CN109238493B - Grinding temperature measuring method - Google Patents
Grinding temperature measuring method Download PDFInfo
- Publication number
- CN109238493B CN109238493B CN201810992329.9A CN201810992329A CN109238493B CN 109238493 B CN109238493 B CN 109238493B CN 201810992329 A CN201810992329 A CN 201810992329A CN 109238493 B CN109238493 B CN 109238493B
- Authority
- CN
- China
- Prior art keywords
- temperature
- grinding
- workpiece
- blind hole
- thermocouple
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a grinding temperature measuring method, which comprises the following steps: s1, performing first electric spark punching on the workpiece by adopting a puncher of a tubular electrode to form a blind hole with a columnar metal tumor; s2, performing secondary electric spark punching on the blind hole with the columnar metal tumor by using a puncher of the columnar electrode to eliminate the columnar metal tumor; s3, placing the thermocouple into the blind hole, and enabling the thermocouple to be tightly attached to the bottom in the blind hole through the adhesive; s4, after the adhesive is solidified, putting the workpiece into a constant temperature box for heat preservation for 2 hours, setting the temperature at 150 ℃, and then waiting for the workpiece to be naturally cooled; s5, connecting the thermocouple to a high-speed temperature acquisition card through a shielding signal wire; and S6, grinding and measuring a temperature signal. The invention is used for measuring the high-temperature grinding temperature of the workpiece, can measure the highest temperature of a grinding interface and the grinding temperature at different depths, and has high measurement accuracy and stability.
Description
Technical Field
The invention relates to the field of workpiece grinding temperature measurement, in particular to a grinding temperature measurement method.
Background
The energy required for the removal of the unit material during the grinding process is very high and this energy is almost entirely converted into heat, which is concentrated in the grinding zone. Because the contact area is typically not cooled efficiently during grinding, the transient high temperatures cause various forms of thermal damage to the workpiece. Such as: the higher temperature gradient is easy to generate residual tensile stress on the surface layer, and the material is burnt, transformed in metallographic phase, softened in surface layer by secondary quenching, reduced in surface fatigue strength and the like after being ground. Besides heat damage, the temperature rise of the workpiece can generate deformation, so that the final quality of the product is influenced by errors in the geometric dimension.
The grinding temperature is difficult to accurately measure due to the particularity of the process, the main reason is that the working condition of a grinding area is complex, the sampling rate is low through a non-contact temperature measuring method such as infrared rays and the like, a grinding peak temperature signal is easy to lose, and the highest temperature of a grinding interface cannot be measured by the measuring method.
At present, a better solution method in the market is to punch a hole on a workpiece and then place a thermocouple into the hole to measure the grinding temperature of the surface of the workpiece and different depths, but the existing method has the problem that the contact between the thermocouple and the hole is not tight enough, so that the measurement precision and stability are influenced.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a grinding temperature measuring method capable of measuring not only the maximum temperature of a grinding interface but also grinding temperatures at different depths.
The technical scheme adopted by the invention is as follows:
a grinding temperature measuring method is characterized by comprising the following steps:
s1, performing first electric spark punching on the workpiece by adopting a puncher of a tubular electrode to form a blind hole with a columnar metal tumor;
s2, performing secondary electric spark punching on the blind hole with the columnar metal tumor by using a puncher of the columnar electrode to eliminate the columnar metal tumor;
s3, placing the thermocouple into the blind hole, and enabling the thermocouple to be tightly attached to the bottom in the blind hole through the adhesive;
s4, after the adhesive is solidified, putting the workpiece into a constant temperature box for heat preservation for 2 hours, setting the temperature at 150 ℃, and then waiting for the workpiece to be naturally cooled;
s5, connecting the thermocouple to a high-speed temperature acquisition card through a shielding signal wire;
and S6, grinding and measuring a temperature signal.
Further, when the electric discharge drilling is performed in step S1 or S2, high-pressure water is injected into the hole, and the discharge of chips is performed while machining is performed by the pressure of the high-pressure water.
Further, the thickness between the bottom of the blind hole formed by the electric spark drilling in the step S1 or S2 and the surface of the workpiece is 1 mm.
Further, in the step S1, the diameter of the tubular electrode is 600 micrometers, the diameter of the cylindrical electrode is 500 micrometers, and the aperture of the blind hole is 680 micrometers.
