CN109708937B - Inlaying method suitable for products with diameter or thickness smaller than 2mm - Google Patents

Abstract

The invention discloses an inlaying method applicable to products with the diameter or thickness smaller than 2mm, which specifically comprises the following steps: (1) selecting a mosaic method according to product requirements, wherein the mosaic method comprises hot mosaic and cold mosaic; (2) a sample with the diameter or the thickness of less than 2mm is flatly laid in a mosaic machine for carrying out mosaic for one time, and the mosaic depth reaches 4-8 mm; (3) cooling the sample subjected to the primary inlaying in the step (2), longitudinally cutting the sample by using a cutting machine, and cutting the sample into small samples subjected to secondary inlaying; (4) erecting the small sample longitudinally cut in the step (3) for secondary embedding, and ensuring the integrity of the product; (5) grinding, polishing and analyzing the sample subjected to secondary embedding according to a preparation process used by a metallographic phase; the invention solves the problem that the spring-free clamp is used for embedding products with the diameter or the thickness smaller than 2mm, and simultaneously solves the problem that the accurate detection and analysis cannot be realized due to the frequent sample deflection in the traditional small sample embedding process.

Description

Inlaying method suitable for products with diameter or thickness smaller than 2mm

Technical Field

The invention relates to a practical embedding method for preparing cold and hot embedding samples in the steel manufacturing industry, in particular to an embedding method which is suitable for analyzing the internal organization structure, the decarburized layer, the surface defect, the failure and the like of a product with the diameter or the thickness of less than 2mm without a spring clamp.

Background

In the steel manufacturing industry, the diversity of the shapes of products is the characteristic of the industry, and how to analyze the surface and internal organization of products with different shapes is one of essential items for the product performance analysis and promotion of the product production process improvement by the inspection and research departments. Therefore, the manufacturing industry is used to treat irregular shapes, wires and plates, fine workpieces, surface treatment, infiltration layers and plating layers for a long time; the products prepared from the materials with decarburized surfaces (grinding and polishing) are easy to chamfer, and the inlaying is difficult to analyze by adopting two modes of machinery or resin. In order to ensure that a sample can keep the original analysis morphology and require that the product is not inclined during inlaying, the traditional inlaying process generally comprises the steps that firstly, a sample above a product with the thickness of about 5mm can be directly erected in an inlaying machine (an inlaying grinding tool) and then a proper amount of inlaying powder (phenolic resin) is placed in the inlaying machine (the inlaying grinding tool) for heating, pressurizing and heat preservation, and secondly, a product with the thickness of about 3mm can be firstly placed in a small amount of inlaying powder (phenolic resin) in the inlaying machine (the inlaying grinding tool), the sample is rapidly erected in the inlaying machine (the inlaying grinding tool); thirdly, most products smaller than 2mm adopt spring clamps to fix the sample and then operate according to the traditional embedding process. The conventional mosaic has the disadvantages that the actual size of the sample cannot be completely guaranteed and the sample is often deviated. If there is no spring clamp on the spot, the integrity of the inlaid sample can not be guaranteed, that is, the product can not be analyzed according to the original shape, the accuracy of the analysis data can not be guaranteed, great confusion is brought to product analysis and inspection, and the product analysis and judgment of the material are influenced.

The product less than 2mm does not have spring clamp and inlays according to the tradition and bring the limitation, and how to solve the product less than 2mm does not have the analysis problem of inlaying under the spring clamp condition, is imperative.

Disclosure of Invention

The invention aims to solve the technical problem that a spring-free clamp is used for inlaying a product with the diameter or the thickness of less than 2mm, namely a sample cannot be subjected to failure analysis or surface and internal organizational structure morphology inspection and analysis correctly; meanwhile, the problem that accurate inspection and analysis cannot be performed due to the fact that a sample deflects frequently in the traditional small sample embedding process is solved, the defects of the prior art are overcome, and the embedding method suitable for products with the diameter or the thickness smaller than 2mm is provided.

