CN212713735U

CN212713735U - Magnetron sputtering equipment

Info

Publication number: CN212713735U
Application number: CN202021512772.0U
Authority: CN
Inventors: 李聪; 潘振伟; 曲佳佳; 陈玲; 李靖
Original assignee: Shaoxing Jinggong Equipment Testing Technology Co ltd
Current assignee: Shaoxing Jinggong Equipment Testing Technology Co ltd
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-03-16
Anticipated expiration: 2030-07-28

Abstract

The utility model discloses a magnetron sputtering equipment, include the magnetic control cabin and install the workstation in magnetic control cabin below, the inside center of workstation is equipped with the ascending motor of direction, the axle of motor is worn out workstation upper portion and is worn out the part and be fixed with the circular carousel with the axle coaxial line of motor, carousel upper portion is equipped with cylindrical base plate, a substrate has been laid to base plate annular side, magnetic control cabin annular side evenly distributed has four targets of sputtering, the target includes shrouding and target, the target surface is equipped with the copper that is used for the tectorial membrane, the target is towards magnetic control cabin center and wear out the annular face in the magnetic control cabin, the shrouding is fixed at the annular face of magnetic control cabin outside. The utility model discloses the substrate laminating has four targets to come the substrate coating film on the annular surface of cylindrical base plate, and base plate annular side evenly distributed, and the base plate can be along with the carousel rotates together simultaneously, makes substrate surface coating film even, has improved efficiency, and the practicality is good.

Description

Magnetron sputtering equipment

Technical Field

The utility model belongs to the technical field of flexible printed wiring board preparation technique and specifically relates to a magnetron sputtering equipment is related to.

Background

Magnetron sputtering is one of physical vapor deposition and is widely applied to the fields of integrated circuits, liquid crystal displays, thin film solar energy and the like, magnetron sputtering equipment bombards materials on a target material by colliding electrons with atoms of argon in a vacuum cavity and continuously bombarding the surface of the target material, and finally deposits the materials on a substrate to form a thin film;

in the prior art, substrates are all flatly laid and fixed above a substrate, and materials on a target are bombarded onto the substrates, so that the method has certain limitation on the size of the substrates, and when the substrates are far larger than the target, a uniform magnetic field cannot be applied in the whole sputtering area, so that the thickness of a film formed on the substrates is easily uneven.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art not enough, provide a magnetron sputtering equipment, the substrate laminating is on the annular surface of cylindrical base plate, and base plate annular side evenly distributed has four targets to come to the substrate coating film, and the base plate can be along with the carousel rotates together simultaneously, makes substrate surface coating film even, has improved efficiency, and the practicality is good.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a magnetron sputtering device comprises a magnetron cabin and a workbench arranged below the magnetron cabin, wherein a motor with an upward direction is arranged at the center inside the workbench, a shaft of the motor penetrates out of the upper part of the workbench, a part of the shaft of the motor penetrates out of the circular turntable which is fixed with a coaxial line with the shaft of the motor, the magnetron cabin comprises a vacuum cavity, the turntable is positioned in the vacuum cavity, a cylindrical substrate is arranged on the upper part of the turntable, a substrate is paved on the annular side surface of the substrate, four sputtering targets are uniformly distributed on the annular side surface of the magnetron cabin, each sputtering target comprises a sealing plate and a target material, a copper plate for film coating is arranged on the surface of the target material, the target material faces the center of the magnetron cabin and penetrates out of the annular surface on the inner side of the magnetron cabin, the copper plate is opposite to the substrate and has a certain distance with the substrate, the sealing plate is fixed on the, The utility model provides a filter that is used for connecting outside evacuating device's first gas vent and is used for connecting outside inert gas device and outside air, first gas vent and air inlet intercommunication vacuum chamber, the inside exhaust apparatus that still is equipped with of workstation, exhaust apparatus is including the inside second gas vent of intercommunication vacuum chamber, exhaust case, the blast pipe of intercommunication second gas vent and exhaust case and the outside and exhaust case of intercommunication, the exhaust case is taken the inside gas in vacuum chamber out through second gas vent and blast pipe to discharge outside through the filter.

The outer side of the magnetic control cabin is also connected with a door frame, the outer side of the door frame is provided with a door which is hinged with the door frame and can completely cover the door frame, and one sputtering target penetrates through the door and a sealing plate is fixed on the outer side of the door.

The door inwards extends to be provided with annular vertical ribs, a target backboard is fixed in front of the sealing plate and penetrates through the inner surface and the outer surface of the door, an insulating part is arranged on the outer side, exceeding the inner side part of the door, of the target backboard and located between the annular vertical ribs and the target backboard, the outer side of the insulating part is fixed on the annular vertical ribs, and a gap exists between the inner side of the insulating part and the target backboard.

The door is characterized by further comprising a hinge pin, handles and bases are arranged on two sides of the door frame respectively, bosses corresponding to the handles and hinges corresponding to the bases are arranged on two sides of the door respectively, the hinges are installed on the bases and hinged through the hinge pin, when the door is attached to the door frame in a rotating mode, the bosses are located between the door frame and the handles and rotate, and the annular side faces of the bosses are abutted to the handles.

The door is characterized in that a circle of first sealing ring is further arranged on the inner side plane of the door, the first sealing ring is adhered to the inner side plane of the door through glue, the door cover is closed on the door frame, and the first sealing ring is abutted to the door frame.

The substrate further comprises a pressure plate and screws, wherein the pressure plate abuts against the surface of the substrate and fixes the substrate and the substrate together through the screws.

The annular surface of the outer side of the magnetron cabin is also provided with a plurality of windows communicated with the vacuum cavities, the windows are provided with transparent lenses for isolating the vacuum cavities from the outside, and the windows are positioned between two adjacent sputtering targets.

And the annular side surface of the magnetic control cabin is also provided with a plasma cleaning device.

And the upper part of the magnetic control cabin is also provided with a pressure gauge and a thermometer, and probes of the pressure gauge and the thermometer extend into the vacuum cavity.

Four corners of the lower part of the workbench are also provided with feet for supporting the workbench.

The utility model has the advantages that: the substrate is cylindrical, the substrate is attached to the annular side face of the substrate, and compared with the substrate with the same size, the substrate is laid flat for coating, so that the occupied space is saved; when the magnetron sputtering equipment is in operation, the motor drives the turntable to rotate, and the substrate on the turntable also rotates, so that the surface of the substrate can be uniformly coated, the efficiency is improved, and the practicability is good.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is an enlarged view of FIG. 1 at A;

FIG. 3 is a schematic structural view of the present invention;

FIG. 4 is an enlarged view of FIG. 3 at B;

FIG. 5 is an enlarged view at C of FIG. 3;

fig. 6 is a cross-sectional view of the present invention;

FIG. 7 is an enlarged view of FIG. 6 at D;

FIG. 8 is an exploded view of a sputtering target;

FIG. 9 is a front view of a sputtering target on a door;

FIG. 10 is a cross-sectional view at E-E of FIG. 9;

FIG. 11 is an enlarged view at F of FIG. 10;

fig. 12 is an enlarged view at G of fig. 10.

In the figure: the magnetron chamber comprises a magnetron chamber 1, a door frame 101, a handle 1011, a base 1012, a window 102, a transparent lens 1021, a first exhaust port 103, an air inlet 104, a plasma cleaning device 105, a pressure gauge 106, a thermometer 107, a door 108, a hinge 1081, a boss 1082, an annular vertical rib 1083, an insulating part 1084, a first sealing ring 1085, a vacuum chamber 109, a pin 110, a sputtering target 2, a sealing plate 201, a groove 2011, a first through hole 2012, a first sealing groove 2013, a second sealing groove 2014, a third sealing groove 2015, a first sealing rib 2016, a target backing plate 202, a fixing part 2021, a target cavity 2022, a convex rib 2023, a cooling cavity 2024, a fourth sealing groove 2025, a second sealing rib 2026, a target 203, a vertical rib 2031, a copper plate 2032, a tube 204, a first cylindrical part 2041, a second cylindrical part 2042, a fifth sealing groove 2043, a sixth sealing groove 2044, a seventh sealing groove 2045, a cylindrical fastening ring 205, an adapter plate 206, a second through hole 2062, an adapter tube 207, The water pipe joint 2071, the second sealing ring 208, the third sealing ring 209, the fourth sealing ring 210, the base plate 3, the pressing plate 301, the screw 302, the substrate 4, the turntable 5, the worktable 6, the motor 7, the exhaust device 8, the second exhaust port 801, the exhaust pipe 802, the exhaust box 803, the filter 804, the foot 9 and the magnet 10.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1 to 12, a magnetron sputtering device includes a magnetron chamber 1 and a workbench 6 installed below the magnetron chamber 1, an upward motor 7 is arranged at the center inside the workbench 6, a shaft of the motor 7 penetrates out of the upper part of the workbench 6 and penetrates out of a circular turntable 5 fixed with a shaft coaxial line with the motor 7, the magnetron chamber 1 includes a vacuum chamber 109, the turntable 5 is located in the vacuum chamber 109, a cylindrical substrate 3 is arranged on the upper part of the turntable 5, a substrate 4 is laid on the annular side surface of the substrate 3, specifically, the substrate 3 further includes a pressing plate 301 and a screw 302, the pressing plate 301 abuts against the surface of the substrate 4 and fixes the substrate 3 and the substrate 4 together through the screw 302, and the substrate 4 is fixed firmly through the pressing plate 301 and the screw 302, and the substrate 4 is also convenient to be detached and replaced.

Four sputtering targets 2 are uniformly distributed on the annular side face of the magnetron chamber 1, each sputtering target 2 comprises a sealing plate 201 and a target material 203, a copper plate 2032 for coating is arranged on the surface of each target material 203, each target material 203 faces the center of the magnetron chamber 1 and penetrates out of the annular face on the inner side of the magnetron chamber 1, each copper plate 2032 is right opposite to each substrate 4 and has a certain distance with each substrate 4, each sealing plate 201 is fixed on the annular face on the outer side of the magnetron chamber 1, a magnet 10 which surrounds the target material 203 for providing a magnetic field, a first exhaust port 103 for connecting an external vacuum pumping device and two air inlets 104 for connecting the external inert gas device and the external air are further arranged on the annular face on the outer side of the magnetron chamber 1, the inert gas communicated with the air inlets 104 of the external inert gas device can be argon, an exhaust device 8 is further arranged inside the workbench 6, and each exhaust device 8, An exhaust box 803, an exhaust pipe 802 communicating the second exhaust port 801 with the exhaust box 803, and a filter 804 communicating the outside with the exhaust box 803, wherein the exhaust box 803 extracts the gas inside the vacuum chamber 109 through the second exhaust port 801 and the exhaust pipe 802, and discharges the gas to the outside through the filter 804.

The 1 outside annular face in magnetic control cabin still is connected with door frame 101, the door frame 101 outside is equipped with and hinges with door frame 101 and can close door frame 101's door 108 completely, specifically does, the utility model discloses still include round pin axle 110, door frame 101 both sides are equipped with handle 1011 and base 1012 respectively, door 108 both sides are equipped with the boss 1082 that corresponds with handle 1011 and the hinge 1081 that corresponds with base 1012 respectively, hinge 1081 installs on base 1012 and articulates through round pin axle 110, when the rotatory laminating of door 108 is on door frame 101, boss 1082 is located between door frame 101 and the handle 1011, rotates the handle, boss 1082 annular side butt handle 1011.

One of the sputtering targets 2 is located on the door 108, specifically, the door 108 extends inward to form an annular vertical rib 1083, the front surface of the sealing plate 201 is fixed with a target backing plate 202, the target backing plate 202 penetrates through the inner and outer surfaces of the door 108, an insulating portion 1084 is arranged on the outer side of the target backing plate 202, which exceeds the inner side portion of the door 108, the insulating portion 1084 is located between the annular vertical rib 1083 and the target backing plate 202, the outer side of the insulating portion 1084 is fixed on the annular vertical rib 1083, and a gap exists between the inner side of the insulating portion and the target backing plate 202.

Before the sputtering process, firstly, the door 108 is covered on the door frame 101, the air inside the vacuum chamber 109 is pumped out from the first exhaust port 103 through the external vacuum pumping device, then the vacuum chamber 109 is pumped out again through the internal vacuum pumping device (the internal vacuum pumping device is a device formed by the second exhaust port 801, the exhaust pipe 802, the exhaust box 803 and the filter 804), then inert gas is introduced into the vacuum chamber 109, the sputtering process is carried out again, the sputtering power supply provides energy for the target 203, the magnet 10 provides a magnetic field for the vacuum chamber 109, so that the argon in the vacuum chamber 109 forms plasma, the argon atoms collide and continuously bombard the copper plate 2032 on the surface of the target 203, the material on the copper plate 2032 is bombarded out, the turntable 5 is rotated through the motor 7 to drive the substrate 3 to rotate, and finally the material on the copper plate 2032 is uniformly deposited on the substrate 4 to form a film, after sputtering is completed, the gas in the vacuum chamber 109 is evacuated through the first exhaust port 103 connected to the outside air, so that vacuum is formed in the vacuum chamber 109, then the air inlet 104 connected to the outside air is opened, the outside air is introduced into the vacuum chamber 109, so that the pressure in the vacuum chamber 109 is kept consistent with the outside atmospheric pressure, and finally the door 108 is opened, and the substrate 4 on the substrate 3 is taken out.

