CN212925158U - Brand-new 8-inch physical vapor deposition tantalum cavity simulation sheet accessory device - Google Patents
Brand-new 8-inch physical vapor deposition tantalum cavity simulation sheet accessory device Download PDFInfo
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- CN212925158U CN212925158U CN202021699828.8U CN202021699828U CN212925158U CN 212925158 U CN212925158 U CN 212925158U CN 202021699828 U CN202021699828 U CN 202021699828U CN 212925158 U CN212925158 U CN 212925158U
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Abstract
The utility model discloses a brand-new 8 inches physical vapor deposition tantalum cavity simulation piece accessory devices, include: the accessory body, accessory body middle part is hollow structure and is formed with the inner chamber, the outer wall of accessory body outwards is the arc protrusion, the bottom level of accessory body forms flat, a plurality of recess has been seted up on the flat bottom surface. The utility model discloses set up bulge loop and recess on the accessory body, improve the efficiency of heating, the accessory body can cover the surface of wafer heater completely, and the annex of reaction can not deposit the surface of wafer heater, prolongs the life of wafer heater, reduces use cost.
Description
Technical Field
The utility model relates to a vapor deposition tantalum cavity accessory technical field, more specifically are a brand-new 8 inches physical vapor deposition tantalum cavity simulation piece accessory device.
Background
The vapor deposition technology is a new technology which utilizes physical and chemical processes generated in vapor phase to change the surface composition of a workpiece and form a metal or compound coating with special properties (such as an ultra-hard wear-resistant layer or special optical and electrical properties) on the surface. The vapor deposition is usually performed by coating the surface of the workpiece with a layer of a compound of a transition group element (Ti, V, Cr, Zr, Mo, Ta, Nb, Hf) with carbon, nitrogen, oxygen and boron to a thickness of about 0.5-10 μm. Vapor deposition can be classified into two broad categories, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD), according to the nature of the process. Vapor deposition is one of new techniques for strengthening the surface of a mold, and is widely applied to surface hardening treatment of various molds, and the deposition layer mainly applied is TiC and TiN.
At present, the existing fitting part of the physical vapor deposition tantalum cavity simulation sheet has the following problems: the small area does not completely cover the wafer heater, resulting in reactive attachments being deposited on the surface of the wafer heater, thereby affecting the life of the heater. For this reason, a new scheme needs to be designed to give improvements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a brand-new 8 inches physical vapor deposition tantalum cavity simulation piece accessory devices has solved the problem that proposes in the background art, satisfies the in-service use demand.
In order to achieve the above object, the utility model provides a following technical scheme: a novel 8 inch physical vapor deposition tantalum chamber simulation piece accessory device, comprising: the accessory body, accessory body middle part is hollow structure and is formed with the inner chamber, the outer wall of accessory body outwards is the arc protrusion, the bottom level of accessory body forms flat, a plurality of recess has been seted up on the flat bottom surface.
As an optimized embodiment of the present invention, the groove is of an annular structure, and the diameter of the groove gradually increases from the middle of the flat bottom to both sides.
As an optimal implementation manner of the present invention, the fitting body is provided with a protruding ring, and the protruding ring and the groove are all integrally formed with the fitting body.
As a preferred embodiment of the present invention, the diameter of the fitting body is 203 mm.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses, set up bulge loop and recess on the accessory body, improve the efficiency of heating, the accessory body can cover the surface of wafer heater completely, and the annex of reaction can not deposit the surface of wafer heater, prolongs the life of wafer heater, reduce cost.
Drawings
FIG. 1 is a schematic diagram of a novel 8-inch PVD tantalum chamber simulation piece fitting device according to the present invention;
FIG. 2 is a bottom view of a novel 8-inch PVD tantalum chamber simulation piece fitting apparatus of the present invention;
FIG. 3 is a side view of a novel 8-inch PVD tantalum chamber simulation piece fitting apparatus of the present invention;
fig. 4 is a top view of the new 8-inch physical vapor deposition tantalum chamber simulation piece fitting device of the present invention.
In the figure, a fitting body 1; a groove 2; a convex ring 3; an inner cavity 4; a flat bottom 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a novel 8 inch physical vapor deposition tantalum chamber simulation piece accessory device, comprising: the accessory comprises an accessory body 1, the middle part of the accessory body 1 is of a hollow structure and is formed with an inner cavity 4, the outer wall of the accessory body 1 outwards protrudes in an arc shape, the bottom level of the accessory body 1 forms a flat bottom 5, a plurality of grooves 2 are formed in the flat bottom 5, the grooves 2 have a certain heat gathering effect, and the heating efficiency is improved.
Further improved, as shown in fig. 1: the grooves 2 are of annular structures, and the diameters of the grooves 2 are gradually increased from the middle of the flat bottom 5 to two sides.
Further improved, as shown in fig. 1: be provided with bulge loop 3 on the accessory body 1, bulge loop 3 and recess 2 all with accessory body 1 integrated into one piece, integrated into one piece is convenient for process.
Specifically, the fitting body 1 has a diameter of 203 mm.
The utility model discloses when using, place accessory body 1 on wafer heater, heat after accessory body 1 and the wafer heater connection to can cover wafer heater's surface completely, the annex of reaction can not deposit wafer heater's surface, prolongs wafer heater's life, reduce cost.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A novel 8 inch physical vapor deposition tantalum chamber simulation piece accessory device, comprising: accessory body (1), its characterized in that: the accessory is characterized in that the middle of the accessory body (1) is of a hollow structure and is provided with an inner cavity (4), the outer wall of the accessory body (1) outwards protrudes in an arc shape, the bottom of the accessory body (1) horizontally forms a flat bottom (5), and a plurality of grooves (2) are formed in the surface of the flat bottom (5).
2. The novel 8-inch physical vapor deposition tantalum chamber simulation piece accessory device according to claim 1, wherein: the grooves (2) are of annular structures, and the diameters of the grooves (2) are gradually increased from the middle of the flat bottom (5) to two sides.
3. The novel 8-inch physical vapor deposition tantalum chamber simulation piece accessory device according to claim 1, wherein: the accessory is characterized in that a convex ring (3) is arranged on the accessory body (1), and the convex ring (3) and the groove (2) are integrally formed with the accessory body (1).
4. The novel 8-inch physical vapor deposition tantalum chamber simulation piece accessory device according to claim 1, wherein: the diameter of the accessory body (1) is 203 mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021699828.8U CN212925158U (en) | 2020-08-15 | 2020-08-15 | Brand-new 8-inch physical vapor deposition tantalum cavity simulation sheet accessory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021699828.8U CN212925158U (en) | 2020-08-15 | 2020-08-15 | Brand-new 8-inch physical vapor deposition tantalum cavity simulation sheet accessory device |
Publications (1)
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CN212925158U true CN212925158U (en) | 2021-04-09 |
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CN202021699828.8U Active CN212925158U (en) | 2020-08-15 | 2020-08-15 | Brand-new 8-inch physical vapor deposition tantalum cavity simulation sheet accessory device |
Country Status (1)
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CN (1) | CN212925158U (en) |
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2020
- 2020-08-15 CN CN202021699828.8U patent/CN212925158U/en active Active
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