In order to solve the technical problems, the invention provides an inlaying method suitable for products with the diameter or thickness smaller than 2mm, which specifically comprises the following steps:

(1) selecting a mosaic method according to product requirements, wherein the mosaic method comprises hot mosaic and cold mosaic;

(2) a sample with the diameter or the thickness of less than 2mm is flatly laid in a mosaic machine for carrying out mosaic for one time, and the mosaic depth reaches 4-8 mm;

(3) cooling the sample subjected to the primary inlaying in the step (2), longitudinally cutting the sample by using a cutting machine, and cutting the sample into small samples subjected to secondary inlaying;

(4) erecting the small sample longitudinally cut in the step (3) for secondary embedding, and ensuring the integrity of the product;

(5) and grinding, polishing and analyzing the sample subjected to secondary embedding according to the preparation process of metallographic phase use.

The technical scheme of the invention is further defined as follows:

further, in the aforesaid inlaying method suitable for products with a diameter or thickness less than 2mm, when hot inlaying is selected, one-time inlaying specifically includes: adding 7-10g of hot embedding powder into an embedding machine with an inner mold of 30mm, closing the cover, applying pressure, and keeping the temperature at 150 ℃ for 10min for hot embedding.

In the inlaying method applicable to products with the diameter or the thickness of less than 2mm, the hot inlaying powder is a mixture of phenolic plastic powder, bakelite powder and jade powder.

In the aforesaid inlaying method suitable for products with diameter or thickness less than 2mm, the sample inlaid twice in step (3) is cut into rectangle, and its length is less than the diameter of the inlaying machine.

The invention has the beneficial effects that:

(1) the cost of 100 samples with the length of 30 multiplied by 25mm in the process of embedding 56 yuan/Kg of powder in the 1 box is about 0.5 yuan/piece, and the cost of 500 samples with the length of 30 multiplied by 5mm in the process of embedding is about 0.1 yuan/piece; the cost of the 30 multiplied by 25mm samples is about 1.5 yuan/piece when the spring clamps are used for inlaying and the spring clamps are about 1.0 yuan/piece; the cost of the sample is 0.7 yuan/piece without using a spring clamp for secondary embedding, 0.8 yuan/piece is saved, and the accuracy of analysis data is ensured by secondary embedding.

(2) The analysis of small samples can not be carried out without a spring clamp, and the outsourcing metallographic analysis cost is 5 thousand yuan/time, and the company carries out metallographic analysis according to the method of the invention: 8 times of 16-year analysis, 19 times of 17 years and 27 times of 18 years, and totally saves the extra entrustment: 56 x 0.5=28 ten thousand, the cost is greatly reduced.

The invention aims to solve the problem that a spring-free clamp is used for inlaying a product with the diameter or the thickness of less than 2mm, namely the problem that a sample cannot be subjected to failure analysis or surface and internal organizational structure morphology and the like. Meanwhile, the problem that accurate inspection and analysis cannot be conducted due to the fact that a sample often deflects in the traditional small sample embedding process is solved, a secondary embedding method is provided aiming at the limitation of the existing embedding technology, and the problems that a spring clamp is not available, products of small specifications and sizes can be accurately and qualitatively analyzed, and compensation is not needed are solved.

Specifically, the thin sample cannot be directly vertically inlaid, the sample is flatly laid and longitudinally cut to expose the cross section of the sample, so that the sample can be conveniently observed whether the sample is correct, and then the rectangular shape is convenient to vertically inlay, sample preparation and analysis.

Drawings

FIG. 1 is a process flow diagram of a dual damascene process according to an embodiment of the present invention;

FIG. 2 is a diagram illustrating the operation of one-time inlaying of the drawn wire sample according to the embodiment of the present invention;

FIG. 3 is a diagram illustrating a sheet sample one-time mounting operation according to an embodiment of the present invention;

FIG. 4 is a schematic longitudinal sectional view of a drawn sample according to an embodiment of the present invention;

FIG. 5 is a schematic longitudinal sectional view of a sample sheet according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a double-damascene drawing of a wire-drawing sample according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a dual damascene process of a sheet sample according to an embodiment of the present invention;

FIG. 8 is a measurement of the dimensions of the wire drawing sample of FIG. 6 under a microscope;

fig. 9 is a microscopic measurement of the sheet sample of fig. 7.

