CN212851542U - Air-cooled heat dissipation system for high-power-consumption card-inserting type instrument module - Google Patents
Air-cooled heat dissipation system for high-power-consumption card-inserting type instrument module Download PDFInfo
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- CN212851542U CN212851542U CN202021763964.9U CN202021763964U CN212851542U CN 212851542 U CN212851542 U CN 212851542U CN 202021763964 U CN202021763964 U CN 202021763964U CN 212851542 U CN212851542 U CN 212851542U
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Abstract
The utility model discloses an air cooling heat dissipation system for a high-power-consumption card-inserting type instrument module, which comprises an instrument substrate and a plurality of main boards which are sequentially arranged along the length direction of the instrument substrate; a heat radiation fan is arranged on one side of the instrument substrate in the length direction; each mainboard is correspondingly provided with a heat dissipation substrate which is arranged in parallel with the mainboard, the heat dissipation substrate is provided with heat dissipation fins which are perpendicular to the heat dissipation substrate and are arranged at equal intervals, the same heat dissipation substrate is provided with heat dissipation fins with different lengths corresponding to a chip arrangement area and a non-chip arrangement area, and the heat dissipation fins are arranged along the wind direction of the heat dissipation fan; the length of the radiating fins of the radiating substrate chip arrangement area close to the radiating fan is smaller than that of the non-chip arrangement area, and the length of the radiating fins of the radiating substrate chip arrangement area far away from the radiating fan is larger than that of the non-chip arrangement area. The air-cooled heat dissipation system of the utility model has good heat dissipation effect, low cost and small noise; the heat dissipation device is simple in overall structure, low in cost, balanced in heat dissipation of all areas, good in heat dissipation uniformity and good in application prospect.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit automatic test machine, a forced air cooling system for high-power consumption plug-in card formula instrument module is related to, in particular to integrated circuit automatic test machine surveys forced air cooling system of board.
Background
An Automatic Test machine (Automatic Test Equipment) for Integrated Circuits (ICs) in the semiconductor industry is used to detect the functional integrity of the ICs and is the final process of the IC production to ensure the quality of the IC production.
An automatic integrated circuit tester usually needs a matching board card (test board), and because a large number of high-power chips are carried on the test board (i.e. a high-power card-insertion type instrument module test board), the power of the test board is large in the operation process, so that the test board generally needs to be cooled in the operation process so as to prevent the board card from being damaged. The key position scheme which is common in the market at present is as follows: (1) although the cooling effect of the water cooling system is good, the water cooling system has high requirements on the use environment, a cooling water circulation system needs to be additionally arranged in a factory, and the operation cost and the maintenance cost are too high; (2) the air cooling system has low cost, but generally the air cooling system is more and more difficult to meet the use requirement, although the heat dissipation effect can be enhanced by increasing the number of the heat dissipation fans, the cost, the power consumption, the noise and the system fault are greatly increased, and in addition, the temperature rise values of different areas on the module are greatly different, which causes that the circuit characteristics are not consistent.
Therefore, the development of the heat dissipation system of the high-power-consumption card-inserting type instrument module which is low in cost and can realize balanced heat dissipation of all areas of the module has practical significance.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art with too high costs, too big and unable each regional balanced radiating defect of realization module of noise, provide a low cost and can realize the radiating cooling system of each regional balanced big consumption plug-in card formula instrument module of module.
In order to achieve the above object, the utility model provides a following technical scheme:
an air-cooled heat dissipation system for a high-power-consumption card-inserting type instrument module comprises an instrument substrate and a plurality of main boards which are sequentially arranged along the length direction of the instrument substrate;
a cooling fan is arranged on one side of the instrument substrate in the length direction;
each mainboard is correspondingly provided with a heat dissipation substrate which is arranged in parallel with the mainboard, the heat dissipation substrate is provided with heat dissipation fins which are perpendicular to the heat dissipation substrate and are arranged at equal intervals, the same heat dissipation substrate is provided with heat dissipation fins with different lengths corresponding to a chip arrangement area and a non-chip arrangement area, and the heat dissipation fins are arranged along the wind direction of the heat dissipation fan;
the length of the radiating fins of the radiating substrate chip arrangement area close to the radiating fan is smaller than that of the non-chip arrangement area, and the length of the radiating fins of the radiating substrate chip arrangement area far away from the radiating fan is larger than that of the non-chip arrangement area. The section of the radiating fin on the same radiating substrate is L-shaped, and the radiating fin arranged in the non-chip arrangement area can assist in radiating.
