CN212750854U

CN212750854U - Wafer coating machine

Info

Publication number: CN212750854U
Application number: CN202022126206.2U
Authority: CN
Inventors: 戚孝峰; 周鹏程; 王哲琦
Original assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Current assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-03-19
Anticipated expiration: 2030-09-24

Abstract

The application relates to a wafer coating machine, which comprises a placing rack for placing wafers, wherein one side of the placing rack is provided with an electric clamping jaw and a supporting frame, the electric clamping jaw is connected with a driving piece for driving the electric clamping jaw to move between the placing rack and the supporting frame, and the supporting frame is used for placing wafers; a taking part is arranged above the supporting frame, a coating part for coating is arranged on one side of the taking part, and the taking part is used for taking the wafer on the supporting frame to the coating part or taking the wafer on the coating part to the supporting frame. This application has the effect of using manpower sparingly the cost.

Description

Wafer coating machine

Technical Field

The application relates to the field of coating machines, in particular to a wafer coating machine.

Background

The wafer is a silicon wafer used for manufacturing a semiconductor circuit, and is widely applied to the production and manufacturing of integrated circuits, and the current domestic wafer production line mainly takes 8 inches and 12 inches. Wafer coating with a solvent (e.g., photoresist) is performed for the subsequent processes such as evaporation and development.

Generally, during coating, a wafer needs to be manually placed below a vacuum chuck, the wafer is sucked by the vacuum chuck, then a solvent is dripped on the wafer from the upper part, and after a certain amount of the solvent is dripped on the wafer, the solvent is uniformly dispersed on the wafer after being rotated by a rotating centrifugal force.

In view of the above-mentioned related technologies, the inventors believe that during coating, a wafer needs to be manually placed under a vacuum chuck, and then coating operation is performed, and after coating, the coated wafer still needs to be manually taken out, so that the whole process consumes much manpower resources.

SUMMERY OF THE UTILITY MODEL

In order to save labor cost, the application provides a wafer coating machine.

The application provides a wafer coating machine adopts following technical scheme:

a wafer coating machine comprises a placing frame for placing a wafer, wherein one side of the placing frame is provided with an electric clamping jaw and a supporting frame, the electric clamping jaw is connected with a driving piece for driving the electric clamping jaw to move between the placing frame and the supporting frame, and the supporting frame is used for placing the wafer; the wafer coating device is characterized in that a taking part is arranged above the supporting frame, a coating part for coating is arranged on one side of the taking part, and the taking part is used for taking a wafer on the supporting frame to the coating part or taking the wafer on the coating part to the supporting frame.

Through adopting above-mentioned technical scheme, the wafer of electronic clamping jaw on to the rack is taken, and the driving piece drives electronic clamping jaw and removes between rack and support frame, and the wafer of taking is taken to the piece of taking, can reduce the manual operation step, and then the cost of using manpower sparingly.

Optionally, a movable electric cylinder is arranged below the placing frame, and a connecting platform is fixedly connected to a sliding table of the movable electric cylinder; the placing frame comprises a first support and a second support, and the first support and the second support are both detachably connected with the connecting platform; a plurality of first clamping grooves are formed in the first support, and a plurality of second clamping grooves are formed in the second support.

By adopting the technical scheme, the 12-inch wafer is placed in the first clamping groove, and the 8-inch wafer is placed in the second clamping groove, so that the applicability of the coating machine can be improved.

Optionally, one side of rack is provided with infrared sensor, infrared sensor is connected with the PLC controller, the PLC controller is connected with removal electric jar and electronic clamping jaw.

By adopting the technical scheme, when the sliding table of the movable electric cylinder moves, the first support or the second support moves along with the sliding table, the infrared sensor senses the wafer, the PLC controller controls the sliding table of the movable electric cylinder to stop moving, and the electric clamping jaw is controlled to clamp the wafer.

Optionally, the driving member includes a first conveying roller and a second conveying roller, a conveying belt is connected between the first conveying roller and the second conveying roller, and a rotating motor is connected to the center of the first conveying roller; the conveying belt is connected with the electric clamping jaw.

