CN212805504U - Light emitting module and vehicle lamp - Google Patents

Light emitting module and vehicle lamp Download PDF

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Publication number
CN212805504U
CN212805504U CN202021331697.8U CN202021331697U CN212805504U CN 212805504 U CN212805504 U CN 212805504U CN 202021331697 U CN202021331697 U CN 202021331697U CN 212805504 U CN212805504 U CN 212805504U
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China
Prior art keywords
light emitting
light
mounting surface
distribution pattern
emitting element
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CN202021331697.8U
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Chinese (zh)
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市川知幸
原崎正人
伊东徹
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Koito Manufacturing Co Ltd
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Koito Manufacturing Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25—Projection lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/60—Circuit arrangements for operating LEDs comprising organic material, e.g. for operating organic light-emitting diodes [OLED] or polymer light-emitting diodes [PLED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles

Abstract

The utility model provides a can realize the novel light emitting module and the vehicle lamp of the miniaturization that help the vehicle lamp of a plurality of grading. The light emitting module has: a first light source which emits light forming a first light distribution pattern and is configured by at least one first semiconductor light emitting element; a second light source which emits light forming a second light distribution pattern and is composed of at least one second semiconductor light emitting element; a lighting control circuit that controls lighting of each semiconductor light emitting element; and a heat sink having a first element mounting surface on which the first semiconductor light emitting element can be mounted, a second element mounting surface on which the second semiconductor light emitting element can be mounted, and a circuit mounting surface on which the lighting control circuit can be mounted. The circuit mounting surface is formed to be orthogonal or inclined with respect to the first element mounting surface, which is a surface different from the second element mounting surface.

Description

Light emitting module and vehicle lamp
Technical Field
The utility model relates to a light emitting module.
Background
Conventionally, a technology has been developed in which a semiconductor light Emitting element such as an led (light Emitting diode) is used as a light source in a vehicle lamp. In such a vehicle lamp, a circuit for controlling lighting of the semiconductor light emitting element may be necessary. Therefore, the following light emitting module is proposed: the semiconductor light-emitting device includes a semiconductor light-emitting element, a lighting control circuit for controlling lighting of the semiconductor light-emitting element, and a heat sink having an element mounting surface on which the semiconductor light-emitting element can be mounted and a circuit mounting surface on which the lighting control circuit can be mounted (see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2012 & 74217
SUMMERY OF THE UTILITY MODEL
Problem to be solved by the utility model
On the other hand, the number of components is increased by electrification and multi-functionalization of vehicles, and downsizing and space saving are also required for vehicle lamps in accordance with the requirements of the layout of components and the degree of freedom in vehicle design. However, the light emitting module described in the above patent document is mainly a light emitting module that forms a light distribution pattern for low beam, and cannot form light distributions for both low beam and high beam.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a novel light emitting module that can realize a plurality of light distributions and contributes to downsizing of a vehicle lamp.
Means for solving the problems
In order to solve the above problem, the light emitting module according to one embodiment of the present invention includes: a first light source which emits light forming a first light distribution pattern and is configured by at least one first semiconductor light emitting element; a second light source which emits light forming a second light distribution pattern different from the first light distribution pattern and is composed of at least one second semiconductor light emitting element; a lighting control circuit that controls lighting of the first semiconductor light emitting element and the second semiconductor light emitting element; and a heat sink having a first element mounting surface on which the first semiconductor light emitting element can be mounted, a second element mounting surface on which the second semiconductor light emitting element can be mounted, and a circuit mounting surface on which the lighting control circuit can be mounted. The circuit mounting surface is formed to be orthogonal or inclined with respect to at least one of the first element mounting surface and the second element mounting surface, and the first element mounting surface is a surface different from the second element mounting surface.
According to this aspect, since the plurality of light sources configured to be capable of forming the plurality of light distribution patterns and the lighting control circuit that controls lighting of the plurality of light sources are mounted on one heat sink, the light emitting module can be downsized.
The first element mounting surface may be formed such that the orientation of the light emitting surface of the first semiconductor light emitting element mounted thereon is different from the orientation of the light emitting surface of the second semiconductor light emitting element mounted on the second element mounting surface. This enables light to be emitted in a plurality of directions, and thus a plurality of light distributions can be formed.
