CN212848317U

CN212848317U - Wafer splitting clamp

Info

Publication number: CN212848317U
Application number: CN202021512206.XU
Authority: CN
Inventors: 徐鹏
Original assignee: Xian Eswin Silicon Wafer Technology Co Ltd
Current assignee: Xian Eswin Silicon Wafer Technology Co Ltd
Priority date: 2020-07-27
Filing date: 2020-07-27
Publication date: 2021-03-30
Anticipated expiration: 2030-07-27

Abstract

The utility model provides a wafer splitting anchor clamps. The shape and the size of the wafer splitting clamp are matched with the shape and the size of a wafer which is not split, a plurality of containing grooves are formed in the wafer splitting clamp and are used for containing the split wafer, and each containing groove is provided with an opening extending to the surface of the wafer splitting clamp.

Description

Wafer splitting clamp

Technical Field

The utility model relates to a semiconductor processing detects technical field, especially relates to a wafer splitting anchor clamps.

Background

Silicon wafers, also known as wafers, are commonly used as substrates for semiconductor integrated circuits, and during semiconductor processing, it is often necessary to inspect the semiconductor for its properties and defects in order to continuously refine the processing and fabrication processes. However, in the inspection process for semiconductors, some methods require further inspection after the wafer is broken into small pieces and then processed by a wet process. In the related technology, the small-size wafer obtained after the splitting is mainly placed in a container such as a beaker filled with chemicals for independent wet processing, and the processing efficiency is low.

Disclosure of Invention

The embodiment of the utility model provides a wafer lobe of a leaf anchor clamps to solve the lower problem of current mode to wafer lobe of a leaf wet processing efficiency.

The embodiment of the utility model provides a wafer lobe of a leaf anchor clamps, the shape and the size of wafer lobe of a leaf anchor clamps and the appearance and the size phase-match of the wafer that does not split, including a plurality of holding tanks in the wafer lobe of a leaf anchor clamps, the holding tank is used for holding the cracked wafer lobe of a leaf, each seted up on the holding tank and extended to the trompil on wafer lobe of a leaf anchor clamps surface.

Optionally, the wafer splinter clamp includes a groove plate and a cover plate covering the surface of the groove plate, the accommodating groove is formed in the groove plate, the opening is formed in the cover plate, and the position of the opening corresponds to the position of the accommodating groove.

Optionally, the area of the opening is smaller than the cross-sectional area of the corresponding accommodating groove in the direction parallel to the cover plate.

Optionally, the number of the cover plates is two, and the two cover plates respectively cover a first surface and a second surface of the slot plate, wherein the first surface and the second surface are two opposite surfaces of the slot plate.

Optionally, at least one of the cover plates is provided with a position identifier, and the position identifier is used for identifying the position of the accommodating groove.

Optionally, the frid is cylindric, the apron is circular, just the edge of apron is provided with the annular protruding edge on the surface of perpendicular to apron, so that the internal diameter on annular protruding edge is greater than or equal to the external diameter of frid, so that the apron cover in when the surface of frid, annular protruding edge encircles the frid.

Optionally, the inner wall of the annular convex edge is provided with an internal thread, the side edge of the groove plate is provided with an external thread matched with the internal thread, and the groove plate and the cover plate are connected through the internal thread and the external thread.

Optionally, the cover plate and the groove plate are respectively provided with a buckle and a clamping piece which are matched with each other, and the cover plate and the groove plate are connected with each other through the buckle and the clamping piece.

Optionally, the outer surface of the cover plate and/or the groove plate is provided with an anti-corrosion coating.

The shape and the size of this application through the wafer lobe of a leaf anchor clamps that provide and the appearance and the size phase-match of the wafer that does not split, include a plurality of holding tanks in the wafer lobe anchor clamps, the holding tank is used for holding the wafer lobe of splitting, set up the trompil that extends to wafer lobe of leaf anchor clamps surface on each holding tank, thus, when handling the wafer lobe, can handle a plurality of wafer lobes simultaneously, and, because the shape and the size of wafer lobe of leaf anchor clamps and the appearance and the size phase-match of the wafer that does not split, so can directly utilize current equipment to complete wafer wet process to handle the wafer lobe, help reduce cost, also help improving experimental efficiency simultaneously.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic structural view of a wafer breaking fixture according to an embodiment of the present invention;

fig. 2A is a schematic structural view of a slot plate according to an embodiment of the present invention;

fig. 2B is a schematic structural diagram of another trough plate according to an embodiment of the present invention;

fig. 3A is a schematic structural diagram of a cover plate according to an embodiment of the present invention;

fig. 3B is a schematic structural diagram of another cover plate according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a wafer lobe of a leaf anchor clamps 100.

As shown in fig. 1 to 3B, in one embodiment, the wafer fragment holder 100 has a shape and size matching the shape and size of the wafer that is not cleaved, the wafer fragment holder 100 includes a plurality of receiving grooves 11, the receiving grooves 11 are used for receiving the cleaved wafer fragments, and each receiving groove 11 is opened with an opening 23 extending to the surface of the wafer fragment holder 100.

