CN210296623U - Printed circuit board integrated with various radio frequency modules - Google Patents
Printed circuit board integrated with various radio frequency modules Download PDFInfo
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- CN210296623U CN210296623U CN201920939937.3U CN201920939937U CN210296623U CN 210296623 U CN210296623 U CN 210296623U CN 201920939937 U CN201920939937 U CN 201920939937U CN 210296623 U CN210296623 U CN 210296623U
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Abstract
The utility model discloses a printed circuit board integrating multiple radio frequency modules and a manufacturing method, which is characterized in that a power supply extension module, a wave control module, a module array, a first feed network, a first shallow hole and a second shallow hole are arranged on a first laminate of the printed circuit board; arranging a signal transmission network and a first through hole on the second laminate; arranging a second feed network, a third shallow hole and a fourth shallow hole on the third laminate; an antenna unit is arranged on the fourth laminate; meanwhile, the first feed network, the second feed network and the signal transmission network are respectively interconnected through the various shallow holes or through holes and supply power and transmit signals to the units or modules, so that the functional modules in the phased array antenna radio frequency system are integrated on one printed circuit board, the number of the printed circuit boards required in the phased array antenna system is greatly reduced, the space layout complexity of the system is reduced, and the technical effects of reducing the production and application cost and improving the applicability are achieved.
Description
Technical Field
The utility model relates to a phased array antenna technical field especially relates to a printed circuit board and manufacturing method of integrated multiple radio frequency module.
Background
Phased array antenna is a new antenna system and technology developed on the basis of array antenna, which is characterized in that a plurality of discrete antennas are arranged in a certain form in space to form a certain shape, the amplitude and phase excitation of each antenna can be controlled independently, so that a certain beam with a required shape can be formed in space, and the position of the beam in space can be controlled by adjusting the phase of the excitation signal of each antenna. The phased array antenna does not need to be mechanically moved in the scanning process, the aperture of the whole antenna is always kept fixed, and the wave beam can be randomly scanned, so that the phased array antenna has the characteristic of inertial-free scanning. Meanwhile, the phased array antenna also has the advantages of large radiation power, capability of quickly, sensitively and accurately controlling the beam direction, capability of simultaneously searching and tracking a plurality of targets in a specified airspace, high stability and reliability, high target capturing probability and the like. Phased array antennas are now finding widespread use in the military and civilian fields.
Phased array antenna radio frequency systems comprise a variety of components, such as: antenna array, radio frequency module array, feed network, wave control board, power extension etc. Conventional phased array antenna systems suffer from several disadvantages: 1. different printed boards are adopted to bear different radio frequency modules, so that the number of the printed boards in the whole phased array antenna system is large, the electrical connection relation among the modules is complex, the spatial layout is complicated, and the installation and debugging difficulty is high; 2. the number of layers of each printed board is large, the cost of mutual combination and connection among the layers is high, and the volume of the combined finished printed board is large, so that the printed board is inconvenient to apply under the condition of limited space.
Therefore, the technical problems that the integration level of each radio frequency module in a phased array antenna radio frequency system is low, the number of printed boards is large, and the spatial layout is complex and tedious exist in the prior art, so that the production and application cost of the phased array antenna radio frequency system is high, and the phased array antenna radio frequency system is difficult to apply under the condition of the limit space.
SUMMERY OF THE UTILITY MODEL
The application provides a printed circuit board integrating multiple radio frequency modules and a manufacturing method thereof, which are used for solving the technical problems that in the prior art, the integration level of each radio frequency module in a phased array antenna radio frequency system is low, the number of printed boards is large, the spatial layout is complex and tedious, and therefore the production and application cost of the phased array antenna radio frequency system is high, and the phased array antenna radio frequency system is difficult to apply under the condition of extreme space.
The application provides a printed circuit board of integrated multiple radio frequency module, includes:
the first layer board comprises a power supply extension module, a wave control module and a module array which are arranged on the outer side surface of the first layer board, and a first feed network, a first shallow hole and a second shallow hole which are arranged on the first layer board, wherein the first feed network is connected with different functional modules in the module array through the first shallow hole and the second shallow hole respectively;
the second laminate is attached to the inner side surface of the first laminate and comprises a signal transmission network arranged on the second laminate and a first through hole penetrating the first laminate and the second laminate, wherein the wave control module, the power extension module, the module array and the signal transmission network are interconnected through inner-layer passages of the first through hole and the second laminate;
the third layer plate is attached to the other side surface of the second layer plate and comprises a second feed network and a third shallow hole which are arranged on the third layer plate, and a fourth shallow hole which is arranged in the first layer plate, the second layer plate and the third layer plate, wherein the module array is connected with the second feed network through the fourth shallow hole;
and the fourth layer plate comprises antenna units arranged on the outer side surface of the fourth layer plate, and the second feed network realizes packet ground processing through the third shallow hole.
Optionally, a grounding line is further arranged around the hole of the third shallow hole, and/or the second shallow hole, and/or the first shallow hole, and/or the fourth shallow hole to realize the wrap-around processing.
Optionally, the inner bore surface of the third shallow hole and/or the fourth shallow hole is filled with metal or resin, and the surface of the third shallow hole tends to be smooth.
Optionally, the printed circuit board further comprises:
and the second through hole is arranged in the first layer plate, the second layer plate and the third layer plate in a penetrating manner, and a grounding wire is arranged in the second through hole.
Optionally, the antenna unit is a printed board etched antenna.
Optionally, the first layer board, the second layer board, the third layer board and the fourth layer board are core boards and/or copper sheets.
A second aspect of the embodiments of the present application provides a method for manufacturing a printed circuit board integrated with multiple kinds of radio frequency modules according to the first aspect, including:
the method comprises the steps that a first material plate and a second material plate are bonded in a pressing mode through bonding materials to obtain a first laminated plate, wherein the first material plate is obtained by drilling a first shallow hole and a second shallow hole which are different in depth on a substrate, a first feed network is arranged in the first plate, and the second material plate is obtained by arranging a signal transmission network and an inner layer passage in the substrate;
drilling a first through hole on the first laminated plate to obtain a first adhesive plate;
pressing and bonding a third material plate and the first bonding plate to obtain a second laminated plate, wherein the third material plate is obtained by drilling a third shallow hole on a substrate in which a second feed network is arranged in one plate;
drilling a hole penetrating through the second laminated plate on the second laminated plate to serve as a fourth shallow hole to obtain a second adhesive plate;
pressing and bonding a fourth material plate and the second bonding plate to obtain a third bonding plate, wherein the fourth material plate is positioned on the outer surface of the other side of the second bonding plate opposite to the position of the first shallow hole;
etching an antenna unit on a first surface of the third bonding plate, and fixedly arranging a power extension module, a wave control module and a module array on a second surface of the third bonding plate to obtain the printed circuit board, wherein the second surface is a surface where the first shallow hole and the second shallow hole are located, and the first surface is the other outer surface opposite to the second surface;
the first feed network is connected with different functional modules in the module array through the first shallow hole and the second shallow hole respectively; the wave control module, the power extension module, the module array and the signal transmission network are interconnected through the first through hole and the inner layer passage; the module array is connected with the second feed network through the fourth shallow hole; and the second feed network realizes packet ground processing through the third shallow hole.
Optionally, after obtaining the second laminate panel, the method further comprises:
and drilling a second through hole for arranging a grounding wire on the second laminated plate to obtain the second adhesive plate.
Optionally, the method further comprises:
and arranging a grounding line around the holes of the first shallow hole, the second shallow hole, the third shallow hole and the fourth shallow hole to realize the ground covering treatment.