The first light source may have a luminance of 300 to 2000[ lm ], consume an electric power of 3 to 20[ W ], and emit light for forming a low-beam light distribution pattern as a first light distribution pattern. The second light source may have a luminance of 150 to 1300[ lm ], consume electric power of 1.5 to 13[ W ], and emit light for forming a light distribution pattern for high beam as a second light distribution pattern.
The surface area of the heat dissipation plate may be 16 to 200 cm2]And a thickness of 1 to 5[ mm ]]Aluminum plate. Thus, a small heat sink can be realized.
The circuit board provided with the lighting control circuit may be provided with a card edge connector at an edge portion, and the heat sink may be formed with a notch into which a socket to be fitted with the card edge connector enters. Thus, the circuit board can be brought closer to the heat sink without interfering with the heat sink in a state where the socket is fitted to the card edge connector.
The light emitting module may further include a shield that covers the lighting control circuit to suppress electromagnetic noise from leaking to the outside. The shield may have a locking portion that is locked to a part of the receptacle so that the card edge connector fitted to the receptacle does not come off. Thus, even if the socket is not provided with a special design, the socket can be prevented from falling off by the shielding piece.
Another aspect of the present invention is a vehicle lamp. The vehicle lamp includes: the above light emitting module; a first reflector that reflects light emitted from the first semiconductor light emitting element toward the front of the vehicle to form a low-beam light distribution pattern; and a second reflector that reflects light emitted from the second semiconductor light emitting element toward the front of the vehicle to form a light distribution pattern for high beam. The heat sink may have a first element mounting surface formed so that the light emitting surface of the first semiconductor light emitting element faces upward, and a second element mounting surface formed so that the light emitting surface of the second semiconductor light emitting element faces downward.
According to this aspect, in the vehicle lamp capable of forming the light distribution pattern for low beam and the light distribution pattern for high beam, the plurality of light sources and the lighting control circuit that controls lighting of the plurality of light sources are mounted on one heat dissipation plate, and therefore the vehicle lamp can be downsized.
The vehicle lamp may further include: an opening portion formed between the first reflector and the second reflector and into which a portion of the light emitting module is inserted; and a guide portion formed from the opening portion toward the front of the vehicle. Thus, the light emitting module can be mounted at a predetermined position with respect to each reflector by inserting the light emitting module through the opening.
Another aspect of the present invention is a lamp for a vehicle. The vehicle lamp may include: the above light emitting module; a reflector that reflects light emitted from the first light source toward the front of the vehicle to form a low-beam light distribution pattern; and a lens that transmits light emitted from the second light source toward the front of the vehicle to form a light distribution pattern for high beam. The heat sink may have a first element mounting surface formed such that the light emitting surface of the first semiconductor light emitting element faces upward, and a second element mounting surface formed such that the light emitting surface of the second semiconductor light emitting element faces forward of the vehicle.
According to this aspect, in the vehicle lamp capable of forming the light distribution pattern for low beam and the light distribution pattern for high beam, the plurality of light sources and the lighting control circuit that controls lighting of the plurality of light sources are mounted on one heat dissipation plate, and therefore the vehicle lamp can be downsized.
The second light source may have a smaller output than the first light source when forming the light distribution pattern for high beam. Thereby, the number of semiconductor light emitting elements in the second light source can be reduced, or a low-output semiconductor light emitting element can be used. Further, the heat sink can be made smaller and thinner by suppressing heat generation by the second light source.
In addition, any combination of the above-described constituent elements, or an embodiment obtained by changing the expression form of the present invention between the method, the apparatus, the system, and the like is also effective as an embodiment of the present invention.
Effect of the utility model
According to the present invention, a novel light emitting module that can realize a plurality of light distributions and that contributes to miniaturization of a vehicle lamp can be provided.
Drawings
Fig. 1 is a side view showing a schematic configuration of a vehicle headlamp according to a first embodiment.
Fig. 2 is a perspective view of the heat sink according to the first embodiment.
Fig. 3 is a perspective view showing a schematic configuration of a light emitting module according to the first embodiment.
Fig. 4 is a partial cross-sectional view for explaining the wiring in the light emitting module according to the first embodiment.
Fig. 5 is a diagram showing an example of wiring between the lighting control circuit and each element according to the first embodiment.
