CN212809127U

CN212809127U - Electronic component geomantic omen high efficiency combines radiator

Info

Publication number: CN212809127U
Application number: CN202021729446.5U
Authority: CN
Inventors: 葛兵
Original assignee: Suzhou Dingqian Energy Industry Co ltd
Current assignee: Suzhou Dingqian Energy Industry Co ltd
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2021-03-26
Anticipated expiration: 2030-08-18

Abstract

The utility model discloses an electronic component geomantic omen high efficiency combines radiator, including protection frame, heat radiation fins, ring frame, chip body and disc frame, the inside of disc frame is equipped with the chip body, and the bottom and the disc frame fixed connection of chip body to ring frame is installed to the disc frame top of chip body one side, the top and the ring frame fixed connection of disc frame, the ring frame top of chip body top is equipped with heat radiation fins, and heat radiation fins's bottom installs four group's chip cassette to the top and the heat radiation fins fixed connection of chip cassette, be equipped with the protection frame on the heat radiation fins outer wall of chip cassette one side, and the inner wall and the heat radiation fins fixed connection of protection frame. The utility model discloses not only realized that geomantic omen combines high-efficient radiator to the heat dissipation of electronic component efficient, prevented that electronic component heat dissipation inequality from arousing that local temperature is too high to cause the damage, improved the stability when geomantic omen high-efficient combination radiator uses moreover.

Description

Electronic component geomantic omen high efficiency combines radiator

Technical Field

The utility model relates to a geomantic omen is high-efficient to combine radiator technical field, specifically is a high-efficient radiator that combines of electronic component geomantic omen.

Background

In order to ensure that electronic equipment such as a computer normally works at a reasonable temperature, the heat-emitting end of an electronic element is generally required to be contacted, radiated and cooled, most of the existing radiators are made into a plate shape by aluminum alloy, brass or bronze, the plate shape is flaky, multiple sheets and the like are combined with a fan to radiate the electronic element, along with the continuous development of electronic technology, the heat flow of a chip is rapidly improved, the air-cooling radiating mode of the traditional structure is more and more difficult to meet the radiating requirement, and the electronic element needs to be efficiently combined with a radiator to radiate the heat in order to ensure the stable operation of the electronic element.

The air-water efficient combination radiator on the market is various and can basically meet the use requirements of people, but certain problems still exist, and the following points exist in the concrete problems:

(1) when the existing wind-water efficient combined radiator is used, the wind-water efficient combined radiator is generally inconvenient to efficiently radiate electronic elements, so that the radiating effect of the wind-water efficient combined radiator is seriously influenced;

(2) when the existing wind-water efficient combined radiator is used, the electronic elements are generally inconvenient to radiate in all directions, so that the reliability of the wind-water efficient combined radiator is greatly influenced;

(3) the existing wind-water efficient combined radiator is generally inconvenient for the close fitting installation of the wind-cooling radiator and an electronic element when in use, thereby bringing great trouble to people.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic component geomantic omen high efficiency combines radiator to it is not convenient for geomantic omen to combine high-efficient radiator to the heat dissipation of electronic component efficient to solve among the above-mentioned background art, to the heat dissipation of electronic component omnidirectional, is not convenient for the problem of forced air cooling radiator and the inseparable laminating installation of electronic component.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic component geomantic omen high efficiency combines radiator, includes protection frame, heat radiation fins, ring frame, chip body and disc holder, the inside of disc holder is equipped with the chip body, and the bottom and the disc holder fixed connection of chip body to the ring frame is installed to the disc holder top of chip body one side, and the top and the ring frame fixed connection of disc holder, the ring frame top of chip body top is equipped with heat radiation fins, and heat radiation fins's bottom installs four groups of chip cassette to the top and the heat radiation fins fixed connection of chip cassette, be equipped with the protection frame on the heat radiation fins outer wall of chip cassette one side, and the inner wall and the heat radiation fins fixed connection of protection frame.

