CN212695315U - Feed structure of tile formula phased array antenna - Google Patents
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- CN212695315U CN212695315U CN202021809646.1U CN202021809646U CN212695315U CN 212695315 U CN212695315 U CN 212695315U CN 202021809646 U CN202021809646 U CN 202021809646U CN 212695315 U CN212695315 U CN 212695315U
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Abstract
The utility model relates to a phased array antenna field, specific saying so relates to a feed structure of tile formula phased array antenna, and it is including the multilayer microwave board that realizes microwave radio frequency signal transmission carrier, phased array antenna radiating element and TR subassembly have been integrateed on the multilayer microwave board, the middle part of multilayer microwave board is provided with the prepreg, the microwave board on prepreg upper portion is the dielectric substrate, realizes phased array antenna radiating element's function; the microwave board at the lower part of the prepreg is of a multilayer board structure, so that the function of a TR component is realized, the radio frequency signals are vertically interconnected by using metal holes penetrating through the multilayer microwave board, and the low frequency signals are interconnected by using low frequency contact pins; this application avoids using radio frequency connectors such as feather button through using a new antenna feed structure, has saved the cost, and occupation space is little simultaneously.
Description
Technical Field
The application relates to the phased array antenna field, and specific saying so relates to a feed structure of tile formula phased array antenna.
Background
The phased array antenna is an array antenna formed by a plurality of antenna element arrays, and beam scanning and beam forming are realized by adjusting the feeding phase of each antenna element. The device has the advantages of small volume, light weight, easy formation of multiple beams, capability of realizing the pointing of antenna beams and the rapid change of beam shapes, capability of realizing the adjustment of communication capacity among the beams and the like, and has the capability of stably tracking a plurality of high-speed moving targets; in addition, the phased array antenna can also realize the synthesis of signal power in space, thereby obtaining the antenna with larger EIRP (isotropic equivalent radiated power), which provides technical potential for increasing the system acting distance, improving the system measurement accuracy and observing various low observable targets including stealth targets. Due to the advantages, the phased array antenna technology becomes a key technology which is developed rapidly in the radar and communication system in recent years.
The traditional brick block type phased array has the characteristics of heavy weight, high thickness, large size and the like, so that the application and popularization of the traditional brick block type phased array are greatly limited. The novel tile-type phased array antenna has the characteristics of low weight, small size, easiness in integrating with a platform and the like, and meanwhile, the design difficulty and the complexity of a processing process are increased. The prior Tile-Type phased-array antenna mainly adopts a flip chip, a hair button and a multilayer substrate to realize integration, for example, the assembly requirement of the hair button is high, the use is limited, the large-area production, the repair and the like are not facilitated, and meanwhile, the cost is correspondingly increased and the space occupancy rate is large due to the use of the hair button.
For example, the patent of the invention with application number 201610305652.5 and named as 'an expandable high-integration active phased array antenna' discloses: the utility model provides an expanded high integrated active phased array antenna, its basic structure includes antenna array face, thermal control structure, TR subassembly array, second grade feed network, one-level feed network, power module and ripples accuse module, the utility model discloses a following scheme is realized: the TR component array is designed in a brick linear array mode, and an eight-channel TR component is used as a linear array sub-array and is expanded according to integral multiple of the eight-channel TR component; the antenna array surface, the thermal control structure, the secondary feed network, the primary feed network, the power supply module and the wave control module are designed in a stacked manner in a tile form; the low-frequency flexible connector integrates power supply of a power supply of the TR component and feed of low-frequency control signals such as switching, phase shifting, attenuation and the like, and high-integration cable-free vertical interconnection of low-frequency feed among the TR component, the power supply and the wave control module is realized. What above-mentioned patent adopted is the active phased array antenna of fragment of brick formula framework, and antenna radiation unit and TR subassembly array are separately designed, and the centre is through blind mate connector SMP interconnection, and this is almost the same with the effect that adopts the use hair button as the radio frequency connector, and is with high costs, and it is big to occupy the size.