Fig. 6 is a partial cross-sectional view for explaining another example of the wiring in the light emitting module according to the first embodiment.
Fig. 7 is a diagram showing another example of connection between the lighting control circuit and each element according to the first embodiment.
Fig. 8 is a side view showing a schematic configuration of a vehicle headlamp according to a second embodiment.
Fig. 9 is a partial cross-sectional view for explaining the wiring in the light-emitting module according to the second embodiment.
Fig. 10 (a) is a front view of the reflector according to the third embodiment, (b) in fig. 10 is a main part side view for explaining a case where the light-emitting module is inserted into the reflector according to the third embodiment, and (c) in fig. 10 is a main part top view for explaining a case where the light-emitting module is inserted into the reflector according to the third embodiment.
Fig. 11 is an exploded perspective view showing a schematic configuration of a light emitting module according to a fourth embodiment.
Fig. 12 is an exploded perspective view showing a schematic configuration of another light-emitting module according to the fourth embodiment.
Description of the reference numerals
10: a vehicle headlamp; 12: a light emitting module; 14: a first reflector; 16: a second reflector; 18: a first semiconductor light emitting element; 20: a first light source; 22: a second semiconductor light emitting element; 24: a second light source; 26: a lighting control circuit; 26 a: a circuit substrate; 26 b: a rim portion; 28: a heat dissipation plate; 28 a: a first component mounting surface; 28 b: a second element mounting surface; 28 c: a circuit mounting surface; 30: a connection terminal; 36: a light emitting module; 38: a heat dissipation plate; 38 a: an opening part; 42: a connection terminal; 44: a light emitting module; 50: a vehicle headlamp; 52: a light emitting module; 54: a projection lens; 56: a heat dissipation plate; 56 a: a first component mounting surface; 56 b: a second element mounting surface; 56 c: a circuit mounting surface; 56 d: an opening part; 58: a connection terminal; 60: a reflector; 60 a: an opening part; 62: a guide section; 62 a: a groove; 64: a light emitting module; 66: a card edge connector; 68: a socket; 70: a shield; 70 a: a locking part.
Detailed Description
The present invention will be described below with reference to the accompanying drawings based on embodiments. The same or equivalent components, members and processes shown in the respective drawings are denoted by the same reference numerals, and overlapping descriptions are appropriately omitted. The embodiments are not intended to limit the present invention but to exemplify the present invention, and all of the features and combinations described in the embodiments are not necessarily essential to the present invention.
In the following embodiments, a vehicle lamp such as a two-wheeled vehicle or a four-wheeled vehicle, particularly a vehicle headlamp for a two-wheeled vehicle which is required to be low in cost and space-saving will be described as an example.
(first embodiment)
Fig. 1 is a side view showing a schematic configuration of a vehicle headlamp according to a first embodiment. Fig. 2 is a perspective view of the heat sink according to the first embodiment. Fig. 3 is a perspective view showing a schematic configuration of a light emitting module according to the first embodiment.
The vehicle headlamp 10 includes a light emitting module 12, a first reflector 14, and a second reflector 16. The light emitting module 12 has: a first light source 20 that emits light forming a first light distribution pattern and is configured by at least one or more first semiconductor light emitting elements 18; a second light source 24 that emits light forming a second light distribution pattern and is configured by at least one or more second semiconductor light emitting elements 22; a lighting control circuit 26 that controls lighting of the first semiconductor light emitting element 18 and the second semiconductor light emitting element 22; and a heat sink plate 28.
Examples of the semiconductor Light Emitting element include an LED, an LD (Laser Diode), and an oled (organic Light Emitting Diode). The reflecting surface of the first reflector 14 is configured to reflect the light L1 emitted from the first semiconductor light-emitting element 18 toward the front of the vehicle to form a low-beam light distribution pattern. Similarly, the reflection surface of the second reflector 16 is configured to reflect the light L2 emitted from the second semiconductor light emitting element 22 toward the front of the vehicle to form a light distribution pattern for high beam.