Optionally, the method further comprises:
and filling metal or resin on the inner hole surface of the third shallow hole and/or the fourth shallow hole, and carrying out plating treatment on the surface of the third shallow hole.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
the printed circuit board in the embodiment of the application can be formed by arranging the power supply extension module, the wave control module, the module array, the first feed network, the first shallow hole and the second shallow hole on the first laminate; arranging a signal transmission network and a first through hole penetrating through the first laminate and the second laminate on the second laminate; a second feed network, a third shallow hole and a fourth shallow hole penetrating through the first layer plate, the second layer plate and the third layer plate are arranged on the third layer plate; an antenna unit is arranged on the fourth laminate; the first feed network, the second feed network and the signal transmission network are respectively interconnected through the various shallow holes or through holes and supply power and transmit signals to the units or modules, so that the functional modules in the phased array antenna radio frequency system are integrated on one printed circuit board, the number of the printed circuit boards required in the phased array antenna system is greatly reduced, the space layout complexity of the system is reduced, and the technical effects of reducing the production and application cost and improving the applicability are achieved.
Drawings
Fig. 1 is a structural diagram of a printed circuit board integrated with multiple radio frequency modules according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a printed circuit board integrated with multiple rf modules according to an embodiment of the present invention.
Detailed Description
The application provides a printed circuit board integrating multiple radio frequency modules and a manufacturing method thereof, which are used for solving the technical problems that in the prior art, the integration level of each radio frequency module in a phased array antenna radio frequency system is low, the number of printed boards is large, the spatial layout is complex and tedious, and therefore the production and application cost of the phased array antenna radio frequency system is high, and the phased array antenna radio frequency system is difficult to apply under the condition of extreme space.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
the printed circuit board in the embodiment of the application can be formed by arranging the power supply extension module, the wave control module, the module array, the first feed network, the first shallow hole and the second shallow hole on the first laminate; arranging a signal transmission network and a first through hole penetrating through the first laminate and the second laminate on the second laminate; a second feed network, a third shallow hole and a fourth shallow hole penetrating through the first layer plate, the second layer plate and the third layer plate are arranged on the third layer plate; an antenna unit is arranged on the fourth laminate; the first feed network, the second feed network and the signal transmission network respectively supply power and transmit signals to the units or modules through the shallow holes or the through holes, so that the functional modules in the phased array antenna radio frequency system are integrated on one printed circuit board, the number of the printed circuit boards required in the phased array antenna system is greatly reduced, the space layout complexity of the system is reduced, and the technical effects of reducing the production and application cost and improving the applicability are achieved.
The technical solutions of the present application are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present application are detailed descriptions of the technical solutions of the present application, and are not limitations of the technical solutions of the present application, and the technical features in the embodiments and examples of the present application may be combined with each other without conflict.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Example one
Referring to fig. 1, an embodiment of the present application provides a printed circuit board integrated with multiple rf modules, including:
the first layer board 11 comprises a power extension module 110, a wave control module 111 and a module array 112 which are arranged on the outer side surface of the first layer board, and a first feeding network 113, a first shallow hole 114 and a second shallow hole 115 which are arranged on the first layer board, wherein the first feeding network is connected with different functional modules in the module array through the first shallow hole 114 and the second shallow hole 115 respectively;
a second layer board 12 attached to the inner surface of the first layer board 11, including a signal transmission network 120 disposed on the second layer board 12 and a first through hole 121 penetrating the first layer board 11 and the second layer board 12, wherein the wave control module 111, the power extension module 110, the module array 113, and the signal transmission network 120 are interconnected through the first through hole 121 and an inner layer path of the second layer board 12;
a third plate 13 attached to another side surface of the second plate, and including a second feeding network 130 and a third shallow hole 131 arranged on the third plate, and a fourth shallow hole 132 arranged in the first plate, the second plate, and the third plate, wherein the module array 112 is connected to the second feeding network 130 through the fourth shallow hole 132;
a fourth layer 14 comprising antenna elements 140 disposed on an outer surface of said fourth layer 14, said second feeding network 130 being packet processed through said third shallow hole 131. It should be noted that, the package ground in the embodiment of the present application may refer to: the second feeding network 130 is surrounded by the line connected with the ground and laid in the third shallow hole 131, so that the treatment measure for reducing the crosstalk between lines of the second feeding network 130 is realized.