Preferably, an annular gasket is installed at the bottom end of the disc frame below the chip body, the top end of the annular gasket is fixedly connected with the disc frame, a support frame is installed at the bottom end of the annular gasket below the disc frame, aluminum fins are arranged inside the support frame, the outer walls of the aluminum fins are fixedly connected with the support frame, a retainer is installed at one end, away from the aluminum fins, of the support frame, a fan is arranged inside the retainer, the outer walls of the fan are fixedly connected with the retainer, and therefore the heat on the surface of the electronic component is greatly reduced.

Preferably, be equipped with annular aluminum sheet on the ring frame outer wall of chip body one side, and the inside of annular aluminum sheet is equipped with serpentine pipeline to serpentine pipeline's outer wall and annular aluminum sheet fixed connection have realized serpentine pipeline structure's stable connection.

Preferably, be fixed with two sets of switching mouths on the annular aluminum sheet outer wall of serpentine pipeline one side, and be equipped with the outlet pipe on the annular frame outer wall of switching mouth one side to the one end and the switching mouth fixed connection of outlet pipe are fixed with the inlet tube on the annular frame outer wall of outlet pipe one side, and the one end and the switching mouth fixed connection of inlet tube have improved electronic component's life.

Preferably, the inside of support frame is equipped with four groups of connecting rods, and the one end of connecting rod extends to inside and the annular frame fixed connection of annular frame to be fixed with the locking on the connecting rod outer wall of support frame one side and detain, realized the inseparable laminating installation of forced air cooling radiator and electronic component.

Preferably, the outer wall of the connecting rod on one side of the locking buckle is sleeved with a gasket body, the outer wall of the connecting rod on one side of the gasket body is sleeved with a spring, one end of the spring is fixedly connected with the gasket body, and the other end of the spring is fixedly connected with the annular frame, so that damage caused by overhigh local temperature due to uneven heat dissipation of the electronic element is prevented.

Compared with the prior art, the beneficial effects of the utility model are that: the wind-water high-efficiency combined radiator not only realizes the high-efficiency heat dissipation of the wind-water combined high-efficiency radiator on the electronic element, prevents the damage caused by overhigh local temperature due to uneven heat dissipation of the electronic element, but also improves the stability of the wind-water high-efficiency combined radiator when in use;

(1) the annular frame, the disc frame and the annular gasket are installed and fixed together by workers, four groups of chip bodies are placed in the disc frame, when the chip bodies work for a long time, a large amount of heat is generated, the aluminum fins conduct heat to the chip bodies under the support of the support frame, the fan is turned on by an external signal, the fan blows the aluminum fins to dissipate heat under the support of the support frame so as to accelerate the air cooling heat dissipation of the chip bodies, an external cooling liquid pipeline is communicated with the water inlet pipe and the water outlet pipe, an external water source enters the inside of the serpentine pipeline through the water inlet pipe under the support of the annular frame, heat exchange is carried out under the support of the annular aluminum sheet, high-temperature water in the serpentine pipeline flows into the water outlet pipe through the adapter port, the high-temperature water is conveyed to an external cooling box by the water outlet pipe to cool and dissipate heat, and the efficient, the heat on the surface of the electronic element is greatly reduced, and the service life of the electronic element is prolonged;

(2) the protective frame and the radiating fins are installed together, the radiating fins are fixedly connected with the annular frame, part of heat of the chip body is transmitted to the inner parts of the radiating fins through the chip clamping seat, the radiating fins perform secondary heat radiation on the chip body to reduce the temperature of the chip body, meanwhile, the protective frame and the radiating fins are fixed together, the protective frame performs external installation and fixation on the chip body, and the chip body is protected safely, so that the air and water are efficiently combined with the radiator to radiate the electronic element in an all-round way, the protection function of the outside of the electronic element is increased, and the stable operation of the electronic element is ensured;

(3) through the inside of penetrating the support frame with four groups of connecting rods, fix connecting rod and ring frame, the surface cover of connecting rod is equipped with spring and gasket body, it fixes connecting rod and support frame to detain by the locking, under the support of gasket body, carry out elastic support to support frame and ring frame by four groups of springs, make aluminium system fin and chip body carry out inseparable laminating, the inside to aluminium system fin with the even transmission of the heat of chip body inside, the inseparable laminating installation of air-cooled radiator and electronic component has been realized, electronic component heat dissipation inequality has been prevented from arousing local high temperature and causing the damage, stability when having improved the high-efficient radiator that combines of geomantic omen and using.