Through adopting above-mentioned technical scheme, can drive electronic clamping jaw through conveyor belt and remove, and then drive electronic clamping jaw and remove the wafer, the cost of using manpower sparingly.

Optionally, the taking part comprises a first electric cylinder and a first air cylinder, the first air cylinder is connected with a sliding table of the first electric cylinder, and the first electric cylinder is arranged along the direction from the support frame to the coating part; a plurality of first vacuum suction nozzles are connected to a piston rod of the first air cylinder, and each first vacuum suction nozzle is connected with a vacuum pump through a first pipeline.

Through adopting above-mentioned technical scheme, first electric jar drives first cylinder and removes, and then can realize holding the wafer through first vacuum suction nozzle, carry out the removal of wafer, saved the human cost.

Optionally, the picking member further comprises a second electric cylinder and a second air cylinder, the second air cylinder is connected with the sliding table of the second electric cylinder, and the second electric cylinder is arranged along the direction from the support frame to the coating member; and a piston rod of the second air cylinder is connected with a plurality of second vacuum suction nozzles, and each second vacuum suction nozzle is connected with a vacuum pump through a second pipeline.

Through adopting above-mentioned technical scheme, the second electric jar drives the second cylinder and removes, and then can realize holding the wafer through second vacuum suction nozzle, carries out the removal of wafer, has saved the human cost.

Optionally, the support frame includes a first connecting frame and a second connecting frame, a first moving roller and a second moving roller are arranged below the first connecting frame and the second connecting frame, a moving motor is connected to the center of the first moving roller, and a moving belt is connected between the first moving roller and the second moving roller; the first connecting frame and the second connecting frame are connected with the movable belt and are respectively located on two sides of the movable belt.

Through adopting above-mentioned technical scheme, first link and second link all are connected with the removal belt, can realize the regulation of distance between first link and the second link, and then can be fit for placing of not unidimensional wafer.

Optionally, the coating part comprises a rotating disc, a driving motor is connected to the bottom surface of the rotating disc, and a motor shaft of the driving motor is arranged along the vertical direction; the driving motor is connected with a driving oil cylinder, and a piston rod of the driving oil cylinder is arranged along the vertical direction; a cleaning motor is arranged on one side of the rotating disc, a motor shaft of the cleaning motor is connected with a cleaning connecting plate, the cleaning connecting plate is connected with a cleaning connecting pipe, one end of the cleaning connecting pipe is connected with a cleaning spray head, and the other end of the cleaning connecting pipe is connected with a water source; the other side of the rotating disc is provided with a spraying motor, a motor shaft of the spraying motor is connected with a spraying connecting plate, the spraying connecting plate is connected with a spraying connecting pipe, one end of the spraying connecting pipe is connected with a spraying nozzle, and the other end of the spraying connecting pipe is connected with a spraying box.

By adopting the technical scheme, the surface of the wafer can be cleaned through the cleaning spray head, and the solvent can be sprayed on the surface of the wafer through the spray head, so that the coating operation is completed.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the arrangement of the placing frame, the electric clamping jaw, the supporting frame, the driving piece, the taking piece and the coating piece, the wafer can be moved to the coating piece from the placing frame to be coated under the action of the electric clamping jaw, the driving piece and the taking piece, so that the labor cost is saved;

2. through the arrangement of the first connecting frame, the second connecting frame, the first moving roller, the second moving roller, the moving motor and the moving belt, the distance between the first connecting frame and the second connecting frame can be adjusted, and the wafer fixing device is suitable for wafers of different sizes.

Drawings

Fig. 1 is a schematic view of the overall configuration of a wafer coater shown in this embodiment;

fig. 2 is a schematic view of a partial structure of the wafer coater shown in this embodiment;

FIG. 3 is a schematic view showing another partial structure of the wafer coater of the present embodiment;

fig. 4 is a schematic structural diagram for embodying the connection relationship between various parts on the mobile platform according to the embodiment;

FIG. 5 is a schematic structural diagram illustrating the connection relationship between the parts of the coating platform according to this embodiment;

fig. 6 is another schematic structural diagram for showing the connection relationship between the parts on the coating platform according to the embodiment.

