JP2021118120A - Vehicular lighting fixture - Google Patents

Abstract

To provide a new vehicular lighting fixture whose configuration is simplified in consideration of heat dissipation characteristics.SOLUTION: A vehicular lighting fixture comprises a first light source package 12, a first board 14 on which the first light source package is mounted, a second light source package 16, a second board 18 on which the second light source package 16 is mounted, and a lighting control circuit 20 mounted on the first board 14, and for controlling lighting of the first light source package 12. The second board 18 is configured so as to have higher heat dissipation characteristics than those of the first board 14. The first board 14 is electrically connected to the second board 18 via a wire 22 so that the lighting control circuit 20 can control lighting of the second light source package 16 mounted on the second board 18.SELECTED DRAWING: Figure 1

Description

The present invention relates to a vehicle lamp.

Conventionally, a first substrate on which the first light source package is mounted, a second substrate on which the second light source package is mounted, and a reflector on which the first substrate and the second substrate are mounted are provided. Vehicle lighting fixtures have been devised (see Patent Document 1). Further, the first light source package that is lit by a higher power than the second light source package is mounted on the first substrate made of a metal substrate, and the second light source package is mounted on the second substrate made of a resin substrate. It is installed.

JP-A-2017-69150

By the way, the above-mentioned vehicle lighting equipment includes a lighting circuit that controls light emission from the first light source package and the second light source package, but a lighting circuit board on which the lighting circuit is mounted is separately required. Is. Therefore, the lighting circuit board and the metal substrate or the resin substrate may be connected by wiring, or a space for arranging the lighting circuit board itself may be required.

The present invention has been made in view of such a situation, and one of its exemplary purposes is to provide a new vehicle lamp with a simplified configuration while considering heat dissipation characteristics.

In order to solve the above problems, the vehicle lamp according to an embodiment of the present invention includes a first light source package, a first substrate on which the first light source package is mounted, a second light source package, and a second light source package. It is provided with a second substrate on which the light source package of the above is mounted, and a lighting control circuit mounted on the first substrate and controlling the lighting of the first light source package. The second substrate is configured to have higher heat dissipation characteristics than the first substrate, and the first substrate is a lighting control circuit for lighting the second light source package mounted on the second substrate. Is electrically connected to the second substrate via wiring so that the can be controlled.

According to this aspect, since the lighting control circuit for controlling the lighting of the first light source package is mounted on the first substrate on which the first light source package is mounted, the board on which the lighting control circuit is mounted is separately mounted. There is no need to provide it. Further, since the lighting of the second light source package is controlled by the lighting control circuit mounted on the first substrate which is electrically connected to the second substrate via wiring, the lighting is controlled by the second substrate. There is no need to provide a lighting control circuit. Therefore, the configuration of the vehicle lamp can be simplified. Here, the light source package is a group of one or a plurality of semiconductor light emitting elements mounted on the same substrate, and even if a plurality of semiconductor light emitting elements are arranged adjacent to each other, they are dispersed. It does not matter if it is placed. Further, the case where the substrate is configured to have high heat dissipation characteristics is, for example, when the substrate is composed of a material having high thermal conductivity or the shape and size of the substrate having high heat dissipation. be.

The first light source package has a plurality of semiconductor light emitting elements, the minimum distance between the plurality of semiconductor light emitting elements is L1, and the second light source package has a plurality of semiconductor light emitting elements. The minimum distance between the plurality of semiconductor light emitting elements may be L2 (L2 <L1). As a result, the second light source package can generate a larger amount of heat locally than the first light source package unless there is a large difference in the performance of each semiconductor light emitting device, but the second light source package has the first light source package. Since it is mounted on a second substrate having higher heat dissipation characteristics than the substrate, it is easy to satisfy the required heat dissipation performance.

The first substrate has a larger mounting area than the second substrate. As a result, it is possible to secure a space for mounting the lighting control circuit while satisfying the required heat dissipation performance of the first substrate having low heat dissipation characteristics.

The first substrate may be a resin substrate, and the second substrate may be a metal substrate or a ceramics substrate. As a result, the cost is reduced by configuring the substrate with low required heat dissipation performance with a resin substrate, while the substrate with high required heat dissipation performance is composed of a metal substrate or ceramic substrate with high heat dissipation characteristics. The size can be reduced.

At least one of the plurality of semiconductor light emitting elements included in the first light source package is a first LED that emits light that contributes to the formation of a low beam light distribution pattern, and the plurality of semiconductor light emitting elements included in the second light source package. At least one of the elements may be a second LED that emits light that contributes to the formation of the high beam light distribution pattern.

