CN212752739U - Detachable mounting structure of high-density circuit board - Google Patents
Detachable mounting structure of high-density circuit board Download PDFInfo
- Publication number
- CN212752739U CN212752739U CN202022074820.9U CN202022074820U CN212752739U CN 212752739 U CN212752739 U CN 212752739U CN 202022074820 U CN202022074820 U CN 202022074820U CN 212752739 U CN212752739 U CN 212752739U
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- circuit board
- density circuit
- substrate
- step groove
- base plate
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Abstract
The utility model discloses a demountable installation structure of high density circuit board, it includes mount pad (1), set firmly in loading board (2) at mount pad (1) top, step groove (3) have been seted up at the top of loading board (2), be provided with finned radiator A in the microgroove of step groove (3), finned radiator A includes base plate A (4) and fin A (5), base plate A (4) weld in the microgroove of step groove (3), the top surface of base plate A (4) and the circular bead parallel and level of step groove (3), the welding has a plurality of fin A (5) on the basal surface of base plate A (4), be provided with finned radiator B who is located loading board (2) top between two stands (6), finned radiator B includes base plate B (7) and fin B (8). The utility model has the advantages that: compact structure, extension high density circuit board life, improvement high density circuit board maintenance efficiency, easy operation.
Description
Technical Field
The utility model relates to a high density circuit board mounting structure's technical field, especially a high density circuit board's demountable installation structure.
Background
Along with electronic product's continuous development, high density circuit board uses gradually in accurate electronic equipment, and high density circuit board includes copper and circuit layer, and the circuit layer sets firmly on the top surface of copper, and the circuit layer sets up, and the copper is in the mount pad in electronic equipment through screw detachable fixed mounting. Because the copper plate is detachably connected with the mounting seat, when the high-density circuit board is damaged, all screws between the copper plate and the mounting seat can be screwed out, and the high-density circuit board can be maintained outside the equipment after being taken down, so that the aim of conveniently maintaining the circuit board is fulfilled. However, this detachable connection structure has the following drawbacks: 1. a plurality of screws are connected between the high-density circuit board and the mounting seat, so that the high-density circuit board can be taken down after a long time, and the maintenance efficiency is reduced. 2. Be provided with multilayer circuit layer in the high density circuit board, circuit layer during operation produces a large amount of heats, if these heats discharge in time, high temperature will probably burn out circuit layer to high density circuit board's life has been reduced. Therefore, a detachable mounting structure for prolonging the service life of the high-density circuit board and improving the maintenance efficiency of the high-density circuit board is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, extension high density circuit board life, improve high density circuit board maintenance efficiency, easy operation's demountable installation structure of high density circuit board.
The purpose of the utility model is realized through the following technical scheme: a detachable mounting structure of a high-density circuit board comprises a mounting seat and a bearing plate fixedly arranged at the top of the mounting seat, wherein a step groove is formed in the top of the bearing plate, a fin type radiator A is arranged in a small groove of the step groove and comprises a substrate A and fins A, the substrate A is welded in the small groove of the step groove, the top surface of the substrate A is flush with the shoulder of the step groove, a plurality of fins A are welded on the bottom surface of the substrate A, two stand columns are welded at the top of the mounting seat, a fin type radiator B positioned above the bearing plate is arranged between the two stand columns, the fin type radiator B comprises a substrate B and fins B, guide holes are formed in the left end and the right end of the substrate B, the two guide holes of the substrate B are respectively sleeved on the two stand columns, a plurality of fins B are fixedly arranged on the top surface of the substrate B, springs are sleeved on the two stand columns, one end, the other end of the spring is welded on the bottom surface of the substrate B, a high-density circuit board is placed on the shoulder of the stepped groove, the high-density circuit board extends to the outside of the stepped groove, a gap is reserved between one side wall of the high-density circuit board and the large groove, and the substrate B is pressed against the top surface of the high-density circuit board under the action of the elastic force of the spring.
The step groove is rectangular, and the width of the step groove is larger than or equal to that of the high-density circuit board.
Two rings are welded at the top of the base plate B and are arranged at the left end and the right end of the base plate B.
The substrate B is arranged in parallel to the mounting seat.
The top of mount pad has set firmly two support columns, the loading board welds in the top of two support columns.
The upright column is a cylinder.
The utility model has the advantages of it is following: the utility model discloses compact structure, extension high density circuit board life, improvement high density circuit board maintenance efficiency, easy operation.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the present invention with the high-density circuit board removed;
FIG. 3 is a top view of the carrier plate.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 1 to 3, a detachable mounting structure of a high-density circuit board includes a mounting base 1, a bearing plate 2 fixedly disposed on the top of the mounting base 1, a step groove 3 is disposed on the top of the bearing plate 2, a fin heat sink a is disposed in a small groove of the step groove 3, the fin heat sink a includes a substrate a4 and a fin A5, a substrate a4 is welded in the small groove of the step groove 3, the top surface of the substrate a4 is flush with a shoulder of the step groove 3, a plurality of fins A5 are welded on the bottom surface of the substrate a4, two upright posts 6 are welded on the top of the mounting base 1, the upright posts 6 are cylindrical, a fin heat sink B disposed above the bearing plate 2 is disposed between the two upright posts 6, the fin heat sink B includes a substrate B7 and a fin B8, the substrate B7 is disposed parallel to the mounting base 1, guide holes are disposed at the left and right ends of the substrate B7, the two guide holes of the substrate B4, set firmly a plurality of fins B8 on the top surface of base plate B7, all overlap on two stands 6 and be equipped with spring 9, the one end of spring 9 welds on mount pad 1, and the other end welds on the basal surface of base plate B7, place high density circuit board 10 on the shoulder of step groove 3, high density circuit board 10 extends in the outside of step groove 3, leaves the clearance between a lateral wall and the big groove of high density circuit board 10, and the base plate B7 supports and presses on the top surface of high density circuit board 10 at spring 9's spring action.