Further, the adhesive in the step S3 is 920 type glue.
Further, before the workpiece is placed in the thermostat in the step S4, the workpiece is placed at room temperature for four hours after the glue is solidified, and then the workpiece is placed in the thermostat for heat preservation.
Further, the oven in step S4 is an electric heating blower box or an electric heating constant temperature drying box.
Further, in the step S5, a shielding copper wire is wound around the bare wire of the thermocouple, a layer of insulating tape is wrapped around the bare wire, and the bare wire of the thermocouple is connected to the high-speed temperature acquisition card through a shielding extension wire.
The invention has the beneficial effects that:
the invention carries out primary punching through the tubular electrode with high efficiency, and then carries out secondary punching through the columnar electrode to eliminate the columnar metal tumor formed by the primary punching, so that the punching efficiency is high, and the thermocouple can be tightly attached to the bottom of the blind hole to reduce the use amount of the adhesive, thereby improving the accuracy of the measuring result; the adhesive force of the adhesive at high temperature is improved through the heat preservation treatment of the constant temperature box, the combination tightness of the thermocouple and the workpiece is ensured, and the temperature measurement stability is improved. The invention is used for measuring the high-temperature grinding temperature of the workpiece, can measure the highest temperature of a grinding interface and the grinding temperature at different depths, and has high measurement accuracy and stability.
Drawings
The following further describes the embodiments of the present invention with reference to the drawings;
FIG. 1 is a diagram showing the connection relationship between a thermocouple and a workpiece and a high-speed temperature acquisition card according to the present invention;
FIG. 2 is a diagram showing the relationship between the thermocouple and the blind hole of the present invention bonded by an adhesive;
FIG. 3a is a schematic view of a blind hole with a pillar-shaped metal tumor formed by the first electric spark drilling;
FIG. 3b is a schematic diagram of a blind via formed by the second spark-drilling.
Detailed Description
Fig. 1 shows a grinding temperature measuring method according to the present invention, which includes the steps of:
s1, performing first electric spark punching on the workpiece by using a punching machine of a hollow tubular electrode, wherein the punching position is the back of the part needing to be ground on the workpiece, the machining efficiency of the tubular electrode is high, but the formed blind hole 3 is internally provided with a columnar metal tumor, as shown in FIG. 3 a;
s2, performing secondary electric spark punching on the blind hole 3 with the columnar metal tumor by using a puncher with a solid columnar electrode to eliminate the columnar metal tumor, wherein the reason why the columnar electrode is not directly used for punching is that the machining efficiency of the columnar electrode is low as shown in figure 3 b;
preferably, the diameter of the tubular electrode is 600 microns, the diameter of the columnar electrode is 500 microns, and the aperture of the blind hole 3 is 680 microns; since the depth of the hole can not be strictly guaranteed by the electric spark drilling, the thickness between the bottom of the blind hole 3 and the surface of the workpiece is 1 mm.
When the electric spark drilling is carried out, if the blind hole 3 is deep, high-pressure water is injected into the blind hole, and the chip removal while machining is realized through the pressure of the high-pressure water.
S3, placing the thermocouple 1 into the blind hole 3, and enabling the thermocouple 1 to be tightly attached to the bottom in the blind hole 3 through the adhesive 2, wherein preferably, the adhesive 2 is glue of type 920, as shown in FIG. 2;
s4, after the glue is solidified for four hours, putting the workpiece into a constant temperature box, keeping the temperature for 2 hours, setting the temperature to be 150 ℃, and then waiting for the workpiece to be naturally cooled, wherein the constant temperature box is preferably an electric heating blast box or an electric heating constant temperature drying box; the adhesive force of the glue at high temperature is improved by a secondary curing method, and the bonding tightness of the thermocouple 1 and a workpiece is ensured;
s5, winding a shielding copper wire on a bare wire of the thermocouple 1, wrapping a layer of insulating tape, and connecting the bare wire of the thermocouple 1 to the high-speed temperature acquisition card through a shielding extension line to reduce noise interference in the measurement process;
and S6, grinding and measuring a temperature signal.