A first reflector that reflects the light emitted from the first light source package and a second reflector that reflects the light emitted from the second light source package may be provided. The first substrate is arranged in a region adjacent to the second substrate in the width direction of the vehicle, and the first reflector reflects the light emitted from the first light source package toward the front of the vehicle. , The second reflector is located above or below the first substrate, and the second reflector is located above or below the second substrate so as to reflect the light emitted from the second light source package toward the front of the vehicle. You may be. As a result, a plurality of light distribution patterns can be formed by appropriately selecting the shape of the reflecting surface of each reflector.

A lamp chamber for accommodating the first substrate and the second substrate is formed, and the first region of the lamp chamber in which the first substrate is arranged is the lamp chamber in which the second substrate is arranged. The space in the front-rear direction of the vehicle is wider than that of the second area. As a result, the first substrate, which tends to be large in size, can be arranged in the first region having a large space.

The second region is closer to the inside of the vehicle than the first region. When the vehicle lighting equipment is a headlight, the headlight cover often has a shape that inclines backward from the inside (center side) of the vehicle toward the left side (or right side) of the vehicle. In such a case, the area of the light room near the inside of the vehicle tends to be narrowed. Therefore, the second substrate having a small size can be arranged in the second region inside the vehicle.

It should be noted that any combination of the above components and the conversion of the expression of the present invention between methods, devices, systems and the like are also effective as aspects of the present invention.

According to the present invention, it is possible to provide a new lamp for a vehicle having a simplified configuration while considering heat dissipation characteristics.

It is a figure which shows the schematic structure of the light emitting module which concerns on 1st Embodiment. It is a front view which shows typically the schematic structure of the vehicle lighting fixture which concerns on 2nd Embodiment. It is a top view which shows typically the schematic structure of the vehicle lighting equipment which concerns on 2nd Embodiment. It is a top view which shows typically the schematic structure of the vehicle lighting equipment which concerns on 3rd Embodiment. It is a figure which shows the schematic structure of the light emitting module which concerns on 4th Embodiment.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are designated by the same reference numerals, and duplicate description will be omitted as appropriate. Further, the configuration described below is an example, and does not limit the scope of the present invention at all.

(First Embodiment)
First, a light emitting module applicable to vehicle lighting equipment will be described. FIG. 1 is a diagram showing a schematic configuration of a light emitting module according to the first embodiment. The light emitting module 10 shown in FIG. 1 includes a first light source package 12, a first substrate 14 on which the first light source package 12 is mounted, a second light source package 16, and a second light source package 16. A second substrate 18 is provided, and a lighting control circuit 20 mounted on the first substrate 14 and controlling the lighting of the first light source package 12 is provided.

The first substrate 14 is electrically connected to the second substrate 18 via the wiring 22 so that the lighting control circuit 20 can control the lighting of the second light source package 16 mounted on the second substrate 18. It is connected. One of the wires 22 is connected to the connector 26 provided on the first board 14, and the other of the wires 22 is connected to the connector 28 provided on the second board 18. The first substrate 14 is provided with printed wiring (not shown) for electrically conducting the first light source package 12 and the lighting control circuit 20. Further, the second substrate 18 is provided with printed wiring (not shown) for electrically conducting the second light source package 16 and the connector 28.

The second substrate 18 according to the present embodiment is configured to have higher heat dissipation characteristics than the first substrate 14. Here, the term "configured so as to have high heat dissipation characteristics" means, for example, that the substrate is made of a material having high thermal conductivity or is made of the shape and size of a substrate having high heat dissipation. Is.

In the light emitting module according to the present embodiment, the lighting control circuit 20 for controlling the lighting of the first light source package 12 is mounted on the first substrate 14 on which the first light source package 12 is mounted. It is not necessary to separately provide a substrate on which the lighting control circuit 20 is mounted. Further, the lighting of the second light source package 16 is controlled by the lighting control circuit 20 mounted on the first substrate 14 which is electrically connected to the second substrate 18 via the wiring 22. It is not necessary to provide a lighting control circuit on the second substrate 18. Therefore, the configuration of the vehicle lighting fixture provided with the light emitting module 10 can be simplified.

Here, the light source package is a group of one or a plurality of semiconductor light emitting elements mounted on the same substrate, and even if a plurality of semiconductor light emitting elements are arranged adjacent to each other (closely), the light source package is used. It may be distributed (separately). In the first light source package 12 shown in FIG. 1, two low-power LEDs 12a and 12b used for forming a low-beam light distribution pattern are arranged apart from each other. Further, in the second light source package 16, two high-power LEDs 16a and 16b and one low-power LED 16c are closely arranged.

The minimum distance L1 between the LED 12a and the LED 12b of the first light source package 12 is larger than the distance L2 between the LED 16a and the LED 16b of the second light source package 16 (L2 <L1). In this case, the second light source package 16 can locally generate a larger amount of heat than the first light source package 12 even if there is no significant difference in the performance of the LEDs 12a, 12b, 16a, 16b, 16c. The light emitting module 10 according to the embodiment can generate a larger amount of heat because the LEDs 16a and 16b included in the second light source package 16 have high output. Therefore, since the second light source package 16 according to the present embodiment is mounted on the second substrate 18 having higher heat dissipation characteristics than the first substrate 14, it is easy to satisfy the required heat dissipation performance.

Further, the first substrate 14 in the light emitting module 10 according to the present embodiment is a resin substrate, for example, a glass fiber cloth impregnated with an epoxy resin and subjected to a thermosetting treatment (FR-4). be. The second substrate in the light emitting module 10 is a metal substrate or a ceramic substrate, for example, a substrate made of aluminum, copper, or aluminum nitride.

As a result, the cost is reduced by forming the first substrate 14 having low required heat dissipation performance with a resin substrate, while the second substrate 18 having high required heat dissipation performance is made of a metal substrate or ceramics having high heat dissipation characteristics. The size of the board can be reduced by configuring it with a board.

Further, although the first substrate 14 is a resin substrate having low heat dissipation characteristics, the mounting area is larger than that of the second substrate 18. Therefore, it is possible to secure a space for mounting the lighting control circuit 20 while satisfying the required heat dissipation performance of the first substrate 14 having low heat dissipation characteristics.

Next, the specifications of each element of the light emitting module 10 will be described in detail. The output of the low output LEDs 12a, 12b, 16c of the light emitting module 10 is about 3W, but may be less than 5W or less than 4W. Further, although the output of the high output LEDs 16a and 16b is about 5W, it may be 4W or more, or 5W or more. The LED 12a in the first light source package 12 has a low output (for low beam), the LED 12b has a high output (for high beam), the LEDs 16a and 16b in the second light source package 16 have a low output (for low beam), and the LED 16c has a low output. High output (for high beam) may be used.

The size of the first substrate 14, which is a resin substrate, has a width W1 of 100 mm, but the width W1 may be in the range of 50 to 150 mm, or 80 to 120 mm. Further, the depth D1 of the region where the first light source package 12 is mounted is 50 mm, but the depth D1 may be in the range of 25 to 75 mm or in the range of 40 to 60 mm. Further, the depth D1'of the region where the lighting control circuit 20 is mounted is 50 mm, but the depth D1'may be in the range of 25 to 75 mm or in the range of 40 to 60 mm.

The size of the second substrate 18, which is a metal substrate, has a width W2 of 25 mm, but the width W2 may be in the range of 15 to 35 mm, or in the range of 20 to 30 mm. Further, the depth D2 of the region where the second light source package 16 is mounted is 35 mm, but the depth D2 may be in the range of 25 to 45 mm or in the range of 30 to 40 mm. The thickness of the second substrate 18 may be 1 to 2 mm.

(Second Embodiment)
FIG. 2 is a front view schematically showing a schematic configuration of a vehicle lamp according to a second embodiment. FIG. 3 is a top view schematically showing a schematic configuration of a vehicle lamp according to the second embodiment. Note that FIG. 3 is a view of a cross section taken along the line AA of FIG. The vehicle lighting fixture 100 shown in FIG. 3 is an example of a vehicle headlight capable of forming a low beam light distribution pattern and a high beam light distribution pattern. Further, in the vehicle lighting equipment 100, the above-mentioned light emitting module 10 is provided in a lighting chamber 34 partitioned by a lamp body 30 and a front cover 32.

Vehicular lamp 100 includes a plurality of LED12a the first light source package 12 has, 12b is an LED of low power (output _{W L)} for emitting light contributing to the formation of the light distribution pattern for low beam, of the second LEDs 16a, of the three LED light source package 16 has 16b is an LED of high output (output _{W H>} output _{W L)} for emitting light contributing to the formation of the light distribution pattern for high beam. That is, the output of the LEDs 12a and 12b is lower than the output of the LEDs 16a and 16b. By arranging a plurality of LEDs adjacent to each other or integrating a plurality of LEDs into a single chip, light having a luminous intensity required for forming a high beam light distribution pattern or a low beam light distribution pattern can be emitted. Each light source package may be configured.

The vehicle lamp 100 includes a first reflector 36 that reflects the light emitted from the first light source package 12, and a second reflector 38 that reflects the light emitted from the second substrate 18. The first reflector 36 reflects the light emitted by the LED 12b to the front of the vehicle with the reflecting surface 36a arranged above or below the first substrate 14 so as to reflect the light emitted by the LED 12a to the front of the vehicle. As described above, it has a reflecting surface 36b arranged above or below the first substrate 14. The second reflector 38 has a reflecting surface 38a arranged above or below the second substrate 18 so as to reflect the light emitted by the LEDs 16a, 16b, 16c toward the front of the vehicle. As a result, a plurality of light distribution patterns can be formed by appropriately selecting the shape of the reflecting surface of each reflector.

The light chamber 34 accommodates the first substrate 14 and the second substrate 18, and in the lamp chamber 34, the first substrate 14 is in the width direction of the vehicle with respect to the second substrate 18 (arrow Y2 direction). It is located in the area adjacent to. Further, the second substrate 18 is arranged so that the front ends of the LEDs 16a and 16b mounted on the second substrate 18 are located in front of the vehicle from the front ends of the LEDs 12a and 12b mounted on the first substrate 14. Have been placed. The first region R1 of the light chamber 34 in which the first substrate 14 is arranged has a space in the vehicle front-rear direction X more than the second region R2 of the light chamber 34 in which the second substrate 18 is arranged. wide. As a result, the first substrate 14, which tends to be large in size, can be arranged in the first region R1 having a large space.

The second region R2 is closer to the inside of the vehicle (arrow Y1 side) than the first region R1. When the vehicle lighting equipment is a headlight, the headlight cover (front cover 32) has a shape that inclines backward from the inside (center side) of the vehicle toward the left side of the vehicle (arrow Y2 side shown in FIG. 3). There are many. In such a case, the region (second region) of the light chamber 34 near the inside of the vehicle tends to be narrowed. Therefore, the second substrate 18 having a small size can be arranged in the second region R2 inside the vehicle. In the vehicle lighting tool 100 according to the present embodiment, a turn signal lamp 40 is provided in a region outside the vehicle (arrow Y2 side) of the light emitting module 10 in the lighting chamber 34. Further, a clearance lamp 42 is provided below the first light source package 12 and the second light source package 16.

(Third Embodiment)
FIG. 4 is a top view schematically showing a schematic configuration of a vehicle lamp 200 according to a third embodiment. The light emitting module 110 provided in the vehicle lighting fixture 200 shown in FIG. 4 has the positions of the first substrate 14 and the second substrate 18 reversed as compared with the light emitting module 10 described above. It's almost the same.

In the light chamber 34, the first substrate 14 is arranged in a region adjacent to the second substrate 18 in the width direction of the vehicle (arrow Y1 direction). The first region R1 of the light chamber 34 in which the first substrate 14 is arranged has a space in the vehicle front-rear direction X more than the second region R2 of the light chamber 34 in which the second substrate 18 is arranged. wide. As a result, the first substrate 14, which tends to be large in size, can be arranged in the first region R1 having a large space.

(Fourth Embodiment)
FIG. 5 is a diagram showing a schematic configuration of a light emitting module according to a fourth embodiment. The main feature of the light emitting module 120 shown in FIG. 5 is that some of the LEDs constituting the first light source package and the second light source package are different, and the other configurations are the light emitting according to the first embodiment. It is almost the same as module 10.

The first light source package 112 mounted on the first substrate 14 of the light emitting module 120 has a low output LED 112a that contributes to the formation of a low beam light distribution pattern and a high output LED 112a that contributes to the formation of a high beam light distribution pattern. It has LEDs 112b and 112c. Further, the second light source package 116 mounted on the second substrate 18 has low output LEDs 116a and 116b that contribute to the formation of the low beam light distribution pattern. The LEDs 116a and 116b are arranged side by side so as to be in close contact with each other.

As a modification of the fourth embodiment, the first light source package 112 may have low output LEDs 112a, 112b, 112c that contribute to the formation of the low beam light distribution pattern. Further, the second light source package 116 may have high output LEDs 116a and 116b that contribute to the formation of the high beam light distribution pattern.

In the case of the light emitting module shown in FIGS. 3 and 4, both the first light source package and the second light source package are lit when the low beam light distribution pattern is formed. Therefore, the appearance of the light emitting module 110 always seems to shine in the horizontal direction. On the other hand, in the light emitting module 120 shown in FIG. 5, it is necessary to separately divide the reflecting surface of the reflector for each of the LED 112a (for low beam) and the LEDs 112b and 112c (for high beam). Therefore, when forming the low beam light distribution pattern, the LEDs 112a and 112b are turned off, and a non-lighting region can be formed in a part of the first light source package 112.

As described in each of the above-described embodiments, the heat dissipation characteristics required for the substrate on which the LEDs are mounted differ depending on the output and layout of the LEDs constituting each light source package. By adopting a substrate with high heat dissipation performance for a substrate that requires high heat dissipation characteristics and a large substrate with low heat dissipation performance for a substrate that does not require high heat dissipation characteristics, the heat dissipation performance is low and the size is large. A lighting control circuit can be mounted on a large board. Since this lighting control circuit controls the lighting of the semiconductor light emitting element mounted on the substrate having high heat dissipation performance, it is not necessary to provide the lighting control circuit on the substrate having high heat dissipation performance, and the heat dissipation performance is high (high cost). The size of the board can be reduced.

Although the present invention has been described above with reference to the above-described embodiments, the present invention is not limited to the above-described embodiments, and the configurations of the embodiments are appropriately combined or substituted. Those are also included in the present invention. Further, it is also possible to appropriately rearrange the combinations and the order of processing in each embodiment based on the knowledge of those skilled in the art, and to add modifications such as various design changes to the embodiments. Additional embodiments may also be included in the scope of the present invention.

In the above-described embodiment, the vehicle lamp fixture in which the reflector for reflecting the light emitted upward from the LED mounted on the upper surface of the substrate is arranged above the substrate is described, but the lamp is mounted on the lower surface of the substrate. It may be a vehicle lighting fixture in which a reflector that reflects the light emitted downward from the LED to the front of the vehicle is arranged below the substrate.

R1 1st region, R2 2nd region, 10 light emitting module, 12 1st light source package, 12a, 12b LED, 14 1st substrate, 16 2nd light source package, 16a, 16b, 16c LED, 18th 2 boards, 20 lighting control circuits, 22 wirings, 34 lighting chambers, 36 first reflectors, 38 second reflectors, 100 vehicle lighting fixtures.

Claims (8)

The first light source package and
The first substrate on which the first light source package is mounted and
The second light source package and
A second substrate on which the second light source package is mounted, and
A lighting control circuit mounted on the first substrate and controlling the lighting of the first light source package is provided.
The second substrate is configured to have higher heat dissipation characteristics than the first substrate.
The first substrate is electrically connected to the second substrate via wiring so that the lighting control circuit can control the lighting of the second light source package mounted on the second substrate. A vehicle lighting fixture that is characterized by being used. The first light source package has a plurality of semiconductor light emitting elements, and the minimum distance between the plurality of semiconductor light emitting elements is L1.
The second light source package has a plurality of semiconductor light emitting elements, and the minimum distance between the plurality of semiconductor light emitting elements is L2 (L2 <L1).
The vehicle lamp according to claim 1. The vehicle lamp according to claim 1 or 2, wherein the first substrate has a larger mounting area than the second substrate. The first substrate is a resin substrate and
The vehicle lamp according to any one of claims 1 to 3, wherein the second substrate is a metal substrate or a ceramic substrate. At least one of the plurality of semiconductor light emitting elements included in the first light source package is a first LED that emits light that contributes to the formation of a low beam light distribution pattern.
At least one of the plurality of semiconductor light emitting elements included in the second light source package is a second LED that emits light that contributes to the formation of a high beam light distribution pattern.
The vehicle lamp according to any one of claims 1 to 4, wherein the lamp is characterized by the above. A first reflector that reflects light emitted from the first light source package,
A second reflector that reflects light emitted from the second light source package is provided.
The first substrate is arranged in a region adjacent to the second substrate in the width direction of the vehicle.
The first reflector is arranged above or below the first substrate so as to reflect the light emitted from the first light source package toward the front of the vehicle.
The second reflector is arranged above or below the second substrate so as to reflect the light emitted from the second light source package toward the front of the vehicle.
The vehicle lamp according to any one of claims 1 to 5, characterized in that. A light chamber for accommodating the first substrate and the second substrate is formed.
The first region of the light chamber in which the first substrate is arranged has a larger space in the vehicle front-rear direction than the second region of the light chamber in which the second substrate is arranged. The vehicle lighting fixture according to any one of claims 1 to 6, which is characteristic. The vehicle lighting fixture according to claim 7, wherein the second region is closer to the inside of the vehicle than the first region.

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