CN201927581U - Wafer constant-temperature gluing table - Google Patents
Wafer constant-temperature gluing table Download PDFInfo
- Publication number
- CN201927581U CN201927581U CN2010206867987U CN201020686798U CN201927581U CN 201927581 U CN201927581 U CN 201927581U CN 2010206867987 U CN2010206867987 U CN 2010206867987U CN 201020686798 U CN201020686798 U CN 201020686798U CN 201927581 U CN201927581 U CN 201927581U
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- wafer
- wafers
- temperature
- constant temperature
- platform
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Abstract
The utility model belongs to the field of quartz crystal wafer processing equipment, and particularly relates to a tool for gluing between wafers in the process of processing the shapes of the wafers. The tool comprises an L-shaped clamp, an I-shaped pressure block and an alignment station. The L-shaped clamp and the I-shaped pressure block are arranged on the alignment station. A constant temperature heating device is arranged below the alignment station. The tool has the advantages that the tool can provide a constant temperature for gluing of the wafers so that the wafers are not influenced by the outside temperature; the perpendicularity and the parallelism of the wafers subjected to gluing processing meet requirements; and the qualification rate is improved.
Description
Technical field
The utility model belongs to quartz wafer process equipment field, especially a kind of frock that is used for gluing together between wafer man-hour that adds in wafer profile.
Background technology
The wafer gummed is the critical process of sharp processing, and the quality of its quality can directly influence the quality of finished product wafer (frequency chip).
In wafer process factory, the cementing jig that a mould that general employing angle bar is welded and a briquetting are formed, the wafer that will soak into glue is put into the anchor clamps that are lined with newspaper, rapidly shaping, and push-tight briquetting are forward treated to take out behind its cooling forming, the newspaper of tearing is promptly finished gummed, in this process,, can not guarantee bonding quality, cause open defects such as product frequency chip edge unfilled corner, bright spot because influenced by ambient temperature, cementing jig precision and operating personnel's qualification very big.
Summary of the invention
The purpose of this utility model is to cause the shortcoming that can't guarantee the wafer bonding quality at cementing jig precision and influenced by ambient temperature in the above-mentioned technology, proposes a kind of wafer constant temperature gummed platform, and it can guarantee bonding quality, improves the qualification rate of finished wafer.
The technical scheme that realizes the utility model purpose is as follows:
Wafer constant temperature gummed platform, it comprises L shaped anchor clamps, I shape briquetting and permutation platform, and L shaped anchor clamps and I shape briquetting are located on the permutation platform, and the permutation platform has constant temperature heating device.
Described constant temperature heating device comprises heating plate, temperature sensor and the temperature control box that is used to control, and temperature control box is connected with heating plate and temperature sensor, and temperature sensor is connected with heating plate.
Advantage of the present utility model is: can provide stationary temperature for the wafer gummed, make it not be subjected to externally temperature influence, wafer perpendicularity, the depth of parallelism that gummed processes meet the demands, and have improved qualification rate.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
As shown in Figure 1, wafer constant temperature gummed platform, it comprises L shaped anchor clamps 1, I shape briquetting 2 and permutation platform 4, L shaped anchor clamps 1 are located on the permutation platform 4 with I shape briquetting 2, permutation platform 4 has constant temperature heating device, wherein, the datum level of L shaped anchor clamps 1, I shape briquetting 2 is vertical with the table top of permutation platform 4, and L shaped anchor clamps 1 are parallel with the datum level of I shape briquetting 2.
Wherein, constant temperature heating device comprises heating plate 5, temperature sensor 6 and the temperature control box 7 that is used to control, and temperature control box 7 is connected with heating plate 5 and temperature sensor 6, and temperature sensor 6 is connected with heating plate 5.
During work wafer stone roller 3 is put between L shaped anchor clamps 1 and the I shape briquetting 2, control temperature control box 7 makes heating plate 5 that heating is provided, and guarantees heated at constant temperature by temperature sensor 6, then wafer is being glued together.
Claims (2)
1. wafer constant temperature glues together platform, and it is characterized in that: it comprises L shaped anchor clamps, I shape briquetting and permutation platform, and L shaped anchor clamps and I shape briquetting are located on the permutation platform, and the permutation platform has constant temperature heating device.
2. wafer constant temperature gummed platform according to claim 1, it is characterized in that: described constant temperature heating device comprises heating plate, temperature sensor and the temperature control box that is used to control, temperature control box is connected with heating plate and temperature sensor, and temperature sensor is connected with heating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206867987U CN201927581U (en) | 2010-12-29 | 2010-12-29 | Wafer constant-temperature gluing table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206867987U CN201927581U (en) | 2010-12-29 | 2010-12-29 | Wafer constant-temperature gluing table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201927581U true CN201927581U (en) | 2011-08-10 |
Family
ID=44431418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206867987U Expired - Fee Related CN201927581U (en) | 2010-12-29 | 2010-12-29 | Wafer constant-temperature gluing table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201927581U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014089895A1 (en) * | 2012-12-11 | 2014-06-19 | 上海现代先进超精密制造中心有限公司 | Method and clamp for gluing detection board assembly |
-
2010
- 2010-12-29 CN CN2010206867987U patent/CN201927581U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014089895A1 (en) * | 2012-12-11 | 2014-06-19 | 上海现代先进超精密制造中心有限公司 | Method and clamp for gluing detection board assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20131229 |