CN212660372U

CN212660372U - BGA (ball grid array) bonding pad structure capable of improving processing yield

Info

Publication number: CN212660372U
Application number: CN202021519507.5U
Authority: CN
Inventors: 罗青; 郝彦霞; 汤昌才
Original assignee: Shenzhen Edadoc Circuit Co ltd
Current assignee: Shenzhen Edadoc Circuit Co ltd
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-03-05
Anticipated expiration: 2030-07-28

Abstract

The utility model discloses an improve BGA pad structure of processing yield, including the pin pad of a plurality of array distributions, arrange outermost the pin pad is the long circle pad, all the other the pin pad is circular pad, long circle pad and adjacent interval D1 between the circular pad equals adjacent two interval D2 between the circular pad, adjacent two interval D3 between the long circle pad is greater than adjacent two interval D2 between the circular pad. The utility model discloses become the long circle pad from traditional circular pad with the pin pad of outermost row to inject the size of the long circle pad of outermost row, make the interval between two adjacent long circle pads be greater than the interval between two adjacent circular pads, have more space between the long circle pad after the improvement to be used for walking the line, can improve the yields of processing.

Description

BGA (ball grid array) bonding pad structure capable of improving processing yield

Technical Field

The utility model relates to a PCB technical field, specific theory relates to a BGA pad structure of improvement processing yield.

Background

A Printed Circuit Board (PCB) is also called a PCB, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. Packaging refers to the routing of circuit pins on a silicon die to external connections for connection to other devices. The circuit of the schematic diagram is reflected in the PCB board by packaging and wiring, and one package corresponds to one component.

Due to market competition, products are increasingly being developed in a small volume direction, which makes the use of dense pitch 0.5mm BGA packages more and more frequent. Generally, in a 0.5mm BGA package, the diameter of a pin pad is 10 mils, the distance between two adjacent pin pads is 9.69 mils, and in a domestic PCB board processing factory, the pin pad can be processed only with a line width of at least 3 mils or more, and the distance from a single-side signal line to the pin pad is (9.69-3)/2 = 3.345 mils, which is very strict for the processing capability of many PCB board processing factories, and since this data is close to the processing capability limit of the PCB board processing factory, the yield of products is affected during processing.

The above disadvantages need to be improved.

Disclosure of Invention

In order to overcome the not enough of traditional technique, the utility model provides an improve BGA pad structure of processing yield.

The utility model discloses technical scheme as follows:

the BGA pad structure is characterized by comprising a plurality of pin pads distributed in an array mode, wherein the pin pads on the outermost row are oval pads, the rest pin pads are round pads, the distance D1 between each oval pad and each adjacent round pad is equal to the distance D2 between each two adjacent round pads, and the distance D3 between each two adjacent oval pads is larger than the distance D2 between each two adjacent round pads.

According to the above scheme the utility model discloses, its characterized in that, the diameter C of circular pad is greater than the width W of long circle pad.

According to the above scheme the utility model discloses, its characterized in that, the diameter C of circular pad is less than the length L of long circle pad.

According to the utility model discloses of above-mentioned scheme, its characterized in that, the diameter C of circular pad is 10 mils.

The utility model discloses according to above-mentioned scheme, its characterized in that, adjacent two interval D2 between the circular pad is 9.69 mils.

According to above-mentioned scheme the utility model discloses, its characterized in that, the width W more than or equal to 8 mils of oblong pad.

According to above-mentioned scheme the utility model discloses, its characterized in that, the width W of long circular pad is 8 mils.

According to the above scheme the utility model discloses, the beneficial effects of the utility model reside in that:

the utility model discloses change the pin pad of the outermost row in 0.5mmBGA encapsulation from traditional circular pad to the long circle pad to the size of the long circle pad of the outermost row of injecing, make the interval between two adjacent long circle pads be greater than the interval between two adjacent circular pads, therefore when walking the line in the middle of two pin pads, have more space between the long circle pad after the improvement and be used for walking the line, can improve the yields of processing; the utility model discloses processing is simple convenient, and is with low costs, can promote on a large scale.