Drawings

Fig. 1 is a schematic view of a three-dimensional explosion section structure of the present invention;

fig. 2 is a schematic view of the three-dimensional cross-sectional structure of the present invention;

FIG. 3 is a schematic side view of the ring frame of the present invention;

FIG. 4 is a schematic top view of the ring frame of the present invention;

fig. 5 is a schematic side view of the cross-sectional structure of the present invention.

In the figure: 1. a protective frame; 2. heat dissipation fins; 3. an annular frame; 4. a chip body; 5. an annular gasket; 6. aluminum fins; 7. a support frame; 8. a fan; 9. a holder; 10. a disc frame; 11. a water inlet pipe; 12. a water outlet pipe; 13. a chip card holder; 14. a spring; 15. an annular aluminum sheet; 16. a gasket body; 17. a locking buckle; 18. a connecting rod; 19. a serpentine conduit; 20. an adapter.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides an embodiment: a wind-water efficient combination radiator for electronic elements comprises a protective frame 1, radiating fins 2, an annular frame 3, a chip body 4 and a disc frame 10, wherein the chip body 4 is arranged inside the disc frame 10, the bottom end of the chip body 4 is fixedly connected with the disc frame 10, the annular frame 3 is arranged at the top end of the disc frame 10 on one side of the chip body 4, the top end of the disc frame 10 is fixedly connected with the annular frame 3, the radiating fins 2 are arranged at the top end of the annular frame 3 above the chip body 4, four groups of chip clamping seats 13 are arranged at the bottom ends of the radiating fins 2, the top ends of the chip clamping seats 13 are fixedly connected with the radiating fins 2, the protective frame 1 is arranged on the outer wall of the radiating fins 2 on one side of the chip clamping seats 13, and the inner wall of the protective frame 1;

when the protective frame is used, the protective frame 1 and the radiating fins 2 are installed together, the radiating fins 2 are fixedly connected with the annular frame 3, part of heat of the chip body 4 is transmitted to the inside of the radiating fins 2 through the chip clamping seat 13, the chip body 4 is radiated again through the radiating fins 2 to reduce the temperature of the chip body 4, meanwhile, the protective frame 1 and the radiating fins 2 are fixed together, the chip body 4 is installed and fixed outside through the protective frame 1, and the chip body 4 is protected safely, so that the wind-water efficient combined radiator can radiate the electronic element in all directions, the protective function of the outside of the electronic element is increased, and the stable operation of the electronic element is ensured;

the bottom end of a disc frame 10 below the chip body 4 is provided with an annular gasket 5, the top end of the annular gasket 5 is fixedly connected with the disc frame 10, the bottom end of the annular gasket 5 below the disc frame 10 is provided with a support frame 7, an aluminum fin 6 is arranged inside the support frame 7, the outer wall of the aluminum fin 6 is fixedly connected with the support frame 7, one end, far away from the aluminum fin 6, of the support frame 7 is provided with a retainer 9, a fan 8 is arranged inside the retainer 9, and the outer wall of the fan 8 is fixedly connected with the retainer 9;

the outer wall of the annular frame 3 on one side of the chip body 4 is provided with an annular aluminum sheet 15, a snake-shaped pipeline 19 is arranged inside the annular aluminum sheet 15, the outer wall of the snake-shaped pipeline 19 is fixedly connected with the annular aluminum sheet 15, the outer wall of the annular aluminum sheet 15 on one side of the snake-shaped pipeline 19 is fixedly provided with two groups of switching ports 20, the outer wall of the annular frame 3 on one side of the switching ports 20 is provided with a water outlet pipe 12, one end of the water outlet pipe 12 is fixedly connected with the switching ports 20, the outer wall of the annular frame 3 on one side of the water outlet pipe 12 is fixedly provided with a water inlet pipe;