The invention carries out primary punching through the tubular electrode with high efficiency, and then carries out secondary punching through the columnar electrode to eliminate the columnar metal tumor formed by the primary punching, thereby having high punching efficiency, and being capable of leading the thermocouple 1 to be clung to the bottom of the blind hole 3 to reduce the using amount of the adhesive 2, thereby improving the accuracy of the measuring result; the adhesive force of the adhesive 2 at high temperature is improved through the heat preservation treatment of the constant temperature box, the combination tightness of the thermocouple 1 and a workpiece is ensured, and the temperature measurement stability is improved. The invention is used for measuring the high-temperature grinding temperature of the workpiece, can measure the highest temperature of a grinding interface and the grinding temperature at different depths, and has high measurement accuracy and stability.
The above is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and any technical means which can achieve the object of the present invention by basically the same means is within the scope of the present invention.
Claims (8)
1. A grinding temperature measuring method is characterized by comprising the following steps:
s1, performing first electric spark punching on the workpiece by adopting a puncher of a tubular electrode to form a blind hole with a columnar metal tumor;
s2, performing secondary electric spark punching on the blind hole with the columnar metal tumor by using a puncher of the columnar electrode to eliminate the columnar metal tumor;
s3, placing the thermocouple into the blind hole, and enabling the thermocouple to be tightly attached to the bottom in the blind hole through the adhesive;
s4, after the adhesive is solidified, putting the workpiece into a constant temperature box for heat preservation for 2 hours, setting the temperature at 150 ℃, and then waiting for the workpiece to be naturally cooled;
s5, connecting the thermocouple to a high-speed temperature acquisition card through a shielding signal wire;
and S6, grinding the workpiece and measuring the temperature signal.
2. A grinding temperature measuring method according to claim 1, characterized in that: when the electric spark drilling is performed in step S1 or S2, high-pressure water is injected into the hole, and the chip can be discharged while being processed by the pressure of the high-pressure water.
3. A grinding temperature measuring method according to claim 1, characterized in that: the thickness between the bottom of the blind hole formed by the electric spark drilling in the step S1 or S2 and the surface of the workpiece is 1 mm.
4. A grinding temperature measuring method according to claim 1, characterized in that: in the step S1, the diameter of the tubular electrode is 600 micrometers, the diameter of the cylindrical electrode is 500 micrometers, and the aperture of the blind hole is 680 micrometers.
5. A grinding temperature measuring method according to claim 1, characterized in that: the adhesive in the step S3 is glue of type 920.
6. A grinding temperature measuring method according to claim 1, characterized in that: and in the step S4, after the glue is solidified for four hours, the workpiece is placed in a constant temperature box for heat preservation treatment.
7. A grinding temperature measuring method according to claim 1, characterized in that: the constant temperature box in the step S4 is an electric heating blast box or an electric heating constant temperature drying box.
8. A grinding temperature measuring method according to claim 1, characterized in that: in the step S5, a shielding copper wire is wound around the bare wire of the thermocouple, a layer of insulating tape is wrapped around the bare wire, and the bare wire of the thermocouple is connected to the high-speed temperature acquisition card through a shielding extension wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992329.9A CN109238493B (en) | 2018-08-29 | 2018-08-29 | Grinding temperature measuring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992329.9A CN109238493B (en) | 2018-08-29 | 2018-08-29 | Grinding temperature measuring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109238493A CN109238493A (en) | 2019-01-18 |
| CN109238493B true CN109238493B (en) | 2020-06-02 |
Family
ID=65069652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810992329.9A Active CN109238493B (en) | 2018-08-29 | 2018-08-29 | Grinding temperature measuring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109238493B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328614A (en) * | 2019-07-08 | 2019-10-15 | 湖南科技大学 | A kind of internal grinding thermometry |
| CN111693568A (en) * | 2020-06-10 | 2020-09-22 | 顺帆家庭用品(南通)有限公司 | Automatic detection method for heat preservation performance detection of thermos bottle liner |