Description of reference numerals: 1. placing a platform; 11. moving the electric cylinder; 12. a first bracket; 121. a first card slot; 13. a second bracket; 131. a second card slot; 14. connecting the platform; 141. a clamping block; 2. a mobile platform; 21. an electric jaw; 22. an infrared sensor; 23. a first conveying roller; 231. rotating the motor; 24. a second conveying roller; 25. a conveyor belt; 26. a first connecting frame; 261. a first moving roller; 262. a moving motor; 27. a second link frame; 271. a second moving roller; 272. moving the belt; 3. a coating platform; 31. rotating the disc; 32. a drive motor; 33. a driving oil cylinder; 34. cleaning the motor; 341. cleaning the connecting plate; 342. cleaning the connecting pipe; 343. cleaning the spray head; 35. a spray motor; 351. spraying a connecting plate; 352. a spray connecting pipe; 353. a spray nozzle; 354. a spray box; 355. a booster pump; 4. a PLC controller; 5. a static eliminator; 6. a first electric cylinder; 61. a first cylinder; 62. a first vacuum nozzle; 63. a first pipeline; 64. a first connecting plate; 7. a second electric cylinder; 71. a second cylinder; 72. a second vacuum nozzle; 73. a second pipeline; 74. a second connecting plate; 8. a vacuum pump.

Detailed Description

The present application is described in further detail below with reference to figures 1-6.

The embodiment of the application discloses a wafer coating machine. Referring to fig. 1 and 2, a wafer coater includes a placement platform 1, a moving platform 2, and a coating platform 3, wherein the moving platform 2 is located at one side of the placement platform 1, and the coating platform 3 is located at one side of the moving platform 2. The placing platform 1 is provided with a placing rack for placing wafers, the moving platform 2 is provided with an electric clamping jaw 21 and a supporting frame, and the electric clamping jaw 21 is connected with a driving piece for driving the electric clamping jaw 21 to move between the placing rack and the supporting frame. The support frame is used for placing wafers, and the electric clamping jaws 21 are used for clamping the wafers on the support frame to the support frame or clamping the wafers on the support frame to the support frame. The top of support frame is provided with takes the piece, takes one side of piece to be provided with the piece of scribbling that is used for the coating, scribbles the piece and is located coating platform 3, and the piece of taking is used for taking the wafer on the support frame to scribble on the piece, or takes the wafer on the piece of scribbling to the support frame.

Referring to fig. 1 and 3, a movable electric cylinder 11 is fixedly connected to the placing platform 1, the movable electric cylinder 11 is located below the placing frame, a connecting platform 14 is fixedly connected to a sliding table of the movable electric cylinder 11, and the sliding table of the movable electric cylinder 11 slides in the vertical direction. The placing frame comprises a first support 12 used for placing 12-inch wafers and a second support 13 used for placing 8-inch wafers, a plurality of clamping blocks 141 are arranged on the connecting platform 14, and the first support 12 and the second support 13 are detachably connected with the connecting platform 14 through the clamping blocks 141.

Referring to fig. 1 and 3, a plurality of first engaging grooves 121 are formed in the first bracket 12, the first engaging grooves 121 are distributed at equal intervals in the vertical direction, a plurality of second engaging grooves 131 are formed in the second bracket 13, and the second engaging grooves 131 are distributed at equal intervals in the vertical direction. An infrared sensor 22 is arranged on the mobile platform 2, and the infrared sensor 22 is connected with a PLC 4.

Referring to fig. 2 and 4, the driving member includes a first conveying roller 23 and a second conveying roller 24, the first conveying roller 23 and the second conveying roller 24 are disposed along the direction from the placing platform 1 to the moving platform 2, a conveying belt 25 is connected between the first conveying roller 23 and the second conveying roller 24, a rotating motor 231 is connected to the center of the first conveying roller 23, and the conveying belt 25 is fixedly connected to the electric clamping jaw 21. The PLC controller 4 is connected to the movable electric cylinder 11, the electric chuck 21, and the rotating motor 231.