The inboard plane of door 108 still is equipped with the first sealing washer 1085 of round, first sealing washer 1085 passes through glue adhesion at the inboard plane of door 108, the door 108 lid closes on door frame 101, first sealing washer 1085 butt door frame 101 seals door 108 and door frame 10 through first sealing washer 1085, has effectually prevented the gas seepage in the vacuum chamber 109.

The annular surface on the outer side of the magnetron cabin 1 is also provided with a plurality of windows 102 communicated with the vacuum cavities, the windows 102 are provided with transparent lenses 1021 for separating the vacuum cavities 109 from the outside, the windows 102 are positioned between two adjacent sputtering targets 2, and the film coating condition of the substrate 4 in the vacuum cavities 109 can be effectively observed through the windows 102.

The annular side surface of the magnetron chamber 1 is also provided with a plasma cleaning device 105, before the sputtering process is carried out, the plasma cleaning device 105 can be started firstly, plasma is generated in the vacuum cavity 109, and the surface of the substrate 4 is cleaned and activated by the action of the plasma on the surface of the substrate 4.

The upper part of the magnetron chamber 1 is also provided with a pressure gauge 106 and a temperature gauge 107, probes of the pressure gauge 106 and the temperature gauge 107 extend into the vacuum chamber 109, the pressure and the temperature in the vacuum chamber 109 can be monitored in real time through the pressure gauge 106 and the temperature gauge 107, and feet 9 for supporting the workbench 6 are further arranged on four corners of the lower part of the workbench 6.

Preferably, the sputtering target 2 may further be communicated with external cooling water, specifically, the sealing plate 201 and the target backing plate 202 are fixed together by screws, a cooling cavity 2024 is formed between the sealing plate 201 and the target backing plate 202, the target backing plate 202 includes a target cavity 2022, a plurality of ribs 2023 extend from the middle of the target backing plate 202 to the inside of the target cavity 2022, wherein the target 203 is arranged inside the target cavity 2022, a plurality of vertical ribs 2031 between two adjacent ribs 2023 are arranged on one side of the surface of the target 203 close to the target backing plate 202, and the contact area between the target backing plate 202 and the target 203 is increased by the cooperation of the ribs 2023 and the vertical ribs 2031, so as to improve the heat dissipation efficiency.

The sealing plate 201 is provided with two first through holes 2012 penetrating through the front and rear surfaces thereof, the lower portion of the sealing plate 201 is fixed with two tubes 204 corresponding to the first through holes 2012 one by one, wherein the two tubes 204 are distributed in an up-and-down arrangement, the interior of the tube 204 is communicated with the first through holes 2012, the exterior of the tube 204 is sleeved with a cylindrical adapter tube 207 with one closed end, the interior of the adapter tube 207 is communicated with the interior of the tube 204, specifically, each tube 204 further comprises a first cylindrical portion 2041, one side of each first cylindrical portion 2041 close to the adapter tube 207 is outwardly extended and provided with a second cylindrical portion 2042, the diameter of the cross section of the first cylindrical portion 2041 is larger than that of the second cylindrical portion 2042, the second cylindrical portion 2042 is commonly sleeved with an adapter plate 206, the adapter plate 206 abuts against the first cylindrical portion 2041, the adapter plate 206 is provided with a plurality of second through holes 2061 corresponding to the two second cylindrical portions 2042 one by one, threaded connection has screw 2062 on the second through-hole 2061, screw 2062 afterbody butt second cylinder portion 2042 annular outside, adapter tube 207 cover is established on second cylinder portion 2042 and the butt keysets 206, adapter tube 207 annular outside still overlaps and is equipped with fastening ring 205, firmly fixes adapter tube 207 on tubular product 204 through fastening ring 205, and when the effectual cooling water that has prevented to lead to, adapter tube 207 drops and causes and leak.

Be equipped with the water pipe head 2071 who connects external cooling device on the adapter tube 207 annular side, inside the inside intercommunication adapter tube 207 of water pipe head 2071, wherein, the inlet tube of water pipe head 2071 switch-on cooling water that is located below on the adapter tube 207, the outlet pipe of water pipe head 2071 switch-on cooling water that is located above on the adapter tube 207, when carrying out the sputtering technology, open the cooling water, make cooling water circulation always, lower the temperature to target 203, the cooling water through circulation flow not only can effectually play the cooling effect and still can reduce the waste of cooling water.

The sputtering target 2 further comprises a second sealing ring 208, the cross sections of the sealing plate 201 and the target material back plate 202 are square, a square groove 2011 is arranged in front of the sealing plate, the groove 2011 comprises a circle of first sealing grooves 2013 and second sealing grooves 2014, a fourth seal groove 2025 and a second seal rib 2026 are disposed on one side of the target backing plate 202 close to the sealing plate 201, the second seal ring 208 is located between the first seal groove 2013 and the fourth seal groove 2025, the diameter of the cross section of the second seal ring 208 is larger than the cross-sectional dimension formed by the first seal groove 2013 and the fourth seal groove 2025, sealing is achieved by pressing the second seal ring 208 during installation, the second seal rib 2026 is inserted into the second seal groove 2014, wherein, the second sealing rib 2026 and the second sealing groove 2014 are completely attached to realize sealing, and the specific installation mode is, a fixing part 2021 is arranged on one side of the target backing plate 202 close to the sealing plate 201, and the fixing part 2021 is inserted into and fixed in the groove 2011; the sputtering target 2 further comprises a third sealing ring 209, a third sealing groove 2015 coaxial with the first through hole 2012 is arranged on the back surface of the sealing plate 201, a first sealing rib 2016 is arranged on the inner wall of the first through hole 2012 on one side of the back surface of the sealing plate 201 in an outward extending manner, a fifth sealing groove 2043 and a sixth sealing groove 2044 are arranged on one side of the tube 204 close to the sealing plate 201, the third sealing ring 209 is arranged between the third sealing groove 2015 and the fifth sealing groove 2043, the cross-sectional diameter of the third sealing ring 209 is larger than the cross-sectional size formed by the third sealing groove 2015 and the fifth sealing groove 2043, when the sputtering target is installed, the third sealing ring 209 is squeezed to realize sealing, the first sealing rib 2016 is inserted into the sixth sealing groove 2044, and the first sealing rib 2016 and the sixth sealing groove 2044 are completely attached to realize sealing; every be equipped with seventh seal groove 2045 on the annular face in the second cylinder portion 2042 outside, the cover is equipped with fourth sealing washer 210 on the seventh seal groove 2045, fourth sealing washer 210 outside butt adapter tube 207 annular inboard, the cross-sectional diameter of fourth sealing washer 210 is greater than the cross-sectional dimension of seventh seal groove 2045, compress through adapter tube 207 during the installation and realize sealing fourth sealing washer 210, through first seal groove 2013, fourth seal groove 2025 and second sealing washer 208 cooperation are sealed, second seal groove 2014 and second seal muscle 2026 cooperation are sealed, third seal groove 2015, fifth seal groove 2043 and third sealing washer 209 cooperation are sealed, first seal muscle 2016 and sixth seal groove 2044 cooperation are sealed, seventh seal groove 2045, adapter tube 207 annular inner wall and fourth sealing washer 210's cooperation is sealed, the effectual seepage that has prevented the cooling water.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a magnetron sputtering equipment, includes magnetron cabin (1) and installs workstation (6) in magnetron cabin (1) below, its characterized in that: the inner center of the workbench (6) is provided with an upward motor (7), the shaft of the motor (7) penetrates out of the upper part of the workbench (6) and penetrates out of the circular turntable (5) which is fixed with a part coaxial with the shaft of the motor (7), the magnetic control cabin (1) comprises a vacuum cavity (109), the turntable (5) is positioned in the vacuum cavity (109), the upper part of the turntable (5) is provided with a cylindrical substrate (3), the annular side surface of the substrate (3) is paved with a substrate (4), four sputtering targets (2) are uniformly distributed on the annular side surface of the magnetic control cabin (1), each sputtering target (2) comprises a sealing plate (201) and a target material (203), the surface of the target material (203) is provided with a copper plate (2032) for film coating, the target material (203) faces the center of the magnetic control cabin (1) and penetrates out of the annular surface on the inner side of the magnetic control cabin (1), the copper plate (2032) is over against the, the sealing plate (201) is fixed on the outer annular surface of the magnetron cabin (1), a magnet (10) surrounding the target (203) in a circle and used for providing a magnetic field, a first exhaust port (103) used for connecting an external vacuumizing device and two air inlets (104) used for connecting an external inert gas device and external air are further arranged on the outer annular surface of the magnetron cabin (1), the first exhaust port (103) and the air inlets (104) are communicated with the vacuum cavity (109), an exhaust device (8) is further arranged inside the workbench (6), the exhaust device (8) comprises a second exhaust port (801) communicated with the inside of the vacuum cavity (109), an exhaust box (803), an exhaust pipe (802) communicated with the second exhaust port (801) and the exhaust box (803) and a filter (804) communicated with the outside and the exhaust box (803), and the exhaust box (803) extracts gas in the vacuum cavity (109) through the second exhaust port (801) and the exhaust pipe (802), and discharged to the outside through the filter (804).