The uncracked wafer in this embodiment refers to the finished wafer, which is generally circular. The wafer fragment holder 100 includes a plurality of receiving grooves 11, the receiving grooves 11 are used for receiving the cracked wafer fragments, and each receiving groove 11 is opened with an opening 23 extending to the surface of the wafer fragment holder 100.

In the using process, the wafer is cracked into small-sized wafer fragments, then the wafer fragments are placed in each accommodating groove 11, then the wafer fragment fixture 100 is arranged in the wet test equipment, the solution can enter the accommodating grooves 11 through the openings 23, the wet treatment of the wafer fragments is realized, and the oxide layer on the surface of the wafer is removed, so that the subsequent treatment or the test process can be further carried out. After the wet processing is completed, the wafer breaking fixture 100 is taken out from the testing equipment, and further the wafer breaking is taken out from the accommodating groove 11.

It should be understood that, the apparatus for performing wet test on a complete wafer belongs to the prior art, and by setting the shape and size of the wafer breaking clamp 100 to match the wafer breaking clamp 100, the existing apparatus for performing wet test on a complete wafer can be directly used for testing without customizing a dedicated apparatus, so that the testing cost is low, and meanwhile, compared with the manual test with low efficiency, the efficiency can be improved by using the wet test apparatus for performing wet test.

As shown in fig. 1, in some embodiments, the wafer fragment clamp 100 includes a groove plate 10 and

cover plates

20A and 20B covering the surface of the groove plate 10, as shown in fig. 2A and 2B, a receiving groove 11 is formed on the groove plate 10, as shown in fig. 3A and 3B, openings 23 are formed on the

cover plates

20A and 20B, and the positions of the openings 23 correspond to the positions of the receiving groove 11.

The number of cover plates may be one, for example, one side of the channel plate is closed and the other side is provided with a cover plate.

As shown in fig. 1, 3A and 3B, there may be two cover plates. The two

cover plates

20A, 20B are illustrated as being included. The number of the

cover plates

20A, 20B is two, and the two

cover plates

20A, 20B cover a first surface and a second surface of the slot plate 10, respectively, wherein the first surface and the second surface are two opposite surfaces of the slot plate 10, that is, the upper and lower surfaces of the slot plate 10 shown in fig. 1.

In other words, the

cover plates

20A, 20B, the slot plate 10 and the

cover plates

20A, 20B are stacked and form a sandwich structure. When the wafer split groove structure is used, one cover plate 20A and one cover plate 20B are fixed on the first surface of the groove plate 10, then the wafer split pieces are placed in the accommodating grooves 11, and the other cover plate 20A and the other cover plate 20B are fixed on the second surface of the groove plate 10.

Generally, the uncracked wafers are circular, and the conventional wet processing apparatus is mainly used for circular wafers, so the wafer breaking fixture 100 is also circular in this embodiment. Specifically, the groove plate 10 is cylindrical, the

cover plates

20A and 20B are circular, and the edges of the

cover plates

20A and 20B are provided with annular flanges 21 perpendicular to the surfaces of the

cover plates

20A and 20B, so that the inner diameter of the annular flanges 21 is greater than or equal to the outer diameter of the groove plate 10, and when the

cover plates

20A and 20B cover the surface of the groove plate 10, the annular flanges 21 surround the groove plate 10.

The

cover plates

20A, 20B and the groove plate 10 can be fixed in different ways, for example, in one embodiment, the inner wall of the annular flange 21 is provided with an internal thread, the side edge of the groove plate 10 is provided with an external thread matching with the internal thread, and the groove plate 10 and the

cover plates

20A, 20B are connected through the internal thread and the external thread.

In another embodiment, the

cover plates

20A and 20B and the slot plate 10 are respectively provided with a matching snap and a catch, and the

cover plates

20A and 20B and the slot plate 10 are connected by the snap and the catch. Obviously, the

cover plates

20A, 20B and the slot plate 10 may be connected by fasteners such as bolts.

In general, a reaction solution having strong corrosiveness, such as hydrofluoric acid or nitric acid, is used in the wet processing of the wafer, and therefore, materials of the

cover plates

20A and 20B and the slot plates 10 are usually tetrafluoroethylene or polyetheretherketone, and an anti-corrosion coating formed of an acid and alkali resistant material, such as teflon, may be disposed outside the

cover plates

20A and 20B and the slot plates 10 to protect the

cover plates

20A and 20B and the slot plates 10.

The shape of the receiving groove 11 on the groove plate 10 can be set according to the test requirement, for example, it can be set to be circular, as shown in fig. 2A and 2B, and it can also be set to be square or rectangular. Specifically, in one embodiment, when measuring the oxygen and nitrogen content by using a GFA method (Gas Fusion Analysis), the native oxide layer needs to be removed by wet processing to obtain more accurate oxygen content data, and during the measurement, only small-sized splinters are required, such as wafer splinters with a cross-sectional area of about 15 mm × 10 mm. When the cross section is observed by a microscope, the length of the splinters is about 280 mm.