The heat sink 28 has a first element mounting surface 28a on which the first semiconductor light emitting element 18 can be mounted, a second element mounting surface 28b on which the second semiconductor light emitting element 22 can be mounted, and a circuit mounting surface 28c on which the lighting control circuit 26 can be mounted. The heat sink 28 is preferably made of an inexpensive material having high heat dissipation, and has a thickness of 1 to 5[ mm ], for example]The aluminum sheet of (3) has good thermal conductivity. The width W1 of the heat sink 28 may be 50 to 80mm, the length D1 of the circuit mounting surface 28c may be 80 to 120mm, and the length D2 of the first component mounting surface 28a (second component mounting surface 28b) may be in the range of 30 to 50 mm. Alternatively, the surface area of the heat dissipating plate 28 may be 16 to 200[ cm ] in length2]. Thus, a small heat sink can be realized.
Further, the heat dissipation plate 28 is formed with: a plurality of screw holes 28d through which screws used when fixing the heat dissipation plate 28 to the lamp pass; and an opening 28e through which a connection terminal for connecting the second semiconductor light-emitting element 22 and the lighting control circuit 26 disposed on the rear surface side of the circuit mounting surface 28c passes. The circuit mounting surface 28c is formed to be orthogonal or inclined with respect to at least one of the first element mounting surface 28a and the second element mounting surface 28 b.
As described above, in the light emitting module 12 according to the present embodiment, the first light source 20 and the second light source 24 capable of forming a plurality of light distribution patterns and the lighting control circuit 26 that controls lighting of the plurality of light sources are configured to be mounted on one L-shaped heat radiation plate 28. Therefore, the light emitting module 12 can be made compact and space-saving, and the length in the vehicle front-rear direction can be made compact.
The first light source 20 has a luminance of 300 to 2000[ lm ], consumes electric power of 3 to 20[ W ], and emits light L1 for forming a light distribution pattern for low beam. The second light source 24 has a luminance of 150 to 1300[ lm ], consumes electric power of 1.5 to 13[ W ], and emits light L2 for forming a light distribution pattern for high beam.
The first element mounting surface 28a is a surface different from the second element mounting surface 28b, and the orientation of the light-emitting surface of the first semiconductor light-emitting element 18 mounted thereon is different from the orientation of the light-emitting surface of the second semiconductor light-emitting element 22 mounted on the second element mounting surface 28b (in fig. 1, the opposite direction). That is, in the heat sink 28 according to the present embodiment, the first element mounting surface 28a is formed so that the light emitting surface of the first semiconductor light emitting element 18 faces upward, and the second element mounting surface 28b is formed so that the light emitting surface of the second semiconductor light emitting element 22 faces downward. This enables light to be emitted in a plurality of directions, and thus a plurality of light distributions can be formed.
Fig. 4 is a partial cross-sectional view for explaining the wiring in the light emitting module according to the first embodiment. Fig. 5 is a diagram showing an example of wiring between the lighting control circuit and each element according to the first embodiment.
As shown in fig. 4, the lighting control circuit 26 is connected to the element substrate 19 on which the first semiconductor light-emitting element 18 is mounted and the element substrate 23 on which the second semiconductor light-emitting element 22 is mounted via the connection terminals 30 and 32. In addition, in the second light source 24, a switch 34 is provided in parallel with the second semiconductor light emitting element 22. When the switch 34 is turned on in a state where current is supplied to the first light source 20 by the lighting control circuit 26, only the first semiconductor light emitting element 18 is turned on, and a low beam light distribution pattern is formed. In addition, if the switch 34 is turned off in a state where current is supplied to the first light source 20 by the lighting control circuit 26, the second semiconductor light emitting elements 22 are also turned on in addition to the first semiconductor light emitting elements 18, and a light distribution pattern for high beam is formed.
In this way, in the vehicle headlamp 10 according to the present embodiment in which the low beam light distribution pattern and the high beam light distribution pattern can be formed, the first light source 20 and the second light source 24, and the lighting control circuit 26 that controls lighting of each light source are mounted on one heat radiation plate 28, and therefore the vehicle headlamp 10 itself can be downsized.
The light-emitting module 12 according to the present embodiment includes two LED chips as the first semiconductor light-emitting element 18 and one LED chip as the second semiconductor light-emitting element 22. When forming the low-beam light distribution pattern, the vehicle headlamp 10 applies a driving current If of 0.7A and a forward voltage Vf of 3.3V to the two first semiconductor light emitting elements 18, thereby obtaining a 500-lumen beam with a power consumption of 4.4W.