The arrangement of the radiating fins can increase the radiating area, and the radiating fins are matched with the radiating fan to solve the radiating problem and the noise problem. Meanwhile, for the stability of circuit characteristics, the temperature difference of each mainboard is avoided to be too large, the air volume obtained by the radiating substrate close to the radiating fan is larger, the temperature drop effect is better, the temperature of each mainboard is relatively consistent, the length of radiating fins of a radiating substrate chip arrangement area (heating area) close to the radiating fan is reduced, the air volume obtained by the radiating substrate chip arrangement area (heating area) far away from the radiating fan is larger, the length of the radiating fins of the radiating substrate chip arrangement area far away from the radiating fan is prolonged, the radiating area is increased, and the radiating effect is enhanced.
The utility model discloses an air-cooled cooling system for big consumption plug-in card formula instrument module has avoided the defect that prior art radiating effect is poor, with high costs, the noise is too big through radiating basal plate, fin and air-cooled cooperation on the one hand, and on the other hand designs the fin alone to each mainboard design, and then realizes each regional balanced heat dissipation, and its overall structure is simple, low cost, and the radiating effect is good and the heat dissipation homogeneity is good, has application prospect.
As a preferred technical scheme:
according to the air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module, all the mainboards are connected with the same instrument substrate;
the mainboard is connected with a mainboard interface slot arranged on the instrument substrate through a mainboard interface.
The air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module comprises four main boards, specifically a main board A, a main board B, a main board C and a main board D which are sequentially arranged along the direction of heat dissipation wind. The utility model discloses a protection scope is not limited to this only, and the here only uses four mainboards as the example, in practical application the utility model discloses a scheme is applicable in the big power consumption card-inserting type instrument module who contains the mainboard of different quantity.
The air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module is characterized in that the heat dissipation substrate and the heat dissipation fins connected with the heat dissipation substrate are a set of mainboard heat dissipation module;
there are two types of motherboard heat dissipation modules, i.e., a motherboard heat dissipation module I corresponding to the motherboard a and the motherboard B, and a motherboard heat dissipation module II corresponding to the motherboard C and the motherboard D. The utility model discloses a protection scope is not only limited to here, and only use this as an example here, the utility model discloses a simplify the design, reduce cost divides into two types with mainboard heat dissipation module, and the technical personnel in the field also can design mainboard heat dissipation module alone according to every mainboard in practical application.
According to the air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module, the mainboard heat dissipation module I is divided into a D1 area corresponding to the chip arrangement area and a D2 area corresponding to the non-chip arrangement area along the width direction of the instrument substrate;
the fin height of the D1 area is lower than the fin height of the D2 area.
According to the air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module, the mainboard heat dissipation module II is divided into a D3 area corresponding to the chip arrangement area and a D4 area corresponding to the non-chip arrangement area along the width direction of the instrument substrate;
the fin height of the D3 area is higher than the fin height of the D4 area.
According to the air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module, the chips are arranged on the same side of the mainboard;
the D1 region is the same as the D3 region in length and corresponding in position; the D2 region is the same length and corresponds in position to the D4 region.
