the length of the chip, and the assembly yield is influenced.

To the above problem, improve current device, provided a novel nitrogen oxide sensor chip heating unit insulating device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a, adopt this device to work to insulating poor problem in the above-mentioned background has been solved.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel nitrogen oxide sensor chip heating unit insulating device, includes heating unit and signal unit, and the lower extreme of heating unit is provided with signal unit, the heating unit includes first substrate and last electrode, and the electrode is installed to the upper end of first substrate, signal unit includes second substrate and bottom electrode, and the lower extreme of second substrate is provided with the bottom electrode, is provided with the curtain coating piece between first substrate and the second substrate.

Furthermore, the periphery of the upper electrode is provided with a moisture-proof sleeve A, the periphery of the lower electrode is provided with a moisture-proof sleeve B, and the moisture-proof sleeve A and the moisture-proof sleeve B are members made of epoxy resin materials.

Furthermore, a first substrate is arranged at the upper end of the casting sheet, a second substrate is arranged at the lower end of the casting sheet, and the first substrate is connected with the second substrate through the casting sheet.

Further, a heat dissipation inner cavity is formed in the casting sheet, and the size of the heat dissipation inner cavity is smaller than that of the casting sheet.

Furthermore, the radiating inner cavity is filled with radiating fins which are members made of silica gel materials.

Furthermore, the moisture-proof sleeve A is in a semi-surrounding shape, and the size of a hole formed in the upper surface of the moisture-proof sleeve A is smaller than that of the upper electrode.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model provides a novel nitrogen oxide sensor chip heating unit insulating device, the upper end of curtain coating piece is provided with first substrate, the lower extreme of curtain coating piece is provided with the second substrate, first substrate is connected with the second substrate through the curtain coating piece, add the whole insulating layer of one deck curtain coating piece between the substrate lamella of heating unit and signal unit, can play the insulating effect the same with the via hole insulation like this, and technology easy operation, the size of whole chip can be done short, the temperature that does not need to prolong chip length through reducing the pin end is below the degree and blocks the electrically conductive effect electric leakage of zirconia, thereby the chip structure is done short and is reduced assembly stress like this, the assembly rate of products has been improved.

2. The utility model provides a novel nitrogen oxide sensor chip heating unit insulating device, the heat dissipation inner chamber has been seted up to the inside of curtain coating piece, and the size of heat dissipation inner chamber is less than the size of curtain coating piece, fills the fin in the heat dissipation inner chamber, and the fin is the component that a silica gel material made, through the fin in the heat dissipation inner chamber, distributes away the heat that the chip produced at work, prevents that chip and material are overheated, strengthens the thermal diffusivity of chip.

3. The utility model provides a novel nitrogen oxide sensor chip heating unit insulating device, the last electrode install dampproofing cover A all around, the lower electrode install dampproofing cover B all around, dampproofing cover A and dampproofing cover B are the component that an epoxy material made, dampproofing cover A is half encirclement shape, the hole size that dampproofing cover A upper surface was seted up is less than the size of last electrode, epoxy has good moisture resistance to improve the moisture resistance of chip.

Drawings

FIG. 1 is a schematic structural view of the novel nitrogen oxide sensor chip heating unit insulation device of the present invention;

fig. 2 is a schematic plan view of the insulating device of the present invention;

FIG. 3 is a schematic view of the structure of the tape casting sheet of the present invention;

FIG. 4 is a cross-sectional view of the heat dissipation chamber of the present invention;

fig. 5 is a schematic view of the structure of the moisture-proof sleeve of the present invention.

In the figure: 1. a heating unit; 11. a first substrate; 111. tape casting; 1111. a heat dissipation inner cavity; 11111. a heat sink; 12. an upper electrode; 121. a moisture-proof sleeve A; 2. a signal unit; 21. a second substrate; 22. a lower electrode; 221. and a moisture-proof sleeve B.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a novel device for insulating a heating unit of a nox sensor chip comprises a heating unit 1 and a signal unit 2, wherein the signal unit 2 is disposed at the lower end of the heating unit 1, the heating unit 1 comprises a first substrate 11 and an upper electrode 12, the upper electrode 12 is mounted at the upper end of the first substrate 11, the signal unit 2 comprises a second substrate 21 and a lower electrode 22, the lower end of the second substrate 21 is provided with the lower electrode 22, a tape casting 111 is disposed between the first substrate 11 and the second substrate 21, and an integral insulating layer of the tape casting is disposed between the substrate layers of the heating unit and the signal unit, so that the same insulating effect as via hole insulation can be achieved, and the process operation is simple.