The step groove 3 is rectangular, and the width of the step groove 3 is greater than or equal to that of the high-density circuit board 10. Two hanging rings 11 are welded to the top of the base plate B7, and the two hanging rings 11 are arranged at the left end and the right end of the base plate B7. The top of mount pad 1 sets firmly two support columns 12, loading board 2 welds in the top of two support columns 12.
The working process of the utility model is as follows: a large amount of heat is generated on the wiring layer of the high-density circuit board 10, and since the bottom surface of the high-density circuit board 10 is in contact with the top surface of the substrate a4 and the top surface of the high-density circuit board 10 is in contact with the bottom surface of the substrate B7, a part of the heat is transferred to the substrate a4, the substrate a4 transfers the heat to the fin a5, and the fin a5 discharges the part of the heat to the outside; and another part heat transfer gives base plate B7, and base plate B7 gives fin B8 with heat transfer again, and fin B8 discharges this part heat to the external world to dispel the heat to high density circuit board through two routes, realized accomplishing the heat dissipation of circuit board in the short time, improved the radiating effect, effectively avoided the circuit layer to burn out because of the temperature risees simultaneously, very big extension the life of circuit board.
Because high density circuit board 10 supports under the spring force effect of spring 9 and presses between the circular bead of base plate B7 and step groove 3, thereby realized high density circuit board 10 fixed, when will maintaining high density circuit board 10, can upwards lift rings 11, rings 11 drive base plate B7 along stand 6 upward movement, after base plate B7 and high density circuit board 10 separation, the maintainer can take out high density circuit board 10 in the step groove 3, thereby make things convenient for the maintainer to maintain the circuit board externally, consequently compare traditional dismantlement screw mode, need not to twist the screw, only need upwards lift rings 11 and can take out high density circuit board, very big shortening the dismantlement time, and then very big improvement high density circuit board's maintenance efficiency.
The foregoing is illustrative of the preferred embodiments of the present invention, and it is to be understood that the invention is not limited to the precise forms disclosed herein, and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the invention as defined by the appended claims. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (6)
1. The utility model provides a demountable installation structure of high density circuit board which characterized in that: the heat dissipation device comprises a mounting seat (1) and a bearing plate (2) fixedly arranged at the top of the mounting seat (1), wherein a step groove (3) is formed in the top of the bearing plate (2), a fin type radiator A is arranged in a small groove of the step groove (3) and comprises a substrate A (4) and fins A (5), the substrate A (4) is welded in the small groove of the step groove (3), the top surface of the substrate A (4) is flush with a shoulder of the step groove (3), a plurality of fins A (5) are welded on the bottom surface of the substrate A (4), two stand columns (6) are welded at the top of the mounting seat (1), a fin type radiator B positioned above the bearing plate (2) is arranged between the two stand columns (6) and comprises a substrate B (7) and fins B (8), guide holes are formed in the left end and the right end of the substrate B (7), and the two guide holes of the substrate B (7) are respectively sleeved on the two stand columns (6), the top surface of base plate B (7) has set firmly a plurality of fins B (8), all overlaps on two stands (6) to be equipped with spring (9), and the one end of spring (9) welds on mount pad (1), and the other end welds on the basal surface of base plate B (7), placed high density circuit board (10) on the circular bead of step groove (3), high density circuit board (10) extend in the outside of step groove (3), leave the clearance between a lateral wall and the big groove of high density circuit board (10), support to press on the top surface of high density circuit board (10) infrabasal plate B (7) at the spring action of spring (9).
2. The detachable mounting structure of a high-density circuit board according to claim 1, wherein: the step groove (3) is rectangular, and the width of the step groove (3) is larger than or equal to that of the high-density circuit board (10).
3. The detachable mounting structure of a high-density circuit board according to claim 1, wherein: the top welding of base plate B (7) has two rings (11), and two rings (11) set up in the left and right ends of base plate B (7).
4. The detachable mounting structure of a high-density circuit board according to claim 1, wherein: the substrate B (7) is arranged in parallel to the mounting base (1).
5. The detachable mounting structure of a high-density circuit board according to claim 1, wherein: the top of mount pad (1) has set firmly two support columns (12), loading board (2) welds in the top of two support columns (12).
6. The detachable mounting structure of a high-density circuit board according to claim 1, wherein: the upright post (6) is a cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022074820.9U CN212752739U (en) | 2020-09-21 | 2020-09-21 | Detachable mounting structure of high-density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022074820.9U CN212752739U (en) | 2020-09-21 | 2020-09-21 | Detachable mounting structure of high-density circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212752739U true CN212752739U (en) | 2021-03-19 |
Family
ID=74990464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022074820.9U Active CN212752739U (en) | 2020-09-21 | 2020-09-21 | Detachable mounting structure of high-density circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212752739U (en) |
-
2020
- 2020-09-21 CN CN202022074820.9U patent/CN212752739U/en active Active
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