CN209757886U - Vertical wafer consignment box - Google Patents

Vertical wafer consignment box Download PDF

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Publication number
CN209757886U
CN209757886U CN201920342866.9U CN201920342866U CN209757886U CN 209757886 U CN209757886 U CN 209757886U CN 201920342866 U CN201920342866 U CN 201920342866U CN 209757886 U CN209757886 U CN 209757886U
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China
Prior art keywords
wafer
upper cover
rack
bottom cover
cover
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CN201920342866.9U
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Chinese (zh)
Inventor
刘春峰
李刚
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Glory Electronic Materials Chongqing Co Ltd
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Glory Electronic Materials Chongqing Co Ltd
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Priority to CN201920342866.9U priority Critical patent/CN209757886U/en
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Abstract

The utility model provides a vertical wafer consignment box, which comprises an upper cover, a rack and a bottom cover, wherein a plurality of slots which are arranged at intervals and used for inserting wafers are arranged on the opposite surface of two opposite rack side walls of the rack, the rack is placed in the bottom cover, and the upper cover is buckled and covered above the bottom cover; the wafer clamping device is characterized in that an arc-shaped portion matched with the top of a wafer in shape is arranged at the center of the inner side face of the upper cover, a plurality of cantilever elastic pieces arranged at intervals are arranged on two side edges, parallel to the central axis of the wafer, of the arc-shaped portion respectively, one end of each cantilever elastic piece is fixed on the inner side face of the upper cover, the other end of each cantilever elastic piece is a free end horizontally extending towards the center of the wafer, a downward U-shaped supporting groove used for clamping and stabilizing the upper portion of the wafer is formed in the lower surface of the end portion of each free end. The utility model has the characteristics of simple structure, simple to operate, saving cost, reduction card phenomenon.