| CN111906693B (en) * | 2020-07-27 | 2022-02-08 | 郑州磨料磨具磨削研究所有限公司 | Grinding arc area thermal power integrated measurement device and method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0875559A (en) * | 1994-09-08 | 1996-03-22 | Souzou Kagaku:Kk | Mechanism for securing temperature measuring sensor to semiconductor substrate |
| CN2422082Y (en) * | 2000-04-28 | 2001-03-07 | 太原重型机械(集团)有限公司 | Tool for removing rag |
| CN102128692A (en) * | 2010-11-24 | 2011-07-20 | 南京林业大学 | End-face-sealed friction surface temperature measuring method |
| CN102234832A (en) * | 2011-06-30 | 2011-11-09 | 清华大学 | Precise controllable electrolysis removal technology for burrs on inner bore intersection line of mechanical metal part |
| CN102284793A (en) * | 2010-05-04 | 2011-12-21 | 西门子公司 | Laser drilling without burr formation |
| CN102922044A (en) * | 2012-11-21 | 2013-02-13 | 铜陵市永生机电制造有限责任公司 | Tool for removing bottom burr of deep blind hole |
| CN104325373A (en) * | 2014-11-04 | 2015-02-04 | 苏州昌田机械设备制造有限公司 | Deburring device for blind hole in wheel rim |
-
2018
- 2018-08-29 CN CN201810992329.9A patent/CN109238493B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0875559A (en) * | 1994-09-08 | 1996-03-22 | Souzou Kagaku:Kk | Mechanism for securing temperature measuring sensor to semiconductor substrate |
| CN2422082Y (en) * | 2000-04-28 | 2001-03-07 | 太原重型机械(集团)有限公司 | Tool for removing rag |
| CN102284793A (en) * | 2010-05-04 | 2011-12-21 | 西门子公司 | Laser drilling without burr formation |
| CN102128692A (en) * | 2010-11-24 | 2011-07-20 | 南京林业大学 | End-face-sealed friction surface temperature measuring method |
| CN102234832A (en) * | 2011-06-30 | 2011-11-09 | 清华大学 | Precise controllable electrolysis removal technology for burrs on inner bore intersection line of mechanical metal part |
| CN102922044A (en) * | 2012-11-21 | 2013-02-13 | 铜陵市永生机电制造有限责任公司 | Tool for removing bottom burr of deep blind hole |
| CN104325373A (en) * | 2014-11-04 | 2015-02-04 | 苏州昌田机械设备制造有限公司 | Deburring device for blind hole in wheel rim |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109238493A (en) | 2019-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109238493B (en) | Grinding temperature measuring method | |
| CN104359393B (en) | A kind of strain gauge and its manufacture and installation method | |
| CN102398220A (en) | Device for measuring temperature of grinding area during plane grinding | |
| CN104731126B (en) | A kind of temperature control method based on integrated form Dewar component temperature variation testing refrigeration structure | |
| CN104942318B (en) | A kind of intelligent transient state cutting thermometric cutter, preparation method and its temp measuring method | |
| CN110021459B (en) | Embedded optical fiber superconducting strip and preparation method thereof | |
| CN109524321A (en) | A kind of measurement method of bond strength and bonded wafer using the measurement method | |
| CN202066612U (en) | Grindable semi-artifical thermocouple measurement device for grinding surface temperature | |
| CN104792440A (en) | Method of testing three-dimensional residual stress inside laser material increase manufacturing part | |
| CN113218875B (en) | Laser ultrasonic measurement method for residual stress of metal additive manufacturing part | |
| CN104075830B (en) | A kind of large scale grinding wafer residual stress test method | |
| CN104280294A (en) | Dynamic temperature measuring device in high-temperature breaking strength tensile test | |
| CN108279169B (en) | Test method and device for monitoring fracture-cavity rock fracturing process by using acoustic emission | |
| CN103639895B (en) | A kind of grinding temperature measuring method based on Inverse Heat Conduction Problem Analysis | |
| CN102501173A (en) | Method for measuring temperature of grinding region of surface grinding | |
| CN110455426A (en) | A kind of measurement of furnace temperature blank and temperature uniformity measurement method | |
| CN111152159B (en) | Large interference assembling process for rotary explosive chamber and inner chamber | |
| CN104446508A (en) | Method for reducing warping degree of NFC magnetic substrate | |
| CN103643014A (en) | Shape correction method for aeroengine support front sealing component matrix inner ring | |
| CN107717169A (en) | The high speed acquisition device and method of testing of a kind of resistance brazing welding temperature | |
| CN104764669B (en) | Ceramic test piece hot machining experimental provision | |
| CN202317994U (en) | Temperature measurer for grinding region in plane grinding | |
| CN209197923U (en) | A kind of metal works welding temperature field measurement device of registration | |
| CN110470200B (en) | Method for detecting cobalt removal depth of diamond compact | |
| CN112986325A (en) | Method and device for measuring welding thermal cycle curve |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |