CN213832569U

CN213832569U - 35 vertical wafer box of placing of piece dress

Info

Publication number: CN213832569U
Application number: CN202021343775.6U
Authority: CN
Inventors: 刘国华; 李刚; 刘春峰
Original assignee: Glory Electronic Materials Chongqing Co ltd
Current assignee: Glory Electronic Materials Chongqing Co ltd
Priority date: 2020-07-10
Filing date: 2020-07-10
Publication date: 2021-07-30
Anticipated expiration: 2030-07-10

Abstract

The utility model provides a 35-piece vertical wafer placing box, which comprises an upper cover, a piece frame and a bottom cover, wherein the piece frame is placed in the bottom cover, and the upper cover is buckled and covered above the bottom cover; the opposite surfaces of the side walls of the two wafer racks are provided with 35 wafer slots which are arranged at intervals; two side edges of the top surface of the upper cover, which are parallel to the axis of the wafer, are respectively provided with 35 cantilever elastic sheets which are arranged at intervals and horizontally extend towards the axis direction of the wafer, and the end parts of the cantilever elastic sheets are provided with supporting grooves for clamping and stabilizing the upper part of the wafer; the groove walls on the two sides of the supporting groove incline upwards and expand outwards to form retaining walls, and the vertical projection of the top points of the retaining walls crosses the central line between the adjacent cantilever elastic sheets, so that the adjacent retaining walls of the adjacent supporting grooves are in a staggered complementary type. The utility model discloses under the prerequisite that does not change the whole size of the current product in market, shape, realize the design of high density draw-in groove, have reduce cost, improve storage and conveying efficiency, can not take place the characteristics of card phenomenon simultaneously.

Description

35 vertical wafer box of placing of piece dress

Technical Field

The utility model relates to a storage and transportation container of wafer especially relates to a vertical wafer box of placing of 35 pieces dress.

Background

The wafer is a basic material for manufacturing semiconductor chips, the wafers sold on the market are round and thin sheets, and if a plurality of wafers are stacked together and packaged for transportation, the wafers are easily polluted, scratched and damaged, and the product quality is affected. Over the years, manufacturers have produced wafer shipping boxes to enable the safe storage and transport of wafers. The vertical wafer placing box on the market generally comprises an upper cover, a wafer rack for inserting wafers and a bottom cover, wherein wafer slots for inserting wafers are arranged on two sides of the wafer rack, an elastic sheet for clamping and stabilizing the upper ends of the wafers is arranged on the inner side of the upper cover, and a V-shaped groove is formed in the end part of the elastic sheet for fixing the wafers.

With the development of the semiconductor industry, it has been difficult to meet cost and efficiency requirements for a multiple piece vertical cassette of 25 pieces. For the 25 wafer-containing cassettes on the existing market, if the number of wafers to be contained is increased without changing the shape, size and volume of the cassettes, the width and distance of the V-shaped grooves on the inner side of the upper cover are necessarily reduced, but at the same time, the risk of the wafers being stuck (i.e., the wafers cannot be effectively fixed in the V-shaped grooves 51, but are stuck in the gaps between adjacent V-shaped grooves 51, as shown in fig. 7) is increased.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a vertical wafer box of placing of 35 pieces dress of high density draw-in groove design under the prerequisite that does not change the current product overall dimension in market, shape, volume, its have reduce cost, improve storage and conveying efficiency, can not take place the characteristics of card phenomenon simultaneously.

In order to solve the technical problem, the utility model provides a 35-piece vertical wafer placing box, which comprises an upper cover, a piece frame and a bottom cover, wherein the piece frame is placed in the bottom cover, and the upper cover is buckled and covered above the bottom cover; the opposite surfaces of the side walls of the two wafer racks are provided with 35 wafer slots which are arranged at intervals; two side edges of the top surface of the upper cover, which are parallel to the axis of the wafer, are respectively provided with 35 cantilever elastic sheets which are arranged at intervals and horizontally extend towards the axis direction of the wafer, and the free ends of the cantilever elastic sheets are provided with supporting grooves for clamping and stabilizing the upper part of the wafer; the cell wall tilt up of supporting groove both sides expands outward and forms the barricade, the vertical projection on barricade summit crosses the central line between the adjacent cantilever shell fragment, makes adjacent supporting groove's adjacent the barricade is the dislocation complementary type.

As a preferred mode, the front sections of the two side walls of the supporting groove extend upwards to form a first retaining wall and a second retaining wall in a mountain peak shape, and the top points of the first retaining wall and the second retaining wall are arranged in diagonal angles, so that the vertical projection shape of the supporting groove is approximate to a diamond shape.

Preferably, 34 groove separating plates are vertically arranged on the inner side wall of the wafer rack, and 35 wafer slots are formed between two adjacent groove separating plates, the end wall of the groove separating plate and the wafer rack, and between the groove separating plate and the side wall of the wafer rack.

Preferably, the bottom region of the wafer slot along the Z direction has a curvature to form an arc-shaped segment, and the arc-shaped segment is adapted to the shape of the lower portion of the wafer.

Preferably, two opposing bottom cover side walls of the bottom cover are provided with centrally projecting attachment structures for attachment with arcuate segments of the film frame side walls.

Preferably, the top of the retaining wall is provided with an arc chamfer.

The utility model relates to a vertical wafer box of placing of 35 pieces dress of high density draw-in groove design, compare with current design, its advantage lies in: (1) according to the wafer box, on the premise that the shapes, sizes and volumes of the upper cover, the wafer frame and the bottom cover are not changed, the number of wafer slots is increased from 25 to 35 on the wafer frame, meanwhile, the end part of the cantilever elastic sheet on the inner side of the upper cover is provided with the staggered complementary wafer supporting groove, the staggered complementary structure saves space, meanwhile, the end part of a wafer is effectively fixed, and the phenomenon of clamping is avoided; (2) the wafer box meets the process of the existing 25 wafer boxes, and compared with the existing 25 wafer boxes, the wafer box effectively reduces the packaging and transportation cost of wafers by more than 30%, and improves the storage and transportation efficiency.

Drawings

Fig. 1 is an exploded schematic view of the 35-piece vertical wafer box of the present invention.

Fig. 2 is a schematic top view of the wafer rack and bottom box for vertically placing the wafer cassettes for 35 wafers according to the present invention.

Fig. 3 is a schematic view of the upper cover of the 35-piece vertical wafer box of the present invention.

Fig. 4 is an enlarged schematic view of a portion a in fig. 3 according to the present invention.

FIG. 5 is a schematic longitudinal sectional view of a 35-piece vertical wafer cassette according to the present invention.

Fig. 6 is an enlarged schematic view of a portion B in fig. 5 according to the present invention.

Fig. 7 is a diagram illustrating a state of use of the prior art.

The reference numbers are as follows:

10-upper cover, 11-top surface, 111-arc plate, 112-convex surface, 12-cantilever elastic sheet, 13-support groove, 131-first retaining wall, 132-second retaining wall, 14-buckle, 20-sheet frame, 21-sheet frame side wall, 211-wafer slot, 211 a-arc section, 212-slot separating plate, 213-limit plate, 214-locating slot, 215-extension plate, 216-mark, 22-sheet frame end wall, 23-H-shaped rod, 30-bottom cover, 31-bottom cover side wall, 311-attachment structure, 312-position clamping, 32-concave surface and 40-wafer.

Detailed Description

The utility model relates to a vertical wafer box of placing of 35 pieces dress, including upper cover 10 and the bottom 30 that upper and lower lock joint formed the box body to and place the piece frame 20 that is used for planting wafer 40 in the box body. As shown in fig. 1, each wafer 40 is placed in the X direction, the Y direction is parallel to the central axis of the wafer 40, several wafers 40 are spaced apart in the Y direction, and the wafers 40 are inserted and removed in the Z direction, in accordance with common practice. The utility model discloses be different with current product: on the premise that the shape, the size and the volume of the existing wafer box are not changed, 35 wafers can be placed in the wafer box. The invention is described in detail below with reference to the accompanying figures 1-7 and the specific embodiments.