The air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module is characterized in that the height of the heat dissipation fins in the D1 area is lower than that of the heat dissipation fins in the D3 area;
the fin height in the D2 region is higher than the fin height in the D4 region, and generally, the fin height in the D1 region is equivalent to the fin height in the D4 region, and the fin height in the D2 region is equivalent to the fin height in the D3 region. The heat dissipation section on the mainboard heat dissipation module I is L-shaped, then the heat dissipation section on the mainboard heat dissipation module II is "shaped, the heat dissipation height of the mainboard heat dissipation module I chip arrangement area is lower, the influence on wind is smaller, the heat dissipation area is smaller, but the heat dissipation height of the non-chip arrangement area is higher, the influence on wind is larger, the heat dissipation effect is better, the air volume obtained by the mainboard heat dissipation module II chip arrangement area is larger than that of the non-chip arrangement area, meanwhile, the heat dissipation height of the chip arrangement area is higher (the air volume is large simultaneously), the heat dissipation area is larger, the heat dissipation effect is better, the heat dissipation height of the non-chip arrangement area is lower (the air volume is small simultaneously), the heat dissipation effect is more general, the whole heat dissipation effect comparing the mainboard heat dissipation module I and the mainboard heat dissipation module II can be found, the heat dissipation.
According to the air-cooled heat dissipation system for the high-power-consumption card-inserting type instrument module, the heat dissipation substrate is connected with the mainboard through the connecting piece;
one side of mainboard heat dissipation module still is equipped with the L shape connecting plate with mainboard fixed connection, L shape connecting plate includes mutually perpendicular and the horizontal connection board and the perpendicular connecting plate of connecting, and wherein the horizontal connection board is connected with the non-chip of mainboard heat dissipation module and arranges the fin in district, and perpendicular connecting plate is connected with mainboard vertically. L shape connecting plate can regard as the handle on the one hand, makes things convenient for operating personnel dismouting mainboard heat dissipation module, and on the other hand, its weight that can balance heat dissipation base plate, fin one side avoids taking place the unstable problem of structure.
Has the advantages that:
(1) the utility model discloses an air-cooled heat dissipation system for high-power-consumption card-inserting type instrument module, through the cooperation of radiating basal plate, fin and air-cooled, avoided the defect that prior art radiating effect is poor, the cost is too high, the noise is too big;
(2) the utility model discloses an air-cooled cooling system for big consumption plug-in card formula instrument module designs fin (crisscross L shape structure) alone to each mainboard design, and then realizes each regional balanced heat dissipation, and its overall structure is simple, low cost, and the radiating effect is good and the heat dissipation homogeneity is good, has application prospect.
Drawings
Fig. 1 is a schematic structural view of an air cooling system for a high-power card-insertion type instrument module according to the present invention;
FIG. 2 is a schematic cross-sectional view of a motherboard A or B;
FIG. 3 is a schematic cross-sectional view of a motherboard C or D;
the device comprises an instrument substrate 1, a heat dissipation fan 2, a mainboard 3, a heat dissipation substrate 4, a heat dissipation sheet 5, an L-shaped connecting plate 6, a horizontal connecting plate 61, a vertical connecting plate 62, a chip 7, a connecting piece 8 and a mainboard interface 9.
Detailed Description
The following describes the present invention with reference to the accompanying drawings.