Disclosure of Invention
To the above-mentioned not enough in the prior art, this application proposes the feed technique who is applicable to tile formula phased array antenna, and is with low costs, and occupation space is little, and can keep phased array antenna performance nearly unchangeable.
In order to achieve the technical effects, the technical scheme of the application is as follows:
a feed structure of a tile-type phased array antenna comprises a plurality of microwave plates for realizing microwave radio frequency signal transmission carriers, wherein a phased array antenna radiation unit and a TR component are integrated on the plurality of microwave plates, a prepreg is arranged in the middle of each microwave plate, and the microwave plates on the upper portions of the prepregs are dielectric substrates for realizing the functions of the phased array antenna radiation unit; the microwave board at the lower part of the prepreg is of a multi-layer board structure, so that the function of a TR component is realized, wherein the multi-layer microwave board is defined from the structure, the TR component is defined from the function, the radio frequency signals are vertically interconnected by using metal holes penetrating through the multi-layer microwave board, and the low frequency signals are interconnected by using low frequency contact pins;
the radio frequency signals between the phased array radiation unit and the TR component are vertically interconnected through the metallized through holes, and the metallized through holes directly penetrate through the bottom layers of the multilayer microwave boards from the surface layers of the multilayer microwave boards;
the metal holes comprise metal signal holes and metal shielding holes, a circle of metal shielding holes is arranged around the metal signal holes, the upper parts of the metal signal holes are connected with the radiation patch layer, and the metal signal holes and the metal shielding holes directly penetrate from the surface layer of the multilayer microwave board to the bottom layer of the multilayer microwave board.
Furthermore, the upper part of the metal shielding hole penetrates through the upper surface of the radiation unit of the phased array antenna and is spaced from the radiation patch layer, the metal shielding hole generally exceeds the surface of the radiation unit ground 23 by 0.1-0.3 mm, the spacing range of the metal shielding hole and the radiation patch layer is h-0.1-h-0.3 mm, and h is the thickness of the medium substrate; the upper part of the metal signal hole penetrates through the upper surface of the radiation unit of the phased array antenna radiation unit and is in contact with the radiation patch layer.
Furthermore, the phased array antenna radiation unit comprises a medium substrate and a radiation unit, wherein a radiation patch layer is arranged on the surface of the medium substrate, a feed point is arranged on the radiation patch layer, and each phased array antenna radiation unit is fed by a single feed point or multiple feed points.
Further, the TR component comprises a sealing chip, a multilayer board, a TR ground and a chip layer ground, wherein the sealing chip is welded on the chip layer ground through a surface mounting technology, and a power circuit and a wave control circuit are contained in the multilayer board.
Furthermore, a layer of prepreg used for bonding the substrate is arranged between the radiation unit of the phased array antenna and the ground of the TR component.
A processing method of a feed structure of a tile-type phased array antenna comprises the following steps:
firstly, blanking an inner-layer copper-clad plate; inner layer pattern making (inner layer etching); punching a positioning hole; inspecting an inner layer; browning; laminating the laminated board; laminating; milling edges and the like; drilling the multilayer board, processing the PCB with a smooth surface by using a numerical control drilling machine to select a drill bit with the diameter of 0.3mm to obtain the aperture required by MI, and drilling a via hole for line connection between layers on the board surface; and (4) copper deposition, namely depositing a layer of copper on the hole wall drilled with the hole through chemical reaction, and further performing copper electroplating on the basis of chemical copper deposition to increase the copper thickness on the surface and the hole wall and achieve the final copper thickness. And realizing hole metallization, thereby manufacturing the metal shielding hole.
And secondly, at the position of the metal shielding hole, a drill bit with the diameter of 0.5mm is selected by a numerical control drilling machine to process the PCB with a smooth surface so as to obtain the aperture required by MI, the direction of the lower surface of the upper surface net of the medium substrate is selected to drill (back drilling), the drilling depth is controlled to be 0.1-0.3 mm higher than the ground surface of the radiation unit according to the design, the original metal shielding hole is partially damaged after the drilling is finished, an air hole is formed, and meanwhile, the patch can also be damaged.
Filling materials such as resin into the air holes formed in the second step, so that the air holes are completely occupied by the materials such as the resin, completing hole plugging, and recovering the appearance of the dielectric substrate; and then, an electroplating technology is used for depositing a layer of copper on the damaged patch, and further electroplating copper on the basis of chemical copper deposition to increase the copper thickness on the surface to reach the final copper thickness, so that the radiation patch is restored to the original shape.
The utility model has the advantages that:
1. this application avoids using radio frequency connectors such as feather button through using a new antenna feed structure, has saved the cost, and occupation space is little simultaneously. The antenna is simple in actual processing, and meanwhile, the original appearance of the surface of the antenna radiation unit can be kept, and the radiation performance of the antenna is kept unchanged. The electromagnetic leakage and the surface wave of the multilayer board are avoided, and the performance of the phased array antenna is prevented from being influenced. The utility model discloses a tile formula framework, antenna and TR subassembly formula integrated design, it is integrated in a multilayer microwave board, it is littleer to have area occupied, and longitudinal section is lower, the higher advantage of integrated level.
2. The tile phased array antenna provided by the application integrates an antenna radiation unit, a TR component, a power division network and the like on one block in a three-dimensional integration mode. And connectors are omitted among the antenna, the TR component and the feed network, so that the cost of the connectors is saved, the space is released, and the large-scale integration is easy.
3. According to the application, after the multilayer microwave board is processed, a back drilling technology is used for drilling partial redundant coaxial-like metal holes, and the coaxial-like holes are kept to penetrate through the chip layer of the TR module to the radiation unit stratum. The radiation unit of the phased array antenna can damage the radiation surface due to back drilling, and the plug hole plating leveling mode is adopted, so that the radiation patch layer of the phased array antenna recovers the original appearance, and the performance of the antenna is kept unchanged.
Drawings
FIG. 1 is a schematic diagram of the antenna feed provided by the present invention
Fig. 2 is a schematic view of the antenna feeding processing method according to the present invention.
Fig. 3 is a schematic view of the package of the present invention. The numbers in fig. 3 are referred to as pin numbers.
In the drawings: 1-multilayer microwave board, 2-radiation unit, 3-TR component, 4-prepreg, 5-metal signal hole, 6-metal shielding hole, 7-sealing chip, 21-dielectric substrate, 22-radiation patch layer, 23-radiation unit ground, 31-multilayer board, 32-TR ground and 33-chip ground.
Detailed Description
Example 1
As shown in fig. 1, a feeding technique of a tile-type phased array antenna includes a multi-layer microwave board 1, a radiation unit 2, a TR assembly 3, a prepreg 4 for bonding the radiation unit 2 and the TR assembly 3, a metal signal hole 5, a metal shielding hole 6, and a sealing chip 7. This application replaces traditional hair button through using metal signal hole 5 as the radio frequency signal hole, has saved the cost, has also saved the space. However, the ground of the phased array antenna is usually separated from the ground of the TR module, a layer of prepreg 4 is arranged between the layer of TR and the layer of 23 layers of the radiation unit for bonding substrates, and a similar coaxial metal shielding hole 6 is required around a metal hole for transmitting radio frequency signals, otherwise, signal leakage is caused, and electromagnetic interference and surface waves are caused. The present application implements the metal shielding holes 6 from the radiating element ground 23 of the radiating element 2 to the chip ground 33 by using a new antenna feeding technique. As shown in the evolution diagram of fig. 2, the feeding technology is simple to process, a hole is drilled first, then the hole is plated through the hole plugging, and meanwhile the original appearance of the surface of the antenna radiation unit 2 can be kept, the performance of the antenna is kept unchanged, and meanwhile the coaxial-like shielding hole is made to surround the metal signal hole 5 from the chip layer ground 33 to the radiation unit ground 23 all the way, so that the electromagnetic leakage and the surface wave are avoided, and the performance of the phased array antenna is almost kept unchanged.
Example 2
As shown in fig. 1, a feeding technique of a millimeter wave tile-type phased array antenna includes a multilayer microwave board 1, a radiation unit 2, a TR assembly 3, a prepreg 4 for bonding the radiation unit 2 and the TR assembly 3, a metal signal hole 5, a metal shielding hole 6, and a sealing chip 7. The multi-layer microwave board 1 has 16 layers of metal and 8 layers of core boards, and has a total thickness of 2.542mm, wherein the thickness of the dielectric substrate 21 is 0.508 mm. All the metal signal holes 5 and the metal shielding holes 6 adopt finished hole diameters with the diameters of 0.3 mm. The length of the metal signal hole 5 is 2.542mm, the metal shielding hole 6 exceeds the upper surface of the radiating element 23 of the radiating element 2 by 0.15mm, so the back drilling depth of the metal shielding hole 6 is 0.508-0.15=0.358mm, and the length of the metal shielding hole 6 is 2.542-0.358=2.184 mm. The sealing chip 7 adopts the technical scheme of sealing a GaAs chip and a silicon-based CMOS multifunctional chip. The combined and sealed chip 7 is formed by cascade and mixed sealing of 1 silicon-based channel multifunctional chip and 4 GaAs T/R chips, the type of the combined and sealed chip 7 is RWC4101C5D, the combined and sealed chip is a four-channel chip, the number of bits of an included phase shifter is 6, the number of bits of the phase shifter is 6, and the maximum attenuation can be 31 dB. The multifunctional chip and the gallium arsenide chip are laid out in a tiled mode, the final packaging size is 8.85mm 4.77mm, a packaging schematic diagram is shown in fig. 2, and a material size diagram after sealing is shown in fig. 3.
Example 3
A feed structure of a tile-type phased array antenna comprises a multilayer microwave board 1 for realizing a microwave radio frequency signal transmission carrier, wherein a phased array antenna radiation unit 2 and a TR component 3 are integrated on the multilayer microwave board 1, a prepreg 4 is arranged in the middle of the multilayer microwave board 1, and a microwave board on the upper part of the prepreg 4 is a dielectric substrate 21 for realizing the function of the phased array antenna radiation unit 2; the microwave board at the lower part of the prepreg 4 is of a multilayer board 31 structure, so that the function of the TR component 3 is realized, wherein the multilayer microwave board 1 is defined from the structure, the TR component 3 is defined from the function, the radio frequency signals are vertically interconnected by using metal holes penetrating through the multilayer microwave board 1, and the low frequency signals are interconnected by using low frequency contact pins;
the metal holes are metalized through holes, radio frequency signals between the phased array radiating unit 2 and the TR component 3 are vertically interconnected through the metalized through holes, and the metalized through holes directly penetrate from the surface layer of the multilayer microwave board 1 to the bottom layer of the multilayer microwave board 1; the metal holes comprise metal signal holes 5 and metal shielding holes 6, a circle of the metal shielding holes 6 is arranged around the metal signal holes 5, the upper parts of the metal signal holes 5 are connected with a radiation patch layer 22, and the metal signal holes 5 and the metal shielding holes 6 directly penetrate from the surface layer of the multilayer microwave board 1 to the bottom layer of the multilayer microwave board 1.
