CN212916613U

CN212916613U - MWT laser drilling interval precision measuring device

Info

Publication number: CN212916613U
Application number: CN202020324650.2U
Authority: CN
Inventors: 裴善水; 商其华; 孙明亮; 吴仕梁; 张凤鸣
Original assignee: Jiangsu Sunport Power Corp Ltd
Current assignee: Jiangsu Sunport Power Corp Ltd
Priority date: 2020-03-16
Filing date: 2020-03-16
Publication date: 2021-04-09
Anticipated expiration: 2030-03-16

Abstract

The utility model discloses a precision measuring device for MWT laser drilling interval, which comprises a frame, a belt and an area array camera, wherein the frame comprises a top part, a middle part and a bottom part from top to bottom, the bottom part is provided with the belt, and the belt is used for carrying a drilled silicon wafer; and the belt stops conveying the silicon wafer carrying the punched holes to the position right below the area array camera. The measuring device can effectively detect the defective silicon wafer after laser drilling, thereby realizing the identification of the silicon wafer without the drilled wafer, the drilled position deviation and the drilled interval exceeding the error range, and improving the precision of subsequent processing.

Description

MWT laser drilling interval precision measuring device

Technical Field

The utility model belongs to the technical field of novel MWT solar cell production facility technique and specifically relates to a MWT laser beam drilling interval precision measurement device.

Background

Nowadays, the photovoltaic industry is developing at a high speed, high-efficiency solar cell modules are receiving more and more attention, wherein an mwt (metal Wrap through) metal perforated winding cell is one of the main representatives of back contact solar cells, and because the front surface of the cell has no metal main grid lines, the front shading loss of the metal grid lines is effectively reduced, the utilization rate of incident light is improved, and the purpose of improving the photoelectric conversion efficiency of products is achieved.

At the beginning of the MWT cell fabrication process, first, 36 holes are laser drilled in the surface of the silicon wafer, and the silicon wafer is irradiated with a laser beam of high power density to ablate the silicon wafer and make the holes. The phenomenon that all or part of existing laser equipment does not punch, punch offset and the punching interval exceeds the error range can appear in the punching process, if the phenomenon is not found in time, the existing laser equipment can continue to produce along with the production line to the rear section, and even enters a component factory to be made into a component finished product to be sold and suffer customer complaints, so that great negative effects are caused. Therefore, the MWT punching space precision detection device is integrated at the blanking end of the laser punching equipment, and the defective pieces can be timely and effectively detected and removed.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem in the above-mentioned background art, the utility model aims at providing a MWT laser drilling interval precision measurement device can detect the bad silicon chip after laser drilling effectively through this measuring device to the realization is discerned the silicon chip that the piece of not punching, the skew of punching and the interval of punching surpass error range, improves the precision of follow-up processing.

The MWT laser punching interval precision measuring device comprises a frame, a belt and an area array camera, wherein the frame comprises a top part, a middle part and a bottom part from top to bottom, the bottom part is provided with the belt, and the belt is used for carrying a punched silicon wafer; and the top of the belt is provided with an area array camera, and the belt stops when the punched silicon wafer is conveyed to the position right below the area array camera.

Furthermore, a capacitance induction sensor is arranged in the middle of the frame and used for detecting the position of the punched silicon wafer.

Furthermore, the area-array camera is connected with an industrial personal computer, and the capacitance induction sensor is also connected with the industrial personal computer; the area-array camera is also connected to an external display device.

Furthermore, the middle part of the frame is provided with a manipulator, and the manipulator is connected with an industrial personal computer and used for receiving a control instruction and grabbing and moving unqualified punched silicon wafers into the TRASH box.

Preferably, the position of the middle part of the frame, where the punched silicon wafer stops, is the photographing position of the punched silicon wafer, and the photographing position is provided with a bowl light device which is installed outside the punched silicon wafer and used for providing a bowl light or large area light effect during photographing.

The utility model can effectively improve the yield of products, realize the identification of the silicon wafers with non-punched sheets, punching position deviation and punching intervals exceeding the error range, and detect and remove the non-punched sheets and the unqualified sheets with poor precision and the like from the source; further, based on this device, can sort out the silicon chip that does not effectively punch, in the unified stack box that picks up these unqualified silicon chips, can improve the machining efficiency of solar energy silicon chip, can effectively promote photovoltaic industry to realize the advantage and the disadvantage, promote photovoltaic industry to continue constantly developing forward when providing high-quality reliable product for the society.

Drawings

FIG. 1 and FIG. 2 are schematic diagrams of an MWT laser drilling pitch precision measuring device;

FIG. 3 is a sampling diagram of qualified perforated silicon wafer samples;

in the figure, 1-frame, 2-belt, 3-area-array camera and 4-bowl light device.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings:

the MWT laser drilling interval precision measuring device comprises a frame 1, a belt 2 and an area array camera 3, wherein the frame 1 comprises a top part, a middle part and a bottom part from top to bottom, the bottom part is provided with the belt 2, and the belt 2 is used for carrying a drilled silicon wafer; the top is provided with an area array camera 3, and the belt 2 stops when transmitting the punched silicon wafer to the position right below the area array camera 3.