An air-cooled heat dissipation system for a high-power-consumption card-inserting type instrument module is shown in fig. 1-3 and comprises an instrument substrate 1 and four main boards 3 (specifically, a main board A, a main board B, a main board C and a main board D which are sequentially arranged along the heat dissipation air direction) which are sequentially arranged along the length direction of the instrument substrate 1;
all the main boards 3 are connected with the same instrument substrate 1;
the mainboard 3 is connected with a mainboard interface slot arranged on the instrument substrate 1 through a mainboard interface 9;
a heat radiation fan 2 is arranged on one side of the instrument substrate 1 in the length direction;
each mainboard 3 is correspondingly provided with a heat dissipation substrate 4 arranged in parallel with the mainboard (the heat dissipation substrate 4 is connected with the mainboard 3 through a connecting piece 8), the heat dissipation substrate 4 is provided with heat dissipation fins 5 which are perpendicular to the heat dissipation substrate 3 and are arranged at equal intervals, the same heat dissipation substrate 4 is provided with heat dissipation fins 5 with different lengths corresponding to a chip 7 arrangement area and a non-chip arrangement area, and the heat dissipation fins 5 are arranged along the wind direction of the heat dissipation fan 1;
the heat dissipation substrate 4 and the heat dissipation fins 5 connected with the heat dissipation substrate are a set of mainboard heat dissipation modules, and the two types of mainboard heat dissipation modules are a mainboard heat dissipation module I corresponding to the mainboard A and the mainboard B and a mainboard heat dissipation module II corresponding to the mainboard C and the mainboard D respectively;
the main board heat dissipation module I (corresponding to fig. 2) is divided into a D1 region corresponding to the chip arrangement region (heat generation region) and a D2 region corresponding to the non-chip arrangement region along the width direction of the instrument substrate 1, and the height of the heat sink in the D1 region is lower than that in the D2 region;
the mainboard heat dissipation module II (corresponding to FIG. 3) is divided into a D3 area corresponding to the chip arrangement area (heat generation area) and a D4 area corresponding to the non-chip arrangement area along the width direction of the instrument substrate 1, and the height of the heat sink in the D3 area is higher than that in the D4 area;
the chip 7 is arranged on the same side of the main board 3;
the D1 region is the same as the D3 region in length and corresponding in position; the D2 region is the same as the D4 region in length and corresponding in position; the fin height in the D1 region is lower than the fin height in the D3 region, and the fin height in the D2 region is higher than the fin height in the D4 region (the fin height in the D1 region is equivalent to the fin height in the D4 region, and the fin height in the D2 region is equivalent to the fin height in the D3 region);
one side of the mainboard heat dissipation module is further provided with an L-shaped connecting plate 6 fixedly connected with the mainboard 3, the L-shaped connecting plate 6 comprises a horizontal connecting plate 61 and a vertical connecting plate 62 which are perpendicular to each other and connected, wherein the horizontal connecting plate 61 is connected with the radiating fins 5 in the non-chip arrangement area of the mainboard heat dissipation module, and the vertical connecting plate 62 is perpendicular to the mainboard 3.
Through verification, the air cooling heat dissipation system for the high-power-consumption card-inserting type instrument module of the utility model avoids the defects of poor heat dissipation effect, high cost and overlarge noise in the prior art through the matching of the heat dissipation substrate, the heat dissipation fins and air cooling; the radiating fins (crossed L-shaped structures) are designed independently for each mainboard, so that balanced heat dissipation of each area is realized, the integral structure is simple, the cost is low, the heat dissipation effect is good, the heat dissipation uniformity is good, and the application prospect is wide.
Although specific embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these embodiments are merely illustrative and various changes or modifications may be made without departing from the spirit and scope of the invention.
Claims (9)
1. An air-cooled heat dissipation system for a high-power-consumption card-inserting type instrument module is characterized by comprising an instrument substrate and a plurality of main boards which are sequentially arranged along the length direction of the instrument substrate;
a cooling fan is arranged on one side of the instrument substrate in the length direction;
each mainboard is correspondingly provided with a heat dissipation substrate which is arranged in parallel with the mainboard, the heat dissipation substrate is provided with heat dissipation fins which are perpendicular to the heat dissipation substrate and are arranged at equal intervals, the same heat dissipation substrate is provided with heat dissipation fins with different lengths corresponding to a chip arrangement area and a non-chip arrangement area, and the heat dissipation fins are arranged along the wind direction of the heat dissipation fan;
the length of the radiating fins of the radiating substrate chip arrangement area close to the radiating fan is smaller than that of the non-chip arrangement area, and the length of the radiating fins of the radiating substrate chip arrangement area far away from the radiating fan is larger than that of the non-chip arrangement area.
2. The air-cooled heat dissipation system for the high-power card-inserted instrument module as claimed in claim 1, wherein all the motherboards are connected to the same instrument substrate;
the mainboard is connected with a mainboard interface slot arranged on the instrument substrate through a mainboard interface.