Referring to fig. 3 and 4, taking the second support 13 mounted on the connecting platform 14 as an example, after the moving electric cylinder 11 is started, the second support 13 moves in the vertical direction, and after the infrared sensor 22 senses a wafer located in the second card slot 131, the PLC controller 4 controls the moving electric cylinder 11 to stop, and controls the electric clamping jaw 21 to start to clamp the wafer; after the electric clamping jaw 21 is clamped, the PLC 4 controls the rotating motor 231 to rotate, so as to drive the electric clamping jaw 21 to move, so that the wafer is clamped on the support frame, then the rotating motor 231 stops rotating, and the electric clamping jaw 21 releases the wafer.

Referring to fig. 2, a static eliminator 5 is fixedly connected to the movable stage 2, and the static eliminator 5 is used to eliminate static electricity on the wafer.

Referring to fig. 4, the supporting frame includes a first connecting frame 26 and a second connecting frame 27, a first moving roller 261 and a second moving roller 271 are disposed below the first connecting frame 26 and the second connecting frame 27, a moving motor 262 is connected to the center of the first moving roller 261, and a moving belt 272 is connected between the first moving roller 261 and the second moving roller 271; the first and second connection frames 26 and 27 are connected to the moving belt 272, and the first and second connection frames 26 and 27 are respectively located at both sides of the moving belt 272.

Referring to fig. 4, when the moving belt 272 is rotated by the moving motor 262, the first connecting frame 26 and the second connecting frame 27 move toward or away from each other. When the moving motor 262 rotates forward, the first connecting frame 26 and the second connecting frame 27 move toward each other, and the wafer capable of being placed by 12 inches is adjusted to the wafer capable of being placed by 8 inches, and when the moving motor 262 rotates backward, the first connecting frame 26 and the second connecting frame 27 move away from each other, and the wafer capable of being placed by 8 inches is adjusted to the wafer capable of being placed by 12 inches.

Referring to fig. 4, the taking part comprises a first electric cylinder 6, a first air cylinder 61, a second electric cylinder 7 and a second air cylinder 71, the first air cylinder 61 is connected with a sliding table of the first electric cylinder 6, and the first electric cylinder 6 is arranged along the direction from the support frame to the coating part; the second cylinder 71 is connected with the sliding table of the second electric cylinder 7, the second electric cylinder 7 is arranged along the direction from the support frame to the coating piece, the first electric cylinder 6 is positioned above the second electric cylinder 7, and the first electric cylinder 6 and the second electric cylinder 7 are both fixedly connected with the mobile platform 2. A piston rod of the first air cylinder 61 is fixedly connected with four first vacuum suction nozzles 62 through a first connecting plate 64, and each first vacuum suction nozzle 62 is connected with a vacuum pump 8 through a first pipeline 63; four second vacuum suction nozzles 72 are fixedly connected to a piston rod of the second cylinder 71 through a second connecting plate 74, and each second vacuum suction nozzle 72 is connected to the vacuum pump 8 through a second pipeline 73.

Referring to fig. 4, the first electric cylinder 6 and the first air cylinder 61 cooperate to transfer the wafers between the first link frame 26 and the second link frame 27 to the coating member for coating operation, while the second electric cylinder 7 and the second air cylinder 71 cooperate to transfer the coated wafers between the first link frame 26 and the second link frame 27. The first electric cylinder 6 and the first air cylinder 61 work synchronously with the second electric cylinder 7 and the second air cylinder 71, so that the working efficiency is improved. After the coated wafer is transferred between the first connection frame 26 and the second connection frame 27, the electric clamping jaw 21 and the rotating motor 231 are started, the electric clamping jaw 21 clamps the wafer, the rotating motor 231 rotates reversely, the wafer is sent into the first clamping groove 121 or the second clamping groove 131, at this time, the electric clamping jaw 21 is released, and the rotating motor 231 stops. And the PLC 4 controls the movable electric cylinder 11 to start, and the coating operation of taking the next wafer is carried out.