When forming a light distribution pattern for high beam, the vehicle headlamp 10 applies a driving current If of 0.7A and a forward voltage Vf of 3.3V to the two first semiconductor light emitting elements 18 and the one second semiconductor light emitting element 22, and thereby obtains a light beam of 750 lumens with a consumed electric power of 6.6W.
Fig. 6 is a partial cross-sectional view for explaining another example of the wiring in the light emitting module according to the first embodiment.
The light emitting module 36 shown in fig. 6 has a different structure of the heat sink 38 than the heat sink 28 of the light emitting module 12 shown in fig. 4. Specifically, the opening 38a through which the connection terminal 42 passes is formed between the first component mounting surface 28a and the second component mounting surface 28 b. The element substrate 23 on which the second semiconductor light-emitting element 22 is mounted is connected to the element substrate 19, not to the lighting control circuit 26.
Fig. 7 is a diagram showing another example of connection between the lighting control circuit and each element according to the first embodiment. In the light emitting module 44 shown in fig. 7, the first light source 20 composed of three first semiconductor light emitting elements 18 and the second light source 24 composed of two second semiconductor light emitting elements 22 are connected to the lighting control circuit 26. Further, the switch 46 is connected in series with the first semiconductor light emitting element 18 in the first light source 20, and the switch 48 is connected in series with the second semiconductor light emitting element 22 in the second light source 24.
When the switch 48 is turned off in a state where the current is supplied to the first light source 20 by the lighting control circuit 26 (the switch 46 is turned on), only the first semiconductor light emitting element 18 is turned on, and a low-beam light distribution pattern is formed. In a state where the switch 46 is turned off and the switch 48 is turned on, the lighting control circuit 26 lights one first semiconductor light emitting element 18 and two second semiconductor light emitting elements 22, thereby forming a light distribution pattern for high beam.
When forming a low-beam light distribution pattern, the vehicle headlamp including the light emitting module 44 shown in fig. 7 applies a driving current If of 1.0A and a forward voltage Vf of 3.3V to the three first semiconductor light emitting elements 18, thereby obtaining a light flux of 1000 lumens with a power consumption of 10W.
When a light distribution pattern for high beam is formed in the vehicle headlamp including the light emitting module 44, a driving current If of 1.0A and a forward voltage Vf of 3.3V are applied to one first semiconductor light emitting element 18 and two second semiconductor light emitting elements 22, so that a beam of 1000 lumens is obtained with a power consumption of 10W.
In the light emitting module 12 and the light emitting module 44, the second light source 24 has a smaller output than the first light source 20 when forming the light distribution pattern for high beam. Thereby, the number of the second semiconductor light emitting elements 22 in the second light source 24 can be reduced, or the second semiconductor light emitting elements 22 of low output can be used. Further, by suppressing heat generation by the second light source 24, the heat sink can be made smaller and thinner.
(second embodiment)
Fig. 8 is a side view showing a schematic configuration of a vehicle headlamp according to a second embodiment. Fig. 9 is a partial cross-sectional view for explaining the wiring in the light-emitting module according to the second embodiment.
The vehicle headlamp 50 includes a light emitting module 52, a first reflector 14 that reflects light L1 emitted from the first light source 20 toward the front of the vehicle to form a low beam light distribution pattern, and a projection lens 54 that transmits light L2 emitted from the second light source 24 toward the front of the vehicle to form a high beam light distribution pattern. The heat sink 56 has a first element mounting surface 56a formed so that the light emitting surface of the first semiconductor light emitting element 18 faces upward, and a second element mounting surface 56b formed so that the light emitting surface of the second semiconductor light emitting element 22 faces the front of the vehicle.
The light emitting module 52 shown in fig. 9 has a different structure of the heat sink 56 from the heat sink 28 of the light emitting module 12 shown in fig. 4. Specifically, the openings 56d and 56e through which the connection terminal 58 passes are formed in the circuit mounting surface 56c and the second element mounting surface 56 b. The element substrate 23 on which the second semiconductor light-emitting element 22 is mounted is connected to the lighting control circuit 26 via the connection terminal 58.
