CN114498017B - Millimeter wave active dual-polarized antenna easy to process - Google Patents
Millimeter wave active dual-polarized antenna easy to process Download PDFInfo
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- CN114498017B CN114498017B CN202210193653.0A CN202210193653A CN114498017B CN 114498017 B CN114498017 B CN 114498017B CN 202210193653 A CN202210193653 A CN 202210193653A CN 114498017 B CN114498017 B CN 114498017B
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000008569 process Effects 0.000 title claims description 11
- 239000002184 metal Substances 0.000 claims abstract description 44
- 239000000523 sample Substances 0.000 claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 230000008878 coupling Effects 0.000 claims abstract description 14
- 238000010168 coupling process Methods 0.000 claims abstract description 14
- 238000005859 coupling reaction Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 9
- 230000010287 polarization Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005388 cross polarization Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses an easy-to-process millimeter wave active dual-polarized antenna, which comprises a stacked millimeter wave dual-polarized antenna, a radio frequency feed structure and a connecting structure for connecting the millimeter wave dual-polarized antenna and the radio frequency feed structure; the millimeter wave dual-polarized antenna comprises two layers of stacked metal patches and an improved double-probe gap coupling feed structure; the connecting structure comprises a solder ball for connecting the feed probe, a solder ball for structural support and an air layer brought by the height of the solder ball; the invention can effectively work in 5G millimeter wave frequency band, compared with the method that the antenna structure and the radio frequency feed structure are processed on the same multi-layer PCB (printed circuit board), the total layer number of the multi-layer PCB is reduced, the order of blind holes in the multi-layer PCB is also reduced, the processing difficulty is reduced, and finally, the processing yield of the millimeter wave dual-polarized active array antenna is improved.
Description
Technical Field
The invention relates to the field of electronics and wireless communication technology, in particular to an easily-processed millimeter wave active dual-polarized antenna.
Background
In response to the system requirements of the fifth generation wireless communication, the millimeter wave band active multi-beam array antenna system has received a lot of attention. The millimeter wave active array antenna has the advantages of small volume, compact structure, high gain, large bandwidth, beam forming and the like, can improve the frequency spectrum and the energy utilization rate in wireless communication, and provides high-speed data transmission. In addition, in order to further improve the communication capacity and quality of millimeter wave communication, a dual polarization function becomes almost a necessary function of the 5G millimeter wave antenna.
In order to realize the beam forming function of the array antenna, a 5G millimeter wave beam forming chip is integrated into a millimeter wave active array antenna system to provide required amplitude and phase excitation for each unit antenna in an antenna array. Compared with the early beam forming system built by discrete components, the millimeter wave active antenna which takes the form of a multi-layer PCB (printed circuit board) is popular at present, and the beam forming chip is integrated on the back of the antenna, so that the beam forming system has the advantages of small volume, low cost, small signal loss and the like. However, in the implementation of the millimeter wave active dual-polarized antenna array, the complexity of the multi-layer PCB structure is inevitably increased, and the requirements of the number of PCB layers, the order of blind holes, the thickness-diameter ratio of metal holes and the like all reach the limit of the PCB processing technology at the current stage in China, so that the rejection rate of PCB processing is higher, the yield is lower, and the popularization and the application of the 5G millimeter wave technology are not facilitated.
Disclosure of Invention
The technology is as follows: the invention provides an easy-to-process millimeter wave active dual-polarized antenna, which can separate and process an antenna structure from a radio frequency feed structure and then connect the antenna structure and the radio frequency feed structure together in a surface-mount welding mode, thereby reducing the processing difficulty of a multilayer PCB and improving the processing yield. The antenna can cover the millimeter wave frequency band required, and reliable antenna performance is provided.