Referring to fig. 5 and 6, the coating member includes a rotating disk 31, a driving motor 32 is fixedly connected to a bottom surface of the rotating disk 31, and a motor shaft of the driving motor 32 is disposed in a vertical direction. A driving oil cylinder 33 is arranged below the driving motor 32, the driving oil cylinder 33 is fixedly connected with the coating platform 3, and a piston rod of the driving oil cylinder 33 is vertically upwards and fixedly connected with the driving motor 32. A cleaning motor 34 is arranged on one side of the rotating disc 31, a cleaning connecting plate 341 is fixedly connected to a motor shaft of the cleaning motor 34, a cleaning connecting pipe 342 is fixedly connected to the cleaning connecting plate 341, one end of the cleaning connecting pipe 342 is connected with a cleaning nozzle 343, and the other end is connected with a water source. The other side of the rotating disc 31 is provided with a spraying motor 35, a motor shaft of the spraying motor 35 is fixedly connected with a spraying connecting plate 351, the spraying connecting plate 351 is fixedly connected with a spraying connecting pipe 352, one end of the spraying connecting pipe 352 is connected with a spraying nozzle 353, the other end of the spraying connecting pipe 352 is connected with a spraying box 354, a booster pump 355 is arranged between the spraying box 354 and the spraying nozzle 353, and a solvent is contained in the spraying box 354.

Referring to fig. 5 and 6, during coating operation, the driving cylinder 33 drives the driving motor 32 and the rotating disc 31 to move upwards to receive a wafer to be coated, and then the piston rod of the driving cylinder 33 retracts. The driving motor 32 rotates, the motor shaft of the cleaning motor 34 rotates at the same time, the cleaning nozzle 343 rotates to the upper side of the wafer to spray clean water, then the motor shaft of the spraying motor 35 rotates, and the spraying nozzle 353 rotates to the upper side of the wafer to spray solvent. After the coating is finished, the driving motor 32 stops, and the piston cylinder of the driving oil cylinder 33 extends out, so that the coated wafer is convenient to move away.

The implementation principle of the wafer coater in the embodiment of the application is as follows:

when coating operation is performed, the movable electric cylinder 11 is started, the first support 12 moves in the vertical direction, and after the infrared sensor 22 senses a wafer positioned in the first clamping groove 121 or the second clamping groove 131, the PLC controller 4 controls the movable electric cylinder 11 to stop and controls the electric clamping jaw 21 to start to clamp the wafer; after the electric clamping jaw 21 is clamped, the PLC controller 4 controls the rotating motor 231 to rotate, so as to drive the electric clamping jaw 21 to move, thereby clamping the wafer to the first connecting frame 26 and the second connecting frame 27, and then the rotating motor 231 stops rotating, so that the electric clamping jaw 21 releases the wafer.

Then, the first electric cylinder 6, the first air cylinder 61, the second electric cylinder 7 and the second air cylinder 71 are started to move the wafer to be coated onto the coating member, and simultaneously, the coated wafer is moved onto the first connecting frame 26 and the second connecting frame 27. And starting the electric clamping jaw 21 and the rotating motor 231, clamping the wafer by the electric clamping jaw 21, reversely rotating the rotating motor 231, sending the wafer into the first clamping groove 121 or the second clamping groove 131, releasing the electric clamping jaw 21 at the moment, and stopping the rotating motor 231. And the PLC 4 controls the movable electric cylinder 11 to start, and the coating operation of taking the next wafer is carried out.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A wafer coater is characterized in that: the wafer placing device comprises a placing frame for placing a wafer, wherein one side of the placing frame is provided with an electric clamping jaw (21) and a supporting frame, the electric clamping jaw (21) is connected with a driving piece for driving the electric clamping jaw (21) to move between the placing frame and the supporting frame, and the supporting frame is used for placing the wafer; the wafer coating device is characterized in that a taking part is arranged above the supporting frame, a coating part for coating is arranged on one side of the taking part, and the taking part is used for taking a wafer on the supporting frame to the coating part or taking the wafer on the coating part to the supporting frame.