when the cooling device is used, the annular frame 3, the disc frame 10 and the annular gasket 5 are installed and fixed together by workers, four groups of chip bodies 4 are placed in the disc frame 10, when the chip bodies 4 generate a large amount of heat during long-time work, the aluminum fins 6 conduct heat to the chip bodies 4 under the support of the support frame 7, the fan 8 is turned on by an external signal, the fan 8 blows air to the aluminum fins 6 to dissipate the heat under the support of the support frame 9 so as to accelerate the air cooling heat dissipation of the chip bodies 4, an external cooling liquid pipeline is communicated with the water inlet pipe 11 and the water outlet pipe 12, an external water source enters the inside of the serpentine pipeline 19 from the water inlet pipe 11 under the support of the annular aluminum sheet 15 to exchange heat, high-temperature water in the serpentine pipeline 19 flows into the inside of the water outlet pipe 12 through the adapter port 20, and is conveyed to an external cooling box by the water outlet pipe 12 to perform, the wind-water combined efficient radiator can efficiently radiate the electronic element, greatly reduce the heat on the surface of the electronic element and prolong the service life of the electronic element;

four groups of connecting rods 18 are arranged in the support frame 7, one ends of the connecting rods 18 extend into the annular frame 3 and are fixedly connected with the annular frame 3, a locking buckle 17 is fixed on the outer wall of the connecting rod 18 on one side of the support frame 7, a gasket body 16 is sleeved on the outer wall of the connecting rod 18 on one side of the locking buckle 17, a spring 14 is sleeved on the outer wall of the connecting rod 18 on one side of the gasket body 16, one end of the spring 14 is fixedly connected with the gasket body 16, and the other end of the spring 14 is fixedly connected with the annular frame 3;

when the air-cooled radiator is used, the four groups of connecting rods 18 penetrate into the support frame 7, the connecting rods 18 are fixed with the annular frame 3, the springs 14 and the gasket body 16 are sleeved on the surfaces of the connecting rods 18, the connecting rods 18 are fixed with the support frame 7 through the locking buckles 17, the support frame 7 and the annular frame 3 are elastically supported by the four groups of springs 14 under the support of the gasket body 16, so that the aluminum fin 6 and the chip body 4 are tightly attached, the heat inside the chip body 4 is uniformly transmitted to the inside of the aluminum fin 6, the air-cooled radiator and an electronic element are tightly attached and installed, the damage caused by overhigh local temperature due to nonuniform heat dissipation of the electronic element is prevented, and the stability of the air-water efficient radiator during use is improved.

The working principle is as follows: when the cooling device is used, an external power supply is connected, firstly, the annular frame 3, the disc frame 10 and the annular gasket 5 are installed and fixed together by a worker, four groups of chip bodies 4 are placed in the disc frame 10, when the chip bodies 4 generate a large amount of heat during long-time work, the aluminum fins 6 conduct heat to the chip bodies 4 under the support of the support frame 7, the fan 8 is turned on by an external signal, the fan 8 conducts blowing heat dissipation to the aluminum fins 6 under the support of the support frame 9 to accelerate the air cooling heat dissipation of the chip bodies 4, an external cooling liquid pipeline is communicated with the water inlet pipe 11 and the water outlet pipe 12, an external water source enters the inside of the serpentine pipeline 19 from the water inlet pipe 11 under the support of the annular aluminum sheet 15 to conduct heat exchange, high-temperature water in the serpentine pipeline 19 flows into the inside of the water outlet pipe 12 through the adapter port 20, and is conveyed to an external cooling box by the water outlet pipe 12, the wind-water combined efficient radiator can realize efficient heat dissipation of electronic elements, greatly reduce the heat on the surface of the electronic elements and prolong the service life of the electronic elements, then the protective frame 1 and the heat dissipation fins 2 are installed together, the heat dissipation fins 2 are fixedly connected with the annular frame 3, part of heat of the chip body 4 is transmitted to the inner parts of the heat dissipation fins 2 through the chip clamping seat 13, the chip body 4 is subjected to secondary heat dissipation through the heat dissipation fins 2 to reduce the temperature of the chip body 4, meanwhile, the protective frame 1 and the heat dissipation fins 2 are fixed together, the protective frame 1 is used for externally installing and fixing the chip body 4, and plays a role of safety protection on the chip body 4, the wind-water combined efficient radiator can realize all-round heat dissipation on the electronic elements, the protective function on the outer parts of the electronic elements is increased, the stable operation of the electronic elements is ensured, and then the four groups of connecting rods 18 are penetrated into the supporting, fixing connecting rod 18 and ring frame 3, the surface cover of connecting rod 18 is equipped with spring 14 and gasket body 16, it is fixed with connecting rod 18 and support frame 7 by locking buckle 17, under gasket body 16's support, carry out elastic support to support frame 7 and ring frame 3 by four group's springs 14, make aluminium fin 6 carry out inseparable laminating with chip body 4, the inside of heat homogeneous transmission aluminium fin 6 of chip body 4 inside, realize the installation of laminating that air-cooled radiator and electronic component are inseparable, prevent that the uneven local high temperature that arouses of electronic component heat dissipation from causing the damage, stability when improving geomantic omen high-efficient combination radiator and using the work, accomplish geomantic omen high-efficient combination radiator.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an electronic component geomantic omen high efficiency combines radiator, includes protection frame (1), heat radiation fins (2), ring frame (3), chip body (4) and disc holder (10), its characterized in that: the chip packaging structure is characterized in that a chip body (4) is arranged inside the disc frame (10), the bottom end of the chip body (4) is fixedly connected with the disc frame (10), the top end of the disc frame (10) on one side of the chip body (4) is provided with an annular frame (3), the top end of the disc frame (10) is fixedly connected with the annular frame (3), the top end of the annular frame (3) above the chip body (4) is provided with heat dissipation fins (2), four groups of chip clamping seats (13) are arranged at the bottom ends of the heat dissipation fins (2), the top ends of the chip clamping seats (13) are fixedly connected with the heat dissipation fins (2), a protection frame (1) is arranged on the outer wall of the heat dissipation fins (2) on one side of the chip clamping seats (13), and the inner wall of the protection frame (1) is fixedly.