The technical scheme is as follows: the millimeter wave active dual-polarized antenna easy to process comprises a stacked millimeter wave dual-polarized antenna, a radio frequency feed structure and a connecting structure for connecting the millimeter wave dual-polarized antenna and the radio frequency feed structure; the millimeter wave dual-polarized antenna comprises two layers of stacked upper metal patches, a lower metal patch, and a double-probe gap coupling feed structure, namely a feed probe and a coupling gap, which are vertically connected with the upper metal patches and the lower metal patches; the connecting structure comprises a feed bonding pad positioned below the feed probe, a first solder ball connecting the feed bonding pad and the lower radio frequency feed structure, a second solder ball positioned at the edge of the antenna and used for structural support, and a fixed bonding pad positioned on the second solder ball; the radio frequency feed structure comprises a plurality of metal layers and a double quasi-coaxial transmission line which is vertically connected with the metal layers, wherein a microstrip line of a bottom layer is arranged below the double quasi-coaxial transmission line, a third tin ball is arranged below the microstrip line, and a beam forming chip is arranged below the third tin ball.
The millimeter wave dual-polarized antenna adopts a structure form of a multi-layer PCB, and the multi-layer PCB is arranged between the upper layer metal patch and the lower layer metal patch and below the lower layer metal patch.
The radio frequency feed structure adopts a structure form of a multi-layer PCB, and the multi-layer PCB is arranged between an upper layer and a lower layer of the multi-layer metal layer.
The millimeter wave dual-polarized antenna is characterized in that a coupling gap is added on the structure of the traditional probe feeding double-layer metal patch for feeding so as to match with an air layer structure in a connecting structure to realize more convenient antenna matching.
In the connecting structure, a feed probe in the millimeter wave dual-polarized antenna and a double quasi-coaxial transmission line in the radio frequency feed structure are connected by a surface welding process by depending on a first solder ball.
An air layer is arranged between the millimeter wave dual-polarized antenna and the radio frequency feed structure.
The coupling gap is positioned between the upper layer metal patch or the lower layer metal patch and the feed probe.
The beneficial effects are that: the millimeter wave dual-polarized antenna is characterized in that the antenna structure is improved based on the traditional probe feed laminated patch antenna. The distance between the two layers of patches corresponds to the coupling between the two layers, and the ideal antenna bandwidth can be obtained by adjusting the coupling. The probe is implemented as a metallized via through the multi-layer PCB. Unlike conventional probe-fed stacked patch antennas, the probe is not directly connected to a metal patch, but excites both the upper and lower metal patches through a slot-coupled feed mechanism. The excitation method effectively neutralizes reflection caused by the air layer in the connection structure, so that the operation bandwidth of the antenna is ensured.
The connecting structure is characterized in that the solder balls connected with the feed probes and the solder balls used for structural support can be placed on a pre-designed bonding pad by adopting a ball-implanting process, and bonding pads are designed at proper corresponding positions of the lower part of the millimeter wave dual-polarized antenna and the uppermost layer of the radio frequency feed structure. The height of the solder balls can influence the height of the air layer which is raised below the millimeter wave dual-polarized antenna, so that the matching of the whole antenna is influenced, and the height needs to be accurately considered in the antenna simulation calculation.
The active antenna structure can be used for separately processing the antenna structure and the radio frequency feed structure and then connecting the antenna structure and the radio frequency feed structure together in a surface-mount welding mode, so that the processing difficulty of the multilayer PCB is reduced, the processing yield is improved, the antenna can cover the required millimeter wave frequency band, and the reliable antenna performance is provided.
Drawings
Fig. 1 is a schematic cross-sectional view of a stack of a millimeter wave active dual-polarized antenna that is easy to process and provided by the invention;
fig. 2 is a schematic three-dimensional diagram of a stack of the millimeter wave active dual-polarized antenna which is easy to process and provided by the invention;
fig. 3 (a) is a schematic structural diagram of connection between an upper patch and a feed probe of a millimeter wave dual-polarized antenna, and fig. 3 (b) is a schematic structural diagram of connection between a lower patch and a feed probe;
FIG. 4 is simulation and test results of reflection coefficients of an input port of the millimeter wave dual-polarized antenna;
fig. 5 is a main polarization and cross polarization pattern measurement result when a horizontal polarization beam is directed to 0 ° in a transmitting state of the millimeter wave active dual polarized antenna;
fig. 6 is a main polarization and cross polarization pattern measurement result when a horizontally polarized beam is directed at 40 ° in a transmitting state of the millimeter wave active dual polarized antenna;
the drawings are as follows: the antenna comprises an upper metal patch 1, a lower metal patch 2, a feed probe 3, a feed pad 4, a coupling gap 5, a fixing pad 6, a first tin ball 7, a second tin ball 8, an air layer 9, a double-dummy coaxial transmission line 10, a microstrip line 11 at the bottom layer, a third tin ball 12, a beam forming chip 13 and a plurality of metal layers 14.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. Any modification made on the basis of the technical scheme according to the technical idea provided by the invention belongs to the protection scope of the invention.