2. The magnetron sputtering apparatus as defined in claim 1, wherein: the outer annular surface of the magnetron cabin (1) is further connected with a door frame (101), a door (108) which is hinged with the door frame (101) and can completely cover the door frame (101) is arranged on the outer side of the door frame (101), one sputtering target (2) penetrates through the door (108) and a sealing plate (201) is fixed on the outer side of the door (108).

3. The magnetron sputtering apparatus as defined in claim 2, wherein: door (108) inwardly extend and be equipped with annular vertical rib (1083), shrouding (201) preceding is fixed with target backplate (202), target backplate (202) run through door (108) inside and outside surface, the outside that target backplate (202) surpass door (108) inside portion is equipped with insulating part (1084), insulating part (1084) are located annular vertical rib (1083) and target backplate (202) between, insulating part (1084) outside is fixed on annular vertical rib (1083) and inboard and target backplate (202) have the clearance.

4. The magnetron sputtering apparatus as defined in claim 2, wherein: still include round pin axle (110), door frame (101) both sides are equipped with handle (1011) and base (1012) respectively, door (108) both sides are equipped with boss (1082) that correspond with handle (1011) respectively and hinge (1081) that correspond with base (1012), hinge (1081) are installed on base (1012) and are articulated through round pin axle (110), when door (108) rotatory laminating is on door frame (101), boss (1082) are located between door frame (101) and handle (1011), rotate handle (1011), boss (1082) annular side butt handle (1011).

5. The magnetron sputtering apparatus according to claim 4, wherein: the inboard plane of door (108) still is equipped with a round first sealing washer (1085), first sealing washer (1085) are through glue adhesion at the inboard plane of door (108), door (108) lid closes on door frame (101), first sealing washer (1085) butt door frame (101).

6. The magnetron sputtering apparatus as defined in claim 1, wherein: the substrate (3) further comprises a pressing plate (301) and screws (302), wherein the pressing plate (301) abuts against the surface of the substrate (4) and the substrate (3) and the substrate (4) are fixed together through the screws (302).

7. The magnetron sputtering apparatus as defined in claim 1, wherein: the magnetron sputtering target comprises a magnetron cabin (1), and is characterized in that a plurality of windows (102) communicated with the vacuum cavities are further arranged on the annular surface on the outer side of the magnetron cabin (1), the windows (102) are provided with transparent lenses (1021) for isolating the vacuum cavities (109) from the outside, and the windows (102) are located between two adjacent sputtering targets (2).

8. The magnetron sputtering apparatus as defined in claim 1, wherein: the annular side surface of the magnetic control cabin (1) is also provided with a plasma cleaning device (105).

9. The magnetron sputtering apparatus as defined in claim 1, wherein: the upper part of the magnetron cabin (1) is also provided with a pressure gauge (106) and a thermometer (107), and probes of the pressure gauge (106) and the thermometer (107) extend into the vacuum cavity (109).

10. The magnetron sputtering apparatus as defined in claim 1, wherein: four corners of the lower part of the workbench (6) are also provided with feet (9) for supporting the workbench (6).