Description

Vertical wafer consignment box
Technical Field
The utility model relates to a storage and transportation container of wafer especially relates to a vertical wafer delivery box.
Background
The wafer is a basic material for manufacturing semiconductor chips, the wafers sold on the market are round and thin sheets, and if a plurality of wafers are stacked together and packaged for transportation, the wafers are easily polluted, scratched and damaged, and the product quality is affected. Over the years, manufacturers have produced wafer shipping boxes to enable the safe storage and transport of wafers.
Currently, a multi-wafer vertical shipping box on the market generally comprises an upper cover, a spring plate for clamping and stabilizing the end part of a wafer, a wafer rack for inserting the wafer, and a bottom cover. When the consignment box with the structure is used, the elastic sheet is firstly installed on the inner side of the upper cover and then buckled with the bottom cover, so that the installation steps are complicated, and the production cost is high; in addition, the elastic sheet component can deform after long-term use and is loosened in the shipping box, so that the wafers are jumped and rubbed in the transportation process, the wafers are damaged, and the service life of the product is greatly influenced. Furthermore, the support grooves of the spring plates are V-shaped grooves 51, and the openings of the V-shaped grooves 51 are small, so that the wafer 40 is prone to be stuck (i.e., the wafer cannot be effectively fixed in the V-shaped grooves 51 and is stuck in the gap between adjacent V-shaped grooves 51, as shown in fig. 9).
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a vertical wafer consignment box, have simple structure, simple to operate, practice thrift the cost, reduce the characteristics of card phenomenon.
In order to solve the technical problem, the utility model provides a vertical wafer consignment box, which comprises an upper cover, a rack and a bottom cover, wherein a plurality of slots for inserting wafers are arranged at intervals on the opposite surfaces of two opposite rack side walls of the rack; the wafer clamping device is characterized in that an arc-shaped portion matched with the top of a wafer in shape is arranged at the center of the inner side face of the upper cover, a plurality of cantilever elastic pieces arranged at intervals are arranged on two side edges, parallel to the central axis of the wafer, of the arc-shaped portion respectively, one end of each cantilever elastic piece is fixed on the inner side face of the upper cover, the other end of each cantilever elastic piece is a free end horizontally extending towards the center of the wafer, a downward U-shaped supporting groove used for clamping and stabilizing the upper portion of the wafer is formed in the lower surface of the end portion of each free end.
Preferably, the arc part is an arc plate protruding upwards from the top surface of the upper cover.
Preferably, the bottom region of the slot has an arcuate section with a curvature to form a shape for receiving the lower portion of the wafer.
Preferably, two opposing bottom cover side walls of the bottom cover are provided with centrally projecting attachment structures for attachment with arcuate segments of the film frame side walls.
Preferably, the slot has a narrow slot bottom and a wide slot opening.
Preferably, the bottom end face of the side wall of the sheet frame is provided with a V-shaped positioning groove, the bottom face of the bottom cover is provided with a positioning bulge, and the positioning bulge is inserted into the positioning groove in a matched mode.
Preferably, the top surface of the upper cover is provided with a plurality of convex surfaces, and the bottom surface of the bottom cover is provided with a plurality of concave surfaces matched with the convex surfaces.
The utility model relates to a vertical wafer consignment box compares with current design, and its advantage lies in: (1) the cantilever elastic sheet for clamping and stabilizing the top end of the wafer is arranged on the inner surface of the upper cover by adopting an integrated forming process, so that the number of components is reduced, the structure is simple, the die sinking is simplified, the installation is convenient, and the cost is reduced; (2) cantilever shell fragment free end tip is equipped with U type support groove, and for prior art's V type, under the unchangeable condition of accomodating wafer quantity, the shape of U type has increased the radian of cell wall, has increased the width of supporting groove notch, even the wafer is placed at the frame inslot back, when the wafer has the slope situation, also can be to setting aside and fixing of wafer, has reduced the wafer card phenomenon.
Drawings
Fig. 1 is a schematic perspective view of the vertical wafer shipping box of the present invention.
Fig. 2 is an exploded view of the vertical wafer shipping box of the present invention.
Fig. 3 is a schematic bottom perspective view of the upper cover of the vertical wafer shipping box of the present invention.
Fig. 4 is an enlarged schematic view of a portion a in fig. 3 according to the present invention.
Fig. 5 is a schematic top perspective view of the bottom cover of the vertical wafer shipping box of the present invention.
Fig. 6 is a longitudinal sectional view of the vertical wafer shipping box of the present invention.
Fig. 7 is an enlarged schematic view of a portion B in fig. 6 according to the present invention.
Fig. 8 is a schematic view of the usage state of the present invention.
fig. 9 is a diagram illustrating a state of use of the prior art.
The reference numbers are as follows:
10-upper cover, 11-top surface, 111-arc plate, 112-convex surface, 12-cantilever elastic sheet, 121-U-shaped supporting groove, 13-buckle, 20-sheet frame, 21-sheet frame side wall, 211-slot, 211 a-arc section, 212-slot separating plate, 213-limit plate, 214-locating slot, 215-extension plate, 216-mark, 22-sheet frame end wall, 23-H-shaped rod, 30-bottom cover, 31-bottom cover side wall, 311-attachment structure, 312-position clip, 32-bottom surface, 321-groove, 322-locating projection, 323-concave surface and 40-wafer.
Detailed Description
The utility model relates to a vertical wafer consignment box, including upper cover, the rack that is used for planting the wafer, bottom, the rack is placed inside the bottom, and the top of bottom is located to the upper cover, with bottom upper and lower lock joint. As shown in fig. 2, in accordance with a common practice, each wafer is placed in the X direction, the Y direction is parallel to the central axis of the wafer, several wafers are spaced apart in the Y direction, and the wafers are inserted and removed in the Z direction. The invention is described in detail below with reference to the accompanying figures 1-9 and the specific embodiments.
As shown in fig. 2, the utility model discloses the rack 20 is basically the same with conventional rack, and the shape of rack 20 is the cubic skeleton of roughly H shape that link up from top to bottom in the Z direction, including the rack lateral wall 21 that is located two relative settings of X direction, the rack end wall 22 that is located the Y direction, and the H shape pole 23 that sets up with the rack end wall 22 relatively, two the opposite face of rack lateral wall 21 is equipped with a plurality of slots 211 that are used for inserting the wafer of arranging along the Y direction interval, and slot 211 is used for limiting the interval of wafer, and stabilizes the wafer. Specifically, a plurality of groove separating plates 212 are vertically and fixedly arranged on the inner side wall of the side wall 21 of the wafer rack, the slot 211 is formed between two adjacent groove separating plates 212, and the slot 211 has a structure with a narrower slot bottom and a wider slot opening, so that wafers can be stored and taken out conveniently, and the contact area between the wafers and the slot is reduced when the wafers are stored.
Further, the bottom region of the slot 211 in the Z direction has a curvature forming arc segment 211a, and the arc segment 211a conforms to the shape of the lower portion of the wafer. The bottom end of the arc-shaped section 211a extends downwards vertically along the Z direction to form a limiting plate 213 for limiting the position of the wafer rack, and the center of the bottom surface of the limiting plate 213 is provided with a V-shaped positioning groove 214 which is concave upwards; the top surface of the side wall 21 of the wafer rack is horizontally and outwardly cantilevered to form an extension plate 215, and marks 216 for marking the number of the slots 211 are arranged on the extension plate 215 at intervals, and can be digital marks or other marks, so as to count the number of wafers on the wafer rack.
As shown in fig. 1-2 and 5, the bottom cover 30 is in the shape of a cuboid shell with an open top for receiving the wafer rack therein, and a boss protruding toward the center is provided on the bottom cover side wall 31 of the bottom cover 30 corresponding to the rack side wall 21 as an attachment structure 311 for abutting against the surface of the arc-shaped section 211a of the rack side wall 21. A groove 321 is formed on the bottom surface 32 of the bottom cover 30, and a positioning protrusion 322 is formed at the center of the groove 321. The wafer holder 20 with the wafer is placed in the bottom cover 30, the limiting plate 213 of the wafer holder 20 is placed in the groove 321, and the positioning protrusion 322 is clamped at the bottom of the positioning groove 214 to limit the wafer holder 30. The top of the bottom cover side wall 31 is provided with a detent 312.
As shown in fig. 1-3, the top cover 10 cooperatively snaps with the bottom cover 30 in the Z-direction to form an enclosed receiving space for enclosing the wafer-bearing wafer holder 20. The upper cover 10 is in a shape of a substantially cubic housing with an opening at the bottom, the center of the top surface 11 of the upper cover 10 is provided with an upward protruding arc-shaped plate 111 meeting the shape of the upper part of a wafer, two sides of the arc-shaped plate 111 in the X direction are respectively provided with a plurality of cantilever spring pieces 12 which are arranged at intervals in the Y direction and horizontally extend in the X direction, one end of each cantilever spring piece 12 is fixed on the top surface 11 of the upper cover 10, the other end of each cantilever spring piece is a free end, the free ends of the two rows of cantilever spring pieces 12 horizontally extend in the wafer center direction, and the bottom surfaces of the free ends of the cantilever spring pieces 12 are provided with downward U-shaped supporting grooves 121, as shown in fig. 6-7, the U-shaped supporting grooves 121 are in one-to-one-up correspondence with the slots 211 on two sides of the wafer frame. The U-shaped supporting groove 121 is arranged, so that under the condition that the number of the accommodated wafers is not changed, the radian of the groove wall is increased and the width of the notch of the supporting groove is increased due to the U-shaped shape, and even after the wafers are placed in the groove of the wafer frame, the wafers can be aligned and fixed when the wafers are inclined. As shown in fig. 8, the wafer 40 is inclined when it just contacts the U-shaped supporting groove 121, and then after the upper cover 10 and the bottom cover 30 are fastened OK, the wafer 40 is already aligned and fixed by the U-shaped supporting groove 121 of the cantilever spring 12.
The bottom end of the side wall of the upper cover 10 is provided with a buckle 13, and the buckle 13 and the clamping position 312 of the bottom cover 30 can be in adaptive clamping in an opening and closing manner, so that wafers can be conveniently loaded and unloaded. Convex surfaces 112 are arranged at four corners of the top surface 11 of the upper cover 10, and concave surfaces 323 matched with the convex surfaces 112 are arranged at four corners of the bottom surface of the bottom cover 30, so that a plurality of shipping boxes can be stacked up and down conveniently.