In the vehicle headlamp 50 capable of forming the low beam light distribution pattern and the high beam light distribution pattern, the first light source 20 and the second light source 24, and the lighting control circuit 26 that controls the lighting of each light source are mounted on one heat radiation plate 56, so that the vehicle headlamp 50 itself can be downsized.
(third embodiment)
Fig. 10 (a) is a front view of the reflector according to the third embodiment, (b) in fig. 10 is a main part side view for explaining a case where the light-emitting module is inserted into the reflector according to the third embodiment, and (c) in fig. 10 is a main part top view for explaining a case where the light-emitting module is inserted into the reflector according to the third embodiment.
The reflector 60 including the first reflector 14 and the second reflector 16 has an opening 60a formed in a bottom portion thereof, and two guide portions 62 are provided so as to protrude toward the vehicle front side from edge portions of the opening 60 a. The guide portion 62 is formed with a groove 62a, and the rectangular plate-like portion 29 of the heat sink 28 having the first element mounting surface 28a and the second element mounting surface 28b is inserted into the groove 62a, whereby the light emitting module 12 is stably held at a predetermined position with respect to the reflector 60.
In the vehicle headlamp having the opening 60a formed between the first reflector 14 and the second reflector 16 into which a part of the light emitting module 12 is inserted and the guide 62 formed to extend from the opening 60a toward the front of the vehicle, the light emitting module 12 can be attached to the reflector 60 at a predetermined position by inserting the light emitting module 12 through the opening 60 a.
(fourth embodiment)
Fig. 11 is an exploded perspective view showing a schematic configuration of a light emitting module according to a fourth embodiment. Fig. 12 is an exploded perspective view showing a schematic configuration of another light-emitting module according to the fourth embodiment. In the light emitting module 64, the circuit board 26a provided with the lighting control circuit 26 has a card edge connector 66 formed in the edge portion 26 b. The heat dissipation plate 28 is formed with a notch 28f into which a socket 68 fitted with the card edge connector 66 enters. This prevents the socket 68 from interfering with the heat sink 28 in a state where the socket 68 is fitted to the card edge connector 66, facilitates assembly, and brings the lighting control circuit 26 closer to the heat sink 28. Further, by supplying power through the card edge connector 66, the power input connector portion can be made smaller and lower in cost.
The light emitting module 64 further includes a conductive shield 70, and the shield 70 covers the lighting control circuit 26 to suppress electromagnetic noise from leaking to the outside. The shield 70 has a locking portion 70a, and the locking portion 70a is locked to a part 68a of the receptacle 68 so that the card edge connector 66 fitted to the receptacle 68 does not fall off. Thus, even if no special design is provided for the receptacle 68, the shield 70 can prevent the receptacle 68 from coming off, thereby improving the connection reliability.
The present invention has been described above with reference to the above embodiments, but the present invention is not limited to the above embodiments, and a structure obtained by appropriately combining the structures of the embodiments or a structure obtained by replacing the structures is also included in the present invention. Further, modifications such as combinations and process sequences in the embodiments, and various design changes may be applied to the embodiments as appropriate based on the knowledge of those skilled in the art, and embodiments to which such modifications are applied are also included in the scope of the present invention.

Claims (10)

1. A light-emitting module is characterized in that,
the light emitting module has:
a first light source which emits light forming a first light distribution pattern and is configured by at least one first semiconductor light emitting element;
a second light source configured to emit light forming a second light distribution pattern different from the first light distribution pattern, the second light source being composed of at least one second semiconductor light emitting element;
a lighting control circuit that controls lighting of the first semiconductor light emitting element and the second semiconductor light emitting element; and
a heat sink having a first element mounting surface on which the first semiconductor light emitting element can be mounted, a second element mounting surface on which the second semiconductor light emitting element can be mounted, and a circuit mounting surface on which the lighting control circuit can be mounted,
the circuit mounting surface is formed to be orthogonal or inclined with respect to at least one of the first element mounting surface and the second element mounting surface,
the first element mounting surface is a surface different from the second element mounting surface.
2. The lighting module of claim 1,
the first element mounting surface is formed such that a light emitting surface of the first semiconductor light emitting element mounted thereon has a different orientation from a light emitting surface of the second semiconductor light emitting element mounted on the second element mounting surface.