The upper part of the metal shielding hole 6 penetrates through the upper surface of a radiation unit ground 23 of the radiation unit 2 of the phased array antenna and is spaced from the radiation patch layer 22, the metal shielding hole 6 generally exceeds the surface of the radiation unit ground 2323 by 0.1-0.3 mm, the spacing value between the metal shielding hole 6 and the radiation patch layer 22 is h-0.1 mm-h-0.3 mm, and h is the thickness of the dielectric substrate 21; the upper part of the metal signal hole 5 passes through the upper surface of the radiating unit ground 23 of the phased array antenna radiating unit 2 and contacts with the radiating patch layer 22.
The phased array antenna radiation unit 2 comprises a medium substrate 21 and a radiation unit ground 23, a radiation patch layer 22 is arranged on the surface of the medium substrate 21, a feed point is arranged on the radiation patch layer 22, and each phased array antenna radiation unit 2 is fed by a single feed point or multiple feed points.
The TR component 3 comprises a sealing chip 7, a multilayer board 31, a TR ground 32 and a chip ground 33, wherein the sealing chip 7 is welded on the chip ground 33 through a surface mounting technology, and a power circuit and a wave control circuit are contained in the multilayer board 31.
The phased array antenna radiating element ground 23 is separated from the ground of the TR component 3 by a prepreg 4 for bonding substrates.
Example 4
A processing method of a feed structure of a tile-type phased array antenna comprises the following steps:
firstly, blanking an inner-layer copper-clad plate; inner layer pattern making (inner layer etching); punching a positioning hole; inspecting an inner layer; browning; laminating the laminated board; laminating; milling edges and the like; drilling the multilayer board 31, processing the PCB with a smooth surface by using a numerical control drilling machine to select a drill bit with the diameter of 0.3mm to obtain the aperture required by MI, and drilling a via hole for line connection between layers on the board surface; and (4) copper deposition, namely depositing a layer of copper on the hole wall drilled with the hole through chemical reaction, and further performing copper electroplating on the basis of chemical copper deposition to increase the copper thickness on the surface and the hole wall and achieve the final copper thickness. Hole metallization is achieved, and thus the metal shielding hole 6 is made.
And secondly, at the position of the metal shielding hole 6, a drill bit with the diameter of 0.5mm is selected by a numerical control drilling machine to process the PCB with a smooth surface so as to obtain the aperture required by MI, drilling (back drilling) is selected from the lower surface direction of the upper surface net of the medium substrate 21, the drilling depth is controlled to be 0.1-0.3 mm higher than the surface of the radiation unit ground 23 according to the design, the original metal shielding hole 6 is partially damaged after the drilling is finished, an air hole is formed, and meanwhile, the patch can also be damaged.
Filling materials such as resin into the air holes formed in the second step, so that the air holes are completely occupied by the materials such as the resin, completing hole plugging, and recovering the appearance of the dielectric substrate 21; then, an electroplating technology is used for depositing a layer of copper on the damaged patch, and electroplating copper is further carried out on the basis of chemical copper deposition to increase the copper thickness on the surface to reach the final copper thickness, so that the radiation patch 22 is restored to the original shape.
Example 5
A feed structure of a tile-type phased array antenna comprises a multilayer microwave board 1 for realizing a microwave radio frequency signal transmission carrier, wherein a phased array antenna radiation unit 2 and a TR component 3 are integrated on the multilayer microwave board 1, a prepreg 4 is arranged in the middle of the multilayer microwave board 1, and a microwave board on the upper part of the prepreg 4 is a dielectric substrate 21 for realizing the function of the phased array antenna radiation unit 2; the microwave board at the lower part of the prepreg 4 is of a multilayer board 31 structure, so that the function of the TR component 3 is realized, wherein the multilayer microwave board 1 is defined from the structure, the TR component 3 is defined from the function, the radio frequency signals are vertically interconnected by using metal holes penetrating through the multilayer microwave board 1, and the low frequency signals are interconnected by using low frequency contact pins;
the metal holes are metalized through holes, radio frequency signals between the phased array radiating unit 2 and the TR component 3 are vertically interconnected through the metalized through holes, and the metalized through holes directly penetrate from the surface layer of the multilayer microwave board 1 to the bottom layer of the multilayer microwave board 1; the metal holes comprise metal signal holes 5 and metal shielding holes 6, a circle of the metal shielding holes 6 is arranged around the metal signal holes 5, the upper parts of the metal signal holes 5 are connected with a radiation patch layer 22, and the metal signal holes 5 and the metal shielding holes 6 directly penetrate from the surface layer of the multilayer microwave board 1 to the bottom layer of the multilayer microwave board 1.