In practice, the accommodating grooves 11 with different sizes are disposed to meet different use requirements, the size of the accommodating groove 11 on each groove plate 10 may be the same or different, and the area of the opening 23 is smaller than the cross-sectional area of the corresponding accommodating groove 11 in the direction parallel to the

cover plates

20A and 20B, so as to prevent the wafer fragment from being separated from the accommodating groove 11.

Further, as shown in fig. 3B, at least one of the

cover plates

20A and 20B is provided with a position mark 22, and the position mark 22 is used for identifying the position of the accommodating groove 11.

As shown in fig. 3B, in an embodiment, the position mark 22 is a protrusion structure disposed on the surface of the

cover plates

20A and 20B, and the wafer cracks in the accommodating grooves 11 and the accommodating grooves 11 can be distinguished by the relative positions of the accommodating grooves 11 and the protrusion structure. Furthermore, the position indicator 22 may be implemented in the form of a number or coordinates, for example, the position information may be marked directly on the

cover plates

20A, 20B or the slot plate 10 by a pattern, a letter, or the like.

In the use process of the wafer breaking clamp 100 in this embodiment, a wafer to be subjected to wet processing is first subjected to a breaking process to obtain small-sized wafer breaks. Next, the dimensions of the wafer fragments are measured and recorded, and an appropriate slot plate 10 is selected according to the dimensions. Generally, the size of the receiving groove 11 on the groove plate 10 is slightly larger than the wafer fragment size, but is not too large. Further, the groove plate 10 is fixed to one of the

cover plates

20A, 20B, and the wafer fragments are placed in each accommodating groove 11, and at this time, whether to record the positions of the wafer fragments can be determined as required. Next, the

other cover plate

20A, 20B is fixed to the slot plate 10 to form a sandwich structure. Finally, the wafer splinter clamp 100 is placed in a wafer cleaning box, and further placed in wet processing equipment for wet processing, after the processing is finished, the wafer splinter clamp 100 is taken out, and the

cover plates

20A and 20B are opened, so that the wafer splinter after the wet processing is finished can be taken out.

According to the technical scheme of the embodiment, the overall shape of the wafer splitting clamp 100 is similar to that of a complete wafer, a wafer round container containing the split wafer can be directly placed into a cleaning box to be subjected to a wet processing process together with the complete wafer, the existing equipment and process are compatible, independent wet processing equipment special for the split wafer is not needed, and cost saving is facilitated.

Furthermore, the size of the accommodating groove 11 can be adjusted according to the size of the wafer fragment required, so as to meet the wet processing requirements of the wafer fragments with different sizes.

The above embodiments are only specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, and all should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The wafer splitting clamp is characterized in that the shape and the size of the wafer splitting clamp are matched with the shape and the size of an uncracked wafer, a plurality of accommodating grooves are formed in the wafer splitting clamp and used for accommodating cracked wafer splits, and each accommodating groove is provided with an opening extending to the surface of the wafer splitting clamp.

2. The wafer breaking clamp of claim 1, wherein the wafer breaking clamp comprises a groove plate and a cover plate covering the surface of the groove plate, the groove plate is provided with the accommodating groove, the cover plate is provided with the opening, and the position of the opening corresponds to the position of the accommodating groove.

3. The wafer fragment clamp of claim 2, wherein the opening has an area smaller than a cross-sectional area of the corresponding receiving groove in a direction parallel to the cover plate.

4. The wafer splinter clamp of claim 2 wherein the number of the cover plates is two, and two cover plates cover a first surface and a second surface of the slot plate respectively, wherein the first surface and the second surface are two opposite surfaces of the slot plate.

5. The wafer breaking clamp of claim 4, wherein at least one cover plate is provided with a position mark, and the position mark is used for marking the position of the accommodating groove.

6. The wafer fragment clamp of claim 2, wherein the groove plate is cylindrical, the cover plate is circular, and an annular ledge perpendicular to the surface of the cover plate is provided at an edge of the cover plate such that an inner diameter of the annular ledge is greater than or equal to an outer diameter of the groove plate, such that the annular ledge surrounds the groove plate when the cover plate covers the surface of the groove plate.

7. The wafer splitting clamp of claim 6, wherein the inner wall of the annular flange is provided with an internal thread, the side edge of the groove plate is provided with an external thread matched with the internal thread, and the groove plate and the cover plate are connected through the internal thread and the external thread.

8. The wafer fragment clamp of any one of claims 2 to 6, wherein the cover plate and the groove plate are respectively provided with a matched buckle and a matched clamping piece, and the cover plate and the groove plate are connected through the buckle and the clamping piece.

9. The wafer fragment clamp of any one of claims 2 to 7, wherein the outer surface of the cover plate and/or the groove plate is provided with an anti-corrosion coating.