Detailed Description

Example 1

The inlaying method applicable to products with the diameter or thickness smaller than 2mm provided by the embodiment specifically comprises the following steps:

(1) selecting an embedding method according to product requirements, for example, selecting cold embedding under the adverse conditions that damage and the like can occur when semiconductors, mild steel and the like are heated, selecting hot embedding for general steel and the like, and selecting according to the product requirements;

(2) a sample sheet with the thickness of 0.85mm and a wire drawing sample with the diameter of 0.3mm are prepared and laid in a metallographic phase embedding machine with the internal mold of 30mm, which is preheated for 5 minutes, and then 7-10g of hot embedding powder (the hot embedding powder is a mixture of phenolic plastic powder, bakelite powder and jade powder, the hot embedding powder is prepared after being bought back, and the hot embedding powder with the components inside is used) is sufficiently formed into a sample with the height of 5mm, the sample is covered, pressed and is subjected to heat preservation at 150 ℃ for 10 minutes to be subjected to hot embedding (wire drawing and cold rolling sheet), and a primary embedding and actual operation schematic diagrams 2 and 3 in the step 1 in the figure 1 are shown;

(3) cooling the inlaid sample, longitudinally cutting the sample by using a metallographic cutting machine according to analysis requirements, cutting the sample into small samples inlaid for the second time, wherein the length of the cut square of the small sample is smaller than the diameter of the inlaying machine, and specifically, the cutting and actual operation schematic diagrams 4 and 5 in the step 2 of fig. 1 are shown;

(4) vertically placing the small sample longitudinally cut in the step (3) into a hot metallographic mosaic for secondary mosaic, thus ensuring the integrity of the sample after the secondary mosaic and meeting the detection requirement, and referring to secondary mosaic and actual operation schematic diagrams 6 and 7 in the step (3) in FIG. 1;

(5) grinding, polishing and analyzing the sample subjected to secondary inlaying according to a preparation process used by a metallographic phase, and carrying out metallographic analysis, wherein the sizes of products in the actual analysis of the sample are measured under an optical microscope in the graphs of fig. 8 and 9, and the actual diameter size of the wire drawing sample in the graph of fig. 6 is 0.3mm 100X; fig. 9 shows the sheet sample of fig. 7 having a true thickness dimension of 0.8mm 50X.

By using the method, the sample is not required to be fixedly embedded by adopting the spring clamp, so that the cost is saved, meanwhile, the operation process is simple, the product with the diameter or the thickness smaller than 2mm is embedded by the spring-free clamp, and the sample can be correctly subjected to failure analysis or surface and internal organizational structure morphology inspection and analysis; meanwhile, the phenomenon that the sample is deflected frequently in the traditional small sample inlaying process to cause that the accurate detection and analysis cannot be realized is avoided.

In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.

Claims (1)

1. An inlaying method suitable for products with diameters or thicknesses smaller than 2mm is characterized by comprising the following steps:

(1) selecting a mosaic method according to a product, wherein the mosaic method comprises hot mosaic and cold mosaic;

when the hot inlaying is selected, the one-time inlaying specifically comprises the following steps: adding 7-10g of hot embedding powder into an embedding machine with an inner mold of 30mm, closing the cover, applying pressure, and keeping the temperature at 150 ℃ for 10min for hot embedding;

the hot-setting powder is a mixture of phenolic plastic powder, bakelite powder and jade powder;

the product is a thin plate or a drawn wire;

(2) a thin plate with the diameter or the thickness of less than 2mm or a drawn wire is flatly laid in an inlaying machine, then inlaying powder is put in the inlaying machine for one-time inlaying, and the inlaying depth reaches 4-8 mm;

(3) cooling the sample after the primary inlaying in the step (2), longitudinally cutting the thin plate or the drawn wire on the sample by using a cutting machine to expose the cross section of the sample, cutting the sample into small samples which are inlaid secondarily, and cutting the small samples which are inlaid secondarily into rectangles, wherein the length of the small samples is smaller than the diameter of the inlaying machine;

(4) vertically erecting the small sample longitudinally cut in the step (3) for secondary inlaying to ensure the integrity of the sample and expose the cross section of a thin plate or a drawn wire on the sample after secondary inlaying;

(5) and grinding, polishing and analyzing the sample subjected to secondary embedding according to the preparation process of metallographic phase use.

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