The upper part of the metal shielding hole 6 penetrates through the upper surface of a radiation unit ground 23 of the radiation unit 2 of the phased array antenna and is spaced from the radiation patch layer 22, the metal shielding hole 6 generally exceeds the surface of the radiation unit ground 2323 by 0.1-0.3 mm, the spacing value between the metal shielding hole 6 and the radiation patch layer 22 is h-0.1 mm-h-0.3 mm, and h is the thickness of the dielectric substrate 21; the upper part of the metal signal hole 5 passes through the upper surface of the radiating unit ground 23 of the phased array antenna radiating unit 2 and contacts with the radiating patch layer 22.
The phased array antenna radiation unit 2 comprises a medium substrate 21 and a radiation unit ground 23, a radiation patch layer 22 is arranged on the surface of the medium substrate 21, a feed point is arranged on the radiation patch layer 22, and each phased array antenna radiation unit 2 is fed by a single feed point or multiple feed points.
The TR component 3 comprises a sealing chip 7, a multilayer board 31, a TR ground 32 and a chip ground 33, wherein the sealing chip 7 is welded on the chip ground 33 through a surface mounting technology, and a power circuit and a wave control circuit are contained in the multilayer board 31.
The phased array antenna radiating element ground 23 is separated from the ground of the TR component 3 by a prepreg 4 for bonding substrates.
The processing method comprises the following steps:
firstly, blanking an inner-layer copper-clad plate; inner layer pattern making (inner layer etching); punching a positioning hole; inspecting an inner layer; browning; laminating the laminated board; laminating; milling edges and the like; drilling the multilayer board 31, processing the PCB with a smooth surface by using a numerical control drilling machine to select a drill bit with the diameter of 0.3mm to obtain the aperture required by MI, and drilling a via hole for line connection between layers on the board surface; and (4) copper deposition, namely depositing a layer of copper on the hole wall drilled with the hole through chemical reaction, and further performing copper electroplating on the basis of chemical copper deposition to increase the copper thickness on the surface and the hole wall and achieve the final copper thickness. Hole metallization is achieved, and thus the metal shielding hole 6 is made.
And secondly, at the position of the metal shielding hole 6, a drill bit with the diameter of 0.5mm is selected by a numerical control drilling machine to process the PCB with a smooth surface so as to obtain the aperture required by MI, drilling (back drilling) is selected from the lower surface direction of the upper surface net of the medium substrate 21, the drilling depth is controlled to be 0.1-0.3 mm higher than the surface of the radiation unit ground 23 according to the design, the original metal shielding hole 6 is partially damaged after the drilling is finished, an air hole is formed, and meanwhile, the patch can also be damaged.
Filling materials such as resin into the air holes formed in the second step, so that the air holes are completely occupied by the materials such as the resin, completing hole plugging, and recovering the appearance of the dielectric substrate 21; then, an electroplating technology is used for depositing a layer of copper on the damaged patch, and electroplating copper is further carried out on the basis of chemical copper deposition to increase the copper thickness on the surface to reach the final copper thickness, so that the radiation patch 22 is restored to the original shape.