Referring to fig. 1-3, the millimeter wave active dual-polarized antenna easy to process provided by the invention comprises a stacked millimeter wave dual-polarized antenna, a radio frequency feed structure and a connecting structure for connecting the millimeter wave dual-polarized antenna and the radio frequency feed structure; the millimeter wave dual-polarized antenna comprises two layers of stacked upper metal patches 1 and lower metal patches 2 and a double-probe gap coupling feed structure, namely a feed probe 3, which is vertically connected with the upper metal patches 1 and the lower metal patches 2; the connection structure comprises a feed pad 4 positioned below the feed probe 3, a first solder ball 7 connecting the feed pad 4 and the lower radio frequency feed structure, a second solder ball 8 positioned at the edge of the antenna for structural support, and a fixed pad 6 positioned on the second solder ball 8; the radio frequency feed structure comprises a plurality of metal layers 14 and a double-quasi-coaxial transmission line 10 which is vertically connected with the metal layers 14, wherein a microstrip line 11 of a bottom layer is arranged below the double-quasi-coaxial transmission line 10, a third solder ball 12 is arranged below the microstrip line 11, and a beam forming chip 13 is arranged below the third solder ball 12. The radio frequency feed structure comprises a radio frequency connecting wire connected with each port of the antenna, a millimeter wave beam forming chip, a radio frequency input circuit, a direct current power supply circuit, a control circuit and the like.
The radio frequency feed structure comprises a radio frequency connecting wire for connecting each port of an antenna, a millimeter wave beam forming chip, a radio frequency input circuit, a direct current power supply circuit, a control circuit and the like. The radio frequency connecting line for connecting each port of the antenna comprises a double-quasi-coaxial transmission line and a microstrip line, wherein the double-quasi-coaxial transmission line penetrates through the whole multi-layer PCB radio frequency feed structure and comprises a central feed through hole and surrounding grounding through holes, and the microstrip line is responsible for connecting the quasi-coaxial line and a radio frequency output port of the beam forming chip. The radio frequency input circuit for feeding and powering the beam forming chip, the dc power supply and control circuit are integrated in a multi-layer PCB having a radio frequency feed structure.
The millimeter wave dual polarized antenna is manufactured and processed on a 6-layer PCB, wherein the key structure comprises: the upper metal patch 1, the lower metal patch 2 and the feed probe 3 respectively used for exciting two polarization radiation modes, wherein signals on the feed probe 3 are used for feeding and exciting the upper metal patch 1 and the lower metal patch 2 through the coupling gap 5, as shown in fig. 2, fig. 3 (a) and fig. 3 (b). In addition, a feed pad 4 and a fixing pad 6 are placed under the feed probe 3 and in place around the antenna Fang Junfen, respectively, so as to be soldered with the first and second solder balls 7 and 8 in the connection structure.
The connection structure comprises a first solder ball 7 for connecting a feed probe 3 in the millimeter wave dual-polarized antenna and a double-quasi-coaxial transmission line 10 in the radio frequency feed structure, and also comprises a second solder ball 8 which is placed at a proper position around the bottom of the antenna and used for carrying out structural support, wherein the second solder ball 8 has small influence on the performance parameters of the antenna through calculation and test, and the connection structure heightens the antenna PCB by a certain height, and an air layer 9 therein can greatly influence the input matching of the antenna. As shown in FIG. 4, the input scattering parameters of the antenna are smaller than-10 dB in the required millimeter wave working frequency band, so that the use requirement is met.