2. The wind-water high-efficiency combined heat radiator for the electronic components as claimed in claim 1, wherein: annular gasket (5) are installed to disc frame (10) bottom of chip body (4) below, and the top and disc frame (10) fixed connection of annular gasket (5) to support frame (7) are installed to annular gasket (5) bottom of disc frame (10) below, the inside of support frame (7) is equipped with aluminium system fin (6), and the outer wall and support frame (7) fixed connection of aluminium system fin (6), and support frame (7) keep away from the one end of aluminium system fin (6) and install holder (9), the inside of holder (9) is equipped with fan (8), and the outer wall and holder (9) fixed connection of fan (8).

3. The wind-water high-efficiency combined heat radiator for the electronic components as claimed in claim 1, wherein: the outer wall of the annular frame (3) on one side of the chip body (4) is provided with an annular aluminum sheet (15), the inside of the annular aluminum sheet (15) is provided with a serpentine pipeline (19), and the outer wall of the serpentine pipeline (19) is fixedly connected with the annular aluminum sheet (15).

4. The wind-water high-efficiency combined heat radiator for the electronic components as claimed in claim 3, wherein: the improved water supply device is characterized in that two sets of switching ports (20) are fixed on the outer wall of the annular aluminum sheet (15) on one side of the snake-shaped pipeline (19), a water outlet pipe (12) is arranged on the outer wall of the annular frame (3) on one side of the switching ports (20), one end of the water outlet pipe (12) is fixedly connected with the switching ports (20), a water inlet pipe (11) is fixed on the outer wall of the annular frame (3) on one side of the water outlet pipe (12), and one end of the water inlet pipe (11) is fixedly connected with the switching ports (.

5. The wind-water high-efficiency combined heat radiator for the electronic components as claimed in claim 2, wherein: the inside of support frame (7) is equipped with four groups of connecting rods (18), and the one end of connecting rod (18) extends to the inside and the ring frame (3) fixed connection of ring frame (3) to be fixed with on the connecting rod (18) outer wall of support frame (7) one side and lock and detain (17).

6. The wind-water high-efficiency combined heat radiator for the electronic components as claimed in claim 5, wherein: the outer wall of the connecting rod (18) on one side of the locking buckle (17) is sleeved with a gasket body (16), the outer wall of the connecting rod (18) on one side of the gasket body (16) is sleeved with a spring (14), one end of the spring (14) is fixedly connected with the gasket body (16), and the other end of the spring (14) is fixedly connected with the annular frame (3).