CN212848368U

CN212848368U - Plastic package diode with high-efficient heat dissipation function

Info

Publication number: CN212848368U
Application number: CN202021012848.3U
Authority: CN
Inventors: 张建军; 卢维明
Original assignee: Jiangsu Poppula Semiconductor Co ltd
Current assignee: Jiangsu Poppula Semiconductor Co ltd
Priority date: 2020-06-05
Filing date: 2020-06-05
Publication date: 2021-03-30
Anticipated expiration: 2030-06-05

Abstract

The utility model discloses a plastic envelope diode with high-efficient heat dissipation function, including diode body, pin and radiator unit, radiator unit still includes radiator unit shell, diode body and places pipe, heat dissipation sheet metal and heat dissipation strip, the beneficial effects of the utility model are that: the utility model discloses novel structure, the cost of manufacture is low, can make the plastic envelope diode in the in-service use, can the efficient heat dissipation, and the radiating effect is strong, and the radiating rate is fast for the plastic envelope diode can not damage because of generating heat in long-time working process, has promoted the quality of plastic envelope diode, has guaranteed the life of plastic envelope diode.

Description

Plastic package diode with high-efficient heat dissipation function

Technical Field

The utility model relates to a relevant technical field of plastic envelope diode specifically is a plastic envelope diode with high-efficient heat dissipation function.

Background

Diodes are one of the most popular semiconductor devices, and are widely used, and particularly, in various electronic circuits, diodes are reasonably connected with components such as resistors, capacitors, inductors and the like to form circuits with different functions, so that various functions such as alternating current rectification, modulation signal detection, amplitude limiting and clamping, and power supply voltage stabilization can be realized. The diode traces can be found in common radio circuits, in other household appliances or in industrial control circuits.

Traditional plastic envelope diode is more single on the structure, does not possess certain functionality, in the in-service use process, the plastic envelope diode generally can all generate heat, traditional plastic envelope diode's radiating effect is not good, especially in the higher environment of temperature, ambient temperature on every side is higher, and add self generate heat, the radiating effect is not good, the heat can not be timely by the discharge, probably can lead to the plastic envelope diode because the high temperature damages, influence plastic envelope diode's life.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The to-be-solved technical problem of the utility model is: because traditional plastic envelope diode is more single on the structure, does not possess certain functionality, in the in-service use process, the plastic envelope diode generally can all generate heat, traditional plastic envelope diode's radiating effect is not good, especially in the higher environment of temperature, ambient temperature is higher on every side to including self generating heat, the radiating effect is not good, the heat can not in time be discharged, probably can lead to the plastic envelope diode to damage because the temperature is too high, influence plastic envelope diode's life's problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a plastic envelope diode with high-efficient heat dissipation function, includes diode body, pin, still includes radiator unit, radiator unit includes that radiator unit shell, diode body place pipe, heat dissipation sheet metal and heat dissipation strip, radiator unit sets up the outside of diode body, the radiator unit shell is radiator unit's outermost, the diode body is placed the pipe setting and is in the inside of radiator unit shell, the heat dissipation sheet metal sets up the surface that the pipe was placed to the diode body, the heat dissipation strip sets up the surface of radiator unit shell.

Furthermore, the diode body placing tube and the radiating component shell are of an integrated structure, and the size of the diode body placing tube is matched with that of the diode body.

Further, the heat dissipation sheet metal is provided with a plurality of, and a plurality of the big small structure of heat dissipation sheet metal is the same, the heat dissipation sheet metal is arranged of equidistance formula to the arrangement mode is even.

Furthermore, the heat dissipation strips are provided with a plurality of heat dissipation strips, the heat dissipation strips are identical in size and structure, and the heat dissipation strips are embedded into the penetrating surface of the heat dissipation assembly shell.

Furthermore, the top end of the heat dissipation thin plate is in contact with the bottom surface of the heat dissipation strip.