The utility model discloses the film frame 20 is basically the same with current conventional film frame, and the institute is different in, under the unchangeable prerequisite of whole shape and size of film frame 20, the slot 211 that is used for planting the wafer on the film frame 20 is equipped with 35. As shown in fig. 1-2, the sheet frame 20 is shaped like a substantially H-shaped cubic frame penetrating vertically in the Z direction, and includes two opposing sheet frame side walls 21 positioned in the X direction, a sheet frame end wall 22 positioned in the Y direction, and an H-shaped bar 23 positioned opposite to the sheet frame end wall 22. The opposite surfaces of the two side walls 21 of the wafer rack are provided with a plurality of wafer slots 211 which are arranged along the Y direction at intervals and used for inserting wafers, and the number of the wafer slots 211 is 35 and used for stabilizing the wafers. As shown in fig. 5, the wafer slots 211 on both sides of the wafer frame 20 correspond to the support grooves 13 one by one in the Z direction.

In a preferred embodiment, 34 groove separating plates 212 are vertically arranged on the inner side wall of the

rack side wall

21, and 35 wafer inserting grooves 211 are formed between two adjacent groove separating plates 212, the groove separating plates 212 and the rack end wall 22, and between the groove separating plates 212 and the rack side wall 21. The wafer slot 211 has a structure with a narrow slot bottom and a wide slot opening, which is beneficial to storing and taking out wafers and reduces the contact area between the wafer slot and the wafer when storing the wafers.

The bottom region of the wafer slot 211 in the Z direction has a curvature forming arc segment 211a, and the arc segment 211a conforms to the shape of the lower portion of the wafer. The bottom end of the arc-shaped section 211a extends downwards vertically along the Z direction to form a limiting plate 213 for limiting the rack, and a V-shaped positioning groove 214 which is concave upwards is formed in the center of the bottom surface of the limiting plate 213. The top surface of the side wall 21 of the wafer rack is horizontally and outwardly cantilevered to form an extension plate 215, and marks 216 for marking the number of the slots 211 are arranged on the extension plate 215 at intervals, and can be digital marks or other marks, so as to count the number of wafers on the wafer rack.

As shown in fig. 1 and 5, the upper cover 10 is cooperatively buckled with the bottom cover 30 in the Z direction to form a closed storage box for enclosing the wafer-carrying wafer holder 20. As shown in fig. 2, the upper lid 10 has a substantially cubic housing shape with an open bottom, and the center of the top surface 11 of the upper lid 10 is provided as an upwardly convex arc 111 that conforms to the upper shape of the wafer 40. Two sides of the arc-shaped plate 111 in the X direction are respectively provided with 35 cantilever spring pieces 12 which are arranged at intervals in the Y direction and horizontally extend in the X direction, the free ends of the two rows of cantilever spring pieces 12 are close to each other and extend, the free ends of the cantilever spring pieces 12 are provided with staggered complementary support grooves 13, and the support grooves 13 are used for clamping and stabilizing the upper part of the wafer 40 and preventing the wafer 40 from scattering or being disordered.

As shown in fig. 3, the slot walls on both sides of the supporting slot 13 extend obliquely and outwardly from the slot bottom, wherein the front section of one slot wall extends and converges obliquely and upwardly relative to the rear end thereof to form a peak-shaped first retaining wall 131, and the front section of the other slot wall extends and converges upwardly relative to the rear end thereof to form a second retaining wall 132 which forms an oblique angle with the first retaining wall 131, so that the vertical projection of the supporting slot 13 is approximately diamond-shaped. The vertical projection of the top points of the first retaining wall 131 and the second retaining wall 132 of the supporting groove 13 crosses the center line a between the adjacent cantilever spring pieces 12, so that the adjacent retaining walls of the adjacent supporting grooves 13 form staggered complementation, that is, the groove walls of the adjacent supporting grooves 13 are partially staggered, so as to save space, and increase the number of the supporting grooves 13 to 35 without changing the shape and size of the upper cover 10. As shown in fig. 4. Further, the vertexes of the first retaining wall 131 and the second retaining wall 132 are provided with arc chamfers.