The radio frequency feed structure is manufactured and processed on an 8-layer PCB and mainly comprises a double-quasi-coaxial transmission line 10 for connecting an antenna port and an output port of a beam forming chip, a microstrip line 11 at the bottom layer, a third tin ball 12, a millimeter wave multichannel radio frequency receiving and transmitting beam forming chip 13, a radio frequency input circuit, a direct current power supply circuit, a control circuit and other circuits. Wherein, the double quasi-coaxial transmission line 10 and the bottom microstrip line 11 which penetrate the multi-layer PCB are designed to have 50 ohm impedance consistent with the port of the beam forming chip 13 so as to ensure good connection performance. The structures of the rf input circuit, the control circuit, and the power supply circuit, which are connected to the input port of the beam forming chip 13, are integrated in the multi-layered metal layer 14, and are not described in detail herein.
In order to verify the authenticity and reliability of the easily-processed millimeter wave active dual-polarized antenna, the active dual-polarized array antenna working in the frequency range from 24GHz to 28GHz is specially manufactured according to the embodiment, and the scale of the array is 2 multiplied by 4. Two 8-channel millimeter wave beam forming chips are used for exciting 16 channels of eight antenna units. Example PCBs of design all used rogers 3003 board as the core and rogers 4450F board as the blocking material. Fig. 5-6 show radiation pattern results of the horizontal polarization of the array antenna in the transmitting state. From experimental results, the array antenna can reach + -40 DEG after the maximum phased beam scanning angle is calibrated, and can provide higher cross polarization suppression in the beam pointing direction.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereto, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the present invention.
Claims (7)
1. The millimeter wave active dual-polarized antenna is characterized by comprising a stacked millimeter wave dual-polarized antenna, a radio frequency feed structure and a connecting structure for connecting the millimeter wave dual-polarized antenna and the radio frequency feed structure; the millimeter wave dual-polarized antenna comprises two layers of stacked upper-layer metal patches (1), lower-layer metal patches (2) and a double-probe gap coupling feed structure, namely a feed probe (3) and a coupling gap (5), which are vertically connected with the upper-layer metal patches (1) and the lower-layer metal patches (2); the connection structure comprises a feed pad (4) positioned under the feed probe (3), a first solder ball (7) for connecting the feed pad (4) with the lower radio frequency feed structure, a second solder ball (8) positioned at the edge of the antenna and used for structural support, and a fixed pad (6) positioned on the second solder ball (8); the radio frequency feed structure comprises a plurality of metal layers (14) and a double-quasi-coaxial transmission line (10) which is vertically connected with the metal layers (14), wherein a microstrip line (11) of a bottom layer is arranged below the double-quasi-coaxial transmission line (10), a third tin ball (12) is arranged below the microstrip line (11), and a beam forming chip (13) is arranged below the third tin ball (12); the double quasi-coaxial transmission line penetrates through the whole multi-layer PCB radio frequency feed structure and comprises a central feed through hole and surrounding grounding through holes.
2. The millimeter wave active dual-polarized antenna of claim 1, wherein the millimeter wave dual-polarized antenna adopts a multi-layer PCB structure, and the multi-layer PCB is arranged between the upper layer metal patch (1) and the lower layer metal patch (2) and below the lower layer metal patch (2).
3. The millimeter wave active dual-polarized antenna of claim 1, wherein said radio frequency feed structure is in the form of a multi-layer PCB, and a multi-layer PCB is disposed between the upper and lower layers of the multi-layer metal layer (14).
4. The millimeter wave active dual-polarized antenna of claim 1, wherein the millimeter wave dual-polarized antenna is characterized in that a coupling gap (5) is added to feed on the structure of the traditional probe feeding double-layer metal patch so as to match with an air layer (9) in the connecting structure to realize more convenient antenna matching.
5. The millimeter wave active dual-polarized antenna of claim 1, wherein in the connection structure, the feed probe (3) in the millimeter wave dual-polarized antenna and the double quasi-coaxial transmission line (10) in the radio frequency feed structure are connected by a surface welding process depending on the first solder ball (7).