3. Light emitting module according to claim 1 or 2,
the first light source has a luminance of 300 to 2000[ lm ], consumes electric power of 3 to 20[ W ], and emits light for forming a light distribution pattern for low beam as the first light distribution pattern,
the second light source has a luminance of 150 to 1300[ lm ], consumes electric power of 1.5 to 13[ W ], and emits light for forming a light distribution pattern for high beam as the second light distribution pattern.
4. The lighting module of claim 3,
the surface area of the heat dissipation plate is 16-200 cm2]And a thickness of 1 to 5[ mm ]]The aluminum plate of (1).
5. Light emitting module according to claim 1 or 2,
the circuit board on which the lighting control circuit is provided with a card edge connector at an edge portion,
the heat dissipation plate is formed with a notch into which a socket to be fitted with the card edge connector enters.
6. The lighting module of claim 5,
the light emitting module further includes a shield member that covers the lighting control circuit to suppress electromagnetic noise from leaking to the outside,
the shield has a locking portion that is locked to a part of the receptacle so that the card edge connector fitted to the receptacle does not come off.
7. A lamp for a vehicle, characterized in that,
the vehicle lamp includes:
a light emitting module according to any one of claims 1 to 6;
a first reflector that reflects light emitted from the first semiconductor light emitting element toward a front side of a vehicle to form a low-beam light distribution pattern; and
a second reflector for reflecting the light emitted from the second semiconductor light emitting element toward the front of the vehicle to form a light distribution pattern for high beam,
the heat sink has the first element mounting surface formed such that the light emitting surface of the first semiconductor light emitting element faces upward, and has the second element mounting surface formed such that the light emitting surface of the second semiconductor light emitting element faces downward.
8. The vehicular lamp according to claim 7,
the vehicle lamp further includes:
an opening portion formed between the first reflector and the second reflector and into which a portion of the light emitting module is inserted; and
and a guide portion formed to face the vehicle front from the opening portion.
9. A lamp for a vehicle, characterized in that,
the vehicle lamp includes:
a light emitting module according to any one of claims 1 to 6;
a reflector that reflects light emitted from the first light source toward a front of the vehicle to form a low-beam light distribution pattern; and
a lens for transmitting light emitted from the second light source toward the front of the vehicle to form a light distribution pattern for high beam,
the heat dissipation plate is formed with the first element mounting surface so that the light emitting surface of the first semiconductor light emitting element faces upward, and is formed with the second element mounting surface so that the light emitting surface of the second semiconductor light emitting element faces forward of the vehicle.
10. The vehicular lamp according to any one of claims 7 to 9,
the second light source has a smaller output than the first light source when forming the light distribution pattern for high beam.
CN202021331697.8U 2019-07-17 2020-07-09 Light emitting module and vehicle lamp Active CN212805504U (en)

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ES2386035T3 (en) 2005-03-04 2012-08-07 Osram Sylvania, Inc. LED headlight system
JP5324778B2 (en) * 2007-12-19 2013-10-23 スタンレー電気株式会社 Vehicular lamp and manufacturing method thereof
JP5390372B2 (en) * 2009-12-25 2014-01-15 株式会社小糸製作所 Light source unit and vehicle lamp
JP5646264B2 (en) * 2010-09-28 2014-12-24 株式会社小糸製作所 Vehicle lighting
JP2012204168A (en) * 2011-03-25 2012-10-22 Toyoda Gosei Co Ltd Vehicular headlight
WO2012151249A1 (en) 2011-05-02 2012-11-08 Peterson Manufacturing Company Illumination lamp with dual beam functions
JP5879065B2 (en) 2011-07-29 2016-03-08 スタンレー電気株式会社 Vehicle headlamp
JP2014067728A (en) 2013-12-17 2014-04-17 Starlite Co Ltd Led lamp for automobile
JP6340696B2 (en) 2014-08-29 2018-06-13 パナソニックＩｐマネジメント株式会社 Lighting device and automobile
JP6712769B2 (en) 2015-07-06 2020-06-24 パナソニックＩｐマネジメント株式会社 Light source unit, lighting device, and vehicle
JP2019036564A (en) 2018-12-05 2019-03-07 株式会社小糸製作所 Vehicular lighting fixture
CN109915787A (en) * 2019-03-01 2019-06-21 深圳大道半导体有限公司 A kind of multi-region illuminating source and automobile-used headlight

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