(III) advantageous effects

The utility model provides a plastic envelope diode with high-efficient heat dissipation function possesses following beneficial effect: the problem of because on traditional plastic envelope diode structure relatively single, do not possess certain functionality, in the in-service use process, the plastic envelope diode generally all can generate heat, traditional plastic envelope diode's radiating effect is not good, especially in the higher environment of temperature, ambient temperature is higher on every side, and add self generating heat, the radiating effect is not good, the heat can not be timely by the discharge, probably can lead to the plastic envelope diode to damage because the high temperature, influence the life of plastic envelope diode is solved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the heat dissipation assembly of the present invention;

FIG. 3 is a schematic view of the connection structure between the heat dissipation sheet and the diode body placing tube of the present invention;

FIG. 4 is a schematic view of the connection structure between the heat dissipation strip and the housing of the heat dissipation assembly of the present invention;

in the figure: 1-diode body, 2-pins, 3-radiating component, 31-radiating component shell, 32-diode body placing tube, 33-radiating thin plate and 34-radiating strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 and fig. 4, the present invention provides a technical solution: the utility model provides a plastic envelope diode with high-efficient heat dissipation function, including diode body 1, pin 2, still include radiator unit 3, radiator unit 3 includes radiator unit shell 31, the pipe 32 is placed to the diode body, heat dissipation sheet metal 33 and heat dissipation strip 34, radiator unit 3 sets up the outside at diode body 1, radiator unit shell 31 is radiator unit 3's outermost, the diode body is placed pipe 32 and is set up the inside at radiator unit shell 31, heat dissipation sheet metal 33 sets up the surface of placing pipe 32 at the diode body, heat dissipation strip 34 sets up the surface at radiator unit shell 31.

The pipe 32 and the formula structure as an organic whole of radiator unit shell 31 are placed to the diode body, and the model size that the pipe 32 was placed to the diode body and 1 phase-match of diode body, heat dissipation sheet metal 33 is provided with a plurality of, and the big or small structure of a plurality of heat dissipation sheet metal 33 is the same, heat dissipation sheet metal 33 is arranging of equidistance formula, and the arrangement is even, heat dissipation strip 34 is provided with a plurality of, and the big or small structure of a plurality of heat dissipation strip 34 is the same, the setting of heat dissipation strip 34 embedding penetrating formula is on the surface of radiator unit shell 31, the top of heat dissipation sheet metal 33 contacts with the bottom surface of heat.

The working principle is as follows: referring to fig. 1 and 4, before the plastic packaged diode is used, the heat dissipation assembly 3 is sleeved on the plastic packaged diode, the diode body 1 is located inside the diode body placing tube 32, heat generated in the working process of the diode body 1 is conducted out by the heat dissipation sheet 33, the heat conducted out by the heat dissipation sheet 33 is transferred to the heat dissipation strip 34, and finally the heat is transferred out by the heat dissipation strip 34.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a plastic envelope diode with high-efficient heat dissipation function, includes diode body (1), pin (2), its characterized in that: still include radiator unit (3), radiator unit (3) include radiator unit shell (31), diode body place pipe (32), heat dissipation sheet metal (33) and radiating strip (34), radiator unit (3) set up the outside of diode body (1), radiator unit shell (31) is the outermost of radiator unit (3), the diode body is placed pipe (32) and is set up the inside of radiator unit shell (31), heat dissipation sheet metal (33) set up the surface of pipe (32) is placed to the diode body, radiating strip (34) set up the surface of radiator unit shell (31).

2. The plastic package diode with the efficient heat dissipation function as recited in claim 1, wherein: the diode body placing tube (32) and the radiating component shell (31) are of an integrated structure, and the size of the diode body placing tube (32) is matched with that of the diode body (1).

3. The plastic package diode with the efficient heat dissipation function as recited in claim 1, wherein: the heat dissipation thin plate (33) is provided with a plurality of, and a plurality of the big small structure of heat dissipation thin plate (33) is the same, heat dissipation thin plate (33) are arranged of equidistance formula, and the arrangement is even.

4. The plastic package diode with the efficient heat dissipation function as recited in claim 1, wherein: the heat dissipation strips (34) are arranged in a plurality of numbers, the heat dissipation strips (34) are identical in size and structure, and the heat dissipation strips (34) are embedded into the surface of the heat dissipation assembly shell (31) in a penetrating mode.

5. The plastic package diode with the efficient heat dissipation function as recited in claim 1, wherein: the top end of the heat dissipation thin plate (33) is in contact with the bottom surface of the heat dissipation strip (34).