Claims (7)

1. A vertical wafer consignment box is characterized in that: the wafer inserting device comprises an upper cover (10), a wafer rack (20) and a bottom cover (30), wherein a plurality of slots (211) which are arranged at intervals and used for inserting wafers are formed in the opposite surfaces of two opposite side walls (21) of the wafer rack (20), the wafer rack (20) is placed in the bottom cover (30), and the upper cover (10) is buckled and covered above the bottom cover (30); the wafer clamping device is characterized in that an arc-shaped portion matched with the shape of the top of a wafer is arranged at the center of the inner side face of the upper cover (10), a plurality of cantilever elastic pieces (12) are arranged on two sides, parallel to the central axis of the wafer, of the arc-shaped portion respectively, one end of each cantilever elastic piece (12) is fixed to the inner side face of the upper cover (10), the other end of each cantilever elastic piece is a free end extending horizontally towards the center of the wafer, a downward U-shaped supporting groove (121) used for clamping and stabilizing the upper portion of the wafer is formed in the lower surface of the end portion of each free end, and the U-shaped supporting grooves (121.
2. The vertical wafer shipping box of claim 1, wherein: the arc part is an arc plate (111) protruding upwards from the top surface of the upper cover (10).
3. The vertical wafer shipping box of claim 1, wherein: the bottom region of the slot (211) has an arcuate section (211a) with a curvature to receive the lower shape of the wafer.
4. The vertical wafer shipping box of claim 3, wherein: two opposite bottom cover side walls (31) of the bottom cover (30) are provided with centrally protruding attachment structures (311) for attachment to the arc-shaped sections (211a) of the sheet holder side walls (21).
5. The vertical wafer shipping box of any of claims 1-4, wherein: the slot (211) is in a shape with a narrow slot bottom and a wide slot opening.
6. The vertical wafer shipping box of any of claims 1-4, wherein: the bottom end face of the side wall (21) of the sheet frame is provided with a V-shaped positioning groove (214), the bottom face (32) of the bottom cover (30) is provided with a positioning protrusion (322), and the positioning protrusion (322) is inserted into the positioning groove (214) in a matching mode.
7. The vertical wafer shipping box of any of claims 1-4, wherein: the top surface of the upper cover (10) is provided with a plurality of convex surfaces (112), and the bottom surface of the bottom cover (30) is provided with a plurality of concave surfaces (323) matched with the convex surfaces (112).
CN201920342866.9U 2019-03-18 2019-03-18 Vertical wafer consignment box Active CN209757886U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920342866.9U CN209757886U (en) 2019-03-18 2019-03-18 Vertical wafer consignment box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920342866.9U CN209757886U (en) 2019-03-18 2019-03-18 Vertical wafer consignment box

Publications (1)

Publication Number Publication Date
CN209757886U true CN209757886U (en) 2019-12-10

Family

ID=68755246

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920342866.9U Active CN209757886U (en) 2019-03-18 2019-03-18 Vertical wafer consignment box

Country Status (1)

Country Link
CN (1) CN209757886U (en)

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