6. The millimeter wave active dual-polarized antenna easy to process according to claim 1, wherein an air layer (9) is arranged between the millimeter wave dual-polarized antenna and the radio frequency feed structure.
7. The millimeter wave active dual-polarized antenna of claim 4, wherein said coupling slot (5) is located between the upper metal patch (1) or the lower metal patch (2) and the feed probe (3).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210193653.0A CN114498017B (en) | 2022-03-01 | 2022-03-01 | Millimeter wave active dual-polarized antenna easy to process |
| PCT/CN2023/089962 WO2023165634A1 (en) | 2022-03-01 | 2023-04-22 | Easily processed millimeter wave active dual-polarized antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210193653.0A CN114498017B (en) | 2022-03-01 | 2022-03-01 | Millimeter wave active dual-polarized antenna easy to process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114498017A CN114498017A (en) | 2022-05-13 |
| CN114498017B true CN114498017B (en) | 2024-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210193653.0A Active CN114498017B (en) | 2022-03-01 | 2022-03-01 | Millimeter wave active dual-polarized antenna easy to process |
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| Country | Link |
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| CN (1) | CN114498017B (en) |
| WO (1) | WO2023165634A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114498017B (en) * | 2022-03-01 | 2024-02-02 | 东南大学 | Millimeter wave active dual-polarized antenna easy to process |
| CN116826365B (en) * | 2022-11-18 | 2024-08-23 | 江苏欧佳智能科技有限公司 | Millimeter wave wide angle scanning antenna array |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134471A1 (en) * | 2018-12-29 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Millimeter wave array antenna module and mobile terminal |
| WO2021022941A1 (en) * | 2019-08-06 | 2021-02-11 | 维沃移动通信有限公司 | Antenna array and terminal |
| CN112787089A (en) * | 2020-12-28 | 2021-05-11 | 京信网络系统股份有限公司 | Millimeter wave package antenna and array antenna |
| CN213906670U (en) * | 2021-01-22 | 2021-08-06 | 苏州硕贝德创新技术研究有限公司 | Millimeter wave communication AIP module |
| CN113690603A (en) * | 2021-08-23 | 2021-11-23 | 安徽大学 | Millimeter wave antenna |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9196951B2 (en) * | 2012-11-26 | 2015-11-24 | International Business Machines Corporation | Millimeter-wave radio frequency integrated circuit packages with integrated antennas |
| CN109860996B (en) * | 2019-03-01 | 2023-12-05 | 华南理工大学 | Low-profile dual-polarization filtering magneto-electric dipole antenna |
| CN112864617B (en) * | 2021-01-12 | 2022-04-08 | 西安电子科技大学 | 5G millimeter wave dual-polarized broadband wide-angle tightly-coupled array antenna |
| CN114498017B (en) * | 2022-03-01 | 2024-02-02 | 东南大学 | Millimeter wave active dual-polarized antenna easy to process |
-
2022
- 2022-03-01 CN CN202210193653.0A patent/CN114498017B/en active Active
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2023
- 2023-04-22 WO PCT/CN2023/089962 patent/WO2023165634A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134471A1 (en) * | 2018-12-29 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Millimeter wave array antenna module and mobile terminal |
| WO2021022941A1 (en) * | 2019-08-06 | 2021-02-11 | 维沃移动通信有限公司 | Antenna array and terminal |
| CN112787089A (en) * | 2020-12-28 | 2021-05-11 | 京信网络系统股份有限公司 | Millimeter wave package antenna and array antenna |
| CN213906670U (en) * | 2021-01-22 | 2021-08-06 | 苏州硕贝德创新技术研究有限公司 | Millimeter wave communication AIP module |
| CN113690603A (en) * | 2021-08-23 | 2021-11-23 | 安徽大学 | Millimeter wave antenna |
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| Publication number | Publication date |
|---|---|
| WO2023165634A1 (en) | 2023-09-07 |
| CN114498017A (en) | 2022-05-13 |
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