Referring to fig. 2 and 3, a moisture-proof sleeve a121 is installed around the upper electrode 12, a moisture-proof sleeve B221 is installed around the lower electrode 22, the moisture-proof sleeve a121 and the moisture-proof sleeve B221 are members made of an epoxy resin material, a first substrate 11 is disposed at an upper end of the casting sheet 111, a second substrate 21 is disposed at a lower end of the casting sheet 111, and the first substrate 11 is connected to the second substrate 21 through the casting sheet 111.

Referring to fig. 4 and 5, a heat dissipation inner cavity 1111 is formed in the casting sheet 111, the size of the heat dissipation inner cavity 1111 is smaller than that of the casting sheet 111, a heat dissipation sheet 11111 is filled in the heat dissipation inner cavity 1111, the heat dissipation sheet 11111 is a member made of a silica gel material, heat generated by the chip during operation is dissipated through the heat dissipation sheet in the heat dissipation inner cavity, the moisture-proof sleeve a121 is in a semi-surrounding shape, and the size of a hole formed in the upper surface of the moisture-proof sleeve a121 is smaller than that of the upper electrode 12.

In summary, the following steps: the novel nitrogen oxide sensor chip heating unit insulation device is characterized in that a first substrate 11 is arranged at the upper end of a casting sheet 111, a second substrate 21 is arranged at the lower end of the casting sheet 111, the first substrate 11 is connected with the second substrate 21 through the casting sheet 111, an integral insulation layer of the casting sheet is additionally arranged between the heating unit and a substrate sheet layer of a signal unit, so that the insulation effect same as via hole insulation can be achieved, the process operation is simple, the size of the whole chip can be shortened, the chip length does not need to be prolonged, the ion conduction effect electric leakage of zirconium oxide is blocked by reducing the temperature of a pin end to be below 300 ℃, the chip structure is shortened, so that the assembly stress is reduced, the assembly yield is improved, a heat dissipation inner cavity 1111 is formed in the casting sheet 111, the size of the heat dissipation inner cavity 1111 is smaller than that of the casting sheet 111, and heat dissipation fins 11111 are, heat dissipation fin 11111 is the component that a silica gel material made, heat dissipation fin through in the heat dissipation inner chamber, distribute away the heat that the chip produced in the work, prevent that chip and material are overheated, strengthen the thermal diffusivity of chip, go up electrode 12 install dampproofing cover A121 all around, dampproofing cover B221 is installed all around to bottom electrode 22, dampproofing cover A121 and dampproofing cover B221 are the component that an epoxy material made, dampproofing cover A121 is half encirclement shape, the hole size that dampproofing cover A121 upper surface was seted up is less than the size of last electrode 12, epoxy has good moisture resistance, thereby improve the moisture resistance of chip.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel nitrogen oxide sensor chip heating unit insulating device, includes heating unit (1) and signal unit (2), the lower extreme of heating unit (1) is provided with signal unit (2), its characterized in that: the heating unit (1) comprises a first substrate (11) and an upper electrode (12), wherein the upper electrode (12) is arranged at the upper end of the first substrate (11);

the signal unit (2) comprises a second substrate (21) and a lower electrode (22), the lower end of the second substrate (21) is provided with the lower electrode (22), and a casting sheet (111) is arranged between the first substrate (11) and the second substrate (21).

2. The novel nitrogen oxide sensor chip heating unit insulation device of claim 1, wherein: the improved solar cell is characterized in that a moisture-proof sleeve A (121) is arranged on the periphery of the upper electrode (12), a moisture-proof sleeve B (221) is arranged on the periphery of the lower electrode (22), and the moisture-proof sleeve A (121) and the moisture-proof sleeve B (221) are members made of epoxy resin materials.

3. The novel nitrogen oxide sensor chip heating unit insulation device of claim 1, wherein: the upper end of the casting sheet (111) is provided with a first substrate (11), the lower end of the casting sheet (111) is provided with a second substrate (21), and the first substrate (11) is connected with the second substrate (21) through the casting sheet (111).

4. The novel nitrogen oxide sensor chip heating unit insulation device of claim 1, wherein: the inside of casting tape (111) is seted up heat dissipation inner chamber (1111), and the size of heat dissipation inner chamber (1111) is less than the size of casting tape (111).

5. The novel nitrogen oxide sensor chip heating unit insulation device of claim 4, wherein: the radiating inner cavity (1111) is filled with radiating fins (11111), and the radiating fins (11111) are members made of silica gel materials.

6. The novel nitrogen oxide sensor chip heating unit insulation device of claim 2, wherein: the moisture-proof sleeve A (121) is in a semi-surrounding shape, and the size of a hole formed in the upper surface of the moisture-proof sleeve A (121) is smaller than that of the upper electrode (12).

7. The novel nitrogen oxide sensor chip heating unit insulation device of claim 1, wherein: the first substrate (11) is a member made of a zirconia material, and the second substrate (21) is a member made of a zirconia material.