2. The wafer coater as set forth in claim 1, wherein: a movable electric cylinder (11) is arranged below the placing rack, and a connecting platform (14) is fixedly connected to a sliding table of the movable electric cylinder (11); the placing frame comprises a first support (12) and a second support (13), wherein the first support (12) and the second support (13) are detachably connected with a connecting platform (14); a plurality of first clamping grooves (121) are formed in the first support (12), and a plurality of second clamping grooves (131) are formed in the second support (13).

3. The wafer coater as set forth in claim 2, wherein: one side of rack is provided with infrared sensor (22), infrared sensor (22) are connected with PLC controller (4), PLC controller (4) are connected with removal electric jar (11) and electronic clamping jaw (21).

4. The wafer coater as set forth in claim 1, wherein: the driving part comprises a first conveying roller (23) and a second conveying roller (24), a conveying belt (25) is connected between the first conveying roller (23) and the second conveying roller (24), and a rotating motor (231) is connected to the center of the first conveying roller (23); the conveying belt (25) is connected with the electric clamping jaw (21).

5. The wafer coater as set forth in claim 1, wherein: the taking part comprises a first electric cylinder (6) and a first air cylinder (61), the first air cylinder (61) is connected with a sliding table of the first electric cylinder (6), and the first electric cylinder (6) is arranged along the direction from the support frame to the coating part; a plurality of first vacuum suction nozzles (62) are connected to a piston rod of the first air cylinder (61), and each first vacuum suction nozzle (62) is connected with a vacuum pump (8) through a first pipeline (63).

6. The wafer coater as set forth in claim 5, wherein: the picking piece further comprises a second electric cylinder (7) and a second air cylinder (71), the second air cylinder (71) is connected with a sliding table of the second electric cylinder (7), and the second electric cylinder (7) is arranged along the direction from the support frame to the coating piece; a plurality of second vacuum suction nozzles (72) are connected to a piston rod of the second air cylinder (71), and each second vacuum suction nozzle (72) is connected with the vacuum pump (8) through a second pipeline (73).

7. The wafer coater as set forth in claim 1, wherein: the supporting frame comprises a first connecting frame (26) and a second connecting frame (27), a first moving roller (261) and a second moving roller (271) are arranged below the first connecting frame (26) and the second connecting frame (27), a moving motor (262) is connected to the center of the first moving roller (261), and a moving belt (272) is connected between the first moving roller (261) and the second moving roller (271); the first connecting frame (26) and the second connecting frame (27) are connected with the moving belt (272), and the first connecting frame (26) and the second connecting frame (27) are respectively positioned on two sides of the moving belt (272).

8. The wafer coater as set forth in claim 1, wherein: the coating piece comprises a rotating disc (31), a driving motor (32) is connected to the bottom surface of the rotating disc (31), and a motor shaft of the driving motor (32) is arranged in the vertical direction; a driving oil cylinder (33) is connected to the driving motor (32), and a piston rod of the driving oil cylinder (33) is arranged along the vertical direction; a cleaning motor (34) is arranged on one side of the rotating disc (31), a cleaning connecting plate (341) is connected to a motor shaft of the cleaning motor (34), a cleaning connecting pipe (342) is connected to the cleaning connecting plate (341), one end of the cleaning connecting pipe (342) is connected with a cleaning spray head (343), and the other end of the cleaning connecting pipe is connected with a water source; the other side of the rotating disc (31) is provided with a spraying motor (35), a motor shaft of the spraying motor (35) is connected with a spraying connecting plate (351), the spraying connecting plate (351) is connected with a spraying connecting pipe (352), one end of the spraying connecting pipe (352) is connected with a spraying nozzle (353), and the other end of the spraying connecting pipe is connected with a spraying box (354).