The arrangement of the offset complementary supporting grooves 13 ensures that the clearance of the adjacent supporting grooves 13 in the linear direction (namely Y direction) of the wafer 40 is zero, so that the wafer can be aligned and fixed even if the wafer is inclined after being placed in the wafer frame groove, thereby basically solving the problem that the wafer is easy to be clamped. When the wafer 40 just contacts the supporting groove 13, it is inclined, and after the top cover 10 and the bottom cover 30 are fastened OK, the wafer 40 is already aligned and fixed by the supporting groove 13 of the cantilever spring 12.

As shown in fig. 1-2 and 5, the bottom cover 30 is in the shape of a cuboid shell with an open top for receiving the wafer rack 20 therein, and the bottom cover 30 is provided with a centrally protruding attachment structure 311 on the bottom cover side wall 31 corresponding to the rack side wall 21 for abutting against the surface of the arc-shaped section 211a of the rack side wall 21. A groove is formed on the bottom surface of the bottom cover 30, and a positioning protrusion is formed at the center of the groove. The wafer holder 20 with the wafer is placed in the bottom cover 30, the limiting plate 213 of the wafer holder 20 is placed in the groove, and the positioning protrusion is clamped at the bottom of the positioning groove 214 to limit the wafer holder 30. The top of the bottom cover side wall 31 is provided with a detent 312.

The bottom end of the side wall of the upper cover 10 is provided with a buckle 14, and the buckle 14 is detachably and fittingly clamped with the clamping position 312 of the bottom cover 30, so that the wafer 40 can be conveniently loaded and unloaded. Convex surfaces 112 are arranged at four corners of the top surface 11 of the upper cover 10, and concave surfaces 32 matched with the convex surfaces 112 are arranged at four corners of the bottom surface of the bottom cover 30, so that a plurality of shipping boxes can be stacked up and down conveniently.

Claims

1. The utility model provides a vertical wafer box of placing of 35 pieces dress which characterized in that: the improved wafer rack comprises an upper cover (10), a wafer rack (20) and a bottom cover (30), wherein the wafer rack (20) is placed in the bottom cover (30), and the upper cover (10) is arranged above the bottom cover (30) in a buckling and covering mode; the opposite surfaces of the two sheet frame side walls (21) of the sheet frame (20) are provided with 35 wafer slots (211) which are distributed at intervals; two side edges of the top surface of the upper cover (10) parallel to the axis of the wafer are respectively provided with 35 cantilever elastic sheets (12) which are arranged at intervals and horizontally extend towards the axis direction of the wafer, and the free ends of the cantilever elastic sheets (12) are provided with supporting grooves (13) for clamping and stabilizing the upper part of the wafer; the groove walls on two sides of the supporting groove (13) are inclined upwards and are expanded outwards to form a retaining wall, the vertical projection of the top point of the retaining wall crosses the center line between adjacent cantilever elastic sheets (12), and the adjacent retaining wall of the supporting groove (13) is in a staggered complementary type.

2. The 35-wafer vertical placement cassette of claim 1, wherein: the anterior segment of the both sides cell wall of support groove (13) upwards extends respectively and draws in first barricade (131) and the second barricade (132) that form the mountain peak form in, the summit of first barricade (131) and second barricade (132) is the diagonal angle setting, makes support groove (13) vertical projection's shape is approximate rhombus.

3. The 35-wafer vertical placement cassette of claim 1, wherein: the inner side wall of the side wall (21) of the wafer frame is vertically provided with 34 groove separating plates (212), and 35 wafer slots (211) are formed between two adjacent groove separating plates (212), the groove separating plates (212) and the end wall (22) of the wafer frame, and between the groove separating plates (212) and the side wall (21) of the wafer frame.

4. A 35-wafer vertical placement cassette according to any of claims 1-3, wherein: the bottom area of the wafer slot (211) along the Z direction is provided with a curvature forming arc-shaped section (211a), and the arc-shaped section (211a) is adapted to the shape of the lower part of the wafer.

5. The 35-wafer vertical placement cassette of claim 4, wherein: two opposite bottom cover side walls (31) of the bottom cover (30) are provided with centrally protruding attachment structures (311) for attachment to the arc-shaped sections (211a) of the sheet holder side walls (21).

6. The 35-wafer vertical placement cassette of claim 5, wherein: and the top point of the retaining wall is provided with an arc chamfer.