Drawings

FIG. 1 is a partial schematic view of a conventional BGA pad structure;

FIG. 2 is a partial schematic view of a BGA pad structure in accordance with the present invention;

in the figures, the reference numerals are as follows:

1. a circular pad; 2. An oblong-shaped pad.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail.

As shown in fig. 1, in a conventional 0.5mm BGA package, the BGA pad structure includes a plurality of pin pads distributed in an array, each pin pad is a circular pad 1, the diameter of each pin pad is 10 mils, and the distance between two adjacent pin pads is 9.69 mils. In a domestic PCB (printed Circuit Board) processing factory, the processing can be carried out only with the line width of at least more than 3 mils, the distance from a single-side signal line to a pin pad is (9.69-3)/2 = 3.345 mils, the requirement on the processing capacity of a plurality of PCB processing factories is very strict, and the data is close to the limit of the processing capacity of the PCB processing factories, so the yield of products is influenced during the processing.

As shown in fig. 2, the utility model provides an improve BGA pad structure of processing yield, including the pin pad of a plurality of array distributions, the pin pad of outermost row is oblong pad 2, and remaining pin pad is circular pad 1, and the interval D1 between oblong pad 2 and the adjacent circular pad 1 equals the interval D2 between two adjacent circular pads 1, and the interval D3 between two adjacent oblong pads 2 is greater than the interval D2 between two adjacent circular pads 1.

Compare with current 0.5mm BGA encapsulation, the utility model discloses become oval pad 2 from traditional circular pad 1 with the pin pad of outermost row to prescribe a limit to the size of oval pad 2 of outermost row, make the interval between two adjacent oval pads 2 be greater than the interval between two adjacent circular pads 1, consequently when walking the line in the middle of two pin pads, have more space between the oval pad 2 after the improvement to be used for walking the line, can improve the yields of processing.

In the present embodiment, the diameter C of the circular pad 1 is larger than the width W of the oblong pad 2, and the diameter C of the circular pad 1 is smaller than the length L of the oblong pad 2, that is, for the outermost row of pin pads, the outermost row of pin pads is only narrowed and lengthened in the outgoing line direction, so that the trace pitch between the outermost row of pin pads is increased, and therefore, the yield of the process can be improved.

Preferably, in 0.5mmBGA encapsulation, the utility model discloses a diameter C of circular pad 1 is 10 mils, and interval D2 between two adjacent circular pads 1 is 9.69 mils, and the width W more than or equal to 8 mils of long circular pad 2. According to the calculation of the line width processing standard of at least more than 3mil in a domestic PCB board processing factory, the distance between the unilateral signal line and the oblong bonding pad 2 is (9.69 + 4-3)/2 = 5.345mil, and the data is 2mil larger than the processing capacity limit data of the PCB board processing factory by 3.345mil, so that the processing yield can be effectively improved.

It will be understood that modifications and variations can be effected by a person skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the appended claims.

The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.

Claims

1. The BGA pad structure is characterized by comprising a plurality of pin pads distributed in an array mode, wherein the pin pads on the outermost row are oval pads, the rest pin pads are round pads, the distance D1 between each oval pad and each adjacent round pad is equal to the distance D2 between each two adjacent round pads, and the distance D3 between each two adjacent oval pads is larger than the distance D2 between each two adjacent round pads.

2. The BGA pad structure of claim 1, wherein a diameter C of the circular pad is greater than a width W of the oblong pad.

3. The BGA pad structure of claim 2, wherein a diameter C of the circular pad is less than a length L of the oblong pad.

4. The BGA pad structure of claim 1, wherein the diameter C of the circular pad is 10 mils.

5. The BGA pad structure of claim 4, wherein a distance D2 between two adjacent circular pads is 9.69 mils.

6. The BGA pad structure of claim 5, wherein the width W of the oblong pad is greater than or equal to 8 mils.

7. The BGA pad structure of claim 5, wherein the oblong pad has a width W of 8 mils.