The module array 112 may refer to a module combination arranged by other functional modules in the phased array antenna system, for example, a chip set composed of a plurality of signal processing chips; the chip battery pack consisting of a plurality of chips and a plurality of batteries, the radio frequency module and the like can be set according to the requirements during actual operation.
On the other hand, it should be noted that the first feeding network 113 may be disposed on the surface of the first board 11, for example, on the surface where the power extension module 110, the wave control module 111, and the module array 112 are disposed; or in an inner layer of said first layer 11, thereby realizing a large-area feed network layout. Different functional modules in the module array 112 can be connected to corresponding feed network sections through first shallow holes 114 and second shallow holes 115 of different depths. Radio frequency signals provided by other devices than the radio frequency system can be transmitted to the module array 112 through the first feeding network 113.
The first feeding network 113 may be configured to transmit various electromagnetic wave signals transmitted or received through a radio frequency system, and the first feeding network 113 may further include a structure that is configured to perform various types of processing on the electromagnetic wave signals, such as a power dividing and combining structure.
The power extension module 110 and the wave control module 111 can be correspondingly interconnected with each functional module in the module array through the first through hole 121 and the inner layer path of the second layer plate 12, and the power extension module 110 can supply power to the module array 112 through the interconnection path; the wave control module 111 can send a wave control signal to the module array 112 to control the generation of the corresponding amplitude and phase beams, so as to realize the control function of the module array 112.
Further, the wave control module 111, the power extension module 110, and the module array 112 may also be connected to the signal transmission network 120 through the first through hole 121 and an inner layer path of the second layer board 12, and output corresponding electrical signals, or control signals, or other signals except for radio frequency signals to the signal transmission network 120.
It should be noted that in the technical solution of the embodiment of the present application, the second feeding network 130 is not directly connected to the antenna unit 140, but feeds the antenna unit 140 by using a radiation feeding method. Therefore, the second feeding network 130 in the embodiment of the present application may be a position that is disposed in the plate of the third plate 13 and is biased to the side of the fourth plate 14, so that a good feeding effect may be provided for the antenna element 140. Meanwhile, the module array 112 is also connected to the second feeding network 130 through the fourth shallow hole 132.
In an actual operation process, the printed circuit board in the embodiment of the present application may first send a radio frequency signal to the first feeding network 113 through an external device, and then transmit the radio frequency signal to the module array 112 through the first shallow hole 114 and the second shallow hole 115, when the module array 112 completes processing of the radio frequency signal based on a control instruction transmitted by the signal transmission network 120 and output by the wave control module 111, the processed radio frequency signal is transmitted to the second feeding network 130 through the fourth shallow hole 132, and the second feeding network 130 radiates the radio frequency signal to the antenna unit 140, and finally the antenna unit 140 radiates the signal.
As a preferable material, the first layer board 11, the second layer board 12, the third layer board 13, and the fourth layer board 14 may be a base board for manufacturing a printed circuit board, such as a core board or a single copper sheet, and any one of the first layer board 11, the second layer board 12, the third layer board 13, and the fourth layer board 14 may be made of a material having a good electrical conductivity and capable of being pressed into a printed circuit board. And furthermore, the laminated board can be pressed into a printed circuit board through bonding materials such as prepregs. Therefore, each basic functional module in the radio frequency system is integrated on one circuit board, the number of printed boards required in the traditional phased array antenna system is greatly reduced, the thickness of a phased array antenna array surface in the vertical direction is reduced, and a connecting circuit structure between the modules is further reduced, so that the production and application cost of the phased array antenna system is greatly reduced, and the phased array antenna array surface can be further miniaturized and lightened.