Claims (7)
1. A feed structure of tile formula phased array antenna which characterized in that: the microwave antenna comprises a multilayer microwave board (1) for realizing a microwave radio frequency signal transmission carrier, wherein a phased array antenna radiation unit (2) and a TR component (3) are integrated on the multilayer microwave board (1), a prepreg (4) is arranged in the middle of the multilayer microwave board (1), and a microwave board on the upper part of the prepreg (4) is a dielectric substrate (21) to realize the function of the phased array antenna radiation unit (2); the microwave board at the lower part of the prepreg (4) is of a multi-layer board (31) structure, the function of the TR component (3) is realized, the radio frequency signals are vertically interconnected by metal holes penetrating through the multi-layer microwave board (1), and the low frequency signals are interconnected by low frequency contact pins.
2. The feed structure of a tile-type phased array antenna according to claim 1, wherein: the metal holes are metalized through holes, radio-frequency signals between the phased array radiating unit (2) and the TR component (3) are vertically interconnected through the metalized through holes, and the metalized through holes directly penetrate through the bottom layer of the multilayer microwave board (1) from the surface layer of the multilayer microwave board (1).
3. The feed structure of a tile-type phased array antenna according to claim 1, wherein: the metal holes comprise metal signal holes (5) and metal shielding holes (6), a circle of metal shielding holes (6) is arranged around the metal signal holes (5), the upper parts of the metal signal holes (5) are connected with the radiation patch layer (22), and the metal signal holes (5) and the metal shielding holes (6) directly penetrate through the bottom layer of the multilayer microwave board (1) from the surface layer of the multilayer microwave board (1).
4. The feed structure of a tile-type phased array antenna according to claim 3, wherein: the upper part of the metal shielding hole (6) penetrates through the upper surface of a radiation unit ground (23) of the phased array antenna radiation unit (2) and is spaced from the radiation patch layer (22), the metal shielding hole (6) exceeds the surface of the radiation unit ground (23) by 0.1-0.3 mm, the spacing range value of the metal shielding hole (6) and the radiation patch layer (22) is h-0.1 mm-h-0.3 mm, and h is the thickness of the dielectric substrate (21); the upper part of the metal signal hole (5) penetrates through the upper surface of a radiating unit ground (23) of the phased array antenna radiating unit (2) and is in contact with the radiating patch layer (22).
5. The feed structure of a tile-type phased array antenna according to claim 1, wherein: phased array antenna radiating element (2) are including medium base plate (21) and radiating element ground (23), the surface of medium base plate (21) is provided with radiation paster layer (22), be provided with the feed point on radiation paster layer (22), every phased array antenna radiating element (2) are single feed point or many feed point feeds.
6. The feed structure of a tile-type phased array antenna according to claim 1, wherein: TR subassembly (3) are including closing packaged chip (7), multiply wood (31), TR ground (32) and chip layer ground (33), close packaged chip (7) and pass through surface mounting technique welding on chip layer ground (33), and multiply wood (31) inside includes power supply circuit and wave control circuit.
7. The feed structure of a tile-type phased array antenna according to claim 1, wherein: a prepreg (4) for bonding substrates is arranged between the radiation unit ground (23) of the phased array antenna and the ground of the TR component (3).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993274A (en) * | 2021-09-27 | 2022-01-28 | 惠州Tcl移动通信有限公司 | SIP module and mobile terminal |
| CN114614275A (en) * | 2022-05-11 | 2022-06-10 | 成都锐芯盛通电子科技有限公司 | HTCC dual-beam tile-type airtight SIP module |
-
2020
- 2020-08-26 CN CN202021809646.1U patent/CN212695315U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993274A (en) * | 2021-09-27 | 2022-01-28 | 惠州Tcl移动通信有限公司 | SIP module and mobile terminal |
| CN114614275A (en) * | 2022-05-11 | 2022-06-10 | 成都锐芯盛通电子科技有限公司 | HTCC dual-beam tile-type airtight SIP module |
| CN114614275B (en) * | 2022-05-11 | 2022-09-20 | 成都锐芯盛通电子科技有限公司 | HTCC dual-beam tile-type airtight SIP module |
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