Furthermore, a capacitance induction sensor is arranged in the middle of the frame 1 and used for detecting the position of the punched silicon wafer.

Further, the area-array camera 3 is connected with an industrial personal computer, and the capacitance induction sensor is also connected with the industrial personal computer; the area-array camera 3 is also connected to an external display device.

Furthermore, a manipulator is arranged in the middle of the frame 1, and the manipulator is connected with an industrial personal computer and used for receiving a control instruction and grabbing and moving unqualified punched silicon wafers into the TRASH box.

Preferably, the position of the middle part of the frame 1 where the punched silicon wafer stops is the photographing position of the punched silicon wafer, the photographing position is provided with a bowl light device 4, and the bowl light device 4 is installed outside the punched silicon wafer and used for providing a bowl light or large area light effect during photographing.

As shown in fig. 1 and 2, the MWT laser drilling pitch precision measuring device system is composed of an industrial personal computer, a display, a detection module and the like. The detection module, namely the precision measurement device, is a core component. When the conveying platform sends the punched silicon wafer to be detected to the detection module, the area array camera 3 performs imaging identification to read data and sends the data to the industrial personal computer for data analysis, and the strip light makes the silicon wafer image clearer and easier to distinguish. And comparing and analyzing the obtained image data with the data meeting the process requirements, continuously and normally outputting the silicon wafers meeting the process requirements, and detecting unqualified wafers and removing the unqualified wafers by a manipulator.

After the silicon chip that punches is carried through belt 2 and is punched interval precision measuring device, capacitive sensing sensor detects that silicon chip load has arrived the measuring position, sends an electrical signal immediately and gives the PLC in the control box, and through the butt joint signal, the unloading is automatic can let conveyor belt 2 motor pause voluntarily, and the silicon chip also stops thereupon. Meanwhile, the camera takes pictures to capture the collected data of the pictures, and the results are presented on the display through computer operation. If the punching distance meets the requirement of a set value, the silicon wafer is detected to automatically continue to move forwards; and if the distance deviation is too large and exceeds the standard, the mechanical arm acts to grab the defective silicon wafer into the TRASH box.

By the method, the defective punched battery pieces can be completely removed, so that the battery pieces cannot flow to the next procedure, each subsequent procedure including the quality of the battery pieces of the assembly is guaranteed to a certain extent, and the reject ratio of the assembly can be effectively reduced.

The punching distance precision measuring device is a core component of the whole system, in the embodiment, the single-track or double-track mode can be adopted according to the difference of the number of the machine table guide rails, the shooting and sampling of images are mainly completed, the integrity and the definition of the images directly influence the operation result of the industrial personal computer, and therefore auxiliary facilities such as a light source are added.

In order to make the photographing effect better and clearer, the middle part of the frame 1 is the photographing position of the punched silicon wafer, the photographing position is provided with the bowl light device 4, and the bowl light device 4 is installed outside the punched silicon wafer and used for providing bowl light or large-area light effect during photographing.

FIG. 3 is a sample drawing of a perforated silicon wafer, wherein the relative measurement sizes of the holes and the holes can be clearly seen, according to the figure, the vertical distance between the holes is 27.00mm, the vertical distance between the holes and the edges is 13.80mm, the error of each distance is required to be within 200um, otherwise, the wafer belongs to a defective wafer. According to the graph, the measured values are within the error range, so that the measured values are qualified pieces.

The hole-to-hole vertical distance should be 27.00mm, with actual values of 26.72 and 27.58 mm; the vertical distance between the hole-edge was 13.80mm, the actual value was 13.28mm, and both the line and the value showed red. And correspondingly outputting a signal to the mechanical arm by the measuring device corresponding to the silicon wafer beyond the error range, and enabling the mechanical arm to act to suck the silicon wafer with the bad pitch and place the silicon wafer into the fish slide box.

It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

The MWT laser drilling interval precision measuring device is characterized by comprising a frame, a belt and an area array camera, wherein the frame comprises a top part, a middle part and a bottom part from top to bottom, the bottom part is provided with the belt, and the belt is used for carrying a drilled silicon wafer; and the top of the belt is provided with an area array camera, and the belt stops when the punched silicon wafer is conveyed to the position right below the area array camera.
2. The apparatus of claim 1, wherein a capacitive sensor is disposed in the middle of the frame, and the capacitive sensor is used to detect the position of the punched silicon wafer.
3. The apparatus for measuring MWT laser drilling pitch accuracy, according to claim 2, wherein the area array camera is connected to an industrial personal computer, and the capacitive sensing sensor is also connected to the industrial personal computer;

the area-array camera is also connected to an external display device.
4. The apparatus of claim 1, wherein a manipulator is disposed in the middle of the frame, and the manipulator is connected to an industrial personal computer and is configured to receive a control command and move the unqualified perforated silicon wafer into a TRASH box.
5. The MWT laser drilling interval precision measuring device of any one of claims 1 to 4, wherein in the middle of the frame, the position where the drilled silicon wafer stops is a shooting position of the drilled silicon wafer, and a bowl light device is arranged at the shooting position and is installed outside the drilled silicon wafer and used for providing a bowl light or a large area light effect during shooting.