It can be seen that the printed circuit board in the embodiment of the present application can be manufactured by providing the power extension module 110, the wave control module 111, the module array 112, the first feeding network 113, the first shallow hole 114, and the second shallow hole 115 on the first laminate board; a signal transmission network 120 and a first through hole 121 penetrating the first layer plate 11 and the second layer plate 12 are arranged on the second layer plate; a second feeding network 130, a third shallow hole 131 and a fourth shallow hole 132 which penetrates through the first layer plate 11, the second layer plate 12 and the third layer plate 13 are arranged on the third layer plate; an antenna unit 140 is arranged on the fourth laminate; the first feed network 113, the second feed network 130 and the signal transmission network 120 are respectively used for interconnecting the units or modules through the shallow holes or through holes and performing power supply and signal transmission, so that the functional modules in the phased array antenna radio frequency system are integrated on one printed circuit board, the number of the printed circuit boards required in the phased array antenna system is greatly reduced, the space layout complexity of the system is reduced, and the technical effects of reducing the production and application cost and improving the applicability are achieved.
Further, in the embodiment of the present application, a ground line is further disposed around the hole of the first shallow hole, and/or the second shallow hole, and/or the third shallow hole, and/or the fourth shallow hole 132 to implement the packet ground processing; and the second feed network implements packet ground processing through the third shallow hole. Meanwhile, the inner hole surface of the third shallow hole 131 and/or the fourth shallow hole 132 is filled with metal or resin, and the surface of the third shallow hole 131 tends to be smooth, so that the electrical quality of the printed circuit board can be further ensured, and a better electrical effect can be realized.
On the other hand, the printed circuit board in the embodiment of the present application further includes:
and a second through hole 150 penetrating the first layer plate 11, the second layer plate 12, and the third layer plate 13, wherein a ground line is disposed in the second through hole 150. By connecting the ground lines in the second through holes 150, the grounding process of each electrical module on the printed circuit board can be realized.
Still further, in order to further reduce the overall weight of the printed circuit board in the embodiment of the present application and achieve light weight and weight, the antenna unit 140 is a printed board etching antenna.
It should be further noted that, in the present invention, the number of the first shallow hole 114, the second shallow hole 115, the first through hole 121, the third shallow hole 131, the fourth shallow hole 132, and the second through hole 150 may be one or more, and a user may set the number according to a requirement, which is not limited in this application.
Example two
Referring to fig. 2, a second embodiment of the present application provides a method for manufacturing a printed circuit board integrated with multiple rf modules according to the first embodiment, including:
step 201: the method comprises the steps that a first material plate and a second material plate are bonded in a pressing mode through bonding materials to obtain a first laminated plate, wherein the first material plate is obtained by drilling a first shallow hole and a second shallow hole which are different in depth on a substrate, a first feed network is arranged in the first plate, and the second material plate is obtained by arranging a signal transmission network and an inner layer passage in the substrate;
step 202: drilling a first through hole on the first laminated plate to obtain a first adhesive plate;
step 203: pressing and bonding a third material plate and the first bonding plate to obtain a second laminated plate, wherein the third material plate is obtained by drilling a third shallow hole on a substrate in which a second feed network is arranged in one plate;
step 204: drilling a hole penetrating through the second laminated plate on the second laminated plate to serve as a fourth shallow hole to obtain a second adhesive plate;
step 205: pressing and bonding a fourth material plate and the second bonding plate to obtain a third bonding plate, wherein the fourth material plate is positioned on the outer surface of the other side of the second bonding plate opposite to the position of the first shallow hole;
step 206: etching an antenna unit on a first surface of the third bonding plate, and fixedly arranging a power extension module, a wave control module and a module array on a second surface of the third bonding plate to obtain the printed circuit board, wherein the second surface is a surface where the first shallow hole and the second shallow hole are located, and the first surface is the other outer surface opposite to the second surface;
the first feed network is connected with different functional modules in the module array through the first shallow hole and the second shallow hole respectively; the wave control module, the power extension module, the module array and the signal transmission network are interconnected through the first through hole and the inner layer passage; the module array is connected with the second feed network through the fourth shallow hole; and the second feed network realizes packet ground processing through the third shallow hole.
Optionally, after obtaining the second laminate panel, the method further comprises:
and drilling a second through hole for arranging a grounding wire on the second laminated plate to obtain the second adhesive plate.
Optionally, the method further comprises:
and arranging a grounding line around the holes of the first shallow hole, the second shallow hole, the third shallow hole and the fourth shallow hole to realize the ground covering treatment.