3. The air-cooled heat dissipation system for the high-power-consumption card-inserted instrument module as claimed in claim 1, wherein there are four main boards, specifically, a main board a, a main board B, a main board C and a main board D, which are sequentially arranged along a heat dissipation air direction.
4. The air-cooled heat dissipation system for the high-power-consumption card-inserted instrument module as claimed in claim 3, wherein the heat dissipation substrate and the heat dissipation fins connected with the heat dissipation substrate are a set of motherboard heat dissipation modules;
there are two types of motherboard heat dissipation modules, i.e., a motherboard heat dissipation module I corresponding to the motherboard a and the motherboard B, and a motherboard heat dissipation module II corresponding to the motherboard C and the motherboard D.
5. The air-cooled heat dissipation system for the high-power card-inserting type instrument module as claimed in claim 4, wherein the motherboard heat dissipation module I is divided into a D1 region corresponding to the chip arrangement region and a D2 region corresponding to the non-chip arrangement region in the width direction of the instrument substrate;
the fin height of the D1 area is lower than the fin height of the D2 area.
6. The air-cooled heat dissipation system for the high-power card-inserted instrument module as claimed in claim 5, wherein the motherboard heat dissipation module II is divided into a D3 region corresponding to the chip arrangement region and a D4 region corresponding to the non-chip arrangement region in the width direction of the instrument substrate;
the fin height of the D3 area is higher than the fin height of the D4 area.
7. The air-cooled heat dissipation system for the high-power-consumption card-inserted instrument module as claimed in claim 6, wherein the chips are arranged on the same side of the motherboard;
the D1 region is the same as the D3 region in length and corresponding in position; the D2 region is the same length and corresponds in position to the D4 region.
8. The air-cooled heat dissipation system for high-power card-inserted instrument modules as claimed in claim 7, wherein the height of the heat sink in the region D1 is lower than the height of the heat sink in the region D3;
the fin height of the D2 area is higher than the fin height of the D4 area.
9. The air-cooled heat dissipation system for the high-power card-inserted instrument module as claimed in claim 8, wherein the heat dissipation substrate is connected with the main board through a connecting member;
one side of mainboard heat dissipation module still is equipped with the L shape connecting plate with mainboard fixed connection, L shape connecting plate includes mutually perpendicular and the horizontal connection board and the perpendicular connecting plate of connecting, and wherein the horizontal connection board is connected with the non-chip of mainboard heat dissipation module and arranges the fin in district, and perpendicular connecting plate is connected with mainboard vertically.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021763964.9U CN212851542U (en) | 2020-08-21 | 2020-08-21 | Air-cooled heat dissipation system for high-power-consumption card-inserting type instrument module |
| TW110205392U TWM619860U (en) | 2020-08-21 | 2021-05-13 | Air-cooling heat dissipation system for high-power plug-in instrument module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021763964.9U CN212851542U (en) | 2020-08-21 | 2020-08-21 | Air-cooled heat dissipation system for high-power-consumption card-inserting type instrument module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212851542U true CN212851542U (en) | 2021-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021763964.9U Active CN212851542U (en) | 2020-08-21 | 2020-08-21 | Air-cooled heat dissipation system for high-power-consumption card-inserting type instrument module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN212851542U (en) |
| TW (1) | TWM619860U (en) |
-
2020
- 2020-08-21 CN CN202021763964.9U patent/CN212851542U/en active Active
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2021
- 2021-05-13 TW TW110205392U patent/TWM619860U/en unknown
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| Publication number | Publication date |
|---|---|
| TWM619860U (en) | 2021-11-21 |
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Address after: 201799 1st floor, building 1, 1130 qinghewan Road, Qingpu District, Shanghai Patentee after: Sundak Semiconductor Technology (Shanghai) Co.,Ltd. Address before: 201799 1st floor, building 1, 1130 qinghewan Road, Qingpu District, Shanghai Patentee before: Sundec semiconductor technology (Shanghai) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |