CN212767600U - Multi-chip vertical wafer placing box and upper cover - Google Patents

Multi-chip vertical wafer placing box and upper cover Download PDF

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Publication number
CN212767600U
CN212767600U CN202020436121.1U CN202020436121U CN212767600U CN 212767600 U CN212767600 U CN 212767600U CN 202020436121 U CN202020436121 U CN 202020436121U CN 212767600 U CN212767600 U CN 212767600U
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wafer
upper cover
groove
barricade
walls
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CN202020436121.1U
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Chinese (zh)
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刘国华
李刚
刘春峰
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Glory Electronic Materials Chongqing Co ltd
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Glory Electronic Materials Chongqing Co ltd
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Abstract

The utility model provides a multi-disc vertical wafer box and an upper cover, which comprises an upper cover, a sheet frame and a bottom cover, wherein, two sides of the top surface of the upper cover parallel to the axis of a wafer are respectively provided with a plurality of cantilever elastic sheets which are arranged at intervals and horizontally extend towards the axis direction of the wafer, and the free ends of the cantilever elastic sheets are provided with supporting grooves for clamping and stabilizing the upper part of the wafer; the groove walls on two sides of the supporting groove incline upwards and expand outwards to form retaining walls, and the retaining walls are adjacent to the supporting groove and are in staggered complementary type. The utility model has the characteristics of the structure is simplified, simple to operate, practice thrift the cost, reduce the card phenomenon.

Description

Multi-chip vertical wafer placing box and upper cover
Technical Field
The utility model relates to a storage and transportation container of wafer especially relates to a vertical wafer box and upper cover of placing of multi-disc.
Background
The wafer is a basic material for manufacturing semiconductor chips, the wafers sold on the market are round and thin sheets, and if a plurality of wafers are stacked together and packaged for transportation, the wafers are easily polluted, scratched and damaged, and the product quality is affected. Over the years, manufacturers have produced wafer shipping boxes to enable the safe storage and transport of wafers.
The multi-wafer vertical wafer box in the market generally comprises an upper cover, a spring plate for clamping and stabilizing the end part of a wafer, a wafer rack for inserting the wafer and a bottom cover. When the consignment box with the structure is used, the elastic sheet is firstly needed to be installed on the inner side of the upper cover and then is buckled with the bottom cover, the installation step is complex, and the production cost is high; in addition, the elastic sheet component can deform after long-term use and is loosened in the shipping box, so that the wafers are jumped and rubbed in the transportation process, the wafers are damaged, and the service life of the product is greatly influenced.
At present, some wafer cassettes in the market locate the spring plates inside the upper cover, and although the installation process is simplified, the support grooves for supporting the wafer on the spring plates are V-shaped grooves 51, the openings of the V-shaped grooves 51 are small, and the distance between adjacent V-shaped grooves 51 is wide, so that the wafer 40 is prone to a chucking phenomenon (i.e., the wafer cannot be effectively fixed in the V-shaped grooves 51, and the wafer is chucked in the gap between adjacent V-shaped grooves 51, as shown in fig. 7).
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a multi-disc vertical wafer box and upper cover of placing of directly solving wafer card problem, have the characteristics of structure simplification, simple to operate, saving cost, reduction card phenomenon.
In order to solve the technical problem, the utility model provides a multi-disc vertical wafer box, including upper cover, rack, bottom, two sides that the top surface of upper cover is on a parallel with the wafer axis are equipped with a plurality of intervals respectively and arrange, to the horizontal cantilever shell fragment that extends of wafer axis direction, the free end of cantilever shell fragment is equipped with the support groove that is used for centre gripping and stable wafer upper portion; the groove walls on two sides of the supporting groove incline upwards and expand outwards to form retaining walls, and the retaining walls are adjacent to the supporting groove and are in staggered complementary type.
Preferably, the vertical projection of the top point of the retaining wall is opposite to or exceeds the center line between the adjacent cantilever elastic sheets.
As a preferred mode, the front sections of the two side walls of the supporting groove extend upwards to form a first retaining wall and a second retaining wall in a mountain peak shape, and the top points of the first retaining wall and the second retaining wall are arranged in diagonal angles, so that the vertical projection shape of the supporting groove is approximate to a diamond shape.
Preferably, the top of the retaining wall is provided with an arc chamfer.
Preferably, a plurality of slots for inserting wafers are arranged on opposite surfaces of side walls of the two wafer racks at intervals, the wafer racks are arranged in the bottom cover, and the upper cover is buckled and covered above the bottom cover.
Preferably, two opposing bottom cover side walls of the bottom cover are provided with centrally projecting attachment structures for attachment with arcuate segments of the film frame side walls.
The utility model also provides an upper cover of a multi-disc vertical wafer box, wherein two side edges of the top surface of the upper cover parallel to the axis of the wafer are respectively provided with a plurality of cantilever elastic pieces which are arranged at intervals and horizontally extend towards the axis direction of the wafer, and the free ends of the cantilever elastic pieces are provided with supporting grooves for clamping and stabilizing the upper part of the wafer; the groove walls on two sides of the supporting groove incline upwards and expand outwards to form retaining walls, and the retaining walls are adjacent to the supporting groove and are in staggered complementary type.
Preferably, the vertical projection of the top point of the retaining wall is opposite to or exceeds the center line between the adjacent cantilever elastic sheets.
As a preferred mode, the front sections of the two side walls of the supporting groove extend upwards to form a first retaining wall and a second retaining wall in a mountain peak shape, and the top points of the first retaining wall and the second retaining wall are arranged in diagonal angles, so that the vertical projection shape of the supporting groove is approximate to a diamond shape.
Preferably, the top of the retaining wall is provided with an arc chamfer.
The utility model relates to a vertical wafer box and upper cover of placing of multi-disc compares with current design, and its advantage lies in: (1) the cantilever elastic sheet and the supporting groove for clamping and stabilizing the top end of the wafer are arranged on the inner surface of the upper cover by adopting an integrated forming process, so that the number of components is reduced, the structure is simple, the die sinking is simplified, the installation is convenient, and the cost is reduced; (2) the arrangement of the staggered complementary supporting grooves enables the clearance of the adjacent supporting grooves in the linear direction (namely Y direction) in which the wafers are clamped to be zero under the condition that the number of the accommodated wafers is not changed, even if the wafers are placed in the wafer frame groove and the wafers are inclined, the wafers can be aligned and fixed, and the problem that the wafers are easy to clamp is solved essentially.
Drawings
Fig. 1 is an exploded view of the vertical wafer cassette with multiple wafers.
Fig. 2 is a schematic view of the upper cover of the multi-disc vertical wafer cassette.
Fig. 3 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.
FIG. 4 is a schematic top view of the front view of the position A in FIG. 2 according to the present invention
FIG. 5 is a schematic longitudinal sectional view of the vertical multiple-wafer cassette of the present invention.
Fig. 6 is an enlarged schematic view of point B in fig. 5 according to the present invention.
Fig. 7 is a diagram illustrating a state of use of the prior art.
The reference numbers are as follows:
10-upper cover, 11-top surface, 111-arc plate, 112-convex surface, 12-cantilever elastic sheet, 13-support groove, 131-first retaining wall, 132-second retaining wall, 14-buckle, 20-sheet frame, 21-sheet frame side wall, 211-slot, 211 a-arc section, 212-slot separating plate, 213-limit plate, 214-locating slot, 215-extension plate, 216-mark, 22-sheet frame end wall, 23-H-shaped rod, 30-bottom cover, 31-bottom cover side wall, 311-attachment structure, 312-position clip, 32-concave surface and 40-wafer.
Detailed Description
The utility model relates to a vertical wafer box of placing of multi-disc, including upper cover 10, be used for planting wafer 40's rack 20, bottom 30, rack 20 places inside bottom 30, and upper cover 10 covers the top of locating bottom 30, with bottom 30 upper and lower lock joint. As shown in fig. 1, each wafer 40 is placed in the X direction, the Y direction is parallel to the central axis of the wafer 40, several wafers 40 are spaced apart in the Y direction, and the wafers 40 are inserted and removed in the Z direction, in accordance with common practice. The invention is described in detail below with reference to the accompanying figures 1-7 and the specific embodiments.
As shown in fig. 1 and 5, the upper cover 10 is cooperatively buckled with the bottom cover 30 in the Z direction to form a closed receiving space for enclosing the wafer-carrying wafer holder 20. As shown in fig. 2, the upper lid 10 has a substantially cubic housing shape with an open bottom, and the center of the top surface 11 of the upper lid 10 is provided as an upwardly convex arc 111 that conforms to the upper shape of the wafer 40. The two sides of the arc-shaped plate 111 in the X direction are respectively provided with a plurality of cantilever spring pieces 12 which are arranged at intervals in the Y direction and horizontally extend in the X direction, the free ends of the two rows of cantilever spring pieces 12 are close to each other and extend, the free ends of the cantilever spring pieces 12 are provided with staggered complementary support grooves 13, and the support grooves 13 are used for clamping and stabilizing the upper part of the wafer 40 and preventing the wafer 40 from scattering or disordering.
As shown in fig. 3, the slot walls on both sides of the supporting slot 13 extend obliquely and outwardly from the slot bottom, wherein the front section of one slot wall extends and converges obliquely and upwardly relative to the rear end thereof to form a peak-shaped first retaining wall 131, and the front section of the other slot wall extends and converges upwardly relative to the rear end thereof to form a second retaining wall 132 which forms an oblique angle with the first retaining wall 131, so that the vertical projection of the supporting slot 13 is approximately diamond-shaped. The vertical projection of the top points of the first retaining wall 131 and the second retaining wall 132 of the supporting groove 13 faces or crosses the center line a between the adjacent cantilever springs 12, so that the adjacent retaining walls of the adjacent supporting grooves 13 are offset and complementary, that is, the groove walls of the adjacent supporting grooves 13 are partially overlapped, as shown in fig. 4. Further, the vertexes of the first retaining wall 131 and the second retaining wall 132 are provided with arc chamfers.
The arrangement of the staggered complementary supporting grooves 13 ensures that the clearance of the adjacent supporting grooves 13 in the linear direction (namely Y direction) of the clamped wafer 40 is zero under the condition of not changing the number of the accommodated wafers, so that the wafers can be aligned and fixed even if the wafers are inclined after being placed in the wafer frame groove, and the problem that the wafers are easy to clamp is solved essentially. When the wafer 40 just contacts the supporting groove 13, it is inclined, and after the top cover 10 and the bottom cover 30 are fastened OK, the wafer 40 is already aligned and fixed by the supporting groove 13 of the cantilever spring 12.
As shown in fig. 1, the utility model discloses the rack 20 is basically the same with conventional rack, and the shape of rack 20 is the cubic skeleton of roughly H shape that link up from top to bottom in the Z direction, including the rack lateral wall 21 that is located two relative settings of X direction, the rack end wall 22 that is located the Y direction, and the H shape pole 23 that sets up with the rack end wall 22 relatively, two the opposite face of rack lateral wall 21 is equipped with a plurality of slots 211 that are used for inserting the wafer of arranging along the Y direction interval, and slot 211 is used for injecing the interval of wafer, and stabilizes the wafer. Specifically, a plurality of groove separating plates 212 are vertically and fixedly arranged on the inner side wall of the side wall 21 of the wafer rack, the slot 211 is formed between two adjacent groove separating plates 212, and the slot 211 has a structure with a narrower slot bottom and a wider slot opening, so that wafers can be stored and taken out conveniently, and the contact area between the wafers and the slot is reduced when the wafers are stored. As shown in fig. 5, the insertion grooves 211 on both sides of the sheet holder 20 correspond to the support grooves 13 one on top of the other in the Z direction.
Further, the bottom region of the slot 211 in the Z direction has a curvature forming arc segment 211a, and the arc segment 211a conforms to the shape of the lower portion of the wafer. The bottom end of the arc-shaped section 211a extends downwards vertically along the Z direction to form a limiting plate 213 for limiting the position of the wafer rack, and the center of the bottom surface of the limiting plate 213 is provided with a V-shaped positioning groove 214 which is concave upwards; the top surface of the side wall 21 of the wafer rack is horizontally and outwardly cantilevered to form an extension plate 215, and marks 216 for marking the number of the slots 211 are arranged on the extension plate 215 at intervals, and can be digital marks or other marks, so as to count the number of wafers on the wafer rack.
As shown in fig. 1-2 and 5, the bottom cover 30 is in the shape of a cuboid shell with an open top for receiving the wafer rack 20 therein, and the bottom cover 30 is provided with a centrally protruding attachment structure 311 on the bottom cover side wall 31 corresponding to the rack side wall 21 for abutting against the surface of the arc-shaped section 211a of the rack side wall 21. A groove is formed on the bottom surface of the bottom cover 30, and a positioning protrusion is formed at the center of the groove. The wafer holder 20 with the wafer is placed in the bottom cover 30, the limiting plate 213 of the wafer holder 20 is placed in the groove, and the positioning protrusion is clamped at the bottom of the positioning groove 214 to limit the wafer holder 30. The top of the bottom cover side wall 31 is provided with a detent 312.
The bottom end of the side wall of the upper cover 10 is provided with a buckle 14, and the buckle 14 is detachably and fittingly clamped with the clamping position 312 of the bottom cover 30, so that the wafer 40 can be conveniently loaded and unloaded. Convex surfaces 112 are arranged at four corners of the top surface 11 of the upper cover 10, and concave surfaces 32 matched with the convex surfaces 112 are arranged at four corners of the bottom surface of the bottom cover 30, so that a plurality of shipping boxes can be stacked up and down conveniently.
The utility model discloses still relate to a vertical upper cover of placing wafer box of multi-disc, as shown in fig. 2, upper cover 10 is the roughly cubic housing shape of bottom surface open-ended, and the top surface 11 center of upper cover 10 sets up to catering to the bellied arc 111 that makes progress of wafer 40 upper portion shape. The two sides of the arc-shaped plate 111 in the X direction are respectively provided with a plurality of cantilever spring pieces 12 which are arranged at intervals in the Y direction and horizontally extend in the X direction, the free ends of the two rows of cantilever spring pieces 12 are close to each other and extend, the free ends of the cantilever spring pieces 12 are provided with staggered complementary support grooves 13, and the support grooves 13 are used for clamping and stabilizing the upper part of the wafer 40 and preventing the wafer 40 from scattering or disordering.
As shown in fig. 3, the slot walls on both sides of the supporting slot 13 extend obliquely and outwardly from the slot bottom, wherein the front section of one slot wall extends and converges obliquely and upwardly relative to the rear end thereof to form a peak-shaped first retaining wall 131, and the front section of the other slot wall extends and converges upwardly relative to the rear end thereof to form a second retaining wall 132 which forms an oblique angle with the first retaining wall 131, so that the vertical projection of the supporting slot 13 is approximately diamond-shaped. The vertical projection of the top points of the first retaining wall 131 and the second retaining wall 132 of the supporting groove 13 faces or crosses the center line a between the adjacent cantilever springs 12, so that the adjacent retaining walls of the adjacent supporting grooves 13 are offset and complementary, that is, the groove walls of the adjacent supporting grooves 13 are partially overlapped, as shown in fig. 4. Further, the vertexes of the first retaining wall 131 and the second retaining wall 132 are provided with arc chamfers.
The arrangement of the staggered complementary supporting grooves 13 ensures that the clearance of the adjacent supporting grooves 13 in the linear direction (namely Y direction) of the clamped wafer 40 is zero under the condition of not changing the number of the accommodated wafers, so that the wafers can be aligned and fixed even if the wafers are inclined after being placed in the wafer frame groove, and the problem that the wafers are easy to clamp is solved essentially. When the wafer 40 just contacts the supporting groove 13, it is inclined, and after the top cover 10 and the bottom cover 30 are fastened OK, the wafer 40 is already aligned and fixed by the supporting groove 13 of the cantilever spring 12.

Claims (10)

1. The utility model provides a vertical wafer box of placing of multi-disc which characterized in that: the wafer clamping device comprises an upper cover (10), a wafer frame (20) and a bottom cover (30), wherein a plurality of cantilever elastic sheets (12) which are arranged at intervals and horizontally extend towards the axis direction of a wafer are respectively arranged on two side edges of the top surface of the upper cover (10) parallel to the axis of the wafer, and supporting grooves (13) used for clamping and stabilizing the upper part of the wafer are formed in the free ends of the cantilever elastic sheets (12); the groove walls on the two sides of the support groove (13) are inclined upwards and expanded outwards to form retaining walls, and the adjacent retaining walls of the adjacent support grooves (13) are in a staggered complementary type;
the anterior segment of the both sides cell wall of support groove (13) upwards extends respectively and draws in first barricade (131) and the second barricade (132) that form the mountain peak form in, the summit of first barricade (131) and second barricade (132) is the diagonal angle setting.
2. The multi-piece vertically positionable wafer pod of claim 1, wherein: the vertical projection of the top point of the retaining wall is over against or over the center line between the adjacent cantilever elastic sheets (12).
3. The multi-piece vertically positionable wafer pod of claim 1 or 2, wherein: the shape of the vertical projection of the supporting groove (13) is approximate to a diamond shape.
4. The multi-piece vertically positionable wafer pod of claim 3, wherein: and the top point of the retaining wall is provided with an arc chamfer.
5. The multi-piece vertically positionable wafer pod of claim 3, wherein: the opposite surfaces of two sheet frame side walls (21) of the sheet frame (20) are provided with a plurality of slots (211) which are arranged at intervals and used for inserting wafers, the sheet frame (20) is placed in the bottom cover (30), and the upper cover (10) is buckled and covered above the bottom cover (30).
6. The multi-piece vertically positionable wafer pod of claim 5, wherein: two opposite bottom cover side walls (31) of the bottom cover (30) are provided with centrally protruding attachment structures (311) for attachment to the arc-shaped sections (211a) of the sheet holder side walls (21).
7. The utility model provides a vertical upper cover of placing wafer box of multi-disc which characterized in that: two side edges of the top surface of the upper cover (10) parallel to the axis of the wafer are respectively provided with a plurality of cantilever elastic sheets (12) which are arranged at intervals and horizontally extend towards the axis direction of the wafer, and the free ends of the cantilever elastic sheets (12) are provided with supporting grooves (13) for clamping and stabilizing the upper part of the wafer; the groove walls on the two sides of the support groove (13) are inclined upwards and expanded outwards to form retaining walls, and the adjacent retaining walls of the adjacent support grooves (13) are in a staggered complementary type; the anterior segment of the both sides cell wall of support groove (13) upwards extends respectively and draws in first barricade (131) and the second barricade (132) that form the mountain peak form in, the summit of first barricade (131) and second barricade (132) is the diagonal angle setting.
8. The lid of claim 7, wherein: the vertical projection of the top point of the retaining wall is over against or over the center line between the adjacent cantilever elastic sheets (12).
9. The lid of claim 7, wherein: the shape of the vertical projection of the supporting groove (13) is approximate to a diamond shape.
10. The lid of claim 7, wherein: and the top point of the retaining wall is provided with an arc chamfer.
CN202020436121.1U 2020-03-30 2020-03-30 Multi-chip vertical wafer placing box and upper cover Active CN212767600U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020436121.1U CN212767600U (en) 2020-03-30 2020-03-30 Multi-chip vertical wafer placing box and upper cover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020436121.1U CN212767600U (en) 2020-03-30 2020-03-30 Multi-chip vertical wafer placing box and upper cover

Publications (1)

Publication Number Publication Date
CN212767600U true CN212767600U (en) 2021-03-23

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Application Number Title Priority Date Filing Date
CN202020436121.1U Active CN212767600U (en) 2020-03-30 2020-03-30 Multi-chip vertical wafer placing box and upper cover

Country Status (1)

Country Link
CN (1) CN212767600U (en)

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