Optionally, the method further comprises:
and filling metal or resin on the inner hole surface of the third shallow hole and/or the fourth shallow hole, and carrying out plating treatment on the surface of the third shallow hole.
Various changes and specific examples in the printed circuit board integrated with multiple rf modules in the embodiment of fig. 1 are also applicable to the manufacturing method of the embodiment, and the implementation method of the manufacturing method in the embodiment is clear to those skilled in the art from the foregoing detailed description of the printed circuit board integrated with multiple rf modules, so that the detailed description is omitted here for the brevity of the description.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Further, the steps of the methods in the technical solution of the present application may be reversed, and the sequence may be changed while still falling within the scope of the present invention. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (6)
1. A printed circuit board integrating a plurality of radio frequency modules, comprising:
the first layer board comprises a power supply extension module, a wave control module and a module array which are arranged on the outer side surface of the first layer board, and a first feed network, a first shallow hole and a second shallow hole which are arranged on the first layer board, wherein the first feed network is connected with different functional modules in the module array through the first shallow hole and the second shallow hole respectively;
the second laminate is attached to the inner side surface of the first laminate and comprises a signal transmission network arranged on the second laminate and a first through hole penetrating the first laminate and the second laminate, wherein the wave control module, the power extension module, the module array and the signal transmission network are interconnected through inner-layer passages of the first through hole and the second laminate;
the third layer plate is attached to the other side surface of the second layer plate and comprises a second feed network and a third shallow hole which are arranged on the third layer plate, and a fourth shallow hole which is arranged in the first layer plate, the second layer plate and the third layer plate, wherein the module array is connected with the second feed network through the fourth shallow hole;
and the fourth layer plate comprises antenna units arranged on the outer side surface of the fourth layer plate, and the second feed network realizes packet ground processing through the third shallow hole.
2. The printed circuit board of claim 1, wherein a ground line is further provided around the hole of the first shallow hole, and/or the second shallow hole, and/or the third shallow hole, and/or the fourth shallow hole to achieve a ground wrap process.
3. The printed circuit board of claim 1, wherein the inner hole surface of the third shallow hole and/or the fourth shallow hole is filled with metal or resin, and the surface of the third shallow hole is smoothed.
4. The printed circuit board of claim 1, wherein the printed circuit board further comprises:
and the second through hole is arranged in the first layer plate, the second layer plate and the third layer plate in a penetrating manner, and a grounding wire is arranged in the second through hole.
5. The printed circuit board of claim 1, wherein the antenna element is a printed board etched antenna.
6. The printed circuit board of claim 1, wherein the first, second, third, and fourth boards are core boards and/or copper sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920939937.3U CN210296623U (en) | 2019-06-20 | 2019-06-20 | Printed circuit board integrated with various radio frequency modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920939937.3U CN210296623U (en) | 2019-06-20 | 2019-06-20 | Printed circuit board integrated with various radio frequency modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210296623U true CN210296623U (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920939937.3U Withdrawn - After Issue CN210296623U (en) | 2019-06-20 | 2019-06-20 | Printed circuit board integrated with various radio frequency modules |
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| Country | Link |
|---|---|
| CN (1) | CN210296623U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323561A (en) * | 2019-06-20 | 2019-10-11 | 成都天锐星通科技有限公司 | A kind of printed circuit board integrating a variety of radio-frequency modules and production method |
| CN111525284A (en) * | 2020-07-03 | 2020-08-11 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
-
2019
- 2019-06-20 CN CN201920939937.3U patent/CN210296623U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323561A (en) * | 2019-06-20 | 2019-10-11 | 成都天锐星通科技有限公司 | A kind of printed circuit board integrating a variety of radio-frequency modules and production method |
| CN110323561B (en) * | 2019-06-20 | 2023-10-27 | 成都天锐星通科技有限公司 | Printed circuit board integrated with various radio frequency modules and manufacturing method |
| CN111525284A (en) * | 2020-07-03 | 2020-08-11 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN111525284B (en) * | 2020-07-03 | 2020-09-22 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
